High-temperature and high-pressure temperature and pressure sensor

Abstract

The utility model relates to the technical field of sensors, in particular to a high-temperature and high-pressure temperature and pressure sensor which comprises an electrical connector, a connecting ring sleeve and a base, the connecting ring sleeve is located between the electrical connector and the base, a separating ring plate is arranged on the connecting ring sleeve, a circuit cavity is defined between the separating ring plate and the electrical connector, and a circuit board is arranged in the circuit cavity. A signal transmission elastic piece is arranged between the circuit board and the electrical connector, a temperature measuring assembly used for measuring temperature and a pressure measuring assembly used for measuring pressure are arranged on the base, the pressure measuring assembly comprises a pressure sensing module arranged between the separating ring plate and the base, and a pressure channel communicated with the pressure sensing module is formed in the outer surface of the base. A sealing piece used for sealing is arranged between the pressure sensing module and the base, and a connecting piece used for transmitting electric signals is arranged between the pressure sensing module and the circuit board. The device has the effects of adapting to measurement of high-temperature media and prolonging the service life.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a high-temperature and high-pressure temperature and pressure sensor. Background Technology

[0002] A temperature and pressure sensor is a sensor that integrates pressure measurement and temperature measurement. It can simultaneously measure temperature and pressure signals and convert these signals into electrical signals or other desired signal outputs according to certain rules.

[0003] Chinese patent CN114216519A discloses a temperature and pressure integrated sensor packaging structure, including a metal component fixed to a metal component. A closed fluid channel and an open fluid channel extend outward from the bottom of the metal component. A metal plate is fixed above the port of the open fluid channel extending upward. A MEMS pressure chip is fixed to the metal plate after being sintered with glass powder at high temperature. A flexible circuit board is mounted on the metal plate. An ASIC conditioning chip is fixed to the flexible circuit board.

[0004] In the above technology, both the pressure chip and the circuit board are mounted on a metal plate. When the sensor is measuring in a high-temperature environment, the measured medium will transfer the high temperature to the metal plate through the pressure chip. Due to the excellent thermal conductivity of the metal plate, the metal plate will transfer the high temperature to the circuit board. Since the electronic components on the circuit board are usually fixed by soldering, the high temperature transferred to the circuit board can easily damage the circuit board, seriously affecting the service life of the sensor, which has shortcomings. Utility Model Content

[0005] To address the issue of reduced sensor lifespan due to circuit board damage in high-temperature environments, this application provides a high-temperature, high-pressure thermo-pressure sensor.

[0006] The high-temperature and high-pressure thermo-pressure sensor provided in this application adopts the following technical solution:

[0007] A high-temperature and high-pressure temperature and pressure sensor includes an electrical connector, a connecting ring, and a base. The connecting ring is located between the electrical connector and the base. A partition ring plate is provided on the connecting ring, and the partition ring plate and the electrical connector form a circuit cavity. A circuit board is provided inside the circuit cavity. A signal transmission spring is provided between the circuit board and the electrical connector. A temperature measuring component for measuring temperature and a pressure measuring component for measuring pressure are provided on the base. The pressure measuring component includes a pressure sensing module disposed between the partition ring plate and the base. A pressure channel communicating with the pressure sensing module is opened on the outer surface of the base. A sealing element for sealing is provided between the pressure sensing module and the base. A connector for transmitting electrical signals is provided between the pressure sensing module and the circuit board.

[0008] By adopting the above technical solution, the designers separate the pressure sensing module and the circuit board with a partition ring plate, and then realize the transmission of electrical signals between the pressure sensing module and the circuit board through the connector. At the same time, the pressure signal received on the circuit board is transmitted to the electrical connector by the signal transmission spring. By reducing the path on the circuit board that can be transmitted to high temperature, the possibility of the circuit board being damaged by high temperature is reduced, thereby improving the service life of the sensor.

[0009] Optionally, the connector includes a conductive spring disposed between the circuit board and the pressure sensing module, and the partition ring plate has a spring slot for accommodating the conductive spring.

[0010] By adopting the above technical solution, installers only need to install the conductive spring made of metal into the spring slot on the separator ring plate, without welding, which reduces the manufacturing process of the sensor and helps to reduce the production cost of the sensor.

[0011] Optionally, the connector includes a conductive pin disposed on the side of the pressure sensing module facing away from the pressure channel, with one end of the conductive pin facing away from the pressure sensing module disposed on the circuit board, and a clearance groove provided on the partition ring plate for the conductive pin to pass through.

