Chip testing equipment

Abstract

The utility model discloses chip testing equipment. The chip testing equipment comprises a rack; the test box is arranged on the rack, the test box comprises a test cavity, and the test cavity is used for accommodating a chip so as to test the performance of the chip; the refrigerator is arranged in the test cavity, and the refrigerator is used for cooling the chip or air in the test cavity; the refrigerating device is arranged on the rack, the refrigerating device comprises a refrigerant pipeline, and the refrigerant pipeline is used for conveying a refrigerant to the refrigerator; the expansion valve is arranged on the refrigerant pipeline and is positioned outside the test box; the thermal insulation cover is arranged on the rack, the thermal insulation cover comprises a containing cavity, the thermal insulation cover is arranged on the expansion valve in a covering mode, and the expansion valve is located in the containing cavity. The thermal insulation cover covers the outside of the expansion valve, the stability of the temperature of the environment where the expansion valve is located is guaranteed, the risks of condensation, freezing and damage of the expansion valve are reduced, the expansion valve is not prone to being soaked by condensate water, the problems of corrosion and short circuit are avoided, and then the reliability and stability of chip testing equipment are guaranteed.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a chip testing device. Background Technology

[0002] During the chip manufacturing process, the chip typically needs to undergo three-temperature testing, which means placing the chip in high-temperature, normal-temperature, and low-temperature environments to test its performance, in order to ensure that the chip can operate stably and reliably under various temperature conditions.

[0003] When performing performance testing on chips in low-temperature environments, a refrigeration unit is required to provide cooling to the test chamber of the chip testing equipment. This refrigeration unit is equipped with an expansion valve. Because the surface temperature of the expansion valve is relatively low compared to the ambient temperature, condensation or even ice can easily form on its surface. Condensate soaking the expansion valve can easily cause short circuits or corrosion, affecting its lifespan and the performance of the refrigeration unit. Utility Model Content

[0004] This application discloses a chip testing device that can prevent condensation or icing at the expansion valve, thereby ensuring the working performance of the chip testing device.

[0005] To achieve the above objectives, this application discloses a chip testing device, comprising: a rack; a test chamber disposed on the rack, the test chamber including a test cavity for accommodating a chip for performance testing; a cooler disposed on the test cavity for cooling the chip or the air inside the test cavity; a cooling device disposed on the rack, the cooling device including a refrigerant pipeline for supplying refrigerant to the cooler; an expansion valve disposed on the refrigerant pipeline and located outside the test chamber; and a heat insulation cover disposed on the rack, the heat insulation cover including a receiving cavity, the heat insulation cover covering the expansion valve, the expansion valve being located inside the receiving cavity.

[0006] In one possible implementation, the chip testing equipment further includes a thermal insulation layer disposed on the inner wall of the thermal insulation shield and / or the outer wall of the thermal insulation shield.

[0007] In one possible implementation, the chip testing equipment further includes: a thermal insulation mounting plate located inside and at the bottom of a thermal insulation cover, and an expansion valve disposed on the thermal insulation mounting plate.

[0008] In one possible implementation, the chip testing equipment further includes: a plurality of heat-insulating particles, which fill the internal space of the heat-insulating cover.

[0009] In one possible implementation, the refrigerant piping includes an inlet pipe and an outlet pipe connected to an expansion valve, the outlet pipe being connected to a refrigerant, and the insulation cover includes: a first opening through which the inlet pipe passes through the insulation cover; and a second opening through which the outlet pipe passes through the insulation cover.

[0010] In one possible implementation, the heat insulation cover includes: a housing forming a receiving cavity; a cover covering the housing, the cover having a clearance opening for accommodating at least a portion of the expansion valve; and a wiring cover on the cover covering the clearance opening, the wiring cover having a wiring port on its side for accommodating an electrical connection wire connected to the expansion valve.

