Heat dissipation device and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a heat dissipation device and electronic equipment. The heat dissipation device provided by the utility model comprises a circuit board, a heat dissipation piece, a fastening assembly and a grounding piece, the circuit board is provided with a grounding layer; the grounding piece is connected with the heat dissipation piece in a clamped mode, the fastening assembly penetrates through the heat dissipation piece and the grounding piece to be connected with the circuit board, the grounding piece abuts against the grounding layer, the heat dissipation piece can be electrically connected with the grounding piece, and therefore the grounding effect is achieved.

Description

Technical Field

[0001] This patent relates to the field of electronic equipment technology, and in particular to a heat dissipation device and electronic equipment. Background Technology

[0002] With the increasing processing speed of Central Processing Units (CPUs) and other computing semiconductor chips, the heat they generate also increases. To prevent heat buildup that could lead to chip malfunction or damage, heat dissipation devices are widely used to achieve heat dissipation. Since heat dissipation devices typically include thermally and electrically conductive metal components that are in contact with the heat sink side of the semiconductor chip, grounding these metal components can simultaneously achieve electromagnetic interference (EMI) shielding. In traditional heat dissipation devices, O-rings are prone to detachment. If the O-ring is made of metal, detachment poses a risk of short circuits within the entire device and can easily damage components on the motherboard. If the O-ring is made of plastic, it cannot provide a grounding effect. Summary of the Invention

[0003] This patent provides a heat dissipation device and electronic device to at least solve the above-mentioned technical problems existing in the prior art.

[0004] The first aspect of this patent provides a heat dissipation device, including: a circuit board, a heat sink, a fastening assembly, and a grounding component;

[0005] The circuit board is provided with a grounding layer;

[0006] The grounding component is snapped into the heat sink, the fastening assembly passes through the heat sink and the grounding component and is connected to the circuit board, and the grounding component abuts against the grounding layer.

[0007] Furthermore, the grounding component includes a first connecting plate, a second connecting plate, and a third connecting plate connected in sequence. A first bending portion is provided between the first connecting plate and the second connecting plate, and a second bending portion is provided between the second connecting plate and the third connecting plate. The heat dissipation component is disposed between the first connecting plate and the third connecting plate.

[0008] Furthermore, the grounding element includes an elastic arm for contacting the grounding layer when the heat sink is connected to the circuit board.

[0009] Furthermore, the elastic arm includes a first cantilever and a second cantilever;

[0010] One end of the first cantilever is connected to the third connecting plate, and the other end is connected to the second cantilever. A third bend is provided between the second cantilever and the first cantilever. The end of the second cantilever away from the first cantilever is used to abut against the grounding layer.

[0011] Furthermore, the elastic arm also includes a connecting arm, and a fourth bend is provided between the connecting arm and the second cantilever, the fourth bend or the connecting arm being used to abut against the grounding layer.

[0012] Furthermore, there are two elastic arms, which are respectively disposed on both sides of the third connecting plate.

[0013] Furthermore, the fastening assembly includes a screw that passes through the heat sink and the grounding component and is threadedly connected to the circuit board.

[0014] Furthermore, the screw includes a head, and a spring is provided between the head and the heat sink.

[0015] Furthermore, the heat sink is provided with a groove, and the first connecting plate is disposed in the groove.

[0016] A second aspect of this disclosure provides an electronic device including the heat dissipation device described in the first aspect.

[0017] The technical solution provided in this patent embodiment has the following advantages compared with the prior art:

[0018] The heat dissipation device provided in this patent embodiment includes a circuit board, a heat sink, a fastening assembly, and a grounding component; the circuit board has a grounding layer; the grounding component is snapped into the heat sink. This snapping of the grounding component into the heat sink reduces the possibility of the grounding component falling off. The fastening assembly passes through the heat sink and the grounding component and connects to the circuit board; the grounding component abuts against the grounding layer, enabling an electrical connection between the heat sink and the grounding component, thereby achieving a grounding effect.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this patent, nor is it intended to limit the scope of this patent. Other features of this patent will become readily apparent from the following description. Attached Figure Description

[0020] The above and other objects, features, and advantages of the exemplary embodiments of this patent will become readily understood by reading the following detailed description with reference to the accompanying drawings. Several embodiments of this patent are illustrated in the drawings by way of example and not limitation, in which:

[0021] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0022] Figure 1 A schematic diagram of the heat dissipation device provided in an embodiment of this patent is shown;

[0023] Figure 2 A schematic diagram of the grounding component in the heat dissipation device provided in this patent embodiment is shown.