[0012] By adopting the above technical solution, the pressure signal between the pressure sensing module and the circuit board is transmitted through the conductive needle, which prevents direct contact between the pressure sensing module and the circuit board. At the same time, the cross-section of the conductive needle is usually small and the conduction temperature is inversely proportional to the length of the conductive needle, which further weakens the effect of the high temperature on the pressure sensing module being transmitted to the circuit board, thereby reducing the possibility of damage to the circuit board.

[0013] Optionally, the seal includes a first sealing ring disposed between the pressure sensing module and the base.

[0014] By adopting the above technical solution, the possibility of the measured medium flowing into the circuit board through the gap between the pressure sensing module and the base is reduced, which helps to improve the service life of the sensor.

[0015] Optionally, a positioning block is provided on the base, and a positioning slot for the positioning block to be inserted is opened at the contact position between the pressure sensing module and the base. A positioning rod is provided on the positioning block, a positioning plate slot for the positioning rod to pass through is opened on the circuit board, and a mounting slot for accommodating the circuit board is opened on the partition ring plate.

[0016] By adopting the above technical solution, the positioning block facilitates the installation personnel in assembling the base, pressure sensing module and partition ring plate, which helps to reduce the installation difficulty for the assembly personnel and improve the assembly production efficiency of the sensor.

[0017] Optionally, the temperature measuring component includes a temperature measuring channel formed on the base, one end of which opens to the contact position between the positioning block and the base, and the other end opens to the outside of the base. The base is provided with a hollow, open-ended temperature-conducting shell, which communicates with the temperature measuring channel. A thermistor is provided inside the temperature-conducting shell, and the pins of the thermistor are set on the circuit board through the temperature measuring channel. The positioning block is provided with pin holes for the pins of the thermistor to pass through.

[0018] By adopting the above technical solution, it is convenient for assembly personnel to install the thermistor. At the same time, the temperature-conducting shell reduces the possibility of the thermistor being directly exposed to the measured medium, reduces the possibility of damage to the thermistor, and helps to improve the service life of the thermistor.

[0019] Optionally, the connecting ring is installed on the electrical connector, and a second sealing ring is provided between the separating ring plate and the electrical connector, the second sealing ring abutting against the inner sidewall of the connecting ring.

[0020] By adopting the above technical solution, the possibility of the tested medium flowing to the circuit board through the gap between the separator ring and the electrical connector is further reduced.

[0021] Optionally, the temperature measurement channel is arranged at an angle toward the axis of the base along the direction from the electrical connector to the base.

[0022] By adopting the above technical solution, it is beneficial to reduce the amount of manufacturing materials used in the base, which is beneficial to reduce the production cost of the sensor. At the same time, the inclined temperature measurement channel extends the pin length of the thermistor, further reducing the possibility of temperature being transferred to the circuit board.

[0023] Optionally, the temperature-conducting shell and the temperature-measuring channel are filled with thermally conductive grease.

[0024] By adopting the above technical solution, the temperature of the measured medium is transferred to the thermal grease through the thermal conductive shell. The thermistor located in the thermal conductive grease measures the surrounding temperature, which helps to improve the accuracy of the temperature measurement results by the thermistor. At the same time, the thermal conductive grease plays a limiting role in the thermistor when it cools down, reducing the possibility of the thermistor colliding with the thermal conductive shell during movement.

[0025] In summary, this application includes at least one of the following beneficial technical effects:

[0026] 1. Designers separate the pressure sensing module and the circuit board using a partition ring plate, and then use connectors to transmit electrical signals between the pressure sensing module and the circuit board. At the same time, the pressure signal received on the circuit board is transmitted to the electrical connector by the signal transmission spring. By reducing the paths on the circuit board that can be transmitted to high temperatures, the possibility of the circuit board being damaged by high temperatures is reduced, thereby improving the service life of the sensor.

[0027] 2. By transmitting the pressure signal between the pressure sensing module and the circuit board through the conductive needle, direct contact between the pressure sensing module and the circuit board is prevented. At the same time, the cross-section of the conductive needle is usually small and the conduction temperature is inversely proportional to the length of the conductive needle, which further weakens the effect of the high temperature on the pressure sensing module being transmitted to the circuit board, thereby reducing the possibility of damage to the circuit board.

[0028] 3. It helps reduce the amount of materials used in the base manufacturing process, which helps reduce the production cost of the sensor. At the same time, the tilted temperature measurement channel extends the pin length of the thermistor, further reducing the possibility of temperature being transferred to the circuit board. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this application.

[0030] Figure 2 This is a cross-sectional view showing the positional relationship between the separator ring plate and the conductive spring in Embodiment 1 of this application.

