Surface mounting device for surface mounting equipment and surface mounting equipment

Abstract

The utility model provides a surface mounting device for surface mounting equipment and the surface mounting equipment, the surface mounting device comprises a first connecting end and a first mounting end, and the first connecting end is used for connecting an air pressure device of the surface mounting equipment; the first mounting end at least comprises a first suction nozzle and a second suction nozzle, the first suction nozzle and the second suction nozzle are arranged at an interval, the first suction nozzle and the second suction nozzle are connected with the first connecting end through a first channel, and the air pressure device is used for changing the air pressure in the first channel so that the first suction nozzle and the second suction nozzle can suck or release electronic elements. According to the embodiment of the invention, at least the first suction nozzle and the second suction nozzle are arranged at the first mounting end, so that when the combined connector for the domain controller is mounted, two vehicle-mounted connectors of the combined connector can be sucked at the same time through the first suction nozzle and the second suction nozzle; it is ensured that the two vehicle-mounted connectors in the combined connector do not generate relative displacement in the moving process, and the combined connector can be accurately placed at the mounting position of the circuit board, so that the mounting qualification rate of the vehicle-mounted connectors is improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of mechanical equipment, and in particular to a mounting device for a patching device and the patching device. BACKGROUND

[0002] The intelligent cabin domain controller is a key component in the intelligent automobile electronic architecture. The intelligent cabin domain controller is an integrated electronic control unit that is responsible for managing and coordinating multiple subsystems and functions in the intelligent cabin. The intelligent cabin domain controller integrates and centrally controls tasks that were originally dispersed and handled by different single controllers, thereby achieving efficient collaborative operation and providing users with intelligent and comfortable in-vehicle experiences.

[0003] To complete centralized management and efficient control of intelligent cabin functions, the domain controller needs to rely on accurate and rapid data transmission with other automotive devices. The data transmission path between the domain controller and other automotive devices is constructed through a vehicle-mounted connector.

[0004] Currently, the vehicle-mounted connector for the domain controller is a combined connector composed of two vehicle-mounted connectors. However, when the combined connector is mounted, the two vehicle-mounted connectors will move relative to each other, resulting in inaccurate mounting positions and thus unqualified mounting. CONTENT OF THE INVENTION

[0005] To solve the above problems, embodiments of the present application provide a mounting device for a patching device and the patching device to at least partially solve the above problems.

[0006] According to a first aspect of the embodiments of the present application, a mounting device for a patching device is provided, comprising a first connection end and a first mounting end. The first connection end is used to connect a pneumatic device of the patching device. The first mounting end comprises at least a first suction nozzle and a second suction nozzle. The first suction nozzle and the second suction nozzle are arranged at intervals, and the first suction nozzle and the second suction nozzle are connected to the first connection end through a first channel. The pneumatic device is used to change the air pressure in the first channel, so that the first suction nozzle and the second suction nozzle can suck or release electronic components.

[0007] In an optional implementation, the first mounting end further comprises a third suction nozzle and a fourth suction nozzle. The third suction nozzle and the fourth suction nozzle are connected to the first connection end through the first channel. The first suction nozzle, the second suction nozzle, the third suction nozzle, and the fourth suction nozzle are all arranged at intervals and in a row.

[0008] In an optional implementation, the third suction nozzle is arranged on the side of the first suction nozzle away from the second suction nozzle. The distance between the first suction nozzle and the third suction nozzle is greater than the distance between the first suction nozzle and the second suction nozzle.

[0009] In an optional implementation, the fourth suction nozzle is arranged on the side of the second suction nozzle away from the first suction nozzle, and the distance between the second suction nozzle and the fourth suction nozzle is greater than the distance between the first suction nozzle and the second suction nozzle.

[0010] In an optional implementation, the outer part of the first suction nozzle is provided with a rubber sleeve, the first end of the rubber sleeve is sleeved on the outer wall of the first suction nozzle, and the second end of the rubber sleeve is used to contact the electronic component, and the contact area of the second end with the electronic component is greater than the contact area of the first suction nozzle with the electronic component.

[0011] In an optional implementation, the first suction nozzle is in a cylindrical shape, and the second end of the rubber sleeve is in a horn shape, and the diameter of the second end is greater than the diameter of the first end.

