Printed circuit board (PCB) gold plating groove

Abstract

The utility model belongs to the technical field of circuit board gold plating, and particularly relates to a PCB gold plating groove which comprises a shell, and the side wall of the shell is rotatably connected with a fixing plate. A glass window is fixedly connected to the middle of the fixing plate; a first spray head is arranged at the top of the shell; the top of the first spray head is communicated with a transmission pipe; the surface of the shell is rotationally connected with a circular plate; the surface of the circular plate is fixedly connected with a rocker; the side wall of the circular plate is fixedly connected with a circular rod; the round rod penetrates through the shell and is rotationally connected with the shell; the end part of the round rod is fixedly connected with a square plate; the middle part of the square plate is rotationally connected with a two-way screw rod; the middle part of the two-way screw rod is in threaded connection with a pair of fixing frames; the fixing frame is arranged in an L shape; the bottom of the shell is fixedly connected with a gold-plated box; the side wall of the shell is slidably connected with a collecting box. The fixing frame is used for fixing the PCB, the two sides of the PCB can be fixed in the fixing process, meanwhile, the fixing frame is arranged in an L shape, and blocking to the PCB can be reduced after the PCB is fixed.

Description

Technical Field

[0001] This utility model relates to the field of circuit board gold plating technology, specifically a PCB gold plating tank. Background Technology

[0002] A printed circuit board (PCB) is an important electronic component. It serves as the support for electronic components and the carrier for their electrical connections. PCBs have evolved from single-layer to double-sided, multi-layer, and flexible designs, and continue to develop in their respective directions.

[0003] As printed circuit boards continue to evolve towards higher precision, higher density, and higher reliability, while simultaneously shrinking in size, reducing costs, and improving performance, they maintain a strong vitality in the development of future electronic devices.

[0004] When it is necessary to extend the life of PCB boards, they are usually gold-plated. However, during use and observation, it was found that after gold plating, the cleaning process requires the PCB board to be taken out and moved to another location for cleaning, which increases the cleaning time.

[0005] Therefore, a PCB gold plating tank is proposed to address the above problems. Utility Model Content

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by this utility model to solve its technical problem is as follows: A PCB gold plating tank of this utility model includes a shell, a fixing plate rotatably connected to the side wall of the shell; a glass window fixedly connected to the middle of the fixing plate; a first nozzle provided on the top of the shell; a transmission pipe connected to the top of the first nozzle; a circular plate rotatably connected to the surface of the shell; a rocker arm fixedly connected to the surface of the circular plate; a circular rod fixedly connected to the side wall of the circular plate; the circular rod is through-hole and rotatably connected to the shell; a square plate fixedly connected to the end of the circular rod; a bidirectional lead screw rotatably connected to the middle of the square plate; a pair of fixing frames threadedly connected to the middle of the bidirectional lead screw; the fixing frames are L-shaped; a gold plating box fixedly connected to the bottom of the shell; and a collection box slidably connected to the side wall of the shell. By using the fixing frames to fix the PCB board, both sides of the PCB board can be fixed during fixing. The L-shaped fixing frames reduce obstruction to the PCB board after fixing, thereby reducing the impact on PCB board cleaning. Furthermore, rotating the square plate with the circular plate allows the PCB board to be moved, thereby accelerating the cleaning speed of the PCB board.

[0008] Preferably, a second nozzle is slidably connected to the top of the outer casing; a square rod is fixedly connected to the side wall of the second nozzle; the end of the square rod is fixedly connected to the first nozzle; a water guide pipe is connected to the top of the second nozzle; the first nozzle is slidably connected to the outer casing; by adding a second nozzle, cleaning agent can be sprayed onto the PCB board after gold plating, thereby reducing the residual electroplating solution on the PCB board surface. At the same time, connecting the first nozzle and the second nozzle through the square rod can drive the second nozzle to move when the first nozzle is moved, thereby reducing the need to switch the position of the first nozzle and speeding up the process. When the first nozzle moves to the end, the second nozzle will also move onto the PCB board, thus reducing the need for position adjustment during movement.