[0011] In one possible implementation, the heat insulation cover is provided with an air inlet, which is connected to the receiving cavity. The chip testing equipment also includes:

[0012] A dry gas generator, the outlet of which is connected to the inlet port.

[0013] In one possible implementation, the refrigerant piping includes an inlet pipe and an outlet pipe. The inlet pipe includes a main inlet pipe and multiple sub-inlet pipes connected to the main inlet pipe, and the outlet pipe includes a main outlet pipe and multiple sub-outlet pipes connected to the main outlet pipe.

[0014] There are multiple expansion valves, each connected to a sub-inlet pipe and a sub-outlet pipe.

[0015] In one possible implementation, the chip testing equipment also includes:

[0016] The support component has one end connected to the bottom of the heat insulation cover and the other end connected to the frame to create a clearance space between the heat insulation cover and the frame.

[0017] In one possible implementation, the testing equipment also includes:

[0018] A heater is installed inside the test chamber and is used to heat the air inside the test chamber.

[0019] In one possible implementation, the chip testing equipment includes: a loading mechanism, mounted on a rack, for feeding the chip to be tested into a test chamber; and an unloading mechanism, mounted on the rack, for conveying the chip that has undergone performance testing.

[0020] Compared with the prior art, the beneficial effects of this application are:

[0021] The chip testing equipment provided in this application embodiment ensures the stability of the ambient temperature around the expansion valve by covering it with a heat insulation cover. This reduces the risk of condensation, icing, and damage to the expansion valve, and prevents it from being easily wetted by condensate, thus avoiding corrosion and short circuits. It also reduces unnecessary energy waste caused by heat loss from the expansion valve. The operational stability of the expansion valve is improved, thereby ensuring the reliability and stability of the chip testing equipment.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the chip testing equipment provided in the embodiments of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the heat insulation cover in the chip testing equipment provided in the embodiments of this application;

[0026] Figure 3 An exploded structural diagram of the heat insulation shield in the chip testing equipment provided in this application embodiment;

[0027] Figure 4 This is a schematic diagram of the structure of the heat insulation cover hidden in the chip testing equipment provided in the embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1000 - Chip testing equipment; 10 - Rack; 20 - Test box; 201 - Test chamber; 40 - Refrigerant piping; 401 - Liquid inlet pipe; 4011 - Main liquid inlet pipe; 4012 - Sub-liquid inlet pipe; 402 - Liquid outlet pipe; 4021 - Main liquid outlet pipe; 4022 - Sub-liquid outlet pipe; 50 - Expansion valve; 60 - Thermal insulation cover; 601 - First opening; 602 - Second opening; 603 - Box body; 604 - Cover body; 6041 - Clearance opening; 605 - Cable routing cover; 606 - Cable routing port; 607 - Air inlet interface; 608 - Receiving cavity; 70 - Thermal insulation layer; 80 - Thermal insulation mounting plate; 90 - Support component; 100 - Loading mechanism; 110 - Unloading mechanism. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0032] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0033] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0034] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0035] During chip manufacturing, to ensure chip quality and performance, chips are typically subjected to three-temperature testing. This is because chips, as highly integrated electronic components, have extremely complex internal structures, containing numerous miniature transistors and circuits. These tiny electronic components are highly sensitive to temperature changes; therefore, temperature directly affects the performance of the electronic components within the chip, such as the conduction and cutoff characteristics of transistors.

[0036] Tri-temperature testing requires placing the chip in three different temperature environments: room temperature, high temperature, and low temperature. Specifically, the room temperature environment is typically set between 20°C and 25°C, the high temperature range is between 50°C and 180°C, and the low temperature range is between -75°C and 0°C. Different chip designs and application scenarios may have different requirements for tri-temperature testing, and the specific temperatures for the tri-temperature test can be determined based on the specific characteristics of the chip under test.