[0012] In an optional implementation, the first mounting end further comprises a limiting part, and the limiting part is arranged between the first suction nozzle and the second suction nozzle, and in the height direction of the first suction nozzle, the height of the limiting part is the same as that of the first suction nozzle.

[0013] In an optional implementation, the mounting device is made by an integral molding process.

[0014] According to a second aspect of the embodiments of the present application, a mounting device for a patch equipment is provided, comprising a second connecting end and a second mounting end, the second connecting end is used to connect the equipment main body of the patch equipment, the second mounting end comprises a first mounting clamp and a second mounting clamp, the first mounting clamp and the second mounting clamp are perpendicular to each other, and the electronic component can be clamped or released through the cooperation of the first mounting clamp and the second mounting clamp.

[0015] According to a third aspect of the embodiments of the present application, a patch equipment is provided, comprising: an equipment main body; the mounting device as described in the first aspect, and the equipment main body is provided with a gas pressure device; or the mounting device as described in the second aspect.

[0016] According to the mounting device for the patch equipment and the patch equipment provided by the embodiments of the present application, the mounting device comprises a first connecting end and a first mounting end, the first connecting end is used to connect the gas pressure device of the patch equipment, the first mounting end comprises at least a first suction nozzle and a second suction nozzle, the first suction nozzle and the second suction nozzle are arranged at intervals, and the first suction nozzle and the second suction nozzle are connected with the first connecting end through a first channel, the gas pressure device is used to change the air pressure in the first channel, so that the first suction nozzle and the second suction nozzle can suck or release the electronic component. According to the embodiments of the present application, at least the first suction nozzle and the second suction nozzle are arranged on the first mounting end, so that when the combined connector for the domain controller is mounted, the two vehicle connectors of the combined connector can be sucked by the first suction nozzle and the second suction nozzle at the same time, the relative displacement of the two vehicle connectors in the combined connector during movement is avoided, and the combined connector can be accurately placed at the mounting position of the circuit board, so as to improve the mounting qualification rate of the vehicle connector.

[0017] In another embodiment, the second connecting end can connect the device body of the patch device; the second mounting end is provided with a first mounting clip and a second mounting clip, the first mounting clip and the second mounting clip are perpendicular to each other, and the electronic component can be clamped or released through cooperation of the first mounting clip and the second mounting clip. In this embodiment, the two vehicle connectors of the combined connector can be simultaneously clamped through cooperation of the first mounting clip and the second mounting clip, the relative displacement of the two vehicle connectors in the combined connector during movement is prevented, and the combined connector can be accurately placed at the mounting position of the circuit board, thereby improving the mounting qualification rate of the vehicle connector. BRIEF DESCRIPTION OF DRAWINGS

[0018] The following drawings are merely intended to schematically illustrate and explain the present application and do not limit the scope of the present application. In the drawings,

[0019] Figure 1 is a structural schematic view of a mounting device for a patch device according to an exemplary embodiment of the present application;

[0020] Figure 2 is a bottom view of a mounting device for a patch device according to an exemplary embodiment of the present application;

[0021] Figure 3 is a structural schematic view of a mounting device for a patch device according to another exemplary embodiment of the present application;

[0022] Explanation of Reference Signs:

[0023] 11, first connecting end;

[0024] 121, first suction nozzle; 122, second suction nozzle; 123, third suction nozzle; 124, fourth suction nozzle; 125, rubber sleeve; 126, limiting portion;

[0025] 21, second connecting end;

[0026] 221, first mounting clip; 222, second mounting clip. DETAILED DESCRIPTION

[0027] In order to have a clearer understanding of the technical features, objects and effects of the embodiments of the present application, the specific implementation manners of the embodiments of the present application will be described with reference to the drawings.

[0028] In this document, "schematic" means "serves as an example, an instance or an illustration", and any illustration or embodiment described as "schematic" in this document should not be interpreted as a more preferred or more advantageous technical solution.

[0029] In order to make the drawing simple, only the part related to the application is shown in the drawing, which does not represent the actual structure of the product. In addition, in order to make the drawing simple and easy to understand, in some drawings, only one or more of the components with the same structure or function are shown, or only one or more of them are marked.

[0030] Before describing the mounting device for the patch device according to the embodiments of the present application, the application scenario of the mounting device for the patch device is briefly described to facilitate understanding.