[0031] Figure 3 This is a schematic diagram showing the positional relationship between the circuit board, the signal transmission spring, and the positioning rod in Embodiment 1 of this application.

[0032] Figure 4 This is a cross-sectional view showing the positional relationship between the partition ring plate and the connecting ring sleeve during separate welding in Embodiment 2 of this application.

[0033] Figure 5 This is a cross-sectional view showing the positional relationship between the thermally conductive shell and the base when they are integrally formed in Embodiment 2 of this application.

[0034] Explanation of reference numerals in the attached drawings: 1. Electrical connector; 2. Connecting ring; 3. Base; 4. Separating ring plate; 5. Circuit cavity; 6. Circuit board; 7. Signal transmission spring; 8. Temperature measuring component; 81. Temperature measuring channel; 82. Temperature conductive shell; 83. Thermistor; 84. Pin hole; 9. Pressure measuring component; 91. Pressure sensing module; 92. Pressure groove; 93. Pressure channel; 94. Seal; 941. First sealing ring; 95. Connector; 951. Conductive spring; 952. Spring slot; 953. Conductive needle; 954. Clearance groove; 10. Positioning block; 11. Positioning slot; 12. Positioning rod; 13. Positioning plate groove; 14. Mounting groove; 15. Second sealing ring; 16. Injection molded part; 17. Thermal grease. Detailed Implementation

[0035] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0036] This application discloses a high-temperature and high-pressure temperature and pressure sensor.

[0037] Example 1

[0038] Reference Figure 1 A high-temperature and high-pressure temperature and pressure sensor includes an electrical connector 1, a connecting ring 2, and a base 3. The connecting ring 2 is located between the electrical connector 1 and the base 3 and is riveted to the electrical connector 1. A partition ring plate 4 is arranged inside the connecting ring 2. The partition ring plate 4 and the connecting ring 2 can be integrally formed or fixed together by welding.

[0039] Reference Figure 1 , Figure 2 and Figure 3 A second sealing ring 15 is arranged between the partition ring plate 4 and the electrical connector 1. The second sealing ring 15 abuts against the inner side wall of the connecting ring sleeve 2. The connecting ring sleeve 2 and the base 3 can be welded together using the laser welding technology in the prior art. The partition ring plate 4 and the electrical connector 1 form a circuit cavity 5. A circuit board 6 is arranged in the circuit cavity 5. The partition ring plate 4 has a mounting groove 14 for accommodating the circuit board 6.

[0040] Reference Figure 1 , Figure 2 and Figure 3 A signal transmission spring 7 is arranged between the circuit board 6 and the electrical connector 1. A positioning block 10 is arranged on the base 3. The positioning block 10 can be made of plastic material. A positioning rod 12 is integrally formed on the positioning block 10. A positioning plate groove 13 is opened on the circuit board 6 for the positioning rod 12 to pass through. A temperature measuring component 8 for measuring temperature and a pressure measuring component 9 for measuring pressure are arranged on the base 3.

[0041] Reference Figure 1 , Figure 2 and Figure 3 The pressure measuring component 9 includes a pressure sensing module 91 arranged between the partition ring plate 4 and the base 3. The base 3 has a pressure groove 92 for accommodating the pressure sensing module 91. The circumferential edge of the pressure sensing module 91 and the contact position with the base 3 have a positioning slot 11 for the positioning block 10 to be inserted. The outer surface of the bottom of the base 3 has a pressure channel 93 that communicates with the pressure groove 92.

[0042] Reference Figure 1 , Figure 2 and Figure 3A sealing element 94 for sealing is arranged between the pressure sensing module 91 and the pressure groove 92. The sealing element 94 includes a first sealing ring 941 arranged between the pressure sensing module 91 and the pressure groove 92. The connection between the pressure channel 93 and the pressure groove 92 is located inside the first sealing ring 941.

[0043] Reference Figure 1 , Figure 2 and Figure 3 A connector 95 for transmitting electrical signals is arranged between the pressure sensing module 91 and the circuit board 6. The connector 95 includes a conductive spring 951 arranged between the circuit board 6 and the pressure sensing module 91. The conductive spring 951 is made of metal material. A spring slot 952 for accommodating the conductive spring 951 is vertically opened on the partition ring plate 4.

[0044] The designers separated the pressure sensing module 91 and the circuit board 6 by designing a partition ring plate 4, and then used a conductive spring 951 to realize the transmission of electrical signals between the pressure sensing module 91 and the circuit board 6. At the same time, the pressure signal received on the circuit board 6 was transmitted to the electrical connector 1 by the signal transmission spring 7.

