Groove type semiconductor substrate transfer printing clamp

Abstract

The utility model discloses a groove type semiconductor substrate transfer printing clamp, which belongs to the technical field of semiconductor substrate transfer printing clamps, and comprises two groups of placing plates which are used for placing semiconductor substrates for transfer printing and are fixedly connected through a connecting plate, and the placing plates are fixedly connected with limiting plates used for limiting the semiconductor substrates; the bottom plate is arranged below the placing plates, and the placing plates slide in the bottom plate and are used for moving the two sets of placing plates; the clamping mechanism comprises a clamping plate which slides on the placing plate and is used for being matched with the limiting plate to clamp the semiconductor substrate; a pressing block is pressed by a semiconductor substrate, so that a clamping plate can be driven to be matched with a limiting plate to fix the semiconductor substrate, and the device can be suitable for fixing the semiconductor substrates of various sizes, so that the universality of the device is enhanced, and the stability during pad printing is also improved; and after transfer printing is completed, the clamping plate is pulled to enable the pressing block to jack up the semiconductor substrate, so that the semiconductor substrate is convenient to take out, and the practicability of the device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor substrate pad printing fixture technical field, specifically point to a kind of trench type semiconductor substrate pad printing fixture. BACKGROUND

[0002] With the continuous development of electronic information technology, semiconductor manufacturing technology has also been rapidly developed and popularized. In the manufacturing process of semiconductor devices, the circuit drawn by organic and inorganic materials on the chip can be transferred to the semiconductor substrate by using pad printing technology, so as to manufacture high-precision micro devices and integrated circuits. The traditional pad printing operation is usually completed by manual operation, which is low in operation efficiency and prone to errors, affecting the quality of the chip and the manufacturing efficiency.

[0003] In order to solve the above problems, through searching the existing public patent (application number: CN202321173790.4) a kind of semiconductor substrate pad printing fixture, the paper proposes "including base, and the installation plate of sliding installation in its top, installation plate top is equipped with multiple limit strips;Base is equipped with multiple motor rotors distributed in installation plate both sides, and power distribution module for motor rotor power supply, motor rotor is electrically connected with power distribution module;The output shaft of motor rotor is equipped with transmission shaft, the end portion of transmission shaft that extends to the outside of base is installed with gear, the tooth groove that can be engaged with gear is opened on installation plate. The utility model can replace manual pad printing operation, improve operation efficiency and reduce pad printing error".

[0004] But in the process of use, although it can be carried out and pad printing to semiconductor, but only through multiple limit strips can be limited to substrate, but the substrate cannot be fixed, and the substrate will still be displaced during printing, which will cause printing failure and reduce work efficiency. UTILITY MODEL CONTENT

[0005] The utility model solves the technical problems in the above background art, and provides a trench type semiconductor substrate pad printing fixture.

[0006] To solve the above technical problems, the technical scheme provided by the utility model is as follows:

[0007] A trench type semiconductor substrate pad printing fixture, comprising:

[0008] A placement plate is used for placing semiconductor substrates for pad printing, and the placement plate is provided with two groups and is fixedly connected by a connecting plate, and a limiting plate for limiting semiconductor substrates is fixedly connected to the placement plate.

[0009] A bottom plate is arranged below the placement plate and the placement plate slides in the bottom plate to move the two groups of placement plates.

[0010] The clamping mechanism comprises a clamping plate sliding on the placing plate for clamping the semiconductor substrate in cooperation with the limiting plate.

[0011] The linkage assembly comprises a limiting rod sliding in the placing plate for limiting the clamping plate.

[0012] The limiting assembly comprises a bolt sliding in the placing plate for limiting the placing plate.

[0013] Preferably, the clamping mechanism further comprises:

[0014] The mounting slot is arranged on the placing plate and the clamping plate slides in the placing plate;

[0015] The mounting rod is fixedly connected in the mounting slot and the mounting slot slides on the mounting rod;

[0016] The first spring is sleeved on the mounting rod for pulling the clamping plate to clamp the semiconductor substrate.