[0024] The following are the labeling instructions in the diagram: 1. Circuit board; 11. Grounding layer; 2. Heat sink; 3. Fastening assembly; 31. Screw; 311. Head; 32. Spring; 4. Grounding component; 41. First connecting plate; 411. First mounting hole; 42. Second connecting plate; 43. Third connecting plate; 431. Second mounting hole; 44. First cantilever; 45. Second cantilever; 46. Connecting arm; 47. First bend; 48. Second bend; 49. Third bend; 50. Fourth bend. Detailed Implementation

[0025] To make the objectives, features, and advantages of this patent more apparent and understandable, the technical solutions in the embodiments of this patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this patent, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this patent without inventive effort are within the scope of protection of this patent.

[0026] Combination Figure 1 and Figure 2 As shown, the heat dissipation device provided in this patent embodiment includes a circuit board 1, a heat sink 2, a fastening assembly 3, and a grounding component 4; the circuit board 1 is provided with a grounding layer 11; the grounding component 4 is snapped into the heat sink 2. The snapping of the grounding component 4 into the heat sink 2 reduces the possibility of the grounding component 4 falling off. The fastening assembly 3 passes through the heat sink 2 and the grounding component 4 and connects to the circuit board 1. The grounding component 4 abuts against the grounding layer 11, enabling an electrical connection between the heat sink 2 and the grounding component 4, thereby achieving a grounding effect.

[0027] Optionally, the heat sink 2 can be made of a thermally and electrically conductive material, suitable for placement on the heat dissipation side of the electronic component.

[0028] Optionally, the grounding element 4 can be made of conductive material. The grounding element 4 includes a grounding tail and a grounding body connected to the grounding tail. The grounding tail is adapted to be electrically connected to the grounding layer 11 of the circuit board 1, and the grounding body is connected to the heat sink 2.

[0029] Optionally, the fastening component 3 may be made of conductive material. The fastening component 3 is used to connect the heat sink 2 and the grounding component 4 and is adapted to be fixed on the circuit board 1, thereby holding the heat sink 2 on the circuit board 1. The connector cooperates with the grounding component 4 to electrically connect the heat sink 2 and the ground layer 11 of the circuit board 1.

[0030] Optionally, heat sink 2 can be a heat dissipation module.

[0031] In some specific embodiments, the grounding component 4 includes a first connecting plate 41, a second connecting plate 42, and a third connecting plate 43 connected in sequence. A first bending portion 47 is provided between the first connecting plate 41 and the second connecting plate 42, and a second bending portion 48 is provided between the second connecting plate 42 and the third connecting plate 43. The heat sink 2 is disposed between the first connecting plate 41 and the third connecting plate 43, which can improve the stability of the connection between the grounding component 4 and the heat sink 2.

[0032] Optionally, the first connecting plate 41 is disposed on the upper surface of the heat sink 2, and the third connecting plate 43 is disposed on the lower surface of the heat sink 2. The first connecting plate 41 is provided with a first mounting hole 411, and the third connecting plate 43 is disposed in a second mounting hole 431. The fastening component 3 passes through the first mounting hole 411, the mounting hole of the heat sink 2, and the second mounting hole 431 to fix the heat sink to the grounding component 4.

[0033] In some specific embodiments, the grounding element 4 includes a resilient arm that abuts against the grounding layer 11 when the heat sink 2 is connected to the circuit board 1. The resilient arm abuts against the circuit board 1 through a rebound force, thereby achieving an electrical connection between the heat sink 2 and the grounding element 4, thus realizing a grounding effect. The resilient arm is elastic, which can improve the stability of the connection between the grounding element 4 and the circuit board 1.

[0034] In some specific embodiments, the elastic arm includes a first cantilever 44 and a second cantilever 45. One end of the first cantilever 44 is connected to a third connecting plate 43, and the other end is connected to the second cantilever 45. A third bend 49 is provided between the second cantilever 45 and the first cantilever 44. The end of the second cantilever 45 away from the first cantilever 44 is used to abut against the grounding layer 11. The elastic arm abuts against the circuit board 1 through a rebound force, thereby realizing the electrical connection between the heat sink 2 and the grounding component 4, thus achieving the grounding effect. The elastic arm is elastic, which can improve the stability of the connection between the grounding component 4 and the circuit board 1.