[0009] Preferably, a pair of baffles are fixedly connected to the top of the outer shell; a plurality of spring telescopic rods are fixedly connected to the surface of the baffles; a limiting plate is fixedly connected to the end of the spring telescopic rod; the end of the limiting plate is arc-shaped; by adding the limiting plate to fix the first nozzle, the stability of the first nozzle can be increased after the first nozzle moves, thereby reducing movement when processing the PCB board, thereby increasing the contact with the PCB board and increasing the processing speed of the PCB board.

[0010] Preferably, a plurality of damping springs are fixedly connected to the middle of the outer shell; a buffer plate is fixedly connected to the end of the damping spring; by adding a buffer plate, the impact on the baffle can be reduced during the movement of the first nozzle, thereby increasing the protection of the first nozzle and reducing impact damage when in contact with the baffle.

[0011] Preferably, the side wall of the outer casing is connected to an air intake pipe; the air intake pipe is located in the lower half of the outer casing; by adding a damping spring, the internal temperature of the outer casing can be increased after rinsing the PCB board, thereby drying the PCB board and reducing the moisture on the surface of the PCB board.

[0012] Preferably, a sponge pad is fixed to the bottom of the collection box; the sponge pad and the collection box are correspondingly arranged; by adding the sponge pad, the used water source can be absorbed, thereby reducing water spillage.

[0013] The advantages of this utility model are:

[0014] 1. The PCB gold plating tank of this utility model uses a fixing bracket to fix the PCB board, which can fix both sides of the PCB board during fixing. At the same time, the fixing bracket is L-shaped, which reduces the obstruction to the PCB board after fixing, thereby reducing the impact on the PCB board cleaning. In addition, the use of a round plate to rotate the square plate can move the PCB board, thereby speeding up the cleaning speed of the PCB board.

[0015] 2. The PCB gold plating tank of this utility model, by adding a second nozzle, can spray cleaning agent on the PCB board after gold plating, thereby reducing the residual electroplating solution on the PCB board surface. At the same time, the first nozzle and the second nozzle are connected by a square rod, so that the second nozzle can be moved when the first nozzle is moved, thereby reducing the need to switch the position of the first nozzle and speeding up the process. When the first nozzle moves to the end, the second nozzle will also move to the PCB board, thereby reducing the need for position adjustment during movement. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the main body of this utility model;

[0018] Figure 2 This is a schematic diagram of the transmission tube in this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the fixing frame in this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the baffle in this utility model;

[0021] Figure 5 This is a schematic diagram of the structure of the buffer plate in this utility model.

[0022] In the diagram: 1. Outer shell; 11. Fixing plate; 12. Glass window; 13. First nozzle; 14. Transmission pipe; 15. Round plate; 16. Rocker arm; 17. Round rod; 18. Square plate; 19. Two-way lead screw; 101. Fixing frame; 102. Gold-plated box; 103. Collection box; 2. Second nozzle; 21. Square rod; 22. Water guide pipe; 3. Baffle; 31. Spring telescopic rod; 32. Limiting plate; 4. Damping spring; 41. Buffer plate; 5. Air intake pipe; 6. Sponge pad. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] Specific implementation examples are given below.

