Pressing module and electronic equipment

Abstract

The utility model provides a pressing module and electronic equipment, and aims to realize multi-point pressing on the basis of low cost. The pressing module comprises a circuit board which is provided with a connecting area, and the connecting area comprises a first pressed position and a second pressed position which are arranged at an interval; the pressing piece corresponds to the connecting area; the first bonding piece is bonded between the connecting area of the circuit board and the pressing piece so as to fix the pressing piece and the circuit board; the supporting piece is arranged on one side, deviating from the first bonding piece, of the circuit board; the first switch piece is arranged on the side, facing the circuit board, of the supporting piece and electrically connected with the circuit board, the first switch piece corresponds to the first pressed position of the connecting area, and when the pressing piece is pressed to abut against the first pressed position, the first switch piece and the circuit board form a first conductive loop; the second switch piece is arranged on the side, facing the circuit board, of the supporting piece and electrically connected with the circuit board, the second switch piece corresponds to the second pressed position of the connecting area, and when the pressing piece is pressed to abut against the second pressed position, the second switch piece and the circuit board form a second conductive loop.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, in particular to a pressing module and an electronic device. BACKGROUND

[0002] Different positions of pressing keys in an electronic device can realize different functions, such as taking pictures, recording videos, etc. The keys in the electronic device are usually fixed to other components in the electronic device by welding, which has high process cost and large replacement cost. CONTENT OF THE UTILITY MODEL

[0003] In view of the above, it is necessary to provide a pressing module and an electronic device to realize multi-point pressing at low cost.

[0004] The present application provides a pressing module, comprising:

[0005] A circuit board is used to be installed on the inner side of the shell of an electronic device and is provided with a connecting area, the connecting area comprising a first pressure receiving position and a second pressure receiving position arranged at intervals;

[0006] A pressing piece is used to be embedded in the shell and corresponds to the connecting area, and part of the pressing piece protrudes from the shell;

[0007] A first adhesive piece is used to be bonded between the connecting area of the circuit board and the pressing piece to fix the pressing piece and the circuit board;

[0008] A support piece is arranged on the side of the circuit board away from the first adhesive piece and is used to be installed in the shell;

[0009] A first switch piece is arranged on the side of the support piece facing the circuit board and is electrically connected to the circuit board, the first switch piece corresponding to the first pressure receiving position of the connecting area, when the first pressure receiving position is pushed by the pressing piece, the circuit board pushes the first switch piece, so that the first switch piece forms a first conductive loop with the circuit board;

[0010] A second switch piece is arranged on the side of the support piece facing the circuit board and is electrically connected to the circuit board, the second switch piece corresponding to the second pressure receiving position of the connecting area, when the second pressure receiving position is pushed by the pressing piece, the circuit board pushes the second switch piece, so that the second switch piece forms a second conductive loop with the circuit board.

[0011] The press module, the presser for starting the function of the electronic device is connected with the circuit board through the first adhesive, the assembly difficulty of the press module is reduced, the manufacturing cost of the press module is reduced, the first pressure receiving position and the second pressure receiving position of the circuit board are pressed by the presser, the first conductive loop and the second conductive loop are formed respectively, and different functions of the electronic device are realized.

[0012] In some embodiments, the support member comprises:

[0013] a main body carrying the first switch member and the second switch member and configured to be installed in the housing;

[0014] two support bodies respectively connected to opposite ends of the main body and configured to support the circuit board.

[0015] Therefore, the two support bodies are respectively connected to the opposite ends of the main body, so that the support member is substantially in a U-shaped structure, and the two support bodies can support the circuit board respectively, thereby reducing the pressure of the circuit board on the first switch member and the second switch member, and facilitating the improvement of the service life of the first switch member and the second switch member.

[0016] In some embodiments, the support bodies are inclined relative to the main body, and the two support bodies are arranged in axial symmetry relative to the center of the main body.

[0017] Therefore, the inclined arrangement of the support bodies relative to the main body can reduce the occupied space of the support member, facilitate the miniaturization of the support member, and the axial symmetry arrangement of the two support bodies relative to the center of the main body can facilitate the improvement of the stability of the support member in supporting the circuit board.

[0018] In some embodiments, the main body and the two support bodies are in an integrated structure.

[0019] Therefore, the main body and the two support bodies in the integrated structure can simplify the processing difficulty of the support member, and facilitate the reduction of the manufacturing cost of the support member.

[0020] In some embodiments, the support member comprises:

[0021] two support bodies respectively supporting the first switch member and the second switch member, and configured to be installed in the housing.

[0022] Therefore, the use of the two support bodies to support the first switch member and the second switch member respectively can facilitate the reduction of the assembly precision of the press module.