[0031] SMT patch (Surface Mount Technology) is a modern electronic assembly technology, widely used in electronic manufacturing industry. It is to directly mount electronic components (such as resistors, capacitors, chips, etc.) on the surface of printed circuit board (PCB) at the specified position, and through reflow soldering process to form reliable electrical and mechanical connection between the components and the pads on the PCB. Compared with the traditional through-hole mounting technology, SMT patch has many advantages such as small size, light weight, high integration, high reliability, high production efficiency, etc. The specific process flow of SMT patch is as follows:

[0032] 1) Printing tin paste: using tin paste printer to print tin paste (a paste-like substance made of alloy solder powder and flux, etc.) on the corresponding pads of PCB according to the pad pattern designed by PCB.

[0033] 2) Electronic component mounting: completed by patch machine. There are different types of patch machines such as high-speed patch machine and multifunctional patch machine, which can be selected according to the type, size and mounting accuracy requirements of electronic components. The suction nozzle of the patch machine will suck the corresponding electronic components and accurately place them on the PCB board according to the program setting.

[0034] 3) Reflow soldering: this is the key step to form a reliable solder joint between the electronic components and the PCB. The PCB with mounted components is sent into the reflow soldering furnace, and the PCB is heated in the furnace to melt the tin paste, and then cooled and solidified, so as to form a firm solder joint between the pins of the electronic components and the pads of the PCB.

[0035] In the automotive industry, the intelligent cockpit domain controller builds data transmission paths with other automotive devices through vehicle connectors, and the installation of vehicle connectors also adopts SMT patch technology.

[0036] The intelligent cockpit domain controller is a key component in the intelligent automobile electronic architecture. The intelligent cockpit domain controller is an integrated electronic control unit responsible for managing and coordinating multiple subsystems and functions within the intelligent cockpit. It integrates and centrally controls tasks that were originally handled by different single controllers, enabling efficient collaboration and providing users with intelligent and comfortable in-car experiences.

[0037] To complete the centralized management and efficient control of intelligent cockpit functions, the domain controller needs to rely on accurate and fast data transmission with other automotive devices. The data transmission path between the domain controller and other automotive devices is built through the vehicle connector.

[0038] Currently, the vehicle connector for the domain controller is a combined connector composed of two vehicle connectors. However, when the combined connector is mounted, relative displacement occurs between the two vehicle connectors, resulting in inaccurate mounting position and further leading to mounting failure. In view of this, the present application proposes a mounting device for a patching equipment and a patching equipment, which can solve the above problems existing in the prior art.

[0039] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0040] Referring to Figures 1 to 2 The mounting device for the patching equipment of the present embodiment includes a first connection end 11 and a first mounting end.

[0041] The first connection end 11 is used to connect the air pressure device of the patching equipment. The first mounting end includes at least a first suction nozzle 121 and a second suction nozzle 122. The first suction nozzle 121 and the second suction nozzle 122 are arranged at intervals, and the first suction nozzle 121 and the second suction nozzle 122 are connected to the first connection end 11 through a first channel. The air pressure device is used to change the air pressure in the first channel, so that the first suction nozzle 121 and the second suction nozzle 122 can suck or release electronic components.

[0042] Exemplarily, the patch device can be a patch machine, which includes different types such as high-speed patch machines and multifunctional patch machines, and can be selected according to the types, sizes and mounting precision requirements of electronic components, and the present embodiment does not limit this. The patch device can be provided with a gas pressure device, such as a vacuum pump, etc., and the gas pressure of the first mounting end can be changed through the gas pressure device. The first mounting end can include a plurality of suction nozzles, such as the first suction nozzle 121 and the second suction nozzle 122, which are arranged at intervals and can simultaneously suck two electronic components (one electronic component is sucked by the first suction nozzle 121 and the second suction nozzle 122 respectively), to ensure that there is no relative displacement between the two electronic components. Moreover, the first suction nozzle 121 and the second suction nozzle 122 are connected with the first connecting end 11 through the first channel, and the gas pressure in the first channel can be changed through the gas pressure device, so that the first suction nozzle 121 and the second suction nozzle 122 can suck or release electronic components.

[0043] Specifically, taking the first suction nozzle 121 as an example, when the first suction nozzle 121 needs to suck an electronic component, the gas pressure device will reduce the gas pressure inside the first channel to form a negative pressure environment. For example, a part of the air in the first channel is extracted through a device such as a vacuum pump, so that the gas pressure at the first suction nozzle 121 is lower than the atmospheric pressure outside, thereby generating a pressure difference between the first suction nozzle 121 and the surface of the electronic component, and promoting the electronic component to be adsorbed to the end of the first suction nozzle 121.