[0037] The core purpose of three-temperature testing is to evaluate the impact of temperature on chip performance. High-temperature testing simulates the thermal stress that chips may encounter during actual use. High temperatures can cause problems such as thermal expansion, signal delay, and increased power consumption. High-temperature testing allows for the assessment of chip reliability and lifespan under thermal stress, and timely detection of potential design defects or material issues. Low-temperature testing examines the chip's performance in cold environments. In low-temperature environments, chips may experience material hardening, reduced response speed, or even failure to start up properly. Low-temperature testing can detect whether a chip can maintain good performance under extreme climatic conditions, which is particularly important in high-reliability technology fields such as aerospace and military equipment.

[0038] Therefore, if a chip can pass the three-temperature test, it can be guaranteed that the chip can maintain a good working state under various temperature conditions, thereby ensuring that the products using the chip have good stability.

[0039] Chip testing equipment typically includes a refrigeration unit for low-temperature testing of chips. This refrigeration unit operates based on the principle of a refrigeration cycle, using four basic processes—compression, expansion, evaporation, and condensation—to lower the temperature of the refrigerant, thereby providing a low-temperature testing environment. The refrigeration unit may include a compressor, evaporator, condenser, and expansion valve, through which the refrigerant flows. The expansion valve regulates the flow and pressure of the refrigerant and is the essential pathway for the refrigerant to flow from the high-pressure side (compressor) to the low-pressure side (evaporator).

[0040] Because of the sudden pressure drop at the expansion valve, the temperature of the refrigerant will also drop significantly. This can cause the temperature of the expansion valve and its surrounding area to fall below the dew point, leading to condensation or even icing. Icing not only affects refrigeration efficiency, but in severe cases, it can also block the flow of refrigerant, damage the expansion valve, and affect the accuracy of the entire low-temperature test and the normal operation of the chip testing equipment.

[0041] Based on this, the present application provides a chip testing device that can reduce or avoid condensation or icing at the expansion valve, thereby ensuring the temperature control accuracy of the chip under the required low temperature environment and improving the overall operating efficiency of the chip testing device.

[0042] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0043] Please see Figure 1 This embodiment discloses a chip testing device 1000, which includes a rack 10; a test chamber 20 disposed on the rack 10, the test chamber 20 including a test cavity 201 for accommodating a chip for performance testing; a cooler disposed on the test cavity 201 for cooling the chip or the air inside the test cavity 201; a refrigeration device disposed on the rack 10, the refrigeration device including a refrigerant pipeline 40 for supplying refrigerant to the cooler; an expansion valve 50 disposed on the refrigerant pipeline 40 and located outside the test chamber 20; and a heat insulation cover 60 disposed on the rack 10, the heat insulation cover 60 including a receiving cavity 608, the heat insulation cover 60 covering the expansion valve 50, the expansion valve 50 being located inside the receiving cavity 608.

[0044] Specifically, the rack 10 is the main structure of the chip testing equipment 1000. The rack 10 can be made of high-strength steel or aluminum alloy to provide sufficient strength to support the structural components and electrical components in the chip testing equipment 1000. The surface of the rack 10 can be specially treated, such as anodizing or spraying, to enhance its corrosion resistance.

[0045] The rack 10 can be constructed as a box-type structure. Sufficient space can be reserved inside the rack 10 for arranging structural components, electrical components, cables, conduits, and other auxiliary equipment, ensuring a neat internal layout. Furthermore, leveling feet can be installed at the bottom of the rack 10, allowing it to remain level on different surfaces, thus ensuring the testing accuracy of the chips and the long-term stable operation of the chip testing equipment 1000.

[0046] like Figure 1 As shown, the test chamber 20 is located inside the rack 10, and a test cavity 201 is formed inside the test chamber 20. The test cavity 201 forms an independent test environment to accommodate the chip to be tested. The test cavity 201 is usually equipped with a special fixture or bracket to ensure that the chip remains fixed during the test, while facilitating connection with the test circuit to perform various performance tests on the chip.

