Silicon wafer drying box

Abstract

The utility model discloses a silicon wafer drying box which comprises a box body, box doors are symmetrically hinged to one side of the box body, drying cavities are symmetrically formed in the box body, fixing assemblies used for installing silicon wafers are arranged in the drying cavities on the two sides, a first drying assembly is arranged on the tops of the drying cavities, and a second drying assembly is arranged in the middle of the box body. An operator clamps a to-be-dried silicon wafer to the middle of the fixing frame and then conveniently and slidably mounts the fixing frame into the corresponding drying cavity of the box body along the sliding rail through the handle groove, so that the silicon wafer is quickly mounted into the drying box to be dried, or the silicon wafer is taken out from the drying box and placed into the drying box after being dried; the drying lamp and the heating fan are matched for drying treatment, the drying temperature in the heating cavity is further ensured through the drying lamp, hot air is further blown to flow through the surface of the silicon wafer through the heating fan, the drying effect on the silicon wafer is further improved, the drying time of the silicon wafer is shortened, and the drying processing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing equipment, and in particular to a silicon wafer drying oven. Background Technology

[0002] During the processing of solar silicon wafers, after the conductive paste is printed on the surface of the wafers, they need to be dried. Currently, solar silicon wafers are usually dried in cabinet-type drying ovens. Due to their sealed structure, airborne particles are not easily allowed to enter the drying oven, resulting in relatively good drying quality. However, the internal structure of traditional drying ovens is relatively complex, and it is inconvenient to remove and place the silicon wafers from the drying oven. At the same time, the silicon wafers placed in the fixing structure are very dense, making it difficult for heat to enter between adjacent silicon wafers. This can easily cause the silicon wafers to heat up too slowly, resulting in a long overall drying time, low efficiency, and poor drying effect and practicality. Utility Model Content

[0003] The purpose of this utility model is to provide a silicon wafer drying oven to solve the problems mentioned in the background art, such as the complex internal structure of traditional drying ovens, long drying time, and poor drying effect.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a silicon wafer drying oven, comprising a box body, a box door symmetrically hinged on one side of the box body, drying chambers symmetrically arranged inside the box body, fixing components for installing silicon wafers in both sides of the drying chambers, a first drying component at the top of the drying chamber, and a second drying component in the middle of the box body.

[0005] Preferably, the fixing assembly includes slide rails symmetrically arranged at the bottom of the drying chamber, a fixing frame movably arranged at the top of the slide rails, a handle groove on each of the four sides of the bottom of the fixing frame, and a plurality of snap-fit ​​grooves for mounting silicon wafers symmetrically arranged on the inner wall of the fixing frame.

[0006] Preferably, the drying assembly includes several mounting slots opened at the top of the drying chamber, and drying lamps are installed in the mounting slots.

[0007] Preferably, the second drying component includes an air chamber in the middle of the box, and several exhaust holes are provided on the side walls of the drying chamber on both sides that are connected to the air chamber. A connecting pipe is provided on the top of the box that is connected to the air chamber, and a heating fan is provided on the top of the box that is connected to the connecting pipe through the air pipe.

[0008] Preferably, the bottom of the box is provided with mounting blocks at the four corners, and the mounting blocks are provided with waist-shaped holes through the center.

[0009] Preferably, the outer side of the cabinet door is provided with a handle, the inner side of the cabinet door is provided with a number of locking pins, and the cabinet body is provided with pin holes that engage with the locking pins.

[0010] Preferably, both sides of the drying chamber are provided with a guide slope on the side away from the exhaust port.

[0011] Preferably, the bottom of the chamber is connected to the flow guide slope on the same side and has a flow guide cavity, and the bottom wall of the drying chamber is connected to the flow guide cavity and has a number of air guide holes.

[0012] The beneficial effects of this utility model are:

[0013] 1. The operator attaches the silicon wafers to be dried to the center of the mounting bracket, and then easily slides the bracket along the guide rail into the corresponding drying chamber of the oven using the handle groove. This allows for quick installation of the silicon wafers into the drying oven for drying, or removal of the dried wafers from the drying oven and placement of them inside. The drying process is then carried out using drying lamps and a heating fan. The drying lamps further ensure the drying temperature within the heating chamber, while the heating fan blows hot air across the surface of the silicon wafers, further enhancing the drying effect and shortening the drying time, thus improving drying efficiency.

[0014] 2. By starting the heating fan, hot air is guided through the air pipe to one end of the connecting pipe, and then through the connecting pipe into the air chamber. Then, through several exhaust holes on both sides of the inner wall of the air chamber, the hot air is guided to the drying chambers on both sides, thereby blowing the hot air onto the surface of the silicon wafer, further improving the drying effect of the silicon wafer and reducing the drying time of the silicon wafer.