[0044] When the first suction nozzle 121 moves the electronic component to the mounting position on the circuit board and is ready to be placed, the gas pressure device can stop the air extraction operation, and the gas pressure in the first channel can be restored by filling a certain amount of air into the first suction nozzle 121, etc., to eliminate the negative pressure environment. In this way, the electronic component adsorbed on the end of the first suction nozzle 121 will naturally fall off due to the loss of adsorption force, and will be stably placed on the pad of the circuit board to realize subsequent mounting operation.

[0045] The mounting device for the patch device in the embodiment comprises a first connecting end 11 and a first mounting end. The first connecting end 11 is used for connecting the air pressure device of the patch device. The first mounting end comprises at least a first suction nozzle 121 and a second suction nozzle 122. The first suction nozzle 121 and the second suction nozzle 122 are arranged at intervals, and the first suction nozzle 121 and the second suction nozzle 122 are connected with the first connecting end 11 through a first channel. The air pressure device is used for changing the air pressure in the first channel, so that the first suction nozzle 121 and the second suction nozzle 122 can suck or release electronic components. In the embodiment, at least the first suction nozzle 121 and the second suction nozzle 122 are arranged in the first mounting end. When mounting the combined connector for the domain controller, the first suction nozzle 121 and the second suction nozzle 122 can simultaneously suck two vehicle connectors of the combined connector, so that the two vehicle connectors in the combined connector will not relatively displace during movement, and the combined connector can be accurately placed at the mounting position of the circuit board, thereby avoiding the problem that the combined connector is floated after mounting due to misalignment between the combined connector and the mounting position on the circuit board, and improving the mounting qualification rate of the vehicle connector.

[0046] In an optional implementation, the first mounting end further comprises a third suction nozzle 123 and a fourth suction nozzle 124. The third suction nozzle 123 and the fourth suction nozzle 124 are connected with the first connecting end 11 through the first channel. The first suction nozzle 121, the second suction nozzle 122, the third suction nozzle 123 and the fourth suction nozzle 124 are arranged at intervals and in a row.

[0047] Exemplarily, referring to Figure 1 and Figure 2 , the first mounting end further comprises a third suction nozzle 123 and a fourth suction nozzle 124. The third suction nozzle 123 and the fourth suction nozzle 124 are connected with the first connecting end 11 through the first channel. The first suction nozzle 121, the second suction nozzle 122, the third suction nozzle 123 and the fourth suction nozzle 124 are arranged at intervals and in a row.

[0048] In the implementation, by increasing the third suction nozzle 123 and the fourth suction nozzle 124, and arranging the first suction nozzle 121, the second suction nozzle 122, the third suction nozzle 123 and the fourth suction nozzle 124 at intervals and in a row, when mounting the combined connector for the domain controller, one vehicle connector of the combined connector can be sucked by each of the two suction nozzles, so that the stability of the suction of the vehicle connector is improved, thereby further ensuring that the two vehicle connectors in the combined connector will not relatively displace during movement, and improving the mounting qualification rate of the vehicle connector.

[0049] In an optional implementation, the third suction nozzle 123 is arranged on the side of the first suction nozzle 121 away from the second suction nozzle 122, and the distance between the first suction nozzle 121 and the third suction nozzle 123 is greater than the distance between the first suction nozzle 121 and the second suction nozzle 122.

[0050] For example, referring to Figure 1 and Figure 2 , the third suction nozzle 123 can be arranged on the side of the first suction nozzle 121 away from the second suction nozzle 122. When the combined connector for the domain controller is attached, the first suction nozzle 121 and the second suction nozzle 122 respectively suck one vehicle-mounted connector in the combined connector, that is, the fitting joint between the two vehicle-mounted connector devices is located between the first suction nozzle 121 and the second suction nozzle 122, and the third suction nozzle 123 sucks the same vehicle-mounted connector as the first suction nozzle 121. The distance between the first suction nozzle 121 and the third suction nozzle 123 can be greater than the distance between the first suction nozzle 121 and the second suction nozzle 122, that is, the distance between the first suction nozzle 121 and the second suction nozzle 122 is small, so as to ensure the stability of the fitting joint between the two vehicle-mounted connector devices, and the distance between the first suction nozzle 121 and the third suction nozzle 123 is large, so as to improve the balance of the vehicle-mounted connector adsorption.