[0045] When measuring the temperature of the medium, the medium flows through pressure channel 93 to pressure sensing module 91. Simultaneously, pressure sensing module 91 transfers the medium temperature to conductive spring 951. Because the conductive spring 951 has a long helix and a small cross-section, it hinders the transfer of heat from pressure sensing module 91 to circuit board 6. Furthermore, the assembly personnel only need to place the conductive spring 951 into the spring slot 952 on the partition ring plate 4, simplifying the assembly process and reducing manufacturing costs.

[0046] Reference Figure 1 , Figure 2 and Figure 3 The base 3 is equipped with an injection molded part 16, which is located between the pressure sensing module 91 and the base 3. The injection molded part 16 can be made of rubber material. The temperature measuring component 8 includes a temperature measuring channel 81 opened on the base 3 and the injection molded part 16. The temperature measuring channel 81 is inclined towards the axis of the base 3 along the direction from the electrical connector 1 to the base 3. One end of the temperature measuring channel 81 is opened to the contact position between the bottom of the positioning block 10 and the positioning groove 11 on the base 3, and the other end is opened to the bottom of the base 3. The base 3 is provided with a hollow internal and open top temperature-conducting shell 82.

[0047] Reference Figure 1 , Figure 2 and Figure 3The temperature-conducting shell 82 can be integrally formed with the base 3 or fixed to the bottom of the base 3 by welding. The top of the temperature-conducting shell 82 is connected to the temperature measuring channel 81. A thermistor 83 is arranged inside the temperature-conducting shell 82. The pins of the thermistor 83 are welded to the circuit board 6 through the temperature measuring channel 81. The positioning block 10 has a pin hole 84 for the pins of the thermistor 83 to pass through. The temperature-conducting shell 82 and the temperature measuring channel 81 are filled with thermal grease 17.

[0048] The inclined temperature measurement channel 81 extends the pins of the thermistor 83, reducing the possibility of heat from the medium being transferred to the circuit board 6 through the pins of the thermistor 83. At the same time, the temperature-conducting shell 82 transfers the temperature of the measured medium to the surrounding area of ​​the thermistor 83, reducing the direct contact between the thermistor 83 and the medium, and reducing the possibility of the thermistor 83 being damaged by external factors.

[0049] The implementation principle of Embodiment 1 of this application is as follows: the designer separates the pressure sensing module 91 and the circuit board 6 by designing the partition ring plate 4, and then realizes the transmission of electrical signals between the pressure sensing module 91 and the circuit board 6 through the conductive spring 951. At the same time, the pressure signal received on the circuit board 6 is transmitted to the electrical connector 1 by the signal transmission spring 7.

[0050] When measuring the temperature of the medium, the medium flows to the pressure sensing module 91 through the pressure channel 93. While measuring the pressure, the pressure sensing module 91 transmits the temperature of the medium to the conductive spring 951. Because the conductive spring 951 has a long spiral length and a small cross-section, it hinders the transfer of heat from the pressure sensing module 91 to the circuit board 6 through the conductive spring 951. At the same time, the assembler only needs to place the conductive spring 951 in the spring slot 952 on the partition ring plate 4, which simplifies the assembly process and reduces the manufacturing cost.

[0051] The inclined temperature measurement channel 81 extends the pins of the thermistor 83, reducing the possibility of heat from the medium being transferred to the circuit board 6 through the pins of the thermistor 83. At the same time, the temperature-conducting shell 82 transfers the temperature of the measured medium to the surrounding area of ​​the thermistor 83, reducing the direct contact between the thermistor 83 and the medium, and reducing the possibility of the thermistor 83 being damaged by external factors.

[0052] Example 2

[0053] refer to Figure 4 and Figure 5 The difference between this embodiment and embodiment 1 is that the connector 95 includes a conductive pin 953 arranged on the side of the pressure sensing module 91 facing away from the pressure channel 93. One end of the conductive pin 953 facing away from the pressure sensing module 91 is soldered to the circuit board 6, and the partition ring plate 4 is provided with a clearance groove 954 for the conductive pin 953 to pass through.

[0054] The implementation principle of Example 2 is as follows: the designer separates the pressure sensing module 91 and the circuit board 6 by designing the partition ring plate 4, and then realizes the transmission of electrical signals between the pressure sensing module 91 and the circuit board 6 through the conductive pin 953. At the same time, the pressure signal received on the circuit board 6 is transmitted to the electrical connector 1 by the signal transmission spring 7.

[0055] When measuring the temperature of the medium, the medium flows through the pressure channel 93 to the pressure sensing module 91. While measuring the pressure, the pressure sensing module 91 transmits the temperature of the medium to the conductive needle 953. Since the cross-section of the conductive needle 953 is usually small and the temperature conduction is inversely proportional to the length of the conductive needle 953, the effect of reducing the transfer of high-temperature heat to the circuit board 6 through the conductive needle 953 is achieved while ensuring stable signal transmission.