[0023] In some embodiments, the cross-sectional area of one end of the support body away from the circuit board is greater than the cross-sectional area of one end of the support body close to the circuit board.

[0024] Therefore, by the above arrangement, the stability of the two support bodies supporting the first and second switch members can be improved.

[0025] In some embodiments, the surface of the pressing member facing the circuit board and the surface of the circuit board facing the pressing member are shaped to match each other, and the first adhesive member projects on the pressing member in a direction from the circuit board to the pressing member with a projection area smaller than the area of the surface of the pressing member facing the circuit board.

[0026] Therefore, the first adhesive member projects on the pressing member in a direction from the circuit board to the pressing member with a projection area smaller than the area of the surface of the pressing member facing the circuit board, so that a gap is formed between the first adhesive member and the periphery of the pressing member, preventing the first adhesive member from overflowing from the periphery of the pressing member during curing and extrusion, thereby improving the appearance quality of the pressing module after being installed in the electronic device.

[0027] In some embodiments, the pressing module further comprises:

[0028] A second adhesive member is attached between the support member and the first switch member, and between the support member and the second switch member.

[0029] Therefore, by fixing the first and second switch members to the support member through the second adhesive member, the assembly difficulty of the pressing module can be reduced, which is conducive to reducing the manufacturing cost of the pressing module.

[0030] In some embodiments, the pressing module further comprises:

[0031] A reinforcing member is connected to one end of the circuit board away from the connecting area.

[0032] Therefore, by the reinforcing member, the collision of external components on the circuit board can be reduced, thereby improving the service life of the circuit board.

[0033] The embodiments of the present application also provide an electronic device comprising:

[0034] A housing;

[0035] The pressing module described above, the circuit board is installed on the inner side of the housing, the pressing member is embedded in the housing, and part of the pressing member protrudes out of the housing.

[0036] In the pressing module of the electronic device described above, the pressing member for starting the function of the electronic device is connected to the circuit board through the first adhesive member, which can reduce the assembly difficulty of the pressing module, thereby reducing the manufacturing cost of the pressing module, and the first and second pressure receiving positions of the circuit board pressed by the pressing member can form the first and second conductive loops, respectively, to realize different functions of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 A structure schematic view of the pressing module provided in Embodiment One of the present application.

[0038] Figure 2 A structure schematic view of the pressing module provided in Embodiment One of the present application. Figure 1 A structure schematic view of the pressing module provided in Embodiment One of the present application.

[0039] Figure 3 A structure schematic view of the pressing module provided in Embodiment One of the present application.

[0040] Figure 4 A structure schematic view of the pressing module provided in Embodiment One of the present application.

[0041] Main element symbol explanation: pressing module 100, circuit board 110, connecting area 110a, first pressure receiving position 110b, second pressure receiving position 110c, pressing piece 120, first adhesive piece 130, support piece 140, support body 141, main body 142, first switch piece 150, second switch piece 160, second adhesive piece 170, reinforcing piece 180, electronic device 1000, shell 200. DETAILED DESCRIPTION

[0042] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and should not be construed as limiting the present application.

[0043] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal connection of two elements or the interaction relationship between two elements. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0044] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and should not be construed as limiting the present application.

[0045] Embodiment One

[0046] Please refer to Figure 1 and Figure 2The embodiment provides a pressing module 100, which comprises a circuit board 110, a pressing piece 120, a first adhesive piece 130, a supporting piece 140, a first switch piece 150 and a second switch piece 160. The circuit board 110 is arranged on the inner side of the shell of an electronic device and is provided with a connecting area 110a, the connecting area 110a comprises a first pressure receiving position 110b and a second pressure receiving position 110c which are arranged at intervals, the pressing piece 120 is arranged in the shell and corresponds to the connecting area 110a, and part of the pressing piece 120 protrudes from the shell, the first adhesive piece 130 is arranged between the connecting area 110a of the circuit board 110 and the pressing piece 120, so as to fix the pressing piece 120 and the circuit board 110, the supporting piece 140 is arranged on the side of the circuit board 110 which is away from the first adhesive piece 130 and is arranged in the shell. The first switch piece 150 is arranged on the side of the supporting piece 140 which is towards the circuit board 110 and is electrically connected with the circuit board 110, the first switch piece 150 corresponds to the first pressure receiving position 110b of the connecting area 110a, when the first pressure receiving position 110b is pushed by the pressing piece 120, the circuit board 110 pushes the first switch piece 150, so that the first switch piece 150 and the circuit board 110 form a first conductive loop, the second switch piece 160 is arranged on the side of the supporting piece 140 which is towards the circuit board 110 and is electrically connected with the circuit board 110, the second switch piece 160 corresponds to the second pressure receiving position 110c of the connecting area 110a, when the second pressure receiving position 110c is pushed by the pressing piece 120, the circuit board 110 pushes the second switch piece 160, so that the second switch piece 160 and the circuit board 110 form a second conductive loop.

