Deep cup type LED lamp bead
By setting a reflective layer and a hollow inner cavity on the base plate and cup-shaped bracket of the deep cup-shaped LED beads, combined with heat dissipation medium and heat sink, the problem of poor heat dissipation effect is solved, and the brightness and service life are improved.
Patent Information
- Application Number
- CN202423232741.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-26
AI Technical Summary
The heat dissipation of existing deep-cup LED chips is poor, which affects the brightness and lifespan of the chips.
A reflective layer is set on the inner wall of the base plate and the cup-shaped bracket to improve light reflection performance, and a hollow inner cavity is set inside the base plate and the cup-shaped bracket to fill the heat dissipation medium. Combined with heat dissipation vents and heat sinks, the heat dissipation performance is improved.
It improves the brightness and heat dissipation performance of the LED beads, and extends their service life.
Smart Images

Figure CN223652649U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED lamp bead technology, specifically a deep cup-shaped LED lamp bead. Background Technology
[0002] LED, short for Light Emitting Diode, is a semiconductor light-emitting device made of semiconductor materials that directly converts electrical energy into light energy and electrical signals into light signals. Its advantages include low power consumption, high brightness, vibrant colors, vibration resistance, long lifespan (80,000 to 100,000 hours of normal operation), and being a cold light source, making it a truly "green lighting" solution. In the 21st century, LED-based lighting products will inevitably replace incandescent bulbs, marking another revolution in human lighting.
[0003] LED beads are widely used in lighting fixtures, LED large screen displays, traffic lights, decorations, computers, electronic toys and gifts, switches, telephones, advertising, urban lighting projects and many other production fields. LED beads include solid materials, brackets and lens layers. The lens layer is generally made of materials such as PMMA, PC, optical glass, silicone (soft silicone, hard silicone). The larger the angle of these structures, the higher the light output efficiency. Therefore, people design the lens layer into round, elliptical, flat and other structures. However, people also need a focusing structure with higher directivity so that the light can be projected farther.
[0004] A deep cup-shaped LED bead is proposed in Chinese Patent Publication No. CN209496891U. The bead's bracket is hollow and the lens layer has a concave structure, which makes the light emitted by the chip more directional and farther, and reduces the amount of material used. However, the deep cup-shaped LED bead still has the problem of poor heat dissipation when in use. Therefore, this utility model proposes a deep cup-shaped LED bead. Utility Model Content
[0005] Technical problems to be solved
[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a deep cup-shaped LED light bead.
[0007] Technical solution
[0008] To achieve the above objectives, this utility model provides the following technical solution: a deep cup-shaped LED bead, comprising a base plate, a cup-shaped bracket mounted on the top of the base plate, a reflective layer disposed on the inner wall of the cup-shaped bracket, and a second reflective layer disposed on the top of the base plate. By providing reflective layers on the inner walls of the base plate and the cup-shaped bracket, the LED bead exhibits better light reflection performance, thereby improving its brightness. An LED chip is mounted at the center of the upper surface of the base plate. A hollow cavity is provided inside the base plate and the cup-shaped bracket, and the hollow cavity is filled with a heat dissipation medium. A heat dissipation vent is also provided on the outer side of the cup-shaped bracket, communicating with the hollow cavity. A heat sink is fixed inside the heat dissipation vent, and the heat sink is in contact with the heat dissipation medium. By providing a hollow cavity inside the base plate and the cup-shaped bracket for installing the heat dissipation medium, and in conjunction with the heat dissipation vent and the heat sink inside, the heat dissipation performance of the LED bead can be effectively improved, which helps dissipate heat from the LED bead and extends its service life.
[0009] Preferably, the heat dissipation medium is one of silicone, aluminum sheet or copper sheet.
[0010] Preferably, the heat sink is an aluminum sheet or a copper sheet.
[0011] Preferably, the cup-shaped support is filled with a filling layer, which is one of epoxy resin, transparent glass, or transparent adhesive.
[0012] Preferably, the LED chip is connected to a wire.
[0013] Preferably, both the base plate and the support are hollow plastic frames.
[0014] Preferably, the base plate has insulating holes inside for installing wires.
[0015] Beneficial effects:
[0016] Compared with existing technologies, this deep-cup LED bead has the following advantages:
[0017] This invention improves the brightness of the LED by setting a reflective layer on the inner wall of the base plate and the cup-shaped bracket, which improves the light reflection performance of the LED. On the other hand, the hollow inner cavity inside the base plate and the cup-shaped bracket is used to install the heat dissipation medium. Combined with the heat dissipation port and the heat sink inside, the heat dissipation performance of the LED can be effectively improved, which helps to dissipate the heat of the LED and improve the service life of the LED. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of this utility model;
[0020] Figure 2 This is a cross-sectional structural diagram of the present invention;
[0021] Figure 3 This is a cross-sectional view of the base plate and cup-shaped support of this utility model.