[0051] In an optional implementation, the fourth suction nozzle 124 is arranged on the side of the second suction nozzle 122 away from the first suction nozzle 121, and the distance between the second suction nozzle 122 and the fourth suction nozzle 124 is greater than the distance between the first suction nozzle 121 and the second suction nozzle 122.

[0052] For example, referring to Figure 1 and Figure 2 , the fourth suction nozzle 124 can be arranged on the side of the second suction nozzle 122 away from the first suction nozzle 121. When the combined connector for the domain controller is attached, the first suction nozzle 121 and the second suction nozzle 122 respectively suck one vehicle-mounted connector in the combined connector, that is, the fitting joint between the two vehicle-mounted connector devices is located between the first suction nozzle 121 and the second suction nozzle 122, and the fourth suction nozzle 124 sucks the same vehicle-mounted connector as the second suction nozzle 122. The distance between the second suction nozzle 122 and the fourth suction nozzle 124 can be greater than the distance between the first suction nozzle 121 and the second suction nozzle 122, that is, the distance between the first suction nozzle 121 and the second suction nozzle 122 is small, so as to ensure the stability of the fitting joint between the two vehicle-mounted connector devices, and the distance between the second suction nozzle 122 and the fourth suction nozzle 124 is large, so as to improve the balance of the vehicle-mounted connector adsorption.

[0053] In an optional implementation, the outer part of the first suction nozzle 121 is provided with a rubber sleeve 125, the first end of the rubber sleeve 125 is sleeved on the outer wall of the first suction nozzle 121, and the second end of the rubber sleeve 125 is used to contact the electronic component, and the contact area between the second end of the rubber sleeve 125 and the electronic component is greater than the contact area between the first suction nozzle 121 and the electronic component.

[0054] With reference to Figure 1 and Figure 2 , the outer part of the first suction nozzle 121 is provided with a rubber sleeve 125, the first end of the rubber sleeve 125 is sleeved on the outer wall of the first suction nozzle 121, and the second end of the rubber sleeve 125 is used to contact the electronic component, and the contact area between the second end of the rubber sleeve 125 and the electronic component is greater than the contact area between the first suction nozzle 121 and the electronic component.

[0055] It should be noted that the second suction nozzle 122, the third suction nozzle 123 and the fourth suction nozzle 124 in the embodiment can be provided with the rubber sleeve 125, and the embodiment does not limit this.

[0056] In an optional implementation, the first suction nozzle 121 is in a cylindrical shape, and the second end of the rubber sleeve 125 is in a horn shape, and the diameter of the second end is greater than the diameter of the first end.

[0057] Exemplarily, with reference to Figure 1 and Figure 2 , the first suction nozzle 121 can be in a cylindrical shape, the first end of the rubber sleeve 125 can also be in a cylindrical shape, and the second end of the rubber sleeve 125 can be in a horn shape, and the diameter of the second end of the rubber sleeve 125 is greater than the diameter of the first end, so that when the electronic component is sucked, the second end of the rubber sleeve 125 contacts the electronic component, and the suction area of the first suction nozzle 121 to the electronic component can be increased, and the suction force can be improved.

[0058] In an optional implementation, the first mounting end further comprises a limiting part 126, the limiting part 126 is arranged between the first suction nozzle 121 and the second suction nozzle 122, and in the height direction of the first suction nozzle 121, the height of the limiting part 126 is the same as the height of the first suction nozzle 121.

[0059] Exemplarily, with reference to Figure 1 , the first mounting end can further comprise a limiting part 126, the limiting part 126 can be arranged between the first suction nozzle 121 and the second suction nozzle 122, that is, when the two vehicle connectors of the combined connector are simultaneously sucked by the first suction nozzle 121 and the second suction nozzle 122, the limiting part 126 is located at the matching joint between the two vehicle connectors. And in the height direction of the first suction nozzle 121 (or the second suction nozzle 122), the height of the limiting part 126 can be the same as the height of the first suction nozzle 121.

