Efficient heat transfer tire mold
By introducing heat-conducting components into the tire mold, the problems of slow and uneven heat transfer in the tire mold are solved, achieving high efficiency, uniformity, and energy-saving effects in tire vulcanization.
Patent Information
- Application Number
- CN202423254636.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-28
AI Technical Summary
Existing tire molds have slow and uneven heat transfer, resulting in uneven tire vulcanization, increased energy consumption, and processing difficulties.
A heat-conducting component is introduced into the tire mold, including a slider heat conductor, a top cover heat conductor, and a base heat conductor. High thermal conductivity materials are used, and the heat conductors are installed through through-holes or blind holes to ensure that heat is quickly transferred to the cavity molding component, and the vulcanization temperature is controlled by reasonable distribution.
It enables rapid and efficient heat transfer during tire vulcanization, ensuring uniform vulcanization, saving energy, and simplifying the processing.
Smart Images

Figure CN223657427U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of tire mold technology, specifically to a tire mold with high-efficiency heat transfer. Background Technology
[0002] Tire molds are key components used in tire vulcanization, determining the tire's quality, performance, and cost. During tire vulcanization, heat is transferred from external heat sources such as hot plates or steam chambers to the tire carcass for vulcanization and molding. However, for heat to reach the tire carcass, it must pass through multiple intermediate mold parts, resulting in slow heat transfer and significant heat loss, thus increasing energy consumption.
[0003] In existing technologies, filling grooves or air chambers are typically incorporated into the tire mold structure. However, the resulting structure has relatively low thermal conductivity and is difficult to manufacture. Furthermore, during vulcanization, inconsistent heat transfer rates to the mold cavity surface lead to uneven vulcanization, affecting tire quality. Therefore, there is an urgent need to develop a mold structure that achieves efficient heat transfer, uniform tire vulcanization, and convenient manufacturing. Utility Model Content
[0004] To address the problems existing in the prior art, this utility model provides a tire mold with high-efficiency heat transfer, which can shorten the vulcanization time, make the tire vulcanization more uniform, improve the heat transfer efficiency, save energy, and is easy to process.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] This utility model provides a high-efficiency heat transfer tire mold, including a mold body, the mold body including a slider, a cavity forming component, a top cover and a base, the slider being located around the cavity forming component, the top cover and the base being located on the upper and lower sides of the cavity forming component respectively; it also includes a heat conductor component, the heat conductor component including one or more of the slider heat conductor, heat conductor block, top cover heat conductor, and base heat conductor, for transferring heat from a heat source to the cavity forming component;
[0007] The heat-conducting element of the slider penetrates the slider from the outside to the inside; the heat-conducting block extends vertically, penetrating or not penetrating the slider; the heat-conducting element of the upper cover penetrates the upper cover from top to bottom; the heat-conducting element of the base penetrates the base from bottom to top.
[0008] In the above-mentioned high-efficiency heat transfer tire mold, the outer side surface of the slider is provided with a plurality of slider through holes, which penetrate the slider from the outside to the inside; the slider heat conductor is embedded in the slider through holes.
[0009] In the aforementioned high-efficiency heat transfer tire mold, the inner end of the slider through hole extends downward at an angle.
[0010] And / or, a plurality of the said slider through holes are spaced apart along the axial direction of the mold body;
[0011] And / or, a plurality of the said slider through holes are distributed at intervals in the circumferential direction of the mold body;
[0012] And / or, the slider through hole is trumpet-shaped.
[0013] In the above-mentioned high-efficiency heat transfer tire mold, the upper side of the upper cover is provided with a plurality of upper cover through holes, the upper cover through holes penetrating the upper cover from top to bottom; the upper cover heat conductor is fixedly installed in the upper cover through holes;
[0014] And / or, the lower side of the base is provided with a base through hole, the base through hole penetrating the base from bottom to top; the base heat conductor is fixedly installed in the base through hole.