[0017] Preferably, the clamping plate is T-shaped, one end of the first spring is fixedly connected on the clamping plate, and the other end of the first spring is fixedly connected in the mounting slot.

[0018] Preferably, the linkage assembly further comprises:

[0019] The pressing block is slidingly connected on the placing plate and one end of the limiting rod is fixedly connected on the pressing block;

[0020] The vertical slot is used for mounting the pressing block and the pressing block slides in the placing plate;

[0021] The second spring is fixedly connected at one end in the vertical slot and at the other end on the top of the pressing block for pushing the pressing block to limit the clamping plate by the limiting rod;

[0022] The moving slot is arranged in the mounting slot and communicates with the vertical slot, and the limiting rod slides in the moving slot.

[0023] Preferably, the limiting rod is attached to the clamping plate, and the length of the limiting rod is less than the length of the mounting rod.

[0024] Preferably, the limiting assembly further comprises:

[0025] The vertical plate is fixedly connected on one side of the bottom plate and the bolt slides through the vertical plate;

[0026] The third spring is sleeved on the bolt for driving the bolt to limit the placing plate;

[0027] The insertion hole is arranged on the placing plate and one end of the bolt slides in the insertion hole.

[0028] Preferably, the bolt is located in the middle of the vertical plate, one end of the third spring is fixedly connected on the bolt, and the other end of the third spring is fixedly connected on the vertical plate.

[0029] With the above structure, this utility model has the following advantages:

[0030] 1. By pressing the semiconductor substrate with the pressing block, the clamping plate and the limiting plate can be used to fix the semiconductor substrate. This method is applicable to fixing semiconductor substrates of various sizes, which not only enhances the versatility of the device but also improves the stability during pad printing. After pad printing is completed, pulling the clamping plate can push the pressing block upward to lift the semiconductor substrate, making it easy to remove and improving the practicality of the device.

[0031] 2. The placement plate is provided in two sets, which can fix the other set of semiconductor substrates while one set of semiconductor substrates is being pad-printed. The placement plate can be positioned directly below the pad printing head by inserting the pin into the socket, which not only improves the efficiency of pad printing, but also further improves the stability of pad printing.

[0032] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of a trench-type semiconductor substrate pad printing fixture according to this utility model;

[0035] Figure 2 This is an exploded view of the structure of a trench-type semiconductor substrate pad printing fixture according to this utility model;

[0036] Figure 3 yes Figure 1 Enlarged view of point A in the image;

[0037] Figure 4 yes Figure 2 Enlarged view of point B in the image.

[0038] As shown in the figure: 1. Placement plate; 101. Connecting plate; 102. Limiting plate; 2. Base plate; 301. Clamping plate; 302. Mounting groove; 303. Mounting rod; 304. First spring; 401. Pressing block; 402. Vertical groove; 403. Second spring; 404. Limiting rod; 405. Moving groove; 501. Pin; 502. Vertical plate; 503. Third spring; 504. Insertion hole. Detailed Implementation

[0039] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] The present invention will now be described in further detail with reference to the full text:

[0042] Example 1:

[0043] Combined with appendix Figures 1 to 4 This embodiment provides a trench-type semiconductor substrate pad printing fixture, including a placement plate 1 for placing a semiconductor substrate for pad printing. The placement plate 1 has two sets and is fixedly connected by a connecting plate 101. A limiting plate 102 for limiting the semiconductor substrate is fixedly attached to the placement plate 1. It also includes a base plate 2 arranged below the placement plate 1, and the placement plate 1 slides in the base plate 2 to move the two sets of placement plates 1.

[0044] It should be noted that the placement plate 1 is provided with mounting holes, which can be fixed to the operating table by using expansion screws to ensure stability during semiconductor substrate transfer printing. The connecting plate 101 is located in the middle of the two sets of placement plates 1 and slides in the groove provided on the base plate 2. The limiting plate 102 is U-shaped.