[0015] 3. The airflow blown out of the exhaust hole is guided to one side of the guide cavity by the guide slope, and then blown from the bottom of the silicon wafer to the surface of the silicon wafer through the air guide hole, thereby improving the drying effect. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0017] Figure 2 This is a three-dimensional structural diagram of an embodiment of the present invention with the door removed;

[0018] Figure 3 This is a cross-sectional perspective view of an embodiment of the present utility model.

[0019] Figure 4 This is a three-dimensional structural diagram of the fixing frame in an embodiment of the present utility model;

[0020] Figure 5 This is a three-dimensional structural diagram of the door in an embodiment of this utility model.

[0021] In the diagram: 1. Cabinet; 2. Cabinet door; 3. Drying chamber; 4. Fixing assembly; 41. Slide rail; 42. Fixing bracket; 43. Handle groove; 44. Snap-fit ​​groove; 5. Drying assembly one; 51. Mounting groove; 52. Drying lamp; 6. Drying assembly two; 61. Air chamber; 62. Exhaust port; 63. Connecting pipe; 64. Heating fan; 7. Mounting block; 8. Waist-shaped hole; 9. Handle; 10. Snap-fit ​​pin; 11. Pin hole; 12. Guide slope; 13. Guide chamber; 14. Air vent. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1 to 5 This utility model provides a silicon wafer drying oven, including a box body 1. A box door 2 is symmetrically hinged on one side of the box body 1. Drying chambers 3 are symmetrically arranged inside the box body 1. Fixing components 4 for installing silicon wafers are provided in both sides of the drying chambers 3. A first drying component 5 is provided at the top of the drying chamber 3. A second drying component 6 is provided in the middle of the box body 1. The operator can quickly install the silicon wafer to be dried into the drying oven by snapping the silicon wafer to be dried into the middle of the fixing bracket 42 in the fixing component 4, and then conveniently slide the fixing bracket 42 along the slide rail 41 into the corresponding drying chamber 3 of the box body 1 through the handle groove 43. This allows the silicon wafer to be quickly installed into the drying oven for drying, or removed from the drying oven after drying and placed into the drying oven. The drying process is carried out by the drying lamp 52 in the first drying component 5 and the heating fan 64 in the second drying component 6. The drying lamp 52 further ensures the drying temperature in the heating chamber, and the heating fan 64 further blows hot air onto the surface of the silicon wafer, further improving the drying effect of the silicon wafer, shortening the drying time of the silicon wafer, and improving the drying processing efficiency.

[0024] like Figure 3 and Figure 4As shown, specifically, the fixing component 4 includes a slide rail 41 symmetrically arranged at the bottom of the drying chamber 3, a fixing frame 42 movably arranged at the top of the slide rail 41, and a handle groove 43 opened on all four sides of the bottom of the fixing frame 42. The inner wall of the fixing frame 42 is symmetrically provided with a number of snap-fit ​​grooves 44 for installing silicon wafers. By snapping the silicon wafer into the snap-fit ​​groove 44, the silicon wafer can be conveniently placed in the middle of the fixing frame 42. Then, the fixing frame 42 is guided along the slide rail 41 through the handle groove 43, and then quickly positioned and installed in the drying chamber 3. This conveniently realizes the placement of silicon wafers into the drying chamber or their removal from the drying chamber, simplifies the internal structure of the drying chamber, and improves the effect of silicon wafer drying.

[0025] Specifically, the fixing frame 42 is in the shape of a right quadrangular prism, which facilitates the placement of round or rectangular silicon wafers.

[0026] Specifically, the door 2 has a transparent glass in the middle to facilitate observation of the drying status of the silicon wafers inside the drying oven.

[0027] Specifically, the hinged connection method between the door 2 and the body 1 is existing technology and will not be described in detail here.

[0028] like Figure 2 As shown, specifically, the drying component 5 includes several mounting slots 51 opened at the top of the drying chamber 3. Drying lamps 52 are installed in the mounting slots 51. By installing several drying lamps 52 into the mounting slots 51, the temperature inside the drying chamber 3 is maintained by the drying lamps 52, and the silicon wafers are dried in conjunction with the heating fan 64, thereby improving the overall drying effect.

[0029] Specifically, the drying assembly 6 includes an air chamber 61 in the middle of the housing 1, and several exhaust holes 62 on the side walls of the drying chambers 3 on both sides, which are connected to the air chamber 61. A connecting pipe 63 is provided on the top of the housing 1, which is connected to the air chamber 61. A heating fan 64 is provided on the top of the housing 1, which is connected to the connecting pipe 63 through an air pipe. By starting the heating fan 64, hot air is guided through the air pipe to one end of the connecting pipe 63, and then through the connecting pipe 63 to the air chamber 61. The hot air is then guided through the several exhaust holes 62 on both sides of the inner wall of the air chamber 61 to the drying chambers 3 on both sides, thereby blowing the hot air onto the surface of the silicon wafer, further improving the drying effect of the silicon wafer and reducing the drying time of the silicon wafer.