[0022] In the picture:
[0023] 1. Base plate; 2. Cup-shaped bracket; 201. Filling layer; 3. Reflective layer; 4. Second reflective layer; 5. LED chip; 6. Hollow inner cavity; 7. Heat dissipation medium; 8. Heat dissipation port; 9. Heat sink; 501. Wire; 101. Insulation hole. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figures 1-3 As shown, this utility model provides a technical solution: a deep cup-shaped LED lamp bead, including a base plate 1, a cup-shaped bracket 2 installed on the top of the base plate 1, a reflective layer 3 provided on the inner wall of the cup-shaped bracket 2, and a second reflective layer 4 provided on the top of the base plate 1. By providing reflective layers on the inner walls of the base plate 1 and the cup-shaped bracket 2, the lamp bead has better light reflection performance, thereby improving the brightness of the lamp bead.
[0026] In this application, an LED chip 5 is installed at the center of the upper surface of the base plate 1. The base plate 1 and the cup-shaped bracket 2 have a hollow cavity 6 inside, which is filled with a heat dissipation medium 7. The outer side of the cup-shaped bracket 2 is also provided with a heat dissipation port 8, which is connected to the hollow cavity 6. A heat sink 9 is fixed inside the heat dissipation port 8 and is in contact with the heat dissipation medium 7. By providing a hollow cavity 6 inside the base plate 1 and the cup-shaped bracket 2 for installing the heat dissipation medium 7, and with the use of the heat dissipation port 8 and the heat sink 9 inside it, the heat dissipation performance of the LED chip can be effectively improved, which helps to dissipate the heat of the LED chip and improve the service life of the LED chip.
[0027] Please refer to the following carefully. Figure 2 The heat dissipation medium 7 is one of silicone, aluminum sheet or copper sheet, the heat sink 9 is aluminum sheet or copper sheet, and the base plate 1 and the cup-shaped bracket 2 are both hollow plastic frames. The cup-shaped bracket 2 is filled with a filling layer 201, which is one of epoxy resin, light-transmitting glass or light-transmitting adhesive. The LED chip 5 is connected with a wire 501, and the base plate 1 is provided with an insulating hole 101 for installing the wire 501.
[0028] Working principle: The light emitted by the LED chip 5 is reflected by the reflective layer set on the inner wall of the base plate 1 and the cup-shaped bracket 2. Compared with the structure without the reflective layer, the brightness of the LED chip is higher. The heat generated by the LED chip can be quickly dissipated by the heat dissipation medium 7 installed in the hollow inner cavity 6 and the heat sink 9 inside the heat dissipation port 8.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A deep-cup type LED light bead, comprising a base plate (1), characterized in that: A cup-shaped bracket (2) is installed on the top of the base plate (1). A reflective layer (3) is provided on the inner wall of the cup-shaped bracket (2). A second reflective layer (4) is provided on the top of the base plate (1). An LED chip (5) is installed at the center of the upper surface of the base plate (1). A hollow cavity (6) is provided inside the base plate (1) and the cup-shaped bracket (2). The hollow cavity (6) is filled with a heat dissipation medium (7). A heat dissipation port (8) is also provided on the outer side of the cup-shaped bracket (2). The heat dissipation port (8) is connected to the hollow cavity (6). A heat dissipation fin (9) is fixed inside the heat dissipation port (8). The heat dissipation fin (9) is in contact with the heat dissipation medium (7).
2. The deep-cup type LED bead according to claim 1, characterized in that: The heat dissipation medium (7) is one of silicone, aluminum sheet or copper sheet.
3. The deep-cup type LED lamp bead according to claim 1, characterized in that: The heat sink (9) is an aluminum sheet or a copper sheet.
4. The deep-cup type LED bead according to claim 1, characterized in that: The cup-shaped support (2) is filled with a filling layer (201), which is one of epoxy resin, transparent glass or transparent adhesive.
5. A deep-cup type LED bead according to claim 1, characterized in that: The LED chip (5) is connected to a wire (501).
6. The deep-cup type LED lamp bead according to claim 1, characterized in that: Both the base plate (1) and the cup-shaped bracket (2) are hollow plastic frames.
7. A deep-cup type LED bead according to claim 5, characterized in that: The base plate (1) has an insulating hole (101) inside for installing wires (501).
Citation Information
Patent Citations
Deep cup type LED lamp bead
CN209496891U