[0025] like Figures 1 to 5 As shown in the embodiment of this utility model, a PCB gold plating tank includes a housing 1, a fixing plate 11 rotatably connected to the side wall of the housing 1; a glass window 12 fixedly connected to the middle of the fixing plate 11; a first nozzle 13 provided on the top of the housing 1; a transmission pipe 14 connected to the top of the first nozzle 13; a circular plate 15 rotatably connected to the surface of the housing 1; a rocker arm 16 fixedly connected to the surface of the circular plate 15; a circular rod 17 fixedly connected to the side wall of the circular plate 15; the circular rod 17 is through-hole and rotatably connected to the housing 1; the circular rod A square plate 18 is fixedly connected to the end of the PCB board 17; a bidirectional lead screw 19 is rotatably connected to the middle of the square plate 18; a pair of fixing brackets 101 are threadedly connected to the middle of the bidirectional lead screw 19; the fixing brackets 101 are L-shaped; a gold-plated box 102 is fixedly connected to the bottom of the outer shell 1; a collection box 103 is slidably connected to the side wall of the outer shell 1; during operation, the bidirectional lead screw 19 is first rotated to push the fixing brackets 101 to move to both sides, thereby freeing up the space in the middle of the square plate 18, then the PCB board is placed horizontally, and then the bidirectional lead screw 19 is rotated in the opposite direction. The fixing bracket 101 is moved closer to the PCB board, thereby clamping the PCB board on both sides to fix it. Then, the circular plate 15 is rotated to put the PCB board into the gold plating box 102 for gold plating. After the gold plating is completed, the PCB board can be rotated out of the gold plating box 102. Then, the transmission pipe 14 is connected to the water pump, and the water flow is transmitted to the first nozzle 13 and finally sprayed onto the surface of the PCB board. When the circular plate 15 is rotated, the cleaning effect of the PCB board can be observed through the glass window 12. During cleaning, the collection box 103 is inserted into the outer shell 1. At this time, the water flow after rinsing will flow into the collection box 103, thereby completing the cleaning work of the PCB board. By using the fixing bracket 101 to fix the PCB board, both sides of the PCB board can be fixed during fixing. At the same time, the L-shaped fixing bracket 101 will reduce the obstruction of the PCB board after fixing, thereby reducing the impact on the PCB board cleaning. At the same time, the circular plate 15 can be rotated to move the PCB board, thereby speeding up the cleaning speed of the PCB board.

[0026] like Figures 1 to 2As shown, a second nozzle 2 is slidably connected to the top of the outer casing 1; a square rod 21 is fixedly connected to the side wall of the second nozzle 2; the end of the square rod 21 is fixedly connected to the first nozzle 13; a water guide pipe 22 is connected to the top of the second nozzle 2; the first nozzle 13 is slidably connected to the outer casing 1; during operation, after the first nozzle 13 is used to gold-plat the PCB board, the residual electroplating solution on the surface of the PCB board needs to be cleaned. At this time, the first nozzle 13 is slidably brought into contact with the end of the outer casing 1. When the first nozzle 13 moves, it will drive the square rod 21 to move. When the square rod 21 moves, it will move the second nozzle 2 in conjunction. When the first nozzle 13 reaches the end of the outer casing 1, the second nozzle 2 will be in the position before the first nozzle 13 moved. At this time, the second nozzle 2... The first nozzle 13 is positioned above the PCB board. The water pipe 22 is connected to a water pump to transmit the cleaning solution through the water pipe 22 to the inside of the second nozzle 2, and finally spray it onto the surface of the PCB board. Then the first nozzle 13 is restored to rinse it, thereby rinsing off the residual electroplating solution on the surface of the PCB board. By adding the second nozzle 2, the cleaning agent can be sprayed on the PCB board after gold plating, thereby reducing the residual electroplating solution on the surface of the PCB board. At the same time, the first nozzle 13 and the second nozzle 2 are connected by a square rod 21, which can drive the second nozzle 2 to move when the first nozzle 13 is moved, thereby reducing the need to switch the position of the first nozzle 13 and speeding up the process. When the first nozzle 13 moves to the end, the second nozzle 2 will also move to the PCB board, thereby reducing the need for position adjustment during movement.