[0056] Meanwhile, the circuit cavity 5 and the mounting groove 14 reduce the contact area between the circuit board 6 and the partition ring plate 4 and the electrical connector 1. The common circuit board 6 is usually made of phenolic resin PCB board, which has poor thermal conductivity. This further reduces the path of high temperature heat transfer to the circuit board 6, thereby reducing the possibility of damage to the electronic components on the circuit board 6. The first sealing ring 941 and the second sealing ring 15 reduce the flow of medium into the circuit cavity 5, which could lead to damage to the circuit board 6.

[0057] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-temperature, high-pressure thermo-pressure sensor, characterized in that: The device includes an electrical connector (1), a connecting ring (2), and a base (3). The connecting ring (2) is located between the electrical connector (1) and the base (3). A partition ring (4) is provided on the connecting ring (2). The partition ring (4) and the electrical connector (1) form a circuit cavity (5). A circuit board (6) is provided inside the circuit cavity (5). A signal transmission spring (7) is provided between the circuit board (6) and the electrical connector (1). A temperature measuring component for measuring temperature is provided on the base (3). 8) and a pressure measuring component (9) for measuring pressure, the pressure measuring component (9) including a pressure sensing module (91) disposed between the partition ring plate (4) and the base (3), a pressure channel (93) communicating with the pressure sensing module (91) is opened on the outer surface of the base (3), a sealing element (94) for sealing is disposed between the pressure sensing module (91) and the base (3), and a connector (95) for transmitting electrical signals is disposed between the pressure sensing module (91) and the circuit board (6).

2. The high-temperature and high-pressure temperature and pressure sensor according to claim 1, characterized in that: The connector (95) includes a conductive spring (951) disposed between the circuit board (6) and the pressure sensing module (91), and the partition ring plate (4) has a spring slot (952) for accommodating the conductive spring (951).

3. The high-temperature and high-pressure temperature and pressure sensor according to claim 1, characterized in that: The connector (95) includes a conductive pin (953) disposed on the side of the pressure sensing module (91) facing away from the pressure channel (93). One end of the conductive pin (953) facing away from the pressure sensing module (91) is disposed on the circuit board (6). A clearance groove (954) is provided on the partition ring plate (4) for the conductive pin (953) to pass through.

4. A high-temperature and high-pressure temperature and pressure sensor according to claim 1, characterized in that: The seal (94) includes a first sealing ring (941) disposed between the pressure sensing module (91) and the base (3).

5. A high-temperature and high-pressure temperature and pressure sensor according to claim 3, characterized in that: The base (3) is provided with a positioning block (10), and the pressure sensing module (91) and the base (3) have a positioning slot (11) for the positioning block (10) to be inserted at the same contact position. The positioning block (10) is provided with a positioning rod (12), and the circuit board (6) has a positioning plate slot (13) for the positioning rod (12) to pass through. The partition ring plate (4) has a mounting slot (14) for accommodating the circuit board (6).

6. A high-temperature and high-pressure thermo-pressure sensor according to claim 5, characterized in that: The temperature measuring component (8) includes a temperature measuring channel (81) opened on the base (3). One end of the temperature measuring channel (81) is opened to the contact position between the positioning block (10) and the base (3), and the other end is opened to the outside of the base (3). The base (3) is provided with a hollow temperature-conducting shell (82) with one end open. The temperature-conducting shell (82) is connected to the temperature measuring channel (81). A thermistor (83) is provided inside the temperature-conducting shell (82). The pins of the thermistor (83) are set on the circuit board (6) through the temperature measuring channel (81). The positioning block (10) is provided with a pin hole (84) for the pins of the thermistor (83) to pass through.

7. A high-temperature and high-pressure temperature and pressure sensor according to claim 1, characterized in that: The connecting ring sleeve (2) is installed on the electrical connector (1), and a second sealing ring (15) is provided between the separating ring plate (4) and the electrical connector (1), and the second sealing ring (15) abuts against the inner side wall of the connecting ring sleeve (2).

8. A high-temperature and high-pressure thermo-pressure sensor according to claim 6, characterized in that: The temperature measuring channel (81) is arranged at an angle toward the axis of the base (3) along the direction from the electrical connector (1) to the base (3).

9. A high-temperature and high-pressure thermo-pressure sensor according to claim 6, characterized in that: The temperature-conducting shell (82) and the temperature measuring channel (81) are filled with thermal grease (16).

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