[0047] A cooler is installed inside the test chamber 201 and connected to the refrigerant line 40 of the cooling device. Low-temperature refrigerant flows into the cooler through the refrigerant line 40 to cool the air inside the test chamber 201, thereby placing the chip in a low-temperature environment to verify its stability and reliability. After heat exchange between the low-temperature refrigerant and the air inside the test chamber 201, the refrigerant flows out of the cooler through the refrigerant line 40.

[0048] Alternatively, the refrigeration unit can be constructed as a plate, with refrigerant piping 40 disposed within the refrigeration unit.

[0049] To prevent the chip from getting too cold, the cooler can avoid direct contact with the chip.

[0050] The refrigeration unit is housed inside the frame 10. The refrigeration unit may include components such as a compressor, heat exchanger, and refrigerant piping 40. The compressor is responsible for compressing the low-temperature, low-pressure refrigerant into a high-temperature, high-pressure gas. During compression, the temperature and pressure of the refrigerant increase significantly, providing the power for refrigerant circulation. The heat exchanger releases heat from the high-temperature, high-pressure refrigerant gas discharged from the compressor, cooling it and causing it to condense into a liquid state. Heat exchangers typically employ a finned tube or plate design, using air to remove the cooling energy released by the refrigerant during condensation. The refrigerant piping 40 is a piping system connecting the various components of the refrigeration unit to ensure smooth refrigerant flow between the compressor and the heat exchanger.

[0051] like Figure 2 and Figure 3 As shown, the expansion valve 50 is installed on the refrigerant line 40 and located outside the test chamber 20. The expansion valve 50 is used to regulate the flow rate and pressure of the refrigerant flowing to the refrigerator, thereby controlling the refrigeration temperature of the refrigerator.

[0052] Alternatively, the expansion valve 50 can be a mechanical expansion valve 50 or an electronic expansion valve 50.

[0053] The heat insulation cover 60 is installed on the frame 10, such as Figure 3 As shown, the thermal insulation cover 60 includes a receiving cavity 608. The thermal insulation cover 60 is disposed outside the expansion valve 50, that is, the expansion valve 50 is located inside the receiving cavity 608 of the thermal insulation cover 60. The thermal insulation cover 60 is disposed over the expansion valve 50, that is, a thermal insulation layer 70 is formed on the outside of the expansion valve 50, thereby effectively preventing external heat from entering the thermal insulation cover 60 or the leakage of cold air inside the thermal insulation cover 60, thereby maintaining the stability of the ambient temperature around the expansion valve 50 and reducing the risk of condensation or icing on the expansion valve 50.

[0054] Alternatively, the insulation cover 60 can be made of sheet metal. Sheet metal is easy to form, and the insulation cover 60 can be precisely manufactured according to the shape and size of the expansion valve 50, so that the insulation cover 60 and the expansion valve 50 fit together more tightly.

[0055] Thus, the chip testing equipment 1000 provided in this application embodiment, by covering the expansion valve 50 with a heat insulation cover 60, ensures the stability of the ambient temperature where the expansion valve 50 is located, reduces the risk of condensation, icing, and damage to the expansion valve 50, thereby ensuring smooth flow of the refrigerant and reducing unnecessary energy waste caused by the loss of cold energy from the expansion valve 50 to the outside. The operational stability of the expansion valve 50 is improved, thereby ensuring the reliability and stability of the chip testing equipment 1000.

[0056] In some embodiments, the chip testing device 1000 may include a thermal insulation layer 70. The thermal insulation layer 70 may be made of a thermal insulation material. Optionally, the thermal insulation layer 70 may be at least one of a polystyrene foam layer, extruded polystyrene foam, polyurethane foam, or phenolic foam.

[0057] In one implementation, such as Figure 3 As shown, the insulation layer 70 can be disposed inside the insulation cover 60. That is, the insulation layer 70 can be disposed on the inner wall of the insulation cover 60.