[0047] Exemplarily, the first switch piece 150 and the second switch piece 160 are both metal springs, the first pressure receiving position 110b and the second pressure receiving position 110c are both conductive areas of the circuit board 110, when the first switch piece 150 is pushed by the circuit board 110, the center of the first switch piece 150 is concave downwards to connect with the circuit of the circuit board 110, so that the first switch piece 150 and the circuit board 110 form the first conductive loop, and the flowing current is generated between the circuit board 110 and the first switch piece 150, thereby starting the preset function of the electronic device in which the pressing module 100 is arranged. Correspondingly, when the second switch piece 160 is pushed by the circuit board 110, the center of the second switch piece 160 is concave downwards to connect with the circuit of the circuit board 110, so that the second switch piece 160 and the circuit board 110 form the second conductive loop, and the flowing current is generated between the circuit board 110 and the second switch piece 160, thereby starting another preset function of the electronic device in which the pressing module 100 is arranged.

[0048] The presser 120 for starting the function of the electronic device is connected with the circuit board 110 through the first adhesive 130, so that the assembly difficulty of the press module 100 is reduced, and the manufacturing cost of the press module 100 is reduced.

[0049] In the embodiment, the support 140 includes two support bodies 141. The two support bodies 141 support the first switch 150 and the second switch 160 respectively, and the two support bodies 141 are used to be installed in the shell.

[0050] Therefore, the two support bodies 141 are used to support the first switch 150 and the second switch 160 respectively, so that the assembly precision of the press module 100 is reduced.

[0051] In the embodiment, the cross-sectional area of the end of the support body 141 away from the circuit board 110 is greater than the cross-sectional area of the end of the support body 141 close to the circuit board 110.

[0052] Therefore, through the above setting, the stability of the two support bodies 141 supporting the first switch 150 and the second switch 160 is improved.

[0053] In the embodiment, the surface of the presser 120 facing the circuit board 110 and the surface of the circuit board 110 facing the presser 120 are matched in shape, and the projection area of the first adhesive 130 on the presser 120 in the direction of the circuit board 110 pointing to the presser 120 is less than the area of the surface of the presser 120 facing the circuit board 110.

[0054] Therefore, the projection area of the first adhesive 130 on the presser 120 in the direction of the circuit board 110 to the presser 120 is less than the area of the surface of the presser 120 facing the circuit board 110, so that a gap is formed between the first adhesive 130 and the periphery of the presser 120, so that the first adhesive 130 does not overflow from the periphery of the presser 120 during curing and extrusion, and the appearance quality of the press module 100 after being installed in the electronic device is improved.

[0055] In the embodiment, the press module 100 further includes a second adhesive 170. The second adhesive 170 is adhered between the support 140 and the first switch 150, and between the support 140 and the second switch 160.

[0056] Therefore, the first switch 150 and the second switch 160 are fixed to the support 140 through the second adhesive 170, so that the assembly difficulty of the press module 100 is reduced, and the manufacturing cost of the press module 100 is reduced.

[0057] In this embodiment, the pressing module 100 further comprises a reinforcing member 180. The reinforcing member 180 is connected to the circuit board 110 at an end away from the connecting area 110a.

[0058] Therefore, the reinforcing member 180 can reduce the collision of external components on the circuit board 110, thereby improving the service life of the circuit board 110.

[0059] Embodiment Two

[0060] The pressing module 100 provided in this embodiment comprises the circuit board 110, the pressing member 120, the first adhesive member 130, the support member 140, the first switch member 150, the second switch member 160, the second adhesive member 170, and the reinforcing member 180, as compared with the pressing module 100 provided in Embodiment One, and the difference lies in the different structure of the support member 140.

[0061] Please refer to Figure 3 In this embodiment, the support member 140 comprises a main body 142 and two support bodies 141. The main body 142 bears the first switch member 150 and the second switch member 160 and is used for being installed in the shell. The two support bodies 141 are respectively connected to opposite ends of the main body 142 and are both used for supporting the circuit board 110.

[0062] Therefore, the two support bodies 141 are respectively connected to opposite ends of the main body 142, so that the support member 140 is substantially in a U-shaped structure, and the two support bodies 141 can respectively support the circuit board 110, thereby reducing the pressure of the circuit board 110 on the first switch member 150 and the second switch member 160, and being beneficial to improving the service life of the first switch member 150 and the second switch member 160.