[0045] In order to clamp the semiconductor substrate during pad printing, a clamping mechanism and a linkage assembly are provided. The clamping mechanism includes a clamping plate 301 that slides on the placement plate 1 and cooperates with the limiting plate 102 to clamp the semiconductor substrate. The linkage assembly includes a limiting rod 404 that slides in the placement plate 1 to limit the clamping plate 301.

[0046] In a preferred embodiment, the clamping mechanism further includes: a mounting groove 302 arranged on the placement plate 1 and the clamping plate 301 sliding within the placement plate 1; a mounting rod 303 fixedly connected within the mounting groove 302 and the mounting groove 302 sliding on the mounting rod 303; and a first spring 304 sleeved on the mounting rod 303 for pulling the clamping plate 301 to clamp the semiconductor substrate.

[0047] In a preferred embodiment, the clamping plate 301 is T-shaped, one end of the first spring 304 is fixed to the clamping plate 301, and the other end of the first spring 304 is fixed to the mounting groove 302.

[0048] It should be noted that the clamping plate 301 is located on one side of the opening of the limiting plate 102, and the top of the clamping plate 301 is parallel to the top of the limiting plate 102.

[0049] In a preferred embodiment, the linkage assembly further includes: a pressing block 401, slidably connected to the placement plate 1, with one end of the limiting rod 404 fixedly connected to the pressing block 401; a vertical groove 402 for mounting the pressing block 401, with the pressing block 401 sliding within the placement plate 1; a second spring 403, with one end fixedly connected to the vertical groove 402 and the other end fixedly connected to the top of the pressing block 401 for causing the pressing block 401 to push the limiting rod 404 to limit the clamping plate 301; and a moving groove 405, arranged within the mounting groove 302 and communicating with the vertical groove 402, with the limiting rod 404 sliding within the moving groove 405.

[0050] In a preferred embodiment, the limiting rod 404 is attached to the clamping plate 301, and the length of the limiting rod 404 is less than the length of the mounting rod 303.

[0051] It should be noted that when the semiconductor substrate is not fixed, the top of the pressing block 401 is higher than the top of the placement plate 1, and the limiting rod 404 is attached to the side of the clamping plate 301 near the pressing block 401. The pressing block 401 is located in the middle of the placement plate 1, and the limiting rod 404 is located on one side of the mounting rod 303.

[0052] Example 2:

[0053] Based on Embodiment 1, in order to move the fixed semiconductor substrate to the bottom of the pad printing machine and fix it, a limiting component is arranged. The limiting component includes a pin 501 that slides through the placement plate 1 to limit the placement plate 1.

[0054] In a preferred embodiment, the limiting component further includes: a vertical plate 502, fixed to one side of the base plate 2, with a pin 501 sliding through it; a third spring 503, sleeved on the pin 501 for driving the pin 501 to limit the placement plate 1; and a socket 504, arranged on the placement plate 1, with one end of the pin 501 sliding within the socket 504.

[0055] In a preferred embodiment, the pin 501 is located in the middle of the vertical plate 502, one end of the third spring 503 is fixed to the pin 501, and the other end of the third spring 503 is fixed to the vertical plate 502.

[0056] It should be noted that the height of the vertical plate 502 is lower than the height of the placement plate 1. When the semiconductor substrate on one set of placement plates 1 is being pad-printed, the semiconductor substrate can be fixed on another set of placement plates 1.

[0057] The operating steps are as follows: First, place a set of semiconductor substrates on a set of placement plates 1. Then, press the pressing block 401 downwards to compress the second spring 403. At this time, the pressing block 401 drives the limiting rod 404 downwards in the moving groove 405. When the top of the pressing block 401 is lower than the top of the placement plate 1, the limiting rod 404 is not in contact with the clamping plate 301. At this point, under the action of the mounting rod 303, the clamping plate 301 is pulled towards the pressing block 401, and the limiting rod 404 is located below the clamping plate 301, thereby fixing the semiconductor substrates. Then, pull the pin 501 to push the insertion hole 504 on the placement plate 1 containing the semiconductor substrates against the pin 501. With position 01 corresponding, release the pin 501 and insert it into the socket 504 under the action of the third spring 503 for fixation. Then, transfer the semiconductor substrate above. Next, place the semiconductor substrate on another set of placement plates 1 for fixation. After one set of printing is completed, pull the pin 501 out of the socket 504, push the other set of placement plates 1 and insert the pin 501 into the socket 504 for fixation for transfer printing. Then, pull the clamping plate 301 to slide to the outermost side. At this time, the clamping plate 301 no longer limits the limit rod 404. Under the action of the second spring 403, push the pressing block 401 upward and push out the semiconductor substrate for easy removal. Then, perform the operation in sequence.