[0058] In another implementation, in order to ensure the tight fit between the insulation cover 60 and the expansion valve 50, the insulation layer 70 can be set on the outside of the insulation cover 60, that is, the insulation layer 70 can be set on the outer wall of the insulation cover 60, thereby avoiding the insulation layer 70 occupying the space inside the insulation cover 60.

[0059] In another implementation, the insulation layer 70 can be disposed on both the outside and inside of the insulation cover 60, that is, the insulation layer 70 can be disposed on both the outer wall and the inner wall of the insulation cover 60, thereby further ensuring the insulation effect of the expansion valve 50 against the external environment.

[0060] Optionally, the insulation layer 70 can be bonded to the insulation cover 60 with adhesive.

[0061] Thus, by setting the insulation layer 70 on the inner wall and / or outer wall of the insulation cover 60, the heat preservation performance of the insulation cover 60 can be effectively improved. The insulation layer 70 and the insulation cover 60 can work together to reduce the heat transfer between the inside and outside of the insulation cover 60, reduce the risk of condensation or icing of the expansion valve 50, and ensure the stable operation of the chip testing equipment 1000 during low-temperature testing.

[0062] In some embodiments, such as Figure 4 As shown, the chip testing equipment 1000 may also include a thermal insulation mounting plate 80. The thermal insulation mounting plate 80 is located inside the thermal insulation cavity, and the expansion valve 50 is mounted on the thermal insulation mounting plate 80. The thermal insulation mounting plate 80 provides structural support for the expansion valve 50. The thermal insulation mounting plate 80 may be located at the bottom of the thermal insulation cover 60.

[0063] Alternatively, the thermal insulation mounting plate 80 can be made of thermal insulation material. The thermal insulation mounting plate 80 can be made of materials such as polyimide, polyurethane foam, polystyrene foam, or mineral wool.

[0064] Since the thermal insulation mounting plate 80 is in direct contact with the expansion valve 50, its thermal insulation performance further isolates the external environment from heat conduction between the expansion valve 50 and the external environment. The installation of the thermal insulation mounting plate 80 reduces performance fluctuations in the expansion valve 50 caused by ambient temperature fluctuations, further ensuring the precise temperature control performance of the expansion valve 50.

[0065] In some embodiments, the chip testing equipment 1000 further includes a plurality of heat-insulating particles, which fill the internal space of the heat insulation cover 60.

[0066] Thermal insulation particles can be made from thermal insulation materials. Specifically, thermal insulation particles can be made from materials such as polyimide, polyurethane foam, polystyrene foam, or mineral wool.

[0067] Multiple insulating particles are filled inside the insulation cover 60. These particles can surround the expansion valve 50, ensuring that the space between the expansion valve 50 and the insulation cover 60 is completely filled with insulating particles. This allows for the removal of as much air as possible from the periphery of the expansion valve 50. This reduces heat exchange between the expansion valve 50 and the air, thereby reducing condensation of moisture in the air and further preventing condensation or even icing on the surface of the expansion valve 50.

[0068] In some embodiments, the refrigerant line 40 includes an inlet pipe 401 and an outlet pipe 402 connected to an expansion valve 50. The expansion valve 50 includes an inlet and an outlet. The inlet of the expansion valve 50 is connected to the inlet pipe 401, which is typically connected to the condenser. The refrigerant in the inlet pipe 401 is in a high-pressure liquid state and may contain a small amount of gaseous refrigerant. The outlet of the expansion valve 50 is connected to the outlet pipe 402, which is connected to the refrigerator. When the high-pressure liquid refrigerant passes through the expansion valve 50, due to the sudden drop in pressure, some of the refrigerant rapidly evaporates, forming a low-pressure, low-temperature vapor-liquid mixture. After being throttled by the expansion valve 50, the refrigerant flows out through the outlet, exits the expansion valve 50, and flows to the refrigerator to lower the temperature inside the test chamber 201.