[0015] In the above-mentioned high-efficiency heat transfer tire mold, the cavity forming component includes a tread block, and a tread block mounting hole is provided on the outer side of the tread block. The tread block mounting hole is a blind hole extending from the outside to the inside. A tread block heat conductor is provided inside the tread block mounting hole.
[0016] In the above-mentioned high-efficiency heat transfer tire mold, the cavity forming component includes a lower side plate, and a lower side plate mounting hole is provided on the lower side surface of the lower side plate. The lower side plate mounting hole is a blind hole extending from bottom to top; a lower side plate heat conductor is provided in the lower side plate mounting hole.
[0017] In the aforementioned high-efficiency heat transfer tire mold, the cavity forming assembly includes a lower steel ring, and a lower steel ring mounting hole is provided on the lower side of the lower steel ring. The lower steel ring mounting hole is a blind hole extending from bottom to top; a lower steel ring heat conductor is provided inside the lower steel ring mounting hole.
[0018] In the above-mentioned high-efficiency heat transfer tire mold, the cavity forming component includes an upper steel ring, the upper side of which is provided with an upper steel ring mounting hole, which is a blind hole extending from top to bottom; an upper steel ring heat conductor is provided inside the upper steel ring mounting hole.
[0019] In the above-mentioned high-efficiency heat transfer tire mold, the cavity forming component includes an upper side plate, and the upper side of the upper side plate is provided with an upper side plate mounting hole, which is a blind hole extending from top to bottom; an upper side plate heat conductor is provided inside the upper side plate mounting hole.
[0020] In the above-mentioned high-efficiency heat transfer tire mold, the upper and / or lower sides of the slider are provided with heat-conducting block mounting holes, which extend vertically; the heat-conducting block is installed in the heat-conducting block mounting holes.
[0021] And / or, the slider heat conductor, the upper cover heat conductor, and the base heat conductor are cylindrical;
[0022] And / or, the material of the heat conductor assembly is a high thermal conductivity material;
[0023] And / or, the slider heat conductor, the upper cover heat conductor, and the base heat conductor are fixed by a fixing structure.
[0024] The beneficial effects of this utility model are as follows:
[0025] 1. In tire molds, one or more of the following are provided on the mold structure between the heat source and the cavity forming component: a slider heat conductor, an upper cover heat conductor, and a base heat conductor made of high thermal conductivity material. This ensures that the heat from the heat source can be transferred to the cavity forming component more quickly and in greater quantities during the tire vulcanization process, providing a suitable temperature environment for tire carcass vulcanization. High heat transfer efficiency further saves energy used in tire vulcanization.
[0026] 2. In application, the location and size of heat conduction can be selectively set according to vulcanization requirements and vulcanization temperature of different areas of the tire, so as to achieve zoned vulcanization while achieving efficient heat transfer;
[0027] 3. Multiple heat conductor components, such as slider heat conductor, top cover heat conductor, and base heat conductor, can be manufactured at once, facilitating quick replacement during subsequent use. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the high-efficiency heat transfer tire mold of this utility model;
[0029] Figure 2 This is a schematic diagram of the first embodiment of the slider in the high-efficiency heat transfer tire mold of this utility model.
[0030] Figure 3 This is a schematic diagram of the circumferential distribution of the heat conductor in the slider in the first embodiment;
[0031] Figure 4 This is a schematic diagram of the second embodiment of the slider in the high-efficiency heat transfer tire mold of this utility model.
[0032] Figure 5 This is a schematic diagram of the third embodiment of the slider in the high-efficiency heat transfer tire mold of this utility model.
[0033] Figure 6 This is a schematic diagram of the upper cover in the high-efficiency heat transfer tire mold of this utility model.
[0034] Figure 7This is a schematic diagram of the base structure in the high-efficiency heat transfer tire mold of this utility model.
