Image capturing module and terminal equipment

Abstract

The utility model discloses an image capturing module and terminal equipment, and the image capturing module comprises a circuit board which is provided with a bonding pad; the wire is welded on the bonding pad; the sealing assembly comprises a first sleeve and a first insulation sealing piece, the first insulation sealing piece is arranged in the first sleeve, the circuit board is embedded in the first insulation sealing piece, and the first sleeve is arranged on the periphery of the first insulation sealing piece in a sleeving mode so as to wrap the first insulation sealing piece. According to the image capturing module, the whole circuit board is wrapped by the first insulation sealing piece, the sealing performance of the welding position of the circuit board and the wire can be effectively improved, the first sleeve is wrapped on the periphery of the first insulation sealing piece, the first insulation sealing piece can be shaped through the first sleeve, and the consistency of the sealing assembly is improved. The terminal equipment disclosed by the utility model comprises the image capturing module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera modules, and in particular to a camera module and a terminal device. BACKGROUND

[0002] In a camera module, a circuit board and a wire are usually welded to enable the camera module to normally receive and send signals. Since the camera module is a high-precision device, impurities such as water vapor and dust will not only seriously affect the imaging quality of the camera module, but also corrode the circuit board, causing short circuit, open circuit and other situations. Therefore, the camera module needs to be designed for all-round sealing to ensure normal operation.

[0003] At present, the sealing of the welding position of the circuit board and the wire in the camera module is generally achieved by spot glueing. However, the spot coating process cannot meet the uniformity of glue coating and the consistency of appearance size, and too thick glue affects assembly, and too thin glue cannot achieve sealing effect. CONTENT OF THE INVENTION

[0004] The present application discloses a camera module and a terminal device, which can improve the sealing performance of the welding position of the circuit board and the wire harness, and facilitate the realization of the consistency of the sealing assembly.

[0005] In a first aspect, the present application discloses a camera module, comprising:

[0006] a circuit board, the circuit board having a solder pad;

[0007] a wire, the wire being welded to the solder pad;

[0008] a sealing assembly, comprising a first sleeve and a first insulating sealing member, the first insulating sealing member being arranged inside the first sleeve, at least a part of the circuit board provided with the solder pad being embedded inside the first insulating sealing member, and the first sleeve being sleeved on the outer periphery of the first insulating sealing member to wrap the first insulating sealing member.

[0009] Thus, at least a part of the circuit board provided with the solder pad is wrapped in the first insulating sealing member, which can improve the sealing performance of the connection between the circuit board and the wire, and the first sleeve wraps the first insulating sealing member, which can shape the first insulating sealing member, thereby improving the sealing performance and the consistency of the product appearance.

[0010] In a possible implementation, the sealing assembly further comprises a second sleeve and a second insulating sealing member, the second insulating sealing member wrapping a part of the wire close to the circuit board, the wire passing through the second insulating sealing member to be welded to the solder pad, and the second sleeve being sleeved on the outer periphery of the second insulating sealing member.

[0011] By wrapping the second insulation seal around the part of the wire close to the circuit board, the sealing performance of the image capturing module at the position where the circuit board and the wire are connected can be further improved, and by wrapping the second sleeve around the second insulation seal, the consistency of the appearance of the product can be improved.

[0012] In a possible implementation, the pads are multiple, the wire includes a power line and a data line, the power line is welded to one of the pads, the data line is welded to another of the pads, the first insulation seal wraps the multiple pads and the part of the power line and the part of the data line welded to the pads, and the second insulation seal wraps the power line and the data line, and the power line and the data line both pass through the second insulation seal to be welded to the pads.

[0013] When the wire includes multiple functional lines, the second insulation seal can also gather the wire harness formed by the multiple functional lines, achieving the effect of arranging the lines. Meanwhile, the second insulation seal can also fill the gaps between different lines, so that the different lines are kept insulated and short-circuiting of the lines is avoided.

[0014] In a possible implementation, the first sleeve and the second sleeve are configured as an integrated structure, and the first insulation seal and the second insulation seal are configured as an integrated structure.