[0060] In the present implementation, by setting the limiting portion 126 between the first suction nozzle 121 and the second suction nozzle 122, and setting the height of the limiting portion 126 to be the same as that of the first suction nozzle 121, when the combined connector for the domain controller is attached, the limiting portion 126 is located at the fitting joint between the two vehicle connectors of the combined connector when the first suction nozzle 121 and the second suction nozzle 122 simultaneously suck the two vehicle connectors, and the movement of the two vehicle connectors in the height direction of the first suction nozzle 121 is limited by the limiting portion 126, that is, the relative displacement of the two vehicle connectors in the height direction of the first suction nozzle 121 under the action of the suction force of the suction nozzle is prevented, and it is further ensured that the two vehicle connectors will not be relatively displaced during the attachment process, thereby improving the attachment qualification rate of the vehicle connector.

[0061] In an optional implementation, the attachment device is made of an integral molding process.

[0062] For example, the attachment device can be made of an integral molding process, and the material thereof can be made of a material with wear resistance, high temperature resistance, and certain flexibility, such as ceramic, tungsten steel, plastic, etc. Ceramic has good wear resistance and insulation, and is suitable for high-precision and high-frequency attachment operations; tungsten steel has high hardness and strong wear resistance, and can cope with some components with hard texture or rough surface.

[0063] In the present implementation, the attachment device is made of an integral molding process, which is convenient for mass production, and can ensure the airtightness of the interior, thereby improving the efficiency of the air pressure device in changing the air pressure of the first channel and reducing energy consumption, etc.

[0064] According to a second aspect of the present application, an attachment device for a paster device is provided, which comprises a second connecting end 21 and a second mounting end.

[0065] The second connecting end 21 is used to connect the device body of the paster device; the second mounting end comprises a first mounting clamp 221 and a second mounting clamp 222, the first mounting clamp 221 and the second mounting clamp 222 are perpendicular to each other, and the electronic component can be clamped or released through cooperation of the first mounting clamp 221 and the second mounting clamp 222.

[0066] For example, with reference to Figure 2 Figure 1 Figure 3The patch device can be a patch machine, which includes different types such as a high-speed patch machine and a multifunctional patch machine, and can be selected according to the type, size and mounting precision requirement of the electronic component, and the embodiment is not limited in this regard. The device main body can refer to the part of the patch machine except the mounting device. The second connecting end 21 can be connected to the device main body of the patch device, and the connection mode can be detachable connection, such as bolt connection, and the embodiment is not limited in this regard. The second mounting end can include a first mounting clamp 221 and a second mounting clamp 222, and the first mounting clamp 221 and the second mounting clamp 222 can be grabbing clamps that are stretched or reduced by an automatic control device. The first mounting clamp 221 and the second mounting clamp 222 can be arranged perpendicular to each other, and the electronic component can be clamped or released by cooperation of the first mounting clamp 221 and the second mounting clamp 222.

[0067] In the embodiment of the application, the first connecting end can be connected to the device main body of the patch device; the first mounting end is provided with a first mounting clamp 221 and a second mounting clamp 222, and the first mounting clamp 221 and the second mounting clamp 222 are perpendicular to each other, and the electronic component can be clamped or released by cooperation of the first mounting clamp 221 and the second mounting clamp 222. The embodiment can simultaneously clamp the two vehicle connectors of the combined connector by cooperation of the first mounting clamp 221 and the second mounting clamp 222, ensure that the two vehicle connectors in the combined connector do not relatively displace during movement, and accurately place the combined connector at the mounting position of the circuit board, thereby improving the mounting qualification rate of the vehicle connector.

[0068] According to a third aspect of the embodiment of the application, a patch device is provided, which includes: a device main body; the mounting device as described in the first aspect, and the device main body is provided with a gas pressure device; or the mounting device as described in the second aspect.

[0069] The patch device of the embodiment can be provided with the mounting device as described in the first aspect, and the device main body is provided with a gas pressure device. The mounting device includes a first connecting end and a first mounting end, the first connecting end is used to connect the gas pressure device of the patch device; the first mounting end includes at least a first suction nozzle and a second suction nozzle, the first suction nozzle and the second suction nozzle are arranged at intervals, and the first suction nozzle and the second suction nozzle are connected to the first connecting end through a first channel. The gas pressure device is used to change the air pressure in the first channel, so that the first suction nozzle and the second suction nozzle can clamp or release the electronic component. According to the embodiment of the application, when the combined connector for the domain controller is mounted, the two vehicle connectors of the combined connector can be clamped by the first suction nozzle and the second suction nozzle at the same time, so that the two vehicle connectors in the combined connector do not relatively displace during movement, and the combined connector can be accurately placed at the mounting position of the circuit board, thereby improving the mounting qualification rate of the vehicle connector.