[0035] Figure 8 This is a schematic diagram of the fixing structure in the tire mold for high-efficiency heat transfer of this utility model;
[0036] Figure 9 This is a schematic diagram of the structure of the tread block in the first embodiment of the high-efficiency heat transfer tire mold of this utility model;
[0037] Figure 10 This is a schematic diagram of the second embodiment of the tread block in the high-efficiency heat transfer tire mold of this utility model;
[0038] Figure 11 This is a schematic diagram of the upper steel ring in the high-efficiency heat transfer tire mold of this utility model;
[0039] Figure 12 This is a schematic diagram of the lower steel ring in the high-efficiency heat transfer tire mold of this utility model;
[0040] Figure 13 This is a schematic diagram of the lower side plate in the high-efficiency heat transfer tire mold of this utility model;
[0041] Figure 14 This is a schematic diagram of the upper side plate in the tire mold for high-efficiency heat transfer according to this utility model.
[0042] Figure 15 This is a schematic diagram of the circumferential distribution structure of the heat conductors on the lower and upper side plates in the tire mold for high-efficiency heat transfer according to this utility model.
[0043] Figure 16 This is a schematic diagram of the fourth embodiment of the slider in the high-efficiency heat transfer tire mold of this utility model;
[0044] Figure 17 This is a schematic diagram of the circumferential distribution structure of the heat-conducting blocks in the fourth embodiment of the slider;
[0045] Figure 18 This is a schematic diagram of the fifth embodiment of the slider in the high-efficiency heat transfer tire mold of this utility model;
[0046] Figure 19 This is a schematic diagram of the circumferential distribution structure of the heat-conducting blocks in the fifth embodiment of the slider.
[0047] In the picture:
[0048] 101-Patterned block; 102-Lower side plate; 103-Lower steel ring; 104-Upper steel ring; 105-Upper side plate; 106-Upper cover; 107-Slider; 108-Heat source; 109-Base;
[0049] 201-Slider heat conductor; 202-Slider through hole; 203-Patterned block heat conductor; 204-Patterned block mounting hole; 205-Top cover heat conductor; 206-Top cover through hole; 207-Base heat conductor; 208-Base through hole; 209-Upper steel ring heat conductor; 210-Upper steel ring mounting hole; 211-Lower steel ring heat conductor; 212-Lower steel ring mounting hole; 213-Lower side plate heat conductor; 214-Lower side plate mounting hole; 215-Upper side plate heat conductor; 216-Upper side plate mounting hole; 217-Heat conductor block; 218-Heat conductor block mounting hole;
[0050] 301 - baffle; 302 - screw. Detailed Implementation
[0051] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.
[0052] Please refer to Figure 1 This invention provides an embodiment of a high-efficiency heat transfer tire mold, comprising a mold body, which includes a slider 107, a cavity forming assembly, an upper cover 106, and a base 109. The cavity forming assembly is used to form the cavity surface and includes a tread block 101, a lower side plate 102, a lower steel ring 103, an upper steel ring 104, and an upper side plate 105. The mold body is prior art, therefore its structure will not be described in detail.
[0053] To overcome the problems of slow heat transfer and significant heat loss in the existing technology during the process of heat transfer from the external heat source 108 to the tire blank, the tire mold is also equipped with a heat-conducting component. The heat-conducting component includes at least several slider heat-conducting elements 201. Please refer to... Figures 2-5 The slider 107 has several through holes 202. The side of the slider 107 that mates with the patterned block 101 is the inner side, and the side that mates with the heat source 108 is the outer side. The through holes 202 penetrate the slider 107 and are open on both the inner and outer sides. The slider heat conductor 201 is embedded in the through hole 202. The size of the slider heat conductor 201 is designed to be as large as possible along the length of the through hole 202. For example, the inner end face of the slider heat conductor 201 can abut against the outer side of the patterned block 101, resulting in high contact heat transfer efficiency. The slider heat conductor 201 transfers the heat from the heat source 108 to the patterned block 101 with high heat transfer efficiency and minimal heat loss in between.