[0035] In some specific embodiments, the elastic arm also includes a connecting arm 46, and a fourth bend 50 is provided between the connecting arm 46 and the second cantilever 45. The fourth bend 50 or the connecting arm 46 is used to abut against the grounding layer 11, which can improve the stability of the connection between the grounding member 4 and the circuit board 1.

[0036] In some specific embodiments, there are two elastic arms, which are respectively arranged on both sides of the third connecting plate 43, which can improve the stability of the connection between the grounding component 4 and the circuit board 1.

[0037] In some specific embodiments, the fastening assembly 3 includes a screw 31 that passes through the heat sink 2 and the grounding member 4 and is threadedly connected to the circuit board 1. The screw 31 is used to connect the heat sink 2 and the grounding member 4 and is adapted to be fixed on the circuit board 1, thereby holding the heat sink 2 on the circuit board 1. The connector cooperates with the grounding member 4 to electrically connect the heat sink 2 to the ground layer 11 of the circuit board 1.

[0038] In some specific embodiments, the screw 31 includes a head 311, and a spring 32 is provided between the head 311 and the heat sink 2, which can improve the stability of the connection between the grounding component 4 and the circuit board 1.

[0039] In some specific embodiments, the heat sink 2 is provided with a groove, and the first connecting plate 41 is disposed in the groove, which can improve the stability of the connection between the grounding component 4 and the circuit board 1.

[0040] The electronic device provided in this disclosure includes the heat dissipation device provided in this disclosure. Since the electronic device and the heat dissipation device provided in this disclosure have the same advantages, they will not be described again here.

[0041] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this patent can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this patent can be achieved, and this is not restricted herein.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this patent, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] The above are merely specific embodiments of this patent, but the scope of protection disclosed in this patent is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this patent should be included within the scope of protection of this patent. Therefore, the scope of protection of this patent should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, include: Circuit board (1), heat sink (2), fastening assembly (3) and grounding component (4); The circuit board (1) is provided with a ground layer (11); The grounding component (4) is snapped into the heat sink (2), the fastening component (3) passes through the heat sink (2) and the grounding component (4) and is connected to the circuit board (1), and the grounding component (4) abuts against the grounding layer (11).

2. The heat dissipation device according to claim 1, characterized in that, The grounding component (4) includes a first connecting plate (41), a second connecting plate (42), and a third connecting plate (43) connected in sequence. A first bending portion (47) is provided between the first connecting plate (41) and the second connecting plate (42), and a second bending portion (48) is provided between the second connecting plate (42) and the third connecting plate (43). The heat dissipation component (2) is disposed between the first connecting plate (41) and the third connecting plate (43).

3. The heat dissipation device according to claim 2, characterized in that, The grounding component (4) includes an elastic arm for contacting the grounding layer (11) when the heat sink (2) is connected to the circuit board (1).

4. The heat dissipation device according to claim 3, characterized in that, The elastic arm includes a first cantilever (44) and a second cantilever (45); One end of the first cantilever (44) is connected to the third connecting plate (43), and the other end is connected to the second cantilever (45). A third bend (49) is provided between the second cantilever (45) and the first cantilever (44). The end of the second cantilever (45) away from the first cantilever (44) is used to abut against the grounding layer (11).

5. The heat dissipation device according to claim 4, characterized in that, The elastic arm further includes a connecting arm (46), and a fourth bend (50) is provided between the connecting arm (46) and the second cantilever (45), the fourth bend (50) or the connecting arm (46) being used to abut against the grounding layer (11).

6. The heat dissipation device according to claim 3, characterized in that, The number of elastic arms is two, and the two elastic arms are respectively disposed on both sides of the third connecting plate (43).

7. The heat dissipation device according to claim 1, characterized in that, The fastening assembly (3) includes a screw (31) that passes through the heat sink (2) and the grounding component (4) and is threaded to the circuit board (1).

8. The heat dissipation device according to claim 7, characterized in that, The screw (31) includes a head (311) and a spring (32) is provided between the head (311) and the heat sink (2).

9. The heat dissipation device according to claim 2, characterized in that, The heat sink (2) is provided with a groove, and the first connecting plate (41) is disposed in the groove.

10. An electronic device, characterized in that, Includes the heat dissipation device as described in any one of claims 1 to 9.

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