Efficient cutting line

By designing a waveform structure and bends on the cutting line, and combining the alternating distribution of spiral twisted sections and non-spiral twisted sections, the problem of insufficient chip removal capacity of steel wire when cutting silicon wafers is solved, achieving efficient cutting and high-quality cutting results.

CN223657338UActive Publication Date: 2025-12-12CHANGZHOU BOSIDA PRECISION MATERIALS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202423240220.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-12-12
Estimated Expiration
2034-12-26

AI Technical Summary

Technical Problem

In existing technologies, when cutting silicon wafers, the increased amount of abrasive carried by the steel wire leads to a decrease in chip removal capacity, which affects the cutting quality.

Method used

Design a high-efficiency cutting wire with a wavy structure along its length and bends in some of the wavy sections. Combine spiral twist sections and non-spiral twist sections, and alternate between wavy and straight structures to improve sand carrying capacity and chip removal capacity.

Benefits of technology

It improves cutting efficiency and quality, reduces scratches on the silicon wafer surface caused by chip debris, enhances chip removal capability, and improves the overall performance of the cutting line.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223657338U_ABST
    Figure CN223657338U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of cutting lines, and relates to an efficient cutting line which comprises a metal line, the metal line is provided with a wave-shaped structure in the length direction of the metal line, at least part of the wave-shaped structure is provided with a bending part, and the bending part deviates from the extending direction of the wave-shaped structure. The metal wire comprises a spiral torsion section and a non-spiral torsion section, and at least part of the waveform structure is located on the spiral torsion section. The wave-shaped structure is formed on the metal wire, the bending portion is arranged on the wave-shaped structure in an overlapped mode, the sand carrying capacity of the cutting wire is improved, meanwhile, the wave-shaped structure is arranged on the spiral twisting section, the metal wire is provided with the wave-shaped structure in all directions, and improvement of cutting efficiency is facilitated. In addition, the non-spiral twisting section is utilized, chip removal is facilitated, and the chip removal capacity of the cutting line is improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model belongs to cutting line technical field, especially, relate to a high -efficient cutting line. BACKGROUND

[0002] The silicon wafer used by the semiconductor is often obtained by wire cutting mode, in order to improve the cutting efficiency, the steel wire is deformed to form a waveform cutting line, which is a common method at present. The steel wire can improve the sand amount in the cutting process after deformation, thereby being beneficial to the improvement of cutting capacity. However, the increase of the sand amount of the steel wire may cause the decrease of the chip removal capacity, and the timely removal of the cutting chips will cause negative effects on the cutting of the product. SUMMARY

[0003] In order to solve the low chip removal capacity in the prior art, the utility model provides a high -efficient cutting line.

[0004] The utility model discloses a technical scheme as follows: a high -efficient cutting line, including metal line, the metal line has the waveform structure in its length direction, at least partial the waveform structure is provided with the bending part, the bending part deviates the extension direction of the waveform structure, the metal line includes spiral torsion section and non spiral torsion section, at least partial the waveform structure is on the spiral torsion section.

[0005] In some embodiments, the metal line is a steel wire or a tungsten wire.

[0006] In some embodiments, the bending part is V-shaped structure.

[0007] In some embodiments, the metal line also has a straight line structure in its length direction, and at least part of the straight line structure is located on the non spiral torsion section.

[0008] In some embodiments, the waveform structure and the straight line structure are alternately distributed on the metal line.

[0009] In some embodiments, the waveform structure between the two adjacent straight line structures forms a waveform unit, and the straight line structure between the two adjacent waveform units forms a straight line unit, and the length ratio of the waveform unit and the straight line unit is 2:1.

[0010] In some embodiments, the spiral torsion section is all the waveform structure, and the non spiral torsion section is all the straight line structure.

[0011] In some embodiments, the angle of the wave crest and / or wave trough of the waveform structure is an obtuse angle.

[0012] In some embodiments, the wave peak height is 1.1-1.4 times of the diameter of the metal wire, and the size of the bending part deviating from the extension direction of the wave structure is 1.05-1.3 times of the diameter of the metal wire.

[0013] The utility model discloses the beneficial effect has: the utility model discloses the wave structure is formed on the metal wire, and the wave structure is superimposed and set up the bending part, has improved the cutting line's sand -carrying capacity, and sets up the wave structure on the helical torsion section, makes the metal wire have the wave structure in each direction, is favorable to the promotion of cutting efficiency. In addition, utilize non helical torsion section, is favorable to chip removal, improves the chip removal ability of cutting line. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 It is structure schematic diagram of the cutting line of the utility model not superimposed spiral torsion state;

[0015] Fig. 2 It is wave structure schematic diagram of superimposed bending part;

[0016] Fig. 3 It is structure schematic diagram of the cutting line superimposed spiral torsion state.

[0017] Fig. 1. wave structure, 11. bending part, 101. wave unit, 2. straight line structure, 102. straight line unit. DETAILED DESCRIPTION

[0018] The utility model will be combined with the specific embodiment and the drawing and make further detailed explanation, but not limited to this, any in the basic spirit of the utility model embodiment improvement or replacement, still belongs to the range that the utility model wants to protect.

[0019] The technical scheme of the utility model discloses a kind of high-efficiency cutting lines, as shown in Figs. 1-3 Fig. 1. wave structure, 11. bending part, 101. wave unit, 2. straight line structure, 102. straight line unit.