[0054] The shape of the slider through-hole 202 can be cylindrical, honeycomb, rectangular, etc. The shape of the slider heat conductor 201 matches the slider through-hole 202; therefore, it is preferable that the slider through-hole 202 is cylindrical, which facilitates the processing, fitting, and assembly of the slider heat conductor 201 and the slider through-hole 202. For the slider 107, its internal slider through-hole 202 can be as follows... Figure 2 , Figure 4 and Figure 5 As shown, the slide holes 202 are spaced apart along the axial direction of the mold body. Figure 2 As shown, the slider through-hole 202 is inclined from top to bottom within the slider 107, moving from the outside in. Furthermore, while ensuring the basic function of the slider 107, the slider through-hole 202 is funnel-shaped, meaning that the inner diameter of one end is smaller than that of the other end; it can be as follows... Figure 4 As shown, the outer end inner diameter of the slider through hole 202 is smaller than its inner end inner diameter, or as... Figure 5 As shown, the inner diameter of the slider through-hole 202 is smaller than the inner diameter of its outer end; one end of the slider heat conductor 201 can form a larger contact surface, which is beneficial to improving heat transfer efficiency. Figure 3 As shown, several slider through holes 202 are also distributed at intervals in the circumferential direction of the mold body.
[0055] The heat conductor assembly also includes a top cover heat conductor 205; please refer to... Figure 6 The upper cover 106 has through holes 206 machined through its upper and lower sides, and the upper cover heat conductor 205 is fixedly installed in the upper cover through hole 206. The upper cover heat conductor 205 matches the upper cover through hole 206, which can be cylindrical, honeycomb, rectangular, etc., preferably cylindrical. The two end faces of the upper cover heat conductor 205 are preferably flush with the upper and lower sides of the upper cover 106.
[0056] The heat conductor assembly also includes a base heat conductor 207; please refer to Figure 7 The base 109 has a base through hole 208 that penetrates the base 109 and has openings on both the upper and lower sides of the base 109. A base heat conductor 207 is fixedly installed within the base through hole 208, and the base heat conductor 207 matches the base through hole 208. The base through hole 208 can be cylindrical, honeycomb, rectangular, etc., but is preferably cylindrical. The two end faces of the base heat conductor 207 are preferably flush with the upper and lower sides of the base 109.
[0057] The base heat conductor 207, the top cover heat conductor 205, and the slider heat conductor 201 are made of high thermal conductivity materials. High thermal conductivity materials have the characteristics of fast mass transfer and rapid heat conduction. Through the base heat conductor 207, the top cover heat conductor 205, and the slider heat conductor 201, heat from the outside of the mold body can be quickly transferred to the cavity forming components, providing heat for the vulcanization of the tire blank. Furthermore, by rationally distributing the base heat conductor 207, the top cover heat conductor 205, and the slider heat conductor 201, the vulcanization temperature at different locations on the tire blank can be controlled to obtain the best vulcanization effect and a high yield. High thermal conductivity materials are not limited to silicon carbide; they can also be aluminum alloys, copper alloys, aluminum nitride, etc.
[0058] Since the through hole 206 in the upper cover, the through hole 208 in the base, and the through hole 202 in the slider are interconnected, in order to prevent the base heat conductor 207, the upper cover heat conductor 205, and the slider heat conductor 201 from loosening during heat transfer, a fixing structure can be used to fix the base heat conductor 207, the upper cover heat conductor 205, and the slider heat conductor 201. For example, as... Figure 8 As shown, the fixing structure is set as a baffle 301, which is fixed to the slider 107, the upper cover 106, or the base 109 by screws 302. Preferably, the end faces of the base heat conductor 207, the upper cover heat conductor 205, and the slider heat conductor 201 are provided with clearance portions, and one side of the upper cover through hole 206, the base through hole 208, and the slider through hole 202 is provided with a groove. The groove connects to the upper cover through hole 206, the base through hole 208, or the slider through hole 202. The baffle 301 can be embedded in the groove and abut against the clearance portion, effectively preventing loosening and not affecting the integrity of the surfaces of the upper cover 106, the base 109, and the slider 107.