[0027] like Figures 1 to 2 As shown, a pair of baffles 3 are fixedly connected to the top of the outer shell 1; multiple spring telescopic rods 31 are fixedly connected to the surface of the baffles 3; a limiting plate 32 is fixedly connected to the end of the spring telescopic rod 31; the end of the limiting plate 32 is arc-shaped; during operation, when the first nozzle 13 moves past the end of the outer shell 1, it will contact the end of the limiting plate 32. At this time, the first nozzle 13 will push the end of the limiting plate 32 to rotate. As the first nozzle 13 continues to move, the pressure on the limiting plate 32 will gradually increase. When the limiting plate 32 rotates, the spring telescopic rods 31 will be compressed. When the first nozzle 13 has completely passed the limiting plate 32, the limiting plate 32 will return to its initial position, thereby locking the first nozzle 13 and fixing it, increasing stability during cleaning; by adding the limiting plate 32 to fix the first nozzle 13, the stability of the first nozzle 13 after it moves can be increased, thereby reducing movement when processing the PCB board, thereby increasing the contact with the PCB board and increasing the processing speed of the PCB board.

[0028] like Figures 4 to 5As shown, a plurality of damping springs 4 are fixedly connected to the middle of the outer shell 1; a buffer plate 41 is fixedly connected to the end of the damping spring 4; during operation, when the first nozzle 13 is pulled, it will contact the baffle 3. At this time, the first nozzle 13 will first contact the buffer plate 41. As the first nozzle 13 gradually moves and pushes the buffer plate 41, the buffer plate 41 will then squeeze the damping spring 4, thereby reducing the impact of the first nozzle 13 when it contacts the baffle 3; by adding the buffer plate 41, the impact on the baffle 3 can be reduced during the movement of the first nozzle 13, thereby increasing the protection of the first nozzle 13 and reducing impact damage when it contacts the baffle 3.

[0029] like Figures 1 to 2 As shown, the side wall of the outer shell 1 is connected to an air intake pipe 5; the air intake pipe 5 is located in the lower half of the outer shell 1; during operation, after the PCB board is cleaned, the damping spring 4 can be connected to a hot air generator to transfer hot air through the air intake pipe 5 to the inside of the outer shell 1, thereby raising the temperature inside the outer shell 1 and drying the PCB board, thus reducing the residual moisture on the surface of the PCB board; by adding the air intake pipe 5, the temperature inside the outer shell 1 can be raised after rinsing the PCB board, thereby drying the PCB board and reducing the moisture on the surface of the PCB board.

[0030] like Figure 2 As shown, a sponge pad 6 is fixed to the bottom of the collection box 103; the sponge pad 6 and the collection box 103 are correspondingly arranged; during operation, when the first nozzle 13 is used to rinse the PCB board, the wastewater will flow through the surface of the PCB board into the collection box 103. When the water flows into the collection box 103, it will come into contact with the sponge pad 6, thereby reducing splashing; by adding the sponge pad 6, the used water can be absorbed, thereby reducing water spillage.