[0015] By configuring the first sleeve and the second sleeve as an integrated structure and configuring the first insulation seal and the second insulation seal as an integrated structure, the sealing performance of the sealing assembly on the position where the circuit board and the wire of the image capturing module are connected can be improved, and meanwhile, the consistency of the sealing assembly can be improved, thereby improving the consistency of the image capturing module provided with the sealing assembly.

[0016] In a possible implementation, the second sleeve has a size of 5 mm-15 mm in the extension direction of the wire.

[0017] By reasonably setting the length of the second sleeve in the extension direction of the wire, the sealing assembly can be kept small in size while the sealing performance of the sealing assembly is ensured, which is beneficial to the miniaturization design of the image capturing module.

[0018] In a possible implementation, the second sleeve is a heat shrink tube, and the second sleeve is provided with glue, and the heat shrink tube is configured to be thermoplastically formed to shape the glue to form the second insulation seal.

[0019] The heat shrink tube is used as the second sleeve, and the glue is filled in the heat shrink tube to form the second insulation seal. In this way, the glue can be filled and wrapped around the position to be sealed before curing. Then, the heat shrink tube can be shrunk by heating, and the heat shrink tube can reduce the volume of the sealing assembly when shrinking, and tightly wrap the glue after shrinking to prevent the glue from leaking out, and shape the glue when the glue is cured, which can improve the sealing effect of the sealing assembly and make the appearance of the sealing assembly more beautiful.

[0020] In a possible implementation, the glue is a thermosetting glue.

[0021] By setting the glue as a thermosetting glue, the glue can be cured synchronously when the heat shrink tube is heated and shrunk, and a separate glue curing process does not need to be provided, which can reduce the manufacturing process and fully utilize the shaping effect of the glue when the heat shrink tube shrinks.

[0022] In a possible implementation, the first sleeve is a heat shrink tube, and the first insulation seal is glue provided in the heat shrink tube.

[0023] The first sleeve is set as a heat shrink tube, and the first insulation seal is set as glue, so that the glue can be filled and wrapped around the position to be sealed before curing. Then, the heat shrink tube can be shrunk by heating, and the heat shrink tube can reduce the volume of the sealing assembly when shrinking, and tightly wrap the glue after shrinking to prevent the glue from leaking out, and shape the glue when the glue is cured, which can improve the sealing effect of the sealing assembly and make the appearance of the sealing assembly more beautiful.

[0024] In a possible implementation, the glue is a thermosetting glue.

[0025] By setting the glue as a thermosetting glue, the glue can be cured synchronously when the heat shrink tube is heated and shrunk, and a separate glue curing process does not need to be provided, which can reduce the manufacturing process and fully utilize the shaping effect of the glue when the heat shrink tube shrinks.

[0026] In a second aspect, the application discloses a terminal device, which comprises any one of the image taking modules.

[0027] Compared with the prior art, the application has at least the following beneficial effects:

[0028] The imaging module and terminal device disclosed in this application, by placing a first insulating sealant inside a first sleeve, with the first sleeve enclosing the first insulating sealant, and the first insulating sealant at least enclosing the portion of the circuit board with solder pads, effectively improves the sealing performance of the circuit board and the solder joints by covering the portion where the wires are soldered. Furthermore, since the first sleeve covers the outer periphery of the first insulating sealant, it can be used to shape the first insulating sealant, which helps improve the consistency of the sealing assembly. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in this application, the drawings used in the application will be briefly introduced below. Obviously, the drawings described below are only some of the drawings in this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a three-dimensional structural diagram of an image-capturing module according to an embodiment of this application;

[0031] Figure 2 yes Figure 1 A front view of the image capturing module shown;

[0032] Figure 3 yes Figure 1 The diagram shown is an exploded view of the imaging module.

[0033] Figure 4 This is a three-dimensional structural diagram of another imaging module according to an embodiment of this application;

[0034] Figure 5 yes Figure 4 A front view of the image capturing module shown;

[0035] Figure 6 yes Figure 5 The image capturing module shown is a cross-sectional schematic diagram along the AA' direction;

[0036] Figure 7 yes Figure 4 The diagram shown is an exploded view of the imaging module.