[0059] Furthermore, such as Figure 9-15 As shown, the heat-conducting component also includes one or more of the following: patterned block heat-conductor 203, upper steel ring heat-conductor 209, lower steel ring heat-conductor 211, lower side plate heat-conductor 213, and upper side plate heat-conductor 215. Correspondingly, the patterned block 101 is provided with a patterned block mounting hole 204, the upper steel ring 104 is provided with an upper steel ring mounting hole 210, the lower steel ring 103 is provided with a lower steel ring mounting hole 212, the lower side plate 102 is provided with a lower side plate mounting hole 214, and the upper side plate 105 is provided with an upper side plate mounting hole 216. Since the inner surface of the cavity forming component is the cavity surface, the patterned block mounting hole 204, upper steel ring mounting hole 210, lower steel ring mounting hole 212, lower side plate mounting hole 214, and upper side plate mounting hole 216 are blind holes extending from the outside to the inside, and none of them open on the cavity surface. The patterned block heat conductor 203 is fixed in the patterned block mounting hole 204, the upper steel ring heat conductor 209 is fixed in the upper steel ring mounting hole 210, the lower steel ring heat conductor 211 is fixed in the lower steel ring mounting hole 212, the lower side plate heat conductor 213 is fixed in the lower side plate mounting hole 214, and the upper side plate heat conductor 215 is fixed in the upper side plate mounting hole 216.
[0060] The pattern block mounting hole 204, the upper steel ring mounting hole 210, and the lower steel ring mounting hole 212 can be cylindrical, honeycomb, rectangular, etc., and are preferably cylindrical.
[0061] The lower side plate mounting holes 214 and the upper side plate mounting holes 216 can be cylindrical, honeycomb, rectangular, or arc-shaped. They can be spaced apart or continuously arranged as a whole to maximize the heat-receiving area while ensuring strength.
[0062] The tread block mounting holes 204 can be set in zones according to the tire vulcanization temperature. During tire vulcanization, the transition area between the tire sidewall and the tread requires a higher temperature. Therefore, the position and diameter of the tread block mounting holes 204 can be set according to different vulcanization requirements to achieve the effect of zoned vulcanization. Preferably, some of the tread block mounting holes 204 on the tread block 101 correspond to and overlap with the slider through holes 202 in the slider 107, which facilitates rapid and efficient heat transfer.
[0063] For slider 107, when there is a need for vertical heat transfer, the heat from the upper and lower parts of slider 107 is transferred to the interior of slider 107. A heat-conducting block 217 can be installed inside slider 107, extending vertically. For example, a heat-conducting block mounting hole 218 is machined on the upper or lower side of slider 107, and the heat-conducting block 217 is fixed within the heat-conducting block mounting hole 218. The heat-conducting block mounting holes 218 can be spaced apart along the circumference of the mold body, allowing the heat-conducting block mounting holes 218 to penetrate slider 107 vertically. Figure 16 and 17 As shown; the heat-conducting block mounting hole 218 can be set as an annular shape. In this case, the heat-conducting block mounting hole 218 cannot pass vertically through the slider 107, such as... Figure 18 and Figure 19 As shown.
[0064] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A high-efficiency heat transfer tire mold, comprising a mold body, the mold body comprising a sliding block (107), a cavity forming assembly, an upper cover (106) and a base (109), the sliding block (107) being located around the cavity forming assembly, the upper cover (106) and the base (109) being respectively located on the upper and lower sides of the cavity forming assembly; characterized in that, Further comprising a heat conductor assembly, the heat conductor assembly comprises one or more of a slider heat conductor (201), a heat conducting block (217), an upper cover heat conductor (205), and a base heat conductor (207), for transmitting heat from the heat source (108) to the cavity forming assembly; The slider heat conductor (201) penetrates the slider (107) from outside to inside; the heat conducting block (217) extends up and down, penetrates or does not penetrate the slider (107); the upper cover heat conductor (205) penetrates the upper cover (106) from top to bottom; and the base heat conductor (207) penetrates the base (109) from bottom to top.