[0063] In this embodiment, the support bodies 141 are obliquely arranged relative to the main body 142, and the two support bodies 141 are arranged in axial symmetry relative to the center of the main body 142.

[0064] Therefore, the oblique arrangement of the support bodies 141 relative to the main body 142 can reduce the occupied space of the support member 140, thereby being beneficial to the miniaturization of the support member 140, and the axial symmetry arrangement of the two support bodies 141 relative to the center of the main body 142 is beneficial to improving the stability of the support member 140 in supporting the circuit board 110.

[0065] In this embodiment, the main body 142 and the two support bodies 141 are in an integral structure.

[0066] Therefore, the integral structure of the main body 142 and the two support bodies 141 can simplify the processing difficulty of the support member 140, thereby being beneficial to reducing the manufacturing cost of the support member 140.

[0067] Embodiment Three

[0068] Please refer toFigure 4 The embodiment of the present application also provides an electronic device 1000, comprising a shell 200 and the pressing module 100 of any one of the above embodiments, the circuit board 110 is installed on the inner side of the shell 200, the pressing piece 120 is embedded in the shell 200, and part of the pressing piece 120 protrudes from the shell 200. Wherein, the electronic device 1000 can be a mobile phone, a tablet computer and the like.

[0069] In the pressing module 100 of the above electronic device 1000, the pressing piece 120 for starting the function of the electronic device 1000 is connected with the circuit board 110 through the first adhesive 130, which can reduce the assembly difficulty of the pressing module 100, thereby reducing the manufacturing cost of the pressing module 100, and by pressing the first pressure receiving position 110b and the second pressure receiving position 110c of the circuit board 110 through the pressing piece 120, the first conductive loop and the second conductive loop can be formed respectively, so as to realize different functions of the electronic device 1000.

[0070] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

[0071] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present application but not limit the present application, although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A pressing module, characterized in that, include: A circuit board for mounting inside the housing of an electronic device and having a connection area, the connection area including a first pressure-bearing position and a second pressure-bearing position spaced apart; A pressing member is used to be embedded in the housing and correspond to the connection area, and part of the pressing member protrudes from the housing; The first adhesive component is bonded between the connection area of ​​the circuit board and the pressing component to fix the pressing component and the circuit board. A support member is provided on the side of the circuit board opposite to the first adhesive member and is used for mounting inside the housing; A first switch is disposed on the side of the support facing the circuit board and electrically connected to the circuit board. The first switch corresponds to a first pressure position in the connection area. When the first pressure position is pushed by the pressing member, the circuit board pushes the first switch so that the first switch and the circuit board form a first conductive circuit. The second switch is disposed on the side of the support facing the circuit board and is electrically connected to the circuit board. The second switch corresponds to the second pressure position of the connection area. When the second pressure position is pushed by the pressing member, the circuit board pushes the second switch so that the second switch and the circuit board form a second conductive circuit.

2. The pressing module as described in claim 1, characterized in that, The support member includes: The main body carries the first and second switching components and is used for installation within the housing; Two supports are connected to opposite ends of the main body, and both are used to support the circuit board.

3. The pressing module as described in claim 2, characterized in that, The support is inclined relative to the main body, and the two supports are symmetrical about the center of the main body.

4. The pressing module as described in claim 2, characterized in that, The main body and the two supporting bodies are an integral structure.

5. The pressing module as described in claim 1, characterized in that, The support member includes: Two supports support the first switch and the second switch respectively, and both supports are used to be installed inside the housing.

6. The pressing module as described in claim 5, characterized in that, The cross-sectional area of ​​the end of the support away from the circuit board is greater than the cross-sectional area of ​​the end of the support closer to the circuit board.

7. The pressing module as described in claim 1, characterized in that, The shape of the surface of the pressing member facing the circuit board and the shape of the surface of the circuit board facing the pressing member are adapted to each other, and the projected area of ​​the first adhesive member on the pressing member along the direction from the circuit board to the pressing member is smaller than the area of ​​the surface of the pressing member facing the circuit board.

8. The pressing module as described in claim 1, characterized in that, Also includes: The second adhesive component is bonded between the support component and the first switch component, and between the support component and the second switch component.

9. The pressing module as described in claim 1, characterized in that, Also includes: A reinforcing member is attached to the end of the circuit board away from the connection area.

10. An electronic device, characterized in that, include: case; According to any one of claims 1 to 9, the circuit board is mounted inside the housing, the pressing member is embedded in the housing, and a portion of the pressing member protrudes from the housing.

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