[0030] like Figure 1 As shown, specifically, the bottom of the box 1 is provided with mounting blocks 7 at the four corners, and the mounting blocks 7 are provided with waist-shaped holes 8 through the middle. By passing bolts through the waist-shaped holes 8, the box 1 is fixedly connected to the mounting base through the mounting blocks 7, thereby fixing the box 1 and improving the stability of the drying box during use.

[0031] like Figure 5As shown, specifically, the outer side of the box door 2 is provided with a handle 9, and the inner side of the box door 2 is provided with several locking pins 10. The box body 1 is provided with pin holes 11 that engage with the locking pins 10. The handle 9 facilitates pulling the box door 2 to rotate, thereby allowing the locking pins 10 on the inner side of the box door 2 to engage or disengage with the pins of the box body 1, thus realizing the opening and closing of the box door 2.

[0032] Specifically, each of the drying chambers 3 on both sides is provided with a guide slope 12 on the side away from the exhaust port 62. The airflow blown out of the exhaust port 62 is guided by the guide slope 12 to the side of the guide chamber 13, and then blown from the bottom of the silicon wafer to the surface of the silicon wafer through the air guide hole 14, thereby improving the drying effect.

[0033] Specifically, the bottom of the box 1 is connected to the flow guide slope 12 on the same side and is provided with a flow guide cavity 13. The bottom wall of the drying chamber 3 is connected to the flow guide cavity 13 and is provided with a number of air guide holes 14.

[0034] The working principle of this utility model is as follows: In use, the operator attaches the silicon wafer to be dried to the middle of the fixing frame 42, and then conveniently slides the fixing frame 42 along the slide rail 41 into the corresponding drying chamber 3 of the box body 1 through the handle groove 43. This allows the silicon wafer to be quickly installed into the drying box for drying, or removed from the drying box after drying and placed in the drying box. The drying is then carried out by the drying lamp 52 and the heating fan 64. The drying lamp 52 further ensures the drying temperature in the heating chamber, and the heating fan 64 further blows hot air over the surface of the silicon wafer, further improving the drying effect of the silicon wafer, thereby shortening the drying time and improving the drying efficiency.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon wafer drying oven, comprising a box body (1), characterized in that: The box (1) is symmetrically hinged with a door (2) on one side. The box (1) is symmetrically provided with a drying chamber (3). Both sides of the drying chamber (3) are provided with a fixing component (4) for installing silicon wafers. The top of the drying chamber (3) is provided with a drying component one (5), and the middle of the box (1) is provided with a drying component two (6).

2. The silicon wafer drying oven according to claim 1, characterized in that: The fixing component (4) includes a slide rail (41) symmetrically arranged at the bottom of the drying chamber (3), a fixing frame (42) movably arranged at the top of the slide rail (41), a useful handle groove (43) is opened on all four sides of the bottom of the fixing frame (42), and a number of snap-fit ​​grooves (44) for installing silicon wafers are symmetrically arranged on the inner wall of the fixing frame (42).

3. A silicon wafer drying oven according to claim 1, characterized in that: The drying assembly (5) includes several mounting slots (51) opened at the top of the drying chamber (3), and a drying lamp (52) is installed in the mounting slot (51).

4. A silicon wafer drying oven according to claim 1, characterized in that: The second drying component (6) includes an air chamber (61) in the middle of the box (1), and several exhaust holes (62) are provided on the side walls of the drying chambers (3) on both sides, which are connected to the air chamber (61). A connecting pipe (63) is provided on the top of the box (1) and connected to the air chamber (61). A heating fan (64) is provided on the top of the box (1) through an air pipe and the connecting pipe (63).

5. A silicon wafer drying oven according to claim 1, characterized in that: The box (1) has four mounting blocks (7) at the bottom corners, and the mounting blocks (7) have waist-shaped holes (8) through the middle.

6. A silicon wafer drying oven according to claim 1, characterized in that: The box door (2) has a handle (9) on the outside side and several locking pins (10) on the inside side. The box body (1) has pin holes (11) that are engaged with the locking pins (10).

7. A silicon wafer drying oven according to claim 4, characterized in that: Both sides of the drying chamber (3) are provided with a guide slope (12) on the side away from the exhaust port (62).

8. A silicon wafer drying oven according to claim 7, characterized in that: The bottom of the box (1) is connected to the flow guide slope (12) on the same side and has a flow guide cavity (13). The bottom wall of the drying chamber (3) is connected to the flow guide cavity (13) and has a number of air guide holes (14).

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