2. A high heat transfer tire mold as set forth in claim 1 wherein, A plurality of slider through holes (202) are arranged on the outer side surface of the slider (107), and the slider through holes (202) penetrate the slider (107) from outside to inside; the slider heat conductor (201) is embedded in the slider through hole (202).
3. A high heat transfer tire mold as set forth in claim 2 wherein, The inner end of the slider through hole (202) extends downwardly and obliquely; And / or, a plurality of slider through holes (202) are distributed in the axial direction of the mold body; And / or, a plurality of slider through holes (202) are distributed in the circumferential direction of the mold body; And / or, the slider through hole (202) is trumpet-shaped.
4. A high heat transfer tire mold as defined in claim 1, wherein, A plurality of upper cover through holes (206) are arranged on the upper side surface of the upper cover (106), and the upper cover through holes (206) penetrate the upper cover (106) from top to bottom; the upper cover heat conductor (205) is fixedly installed in the upper cover through hole (206); And / or, a base through hole (208) is arranged on the lower side surface of the base (109), and the base through hole (208) penetrates the base (109) from bottom to top; the base heat conductor (207) is fixedly installed in the base through hole (208).
5. A high heat transfer tire mold as defined in claim 1, wherein, The cavity forming assembly comprises a pattern block (101), and the outer side surface of the pattern block (101) is provided with a pattern block mounting hole (204), which is a blind hole extending from outside to inside; the pattern block mounting hole (204) is provided with a pattern block heat conductor (203).
6. A high heat transfer tire mold as defined in claim 1, wherein, The cavity forming assembly comprises a lower side plate (102), and the lower side surface of the lower side plate (102) is provided with a lower side plate mounting hole (214), which is a blind hole extending from bottom to top; the lower side plate mounting hole (214) is provided with a lower side plate heat conductor (213).
7. A high heat transfer tire mold as defined in claim 1, wherein, The cavity forming assembly comprises a lower steel ring (103), and the lower side surface of the lower steel ring (103) is provided with a lower steel ring mounting hole (212), which is a blind hole extending from bottom to top; the lower steel ring mounting hole (212) is provided with a lower steel ring heat conductor (211).
8. A high heat transfer tire mold as defined in claim 1, wherein, The cavity forming assembly comprises an upper steel ring (104), and the upper side surface of the upper steel ring (104) is provided with an upper steel ring mounting hole (210), which is a blind hole extending from top to bottom; the upper steel ring mounting hole (210) is provided with an upper steel ring heat conductor (209).
9. A high heat transfer tire mold as defined in claim 1, wherein, The cavity forming assembly comprises an upper side plate (105), an upper side of the upper side plate (105) is provided with an upper side plate mounting hole (216), the upper side plate mounting hole (216) is a blind hole extending from top to bottom; the upper side plate mounting hole (216) is provided with an upper side plate heat conduction body (215).
10. A high heat transfer tire mold as defined in claim 1, wherein, The upper side and / or the lower side of the sliding block (107) is provided with a heat conduction block mounting hole (218), the heat conduction block mounting hole (218) extends from top to bottom; the heat conduction block (217) is mounted in the heat conduction block mounting hole (218); And / or, the sliding block heat conduction body (201), the upper cover heat conduction body (205) and the base heat conduction body (207) are cylindrical; And / or, the material of the heat conduction body assembly is high-thermal-conductivity material; And / or, the sliding block heat conduction body (201), the upper cover heat conduction body (205) and the base heat conduction body (207) are fixed by a fixing structure.