[0069] In some embodiments, such as Figure 2 As shown, a first opening 601 may be provided on the heat insulation cover 60. The liquid inlet pipe 401 passes through the first opening 601 and enters the heat insulation cover 60.

[0070] In some embodiments, such as Figure 2 As shown, a second opening 602 may be provided on the heat insulation cover 60. The liquid outlet pipe 402 passes through the second opening 602 and enters the heat insulation cover 60.

[0071] In some embodiments, the first opening 601 and the second opening 602 may be disposed on the side wall of the heat insulation cover 60. In this way, even if a small amount of condensate is generated inside the heat insulation cover 60 under special circumstances, disposing of the first opening 601 and the second opening 602 on the side wall of the heat insulation cover 60 can effectively prevent the condensate from dripping to the outside.

[0072] In this way, by setting a first opening 601 and a second opening 602 on the heat insulation cover 60 to allow the liquid inlet pipe 401 and the liquid outlet pipe 402 to pass through, there will be no structural interference between the heat insulation cover 60 and the expansion valve 50. By controlling the size of the first opening 601 and the second opening 602, the heat conduction between the external environment and the expansion valve 50 can be reduced, thus ensuring the heat insulation effect of the heat insulation cover 60.

[0073] In some embodiments, such as Figure 3 As shown, the heat insulation cover 60 includes a housing 603, which forms a receiving cavity 608; a cover 604, which covers the housing 603 and has a clearance opening 6041 for accommodating at least a portion of the expansion valve 50; and a wiring cover 605, which is disposed on the cover 604 and covers the clearance opening 6041. A wiring port 606 is formed on the side of the wiring cover 605 for accommodating an electrical connection wire connected to the expansion valve 50.

[0074] The housing 603 has a hollow structure to form the aforementioned receiving cavity 608. The thermal insulation mounting plate 80 and the expansion valve 50 can be disposed within the housing 603.

[0075] like Figure 3 As shown, the cover 604 can be a flat plate structure, and a clearance opening 6041 can be provided on the cover 604. The clearance opening 6041 is used to accommodate a portion of the expansion valve 50.

[0076] It should be noted that along the height direction of the insulation cover 60, the expansion valve 50 may have a certain height, and at least part of the expansion valve 50 may exceed the height of the box 603. In this way, the clearance opening 6041 can allow part of the expansion valve 50 to protrude out of the cover 604 and avoid interference with the cover 604.

[0077] like Figure 3 As shown, the cable tray cover 605 is detachably disposed on the cover body 604 and disposed at the clearance opening 6041. The cable tray cover 605 is used to close the clearance opening 6041 to reduce heat conduction between the interior of the insulation cover 60 and the external space. The cable tray cover 605 protrudes from the cover body 604 to cover the portion of the expansion valve 50 that extends beyond the cover body 604.

[0078] In some embodiments, the expansion valve 50 may be an electronic expansion valve 50. The electronic expansion valve 50 is connected to an electrical connection wire, which is used for power supply and transmission of electrical signals.

[0079] The cable tray cover 605 has a cable tray opening 606 on its side, through which the electrical connection cable can pass out of the insulation cover 60. The electrical connection cable is connected to the electronic expansion valve 50 through the cable tray opening 606, ensuring that the electrical connection cable is not subjected to excessive bending or compression when passing through the cable tray cover 605, thereby protecting the performance of the electrical connection cable.

[0080] When the expansion valve 50 needs maintenance, the wiring cover 605 can be removed from the cover 604 to inspect the expansion valve 50 and electrical connection wires without dismantling the entire insulation cover 60 structure. This not only improves the maintainability of the chip testing equipment 1000, but also extends the service life of the electrical connection wires and the electronic expansion valve 50.

[0081] In some embodiments, such as Figure 2 and Figure 3 As shown, the heat insulation cover 60 is also provided with an air inlet 607, which is connected to the receiving cavity 608. In addition, the chip testing equipment 1000 also includes a dry gas generator, the outlet of which is connected to the air inlet 607.