[0070] The patch device of the embodiment can also be provided with the mounting device as described in the second aspect, and the second connecting end of the mounting device can be connected to the device main body of the patch device; the second mounting end is provided with the first mounting clamp and the second mounting clamp, the first mounting clamp and the second mounting clamp are perpendicular to each other, and the electronic component can be clamped or released through cooperation of the first mounting clamp and the second mounting clamp. The two vehicle connectors of the combined connector can be simultaneously clamped through cooperation of the first mounting clamp and the second mounting clamp, the relative displacement of the two vehicle connectors in the combined connector during movement is prevented, and the combined connector can be accurately placed at the mounting position of the circuit board, thereby improving the mounting qualification rate of the vehicle connector.

[0071] It should be noted that unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing specific embodiments only and is not intended to be limiting of the application.

[0072] It should be noted that although the specific embodiments of the application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the application. Various modifications and variations of the embodiments described in the scope of the claims can be made by those skilled in the art without creative labor, which still belong to the scope of protection of the application.

[0073] It should be understood that although the present specification is described in terms of various embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be combined appropriately to form other embodiments that can be understood by those skilled in the art.

[0074] The examples of the embodiments of the application are intended to simply illustrate the technical features of the embodiments of the application, so that those skilled in the art can intuitively understand the technical features of the embodiments of the application, and not as improper limitation of the embodiments of the application.

[0075] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A mounting apparatus for a chip mounting machine, characterized in that, The first connecting end (11) is used for connecting a gas pressure device of a patch device. The first mounting end further comprises a third suction nozzle (123) and a fourth suction nozzle (124), and the third suction nozzle (123) and the fourth suction nozzle (124) are connected with the first connecting end (11) through the first channel. The third suction nozzle (123) is arranged on the side of the first suction nozzle (121) away from the second suction nozzle (122), and the distance between the first suction nozzle (121) and the third suction nozzle (123) is greater than the distance between the first suction nozzle (121) and the second suction nozzle (122).

2. The pick-and-place apparatus for a patch device according to claim 1, wherein, The fourth suction nozzle (124) is arranged on the side of the second suction nozzle (122) away from the first suction nozzle (121), and the distance between the second suction nozzle (122) and the fourth suction nozzle (124) is greater than the distance between the first suction nozzle (121) and the second suction nozzle (122).

3. The pick-and-place apparatus for a patch device of claim 2, wherein, The first suction nozzle (121) is provided with a rubber sleeve (125), a first end of the rubber sleeve (125) is sleeved on the outer wall of the first suction nozzle (121), and a second end of the rubber sleeve (125) is used for contacting the electronic element, and the contact area of the second end with the electronic element is greater than the contact area of the first suction nozzle (121) with the electronic element.

4. The pick-and-place apparatus for a patch device of claim 3, wherein, The first suction nozzle (121) is cylindrical, the second end of the rubber sleeve (125) is horn-shaped, and the diameter of the second end is greater than the diameter of the first end.

5. The pick-and-place apparatus for patch devices of claim 1, wherein, The first mounting end further comprises a limiting portion (126), and the limiting portion (126) is arranged between the first suction nozzle (121) and the second suction nozzle (122) in the height direction of the first suction nozzle (121), and the height of the limiting portion (126) is the same as that of the first suction nozzle (121).

6. The pick-and-place apparatus for a patch device of claim 5, wherein, The patch device is made by an integrated molding process.

7. The pick-and-place apparatus for a patch device according to any one of claims 1-6, wherein, The second connecting end (21) is used for connecting a device body of a patch device.

8. The pick-and-place apparatus for patch devices of claim 1, wherein, The second mounting end comprises a first mounting clamp (221) and a second mounting clamp (222), the first mounting clamp (221) and the second mounting clamp (222) are perpendicular to each other, and the electronic element can be clamped or released through cooperation of the first mounting clamp (221) and the second mounting clamp (222).

9. A mounting apparatus for a chip mounting machine, characterized in that, The device body comprises a first connecting end (11) and a first mounting end. ​ ​ 10. A patch device characterized in that, ​ ​ The attaching apparatus according to any one of claims 1 to 8, wherein the air pressure device is provided in the device main body. Or, The attaching apparatus according to claim 9.

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