[0037] Figure 8 This is a three-dimensional structural diagram of a terminal device according to an embodiment of this application. Detailed Implementation

[0038] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0039] In the present application, the positions or location relationships indicated by the terms "upper", "inner", "outer", "middle" and the like are based on the positions or location relationships shown in the drawings. These terms are mainly used for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific position, or to be constructed and operated in a specific position.

[0040] In addition, the above-mentioned terms can be used to represent other meanings in addition to the positions or location relationships, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. A person of ordinary skill in the art can understand the specific meanings of these terms in the present application according to the specific circumstances.

[0041] In addition, the terms "provided with" and "connected" should be understood broadly. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate medium, or internal communication between two devices, elements or components. A person of ordinary skill in the art can understand the specific meanings of the above-mentioned terms in the present application according to the specific circumstances.

[0042] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific types and structures can be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "multiple" is two or more.

[0043] In the related art, the welding points of the circuit board and the wire of the module are often sealed by dispensing. However, since the welding points are usually multiple, each welding point needs to be sealed by dispensing, which is very low in production efficiency, and can also cause other problems. Specifically, when the dispensing amount is small, the sealing effect is poor; and when the dispensing amount is too large, the assembly of the module will be affected. Due to the inherent defects of the current dispensing process, it is difficult to ensure that the dispensing amounts at different positions are the same or close, which makes the dispensing effects at different positions on the same product inconsistent, and the consistency of the dispensing effects of different products is also low.

[0044] To solve the above problems, the application provides a kind of image taking module and terminal equipment, can enhance the sealing performance of circuit board and wire harness welding place, and improve the consistency of sealing assembly, thereby improving the consistency of image taking module.

[0045] Please see Figures 1 to 3 Wherein, Figure 1 It is a kind of image taking module of the application embodiment, and its three-dimensional structure schematic diagram is shown in the figure, Figure 2 It is Figure 1 The front view schematic diagram of the image taking module shown in the figure, Figure 3 It is Figure 1 The structure explosion schematic diagram of the image taking module shown in the figure.

[0046] Firstly, the application discloses a kind of image taking module. The image taking module 100 includes circuit board 110, wire 120 and sealing assembly 130. Wherein, one end of wire 120 is used to electrically connect circuit board 110, and the other end of wire 120 is used to electrically connect external device, for example, power supply, processor and the like, which is not specifically limited here. Sealing assembly 130 at least wraps the part of circuit board 110 and wire 120 connection, effectively enhances the sealing performance of circuit board 110 and wire 120 at welding place.

[0047] It can be understood that circuit board 110 can be the circuit board used for electrically connecting sensor device in image taking module 100, sensor device is connected through circuit board 110 and wire 120, can realize data exchange with external device (for example, processor, power supply control circuit and the like), and completes image taking and / or information transmission under the control of controller device with control function.

[0048] In some embodiments, circuit board 110 has pad 111, and the end of wire 120 is welded to pad 111, so as to realize electrical connection with circuit board 110. Optionally, welding between pad 111 and wire 120 can be realized by current welding, laser welding, ultrasonic welding or other ways, which is not specifically limited in the application.

[0049] It can be understood that pad 111 and the part of wire 120 connected with pad 111 are all wrapped by sealing assembly 130, therefore, good sealing effect can be provided for pad 111 and wire 120 at this place. Moreover, sealing assembly 130 can also fix wire 120 at welding place, so that pad 111 and wire 120 remain stably connected, which can improve the connection strength between circuit board 110 and wire 120.

[0050] In some embodiments, the sealing assembly 130 includes a first sleeve 131 and a first insulating seal 132, the first insulating seal 132 is arranged inside the first sleeve 131, so that the first sleeve 131 wraps the first insulating seal 132, and the part of the circuit board 110 where the solder pad 111 is arranged is embedded inside the first insulating seal 132, that is, the solder pad 111 and the part of the wire 120 connected with the solder pad 111 are wrapped by the first insulating seal 132, which can well enhance the sealing performance of this position and achieve good waterproof and dustproof effect. The area of the circuit board 110 where the solder pad 111 is not arranged is exposed outside the first insulating seal 132, so that other components (if any) on the circuit board 110 can normally dissipate heat and heat accumulation will not occur.