[0082] As mentioned earlier, the insulation cover 60, insulation layer 70, and insulation mounting plate 80 can all minimize condensation on the expansion valve 50. To further prevent condensation, the chip testing equipment 1000 is also equipped with a drying gas generator. This generator produces drying gas, which is injected into the insulation cover 60 through the air inlet 607. This reduces the internal humidity of the insulation cover 60, thereby further preventing the formation of condensate droplets.

[0083] Furthermore, the injection of dry gas can form a gas insulation layer 70 inside the insulation cover 60, which can further reduce the influence of the external ambient temperature on the internal temperature of the insulation cover 60. The reduction of condensate inside the insulation cover 60 can prevent corrosion of the expansion valve 50 caused by condensate, extend the service life of the expansion valve 50, and reduce maintenance costs.

[0084] In some embodiments, such as Figure 4 As shown, the inlet pipe 401 includes a main inlet pipe 4011 and multiple sub-inlet pipes 4012 connected to the main inlet pipe 4011. The outlet pipe 402 includes a main outlet pipe 4021 and multiple sub-outlet pipes 4022 connected to the main outlet pipe 4021. There are multiple expansion valves 50, each connected to one sub-inlet pipe 4012 and one sub-outlet pipe 4022.

[0085] Specifically, there can be multiple expansion valves 50. Multiple sub-inlet pipes 4012 branch off from the inlet pipe 401, and multiple sub-outlet pipes 4022 branch off from the outlet pipe 402, so that each expansion valve 50 can be connected to a sub-inlet pipe 4012 and a sub-outlet pipe 4022, to ensure that each expansion valve 50 can perform independent throttling operation.

[0086] Optionally, the number of expansion valves 50 can be four to ensure throttling efficiency of the refrigerant.

[0087] In some embodiments, the chip testing equipment 1000 further includes a support member 90, one end of which is connected to the bottom of the heat insulation cover 60, and the other end of which is connected to the frame 10 so that a clearance space is formed between the heat insulation cover 60 and the frame 10.

[0088] The support member 90 may be provided with mounting holes, so that the heat insulation cover 60 can be fixed to the frame 10 with screws. At the same time, since the support member 90 has a certain height, a clearance space is formed between the support member 90 and the frame 10.

[0089] Optionally, the clearance space can be used to install other structural components to utilize the space inside the rack 10 and ensure the compactness of the chip testing equipment 1000.

[0090] Optionally, no components may be installed in the clearance space to prevent the heat generated by the components during operation from affecting the insulation effect of the insulation cover 60.

[0091] In some embodiments, the testing apparatus further includes a heater. The heater is disposed within the testing chamber 201 and is used to heat the air within the testing chamber 201.

[0092] As mentioned earlier, the heater can be used for high-temperature testing of the chip. The heater is also located inside the test chamber 201, but it does not come into direct contact with the chip to avoid damaging it.

[0093] Although the cooler and heater are both located in the test chamber 201, the high-temperature test and the low-temperature test are not performed simultaneously. The chip test equipment 1000 can only start the high-temperature test or the low-temperature test after a period of time has passed since the low-temperature test or the high-temperature test ended, when the temperature in the test chamber 201 is close to the room temperature.

[0094] Alternatively, the heater can be a heating element such as an electric heating wire or a ceramic heater.

[0095] In some embodiments, such as Figure 1As shown, the chip testing equipment 1000 includes: a loading mechanism 100, which is disposed on the rack 10 and is used to feed the chip to be tested into the test chamber 20; and a unloading mechanism 110, which is disposed on the rack 10 and is used to transport the chip that has undergone performance testing.

[0096] Both the loading mechanism 100 and the unloading mechanism 110 are located on the frame 10. The loading mechanism 100 can be located on one side of the test chamber 20, and the unloading mechanism 110 can be located on the other side of the test chamber 20. The loading mechanism 100 is used to feed the chip to be tested into the test chamber 20, and the unloading mechanism 110 receives and transports the chip that has undergone performance testing.

