Flexible circuit board heat dissipation device with self-adaptive cooling function

Abstract

The utility model relates to the technical field of circuit board heat dissipation, in particular to a flexible circuit board heat dissipation device with a self-adaptive cooling function, which comprises a support and a circuit board main body, the support is provided with an air cooling assembly and a water cooling assembly which are used for heat dissipation of the circuit board main body, and the circuit board main body is provided with a support plate extending into the support. The support is of a concentric-square-shaped structure, and the air cooling assembly comprises a fan, a controller and a temperature detector which are fixedly installed on the support and electrically connected. According to the utility model, the fan and the two air pipes are arranged on the support, so that the heat energy radiated by the circuit board main body is discharged out of the support through the radiating holes, and the flowing speed of the heat energy is accelerated; the heat absorbing plate used for absorbing heat of the circuit board body is arranged on the support, the condenser pipe can dissipate heat of the heat absorbing plate through mutual cooperation of the water tank and the condenser, the airflow flowing speed can be increased through airflow blown out by the fan, and then the service life of the circuit board body is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of circuit board heat dissipation technology, and in particular to a flexible circuit board heat dissipation device with adaptive cooling function. Background Technology

[0002] Flexible printed circuit boards (FPCBs) are printed circuits made from flexible insulating substrates. Flexible circuits offer excellent electrical performance, meet the design requirements for smaller and higher density installations, and also help reduce assembly steps and enhance reliability.

[0003] Flexible circuit boards (PCBs) incorporate integrated components. However, as the number of integrated components increases, the PCBs generate a significant amount of heat during operation. To dissipate heat, fans are installed on one side of the PCB. However, the airflow from the fans can only reach the surface of the PCB, and the cooling speed of air cooling is limited. This results in the heat generated by the PCB during operation not being dissipated quickly, thus affecting the lifespan of the PCB. Summary of the Invention

[0004] The purpose of this invention is to solve the problem of slow heat dissipation of flexible circuit boards during operation in the prior art, and to propose a heat dissipation device for flexible circuit boards with adaptive cooling function.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A flexible circuit board heat dissipation device with adaptive cooling function includes a support and a circuit board body. The support is equipped with air-cooling components and water-cooling components for dissipating heat from the circuit board body.

[0007] Preferably, the circuit board body is provided with a support plate extending into the support, and the support has a U-shaped structure.

[0008] Preferably, the air-cooling assembly includes a fan, a controller, and a temperature detector that are fixedly installed on the support and electrically connected, and the fan has two air ducts extending into the support.

[0009] Preferably, the air duct is horizontally positioned on both sides of the circuit board body, and the support has heat dissipation holes corresponding to the air duct.

[0010] Preferably, the water-cooling assembly includes a heat-absorbing plate fixedly installed on a support, a water tank and a condenser fixedly installed on the support, and a delivery pipe and a condensation pipe are provided between the water tank and the condenser.

[0011] Preferably, the heat-absorbing plate is horizontally positioned below the main body of the circuit board, and the condenser tube has an arc-shaped structure.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. This utility model provides a fan and two air ducts on the support. When the air ducts are opened, the airflow can dissipate heat from both sides of the circuit board body, and the heat dissipated by the circuit board body can be discharged to the outside of the support through the heat dissipation holes, thereby accelerating the flow of heat energy.

[0014] 2. This utility model provides a heat-absorbing plate on the support to absorb heat from the circuit board body. The condenser tube can dissipate heat from the heat-absorbing plate through the cooperation of the water tank and the condenser. The airflow blown out by the fan can accelerate the airflow speed, thereby improving the service life of the circuit board body. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a flexible circuit board heat dissipation device with adaptive cooling function proposed in this utility model.

[0016] Figure 2 This is a rear view of a flexible circuit board heat dissipation device with adaptive cooling function proposed in this utility model.

[0017] Figure 3 This is a bottom view of a flexible circuit board heat dissipation device with adaptive cooling function proposed in this utility model;

[0018] Figure 4 This is a cross-sectional view of a flexible circuit board heat dissipation device with adaptive cooling function proposed in this utility model.

[0019] In the diagram: 1. Support; 2. Circuit board body; 3. Support plate; 4. Fan; 5. Controller; 6. Temperature detector; 7. Heat dissipation hole; 8. Heat absorption plate; 9. Water tank; 10. Condenser; 11. Delivery pipe; 12. Condenser pipe. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figures 1-4A flexible circuit board heat dissipation device with adaptive cooling function includes a support 1 and a circuit board body 2. The circuit board body 2 is provided with a support plate 3 extending into the support 1. The support 1 has a U-shaped structure. Air-cooling components and water-cooling components for dissipating heat from the circuit board body 2 are installed on the support 1. By setting air-cooling components and water-cooling components on the support 1, the circuit board body 2 can dissipate heat through air cooling and water flow during operation. The controller 5 can send opening and closing commands to the fan 4, water tank 9, and condenser 10. This technical solution is existing technology and will not be elaborated on here.