[0031] Working principle: First, the bidirectional lead screw 19 is rotated, pushing the fixing frame 101 to move to both sides, thereby freeing up the space in the middle of the square plate 18. Then, the PCB board is placed horizontally. Next, the bidirectional lead screw 19 is rotated in the opposite direction, bringing the fixing frame 101 closer to the PCB board. This clamps the PCB board on both sides, thus fixing it in place. Then, the circular plate 15 is rotated, placing the PCB board into the gold plating box 102 for gold plating. After gold plating is completed, the PCB board can be rotated out of the gold plating box 102. Then, the transmission pipe 14 is connected to the water pump, and the water flow is transmitted to the first nozzle 13 and finally sprayed onto the surface of the PCB board. While the circular plate 15 is rotating, the cleaning of the PCB board can be observed through the glass window 12. The effect is that during cleaning, the collection box 103 is inserted into the outer casing 1. At this time, the water after rinsing will flow into the collection box 103, thus completing the cleaning of the PCB board. After using the first nozzle 13 to gold plate the PCB board, it is necessary to clean the residual electroplating solution on the surface of the PCB board. At this time, the first nozzle 13 is slid to contact the end of the outer casing 1. When the first nozzle 13 moves, it will drive the square rod 21 to move. When the square rod 21 moves, it will move the second nozzle 2. When the first nozzle 13 reaches the end of the outer casing 1, the second nozzle 2 will be in the position before the first nozzle 13 moved. At this time, the second nozzle 2 will be above the PCB board. Then, the water guide pipe 22 is connected to the water pump to transmit the cleaning solution through the water guide pipe 22. The solution is fed into the second nozzle 2 and finally sprayed onto the PCB board surface. Then, the first nozzle 13 is restored to its original position to rinse the PCB board surface, thus removing residual electroplating solution. When the first nozzle 13 moves past the end of its outer shell 1, it contacts the end of the limiting plate 32. At this time, the first nozzle 13 pushes the end of the limiting plate 32 to rotate. As the first nozzle 13 continues to move, the pressure on the limiting plate 32 gradually increases. When the limiting plate 32 rotates, the spring telescopic rod 31 is compressed. After the first nozzle 13 has completely passed the limiting plate 32, the limiting plate 32 returns to its initial position, thus locking the first nozzle 13 in place and increasing stability during cleaning. Pulling the first nozzle 13... When the first nozzle 13 comes into contact with the baffle 3, it will first contact the buffer plate 41. As the first nozzle 13 moves, it pushes the buffer plate 41, and then the buffer plate 41 will squeeze the damping spring 4, thereby reducing the impact of the first nozzle 13 when it comes into contact with the baffle 3. After cleaning the PCB board, the damping spring 4 can be connected to a hot air machine to transfer hot air through the air inlet pipe 5 to the inside of the outer shell 1, so that the inside of the outer shell 1 is heated, thereby drying the PCB board and reducing the residual moisture on the surface of the PCB board. When the first nozzle 13 is used to rinse the PCB board, the wastewater will flow through the surface of the PCB board into the collection box 103. When the water flows into the collection box 103, it will come into contact with the sponge pad 6, thereby reducing splashing.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A PCB gold plating tank, comprising a housing (1), characterized in that: A fixing plate (11) is rotatably connected to the side wall of the outer shell (1); a glass window (12) is fixedly connected to the middle of the fixing plate (11); a first nozzle (13) is provided on the top of the outer shell (1); a transmission pipe (14) is connected to the top of the first nozzle (13); a circular plate (15) is rotatably connected to the surface of the outer shell (1); a rocker arm (16) is fixedly connected to the surface of the circular plate (15); a circular rod (17) is fixedly connected to the side wall of the circular plate (15); the circular rod... (17) The outer shell (1) is through-connected and rotatably connected; a square plate (18) is fixed to the end of the round rod (17); a double-acting screw (19) is rotatably connected to the middle of the square plate (18); a pair of fixing brackets (101) are threadedly connected to the middle of the double-acting screw (19); the fixing brackets (101) are L-shaped; a gold-plated box (102) is fixed to the bottom of the outer shell (1); a collection box (103) is slidably connected to the side wall of the outer shell (1).

2. The PCB gold plating bath according to claim 1, characterized in that: The top of the outer shell (1) is slidably connected to a second nozzle (2); a square rod (21) is fixedly connected to the side wall of the second nozzle (2); the end of the square rod (21) and the first nozzle (13) are fixedly connected; a water guide pipe (22) is connected to the top of the second nozzle (2); the first nozzle (13) is slidably connected to the outer shell (1).

3. The PCB gold plating bath according to claim 2, characterized in that: A pair of baffles (3) are fixed to the top of the outer shell (1); a plurality of spring telescopic rods (31) are fixed to the surface of the baffles (3); a limiting plate (32) is fixed to the end of the spring telescopic rod (31); the end of the limiting plate (32) is arc-shaped.

4. A PCB gold plating tank according to claim 3, characterized in that: Multiple damping springs (4) are fixedly connected to the middle of the outer shell (1); buffer plates (41) are fixedly connected to the ends of the damping springs (4).

5. A PCB gold plating bath according to claim 4, characterized in that: The side wall of the outer shell (1) is connected to an air intake pipe (5); the air intake pipe (5) is located in the lower half of the outer shell (1).

6. A PCB gold plating bath according to claim 5, characterized in that: A sponge pad (6) is fixed to the bottom of the collection box (103); the sponge pad (6) and the collection box (103) are arranged correspondingly.

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