[0097] The loading mechanism 100 and the unloading mechanism 110 may each include a conveyor chain that can enter the test chamber 20. The conveyor chain may be made of metal to adapt to temperature changes inside the test chamber 20.

[0098] In this way, transporting chips through the loading mechanism 100 and the unloading mechanism 110 not only ensures the safety and reliability of the chips during the loading and unloading process, but also improves the automation level and testing efficiency of the chip testing equipment 1000.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A chip testing device, characterized in that, include: frame; A test chamber is disposed on the rack, the test chamber including a test cavity for accommodating a chip for performance testing of the chip; A cooler is disposed in the test chamber, and the cooler is used to cool the chip or the air in the test chamber; A refrigeration unit is mounted on the frame, and the refrigeration unit includes a refrigerant pipeline for supplying refrigerant to the refrigerator. An expansion valve is installed in the refrigerant pipeline and located outside the test chamber; A heat insulation cover is disposed on the frame. The heat insulation cover includes a receiving cavity. The heat insulation cover covers the expansion valve, and the expansion valve is located inside the receiving cavity.

2. The chip testing equipment according to claim 1, characterized in that, The chip testing equipment also includes: A thermal insulation layer is disposed on the inner wall of the thermal insulation cover and / or the outer wall of the thermal insulation cover.

3. The chip testing equipment according to claim 1, characterized in that, The chip testing equipment also includes: A thermal insulation mounting plate is located inside the thermal insulation cover and at the bottom of the thermal insulation cover, and the expansion valve is disposed on the thermal insulation mounting plate.

4. The chip testing equipment according to claim 1, characterized in that, The chip testing equipment also includes: Multiple heat-insulating particles are filled in the internal space of the heat-insulating cover.

5. The chip testing equipment according to claim 1, characterized in that, The refrigerant piping includes an inlet pipe and an outlet pipe connected to the expansion valve, the outlet pipe being connected to the refrigerator, and the heat insulation cover including: The first opening allows the liquid inlet pipe to pass through the heat insulation cover. The second opening allows the liquid outlet pipe to pass through the heat insulation cover.

6. The chip testing equipment according to claim 1, characterized in that, The heat insulation cover includes: A box body that forms the receiving cavity; A cover body, the cover body being disposed on the box body, the cover body being provided with a clearance opening, the clearance opening being used to accommodate at least a portion of the expansion valve; A cable routing cover is disposed on the cover body and covers the clearance opening. A cable routing opening is formed on the side of the cable routing cover, and the cable routing opening is used to accommodate the electrical connection cable connected to the expansion valve.

7. The chip testing equipment according to claim 1, characterized in that, The heat insulation cover is provided with an air inlet, which is connected to the receiving cavity. The chip testing equipment further includes: A drying gas generator, wherein the outlet of the drying gas generator is connected to the inlet port.

8. The chip testing equipment according to claim 1, characterized in that, The refrigerant piping includes an inlet pipe and an outlet pipe. The inlet pipe includes a main inlet pipe and multiple sub-inlet pipes connected to the main inlet pipe. The outlet pipe includes a main outlet pipe and multiple sub-outlet pipes connected to the main outlet pipe. The number of expansion valves is multiple, and each expansion valve is connected to one of the sub-inlet pipes and one of the sub-outlet pipes.

9. The chip testing equipment according to claim 1, characterized in that, The chip testing equipment also includes: A support member, one end of which is connected to the bottom of the heat insulation cover, and the other end of which is connected to the frame to create a clearance space between the heat insulation cover and the frame.

10. The chip testing equipment according to any one of claims 1 to 9, characterized in that, The chip testing equipment also includes: A heater is disposed inside the test chamber and is used to heat the air inside the test chamber.

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