[0058] The present invention and its embodiments have been described above. This description is not restrictive, and the embodiments shown throughout the text are only one of the embodiments of the present invention. The actual structure is not limited to this. In conclusion, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit of the present invention, such design should fall within the protection scope of the present invention.

Claims

1. A trench-type semiconductor substrate pad printing fixture, characterized in that: include: Placement plate (1) is used to place semiconductor substrate for pad printing. The placement plate (1) is provided in two sets and is fixedly connected by a connecting plate (101). A limiting plate (102) for limiting the semiconductor substrate is fixedly attached to the placement plate (1). A base plate (2) is arranged below the placement plate (1) and the placement plate (1) slides within the base plate (2) to move the two sets of placement plates (1); The clamping mechanism includes a clamping plate (301) that slides on the placement plate (1) for engaging with the limiting plate (102) to clamp the semiconductor substrate; The linkage assembly includes a limiting rod (404) that slides within the placement plate (1) to limit the clamping plate (301); The limiting component includes a pin (501) that slides through the placement plate (1) to limit the placement plate (1).

2. The trench-type semiconductor substrate pad printing fixture according to claim 1, characterized in that: The clamping mechanism further includes: The mounting slot (302) is arranged on the placement plate (1) and the clamping plate (301) slides within the placement plate (1); The mounting rod (303) is fixedly connected to the mounting groove (302) and the mounting groove (302) slides on the mounting rod (303); The first spring (304) is sleeved on the mounting rod (303) and is used to pull the clamp (301) to clamp the semiconductor substrate.

3. The trench-type semiconductor substrate pad printing fixture according to claim 2, characterized in that: The clamping plate (301) is T-shaped, one end of the first spring (304) is fixed to the clamping plate (301), and the other end of the first spring (304) is fixed to the mounting groove (302).

4. The trench-type semiconductor substrate pad printing fixture according to claim 3, characterized in that: The linkage component also includes: The pressing block (401) is slidably connected to the placement plate (1) and one end of the limiting rod (404) is fixed to the pressing block (401); A vertical groove (402) is used to install a pressing block (401), and the pressing block (401) slides within the placement plate (1); The second spring (403) is fixed at one end in the vertical groove (402) and at the other end to the top of the pressing block (401) to push the limiting rod (404) to limit the clamping plate (301). The movable groove (405) is arranged in the mounting groove (302) and communicates with the vertical groove (402), and the limiting rod (404) slides in the movable groove (405).

5. A trench-type semiconductor substrate pad printing fixture according to claim 4, characterized in that: The limiting rod (404) is attached to the clamp (301), and the length of the limiting rod (404) is less than the length of the mounting rod (303).

6. The trench-type semiconductor substrate pad printing fixture according to claim 5, characterized in that: The linkage component also includes: A vertical plate (502) is fixed to one side of the base plate (2) and a pin (501) slides through the vertical plate (502); The third spring (503) is sleeved on the pin (501) to drive the pin (501) to limit the placement plate (1); A socket (504) is arranged on the placement plate (1) and one end of the pin (501) slides in the socket (504).

7. A trench-type semiconductor substrate pad printing fixture according to claim 6, characterized in that: The pin (501) is located in the middle of the vertical plate (502), one end of the third spring (503) is fixed to the pin (501), and the other end of the third spring (503) is fixed to the vertical plate (502).

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