[0020] As shown in Fig. 2 Fig. 1. wave structure, 11. bending part, 101. wave unit, 2. straight line structure, 102. straight line unit. Fig. 3The wave structure 1 on the helical torsion segment 2 is helical torsion, so that the cutting wire has the wave structure 1 and the bending part 11 in each direction, and the overall outer contour of the cutting wire in the helical torsion segment 2 is substantially circular when viewed from the direction of the axis of the cutting wire, which can avoid scratches on the surface of the silicon wafer and improve the cutting quality. In addition, the cutting wire has no helical torsion structure on the non-helical torsion segment, and the wave structure 1 on the non-helical torsion segment is distributed in only one direction or is absent, and the size of the non-helical torsion segment is smaller than the outer contour size of the helical torsion segment when viewed from the direction of the axis of the cutting wire, which is beneficial to the removal of the cutting debris and reduces the phenomenon of scratches on the surface of the silicon wafer, and is beneficial to improve the cutting quality.

[0021] The steel wire and the tungsten wire both have excellent hardness and wear resistance, and in some embodiments, the metal wire is a steel wire or a tungsten wire.

[0022] Specifically, in some embodiments, the bending part 11 is in a V-shaped structure. The bending part 11 is arranged in a V-shaped structure to facilitate molding.

[0023] In order to further improve the debris removal capability, in some embodiments, the metal wire also has a straight structure helical torsion segment 2 helical torsion segment in the length direction thereof, and at least part of the straight structure helical torsion segment 2 helical torsion segment is located on the non-helical torsion segment. The non-helical torsion segment is provided with at least part of the straight structure helical torsion segment 2 helical torsion segment, and the part of the outer contour size is the diameter of the metal wire, which is more beneficial to the removal of the debris and improves the debris removal capability.

[0024] In order to ensure that the cutting debris can be removed as soon as possible during the cutting process, in some embodiments, the wave structure 1 and the straight structure helical torsion segment 2 helical torsion segment are alternately distributed on the metal wire.

[0025] In some embodiments, the wave structure 1 between the adjacent two straight structure helical torsion segments 2 helical torsion segments forms a wave unit helical torsion segment 101 helical torsion segment, the straight structure helical torsion segment 2 helical torsion segment between the adjacent two wave unit helical torsion segments 101 helical torsion segments forms a straight unit helical torsion segment 102 helical torsion segment, and the length ratio of the wave unit helical torsion segment 101 helical torsion segment to the straight unit helical torsion segment 102 helical torsion segment is 2:1. The wave structure 1 superimposed with the bending part 11 is the main cutting part, which cooperates with the straight unit helical torsion segment 102 helical torsion segment to remove the cutting debris in time after efficient cutting.

[0026] In some embodiments, the wave structure 1 is arranged on the helical torsion segment, and the straight structure helical torsion segment 2 is arranged on the non-helical torsion segment. That is, the wave structure 1 is helical torsion to form the helical torsion segment, and the non-helical torsion segment is the straight structure helical torsion segment 2 helical torsion segment. This arrangement makes the size difference between the non-helical torsion segment and the helical torsion segment maximum when viewed from the direction of the cutting line axis, which improves the cutting efficiency and is more conducive to the removal of the cuttings generated by cutting.

[0027] Specifically, the angle of the wave crest and / or the wave trough of the wave structure is an obtuse angle.

[0028] In some embodiments, the wave crest height of the wave structure 1 is 1.1-1.4 times the diameter of the metal wire, and the size of the bending part 11 deviating from the extension direction of the wave structure 1 is 1.05-1.3 times the diameter of the metal wire.

[0029] It should be noted that the above-described embodiments are only used to explain the present application and do not constitute any limitation on the present application. The present application has been described by referring to typical embodiments, but it should be understood that the words used therein are descriptive and explanatory words rather than limiting words. The present application can be modified within the scope of the claims, and the present application can be revised without departing from the scope and spirit of the present application. Although the present application described therein relates to specific methods, materials and embodiments, it does not mean that the present application is limited to the specific examples disclosed therein, on the contrary, the present application can be extended to all other methods and applications with the same function.

Claims

1. A high performance cutting thread, characterized in that, The metal wire has a wave structure (1) in the length direction, and a bending part (11) is arranged on at least part of the wave structure (1), and the bending part (11) deviates from the extension direction of the wave structure (1); the metal wire comprises a spiral torsion section and a non-spiral torsion section, and at least part of the wave structure (1) is located on the spiral torsion section.

2. The high-efficiency cutting thread of claim 1, wherein, The metal wire is a steel wire or a tungsten wire.

3. The high-efficiency cutting thread of claim 1 or 2, wherein, The bending part (11) is in V-shaped structure.

4. The high-efficiency cutting thread of claim 1 or 2, wherein, The metal wire also has a straight line structure (2) in the length direction, and at least part of the straight line structure (2) is located on the non-spiral torsion section.

5. The high performance cutting thread of claim 4, wherein, The wave structure (1) and the straight line structure (2) are alternately distributed on the metal wire.

6. The high performance cutting thread of claim 5, wherein, The wave structure (1) between two adjacent straight line structures (2) forms a wave unit (101), and the straight line structure (2) between two adjacent wave units (101) forms a straight line unit (102), and the length ratio of the wave unit (101) to the straight line unit (102) is 2:

1.

7. The high performance cutting thread of claim 5, wherein, The spiral torsion section is provided with the wave structure (1), and the non-spiral torsion section is provided with the straight line structure (2).

8. The high performance cutting thread of claim 1, wherein, The angle of the wave crest and / or the wave trough of the wave structure (1) is obtuse.

9. The high-efficiency cutting thread of claim 1 or 8, wherein, The wave crest height of the wave structure (1) is 1.1-1.4 times of the diameter of the metal wire, and the size of the bending part (11) deviating from the extension direction of the wave structure (1) is 1.05-1.3 times of the diameter of the metal wire.