[0022] The air-cooled assembly includes a fan 4, a controller 5, and a temperature detector 6, which are fixedly installed on the support 1 and electrically connected. Two air ducts extending into the support 1 are installed on the fan 4. The air ducts are horizontally arranged on both sides of the circuit board body 2, and the support 1 is provided with heat dissipation holes 7 corresponding to the air ducts.

[0023] Temperature detector 6 can monitor the temperature of circuit board body 2. When the temperature of circuit board body 2 is within the specified threshold, temperature detector 6 sends a command to controller 5, causing controller 5 to send a signal to fan 4, causing fan 4 to turn on and allow airflow to be discharged through two air ducts. The airflow blows to the surface and bottom of circuit board body 2, allowing the heat energy on circuit board body 2 to be discharged outside support 1 through heat dissipation holes 7.

[0024] The water-cooled assembly includes a heat-absorbing plate 8 fixedly installed on a support 1. A water tank 9 and a condenser 10 are fixedly installed on the support 1. A delivery pipe 11 and a condensing pipe 12 are provided between the water tank 9 and the condenser 10. The heat-absorbing plate 8 is horizontally positioned below the circuit board body 2. The condensing pipe 12 has an arc-shaped structure.

[0025] When the temperature of the circuit board body 2 exceeds the specified threshold, a signal is immediately sent to the controller 5. The controller 5 sends instructions to the fan 4, water tank 9, and condenser 10. The airflow discharged from the duct can dissipate heat from the circuit board body 2. At the same time, the cold water in the condenser pipe 12 can cool the heat absorption plate 8. The heat energy is discharged from the support 1 through the heat dissipation hole 7 through the airflow.

[0026] It should be noted that the specific models and specifications of the fan 4, controller 5, temperature detector 6, water tank 9, and condenser 10 need to be selected and determined according to the actual specifications of the device. The specific selection and calculation methods adopt existing technology in this field, so they will not be elaborated here.

[0027] The functional principle of this utility model can be explained through the following operation methods:

[0028] When the components on the circuit board body 2 are running, the temperature rises immediately, and the temperature detector 6 monitors the temperature of the circuit board body 2.

[0029] When the temperature of the circuit board body 2 is within the specified threshold, it immediately sends a signal to the controller 5. The controller 5 then sends a command to the fan 4 to turn on the fan 4 and blow cold air through the air duct onto the circuit board body 2. The heat energy on the circuit board body 2 is discharged from the support 1 through the heat dissipation hole 7.

[0030] When the temperature of the circuit board body 2 exceeds the specified threshold, the heat absorption plate 8 absorbs the heat energy dissipated by the circuit board body 2 and immediately sends a signal to the controller 5. The controller 5 sends a signal to the water tank 9 and the condenser 10. The water in the water tank 9 enters the condenser 10 through the delivery pipe 11. After the water in the condenser 10 is cooled, it enters the condenser pipe 12. The cold air dissipated by the condenser 10 can cool the heat absorption plate 8. The continuous operation of the fan 4 causes the heat energy absorbed by the heat absorption plate 8 to be quickly discharged to the outside of the support 1 through the heat dissipation hole 7.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A flexible circuit board heat dissipation device with adaptive cooling function, comprising a support (1) and a circuit board body (2), characterized in that, The support (1) is equipped with air-cooled components and water-cooled components for dissipating heat from the circuit board body (2).

2. The flexible circuit board heat dissipation device with adaptive cooling function according to claim 1, characterized in that, The circuit board body (2) is provided with a support plate (3) extending into the support (1), and the support (1) is a U-shaped structure.

3. The flexible circuit board heat dissipation device with adaptive cooling function according to claim 1, characterized in that, The air-cooled assembly includes a fan (4), a controller (5), and a temperature detector (6) that are fixedly installed on the support (1) and electrically connected. Two air ducts extending into the support (1) are installed on the fan (4).

4. A flexible circuit board heat dissipation device with adaptive cooling function according to claim 3, characterized in that, The air duct is horizontally positioned on both sides of the circuit board body (2), and the support (1) is provided with heat dissipation holes (7) corresponding to the air duct.

5. A flexible circuit board heat dissipation device with adaptive cooling function according to claim 1, characterized in that, The water-cooling assembly includes a heat-absorbing plate (8) fixedly installed on a support (1). A water tank (9) and a condenser (10) are fixedly installed on the support (1). A delivery pipe (11) and a condenser pipe (12) are provided between the water tank (9) and the condenser (10).

6. A flexible circuit board heat dissipation device with adaptive cooling function according to claim 5, characterized in that, The heat absorption plate (8) is horizontally positioned below the circuit board body (2), and the condenser tube (12) has an arc-shaped structure.

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