[0051] In some embodiments, the entire circuit board 110 is embedded in the first insulating seal 132, so that all connection points and components on the entire circuit board 110 are wrapped by the first insulating seal 132, which can effectively improve the sealing effect of the sealing assembly 130 on the circuit board 110.

[0052] Since the circuit board 110 is completely wrapped by the first insulating seal 132, the shell for surrounding the circuit board 110 can be omitted, thereby reducing the volume of the image capturing module 100 and achieving miniaturization design of the image capturing module 100.

[0053] It can be understood that the complete wrapping mentioned above refers to that the first insulating seal 132 completely covers the surface of the circuit board 110, and the part of the wire 120 connected with the circuit board 110 is also embedded inside the first insulating seal 132.

[0054] In a specific example, the circuit board 110 is arranged in a rectangular plate shape, and the first sleeve 131 can be arranged in a hollow structure surrounding the outer periphery of the circuit board 110, such as a hexahedral, spherical, ellipsoidal or other tubular structure. The first sleeve 131 is provided with a first opening, through which the material for forming the first insulating seal 132 can be filled into the inside of the first sleeve 131.

[0055] In some embodiments, the first sleeve 131 can be composed of a heat shrink tube or other elements with shaping function, and the first insulating seal 132 can be glue. The glue is poured into the inside of the heat shrink tube, and when the heat shrink tube shrinks, the glue can completely wrap the circuit board 110, preventing the glue from leaking out and improving the sealing performance. The shrinkage of the heat shrink tube can reduce the volume of the sealing assembly 130, which is conducive to the miniaturization design of the image capturing module 100.

[0056] In some embodiments, the first insulation seal 132 can be formed by using a thermosetting glue. In this way, when the heat shrink tube is heated and shaped, the thermosetting glue can be cured and shaped at the same time, and a separate glue curing process is not needed, thereby reducing the manufacturing process.

[0057] Optionally, the heat shrink tube can be a glue-coated heat shrink tube or a glue-free heat shrink tube, and the glue can be a UV glue or a UV thermosetting glue.

[0058] Of course, it can be understood that an element with a relatively stable shape can also be used to shape the insulation seal, such as a plastic tube, a rubber tube, or a silica tube, which is sleeved around the outer periphery of the circuit board 110 and / or the wire 120, and then a material used to form the insulation seal is filled into the rubber tube or the silica tube, and the filled material is cured to form the sealing assembly. In this design, the rubber tube or the silica tube can be retained or removed to reduce the volume of the image capturing module 100. The shape and size of the non-plastic element can remain consistent, and therefore, shaping the insulation seal by using an element with a relatively stable shape can further improve the consistency of the sealed product.

[0059] Referring to Figures 4 to 7 , Figure 4 is a perspective view of another image capturing module according to an embodiment of the present application, Figure 5 is Figure 4 a front view of the image capturing module shown in Figure 6 is Figure 5 a cross-sectional view of the image capturing module shown in Figure 7 is Figure 4 an exploded view of the structure of the image capturing module shown in

[0060] In some embodiments, the sealing assembly 130 further includes a second sleeve 133 and a second insulation seal 134. The second insulation seal 134 wraps the portion of the wire 120 close to the circuit board 110, and the end of the wire 120 connected to the pad 111 is welded to the pad 111 after passing through the second insulation seal 134, and the second sleeve 133 is sleeved around the outer periphery of the second insulation seal 134. By providing the second insulation seal 134 wrapping the portion of the wire 120 close to the circuit board 110, the sealing performance of the image capturing module 100 at the position where the wire 120 is connected to the circuit board 110 can be further improved, and a good waterproof and dustproof effect can be achieved for the wire 120, thereby preventing the wire 120 from being corroded or worn. The second sleeve 133 wraps the outer periphery of the second insulation seal 134, and the second sleeve 133 can be used to shape the second insulation seal 134, so that the second insulation seal 134 closely fits the wire 120, thereby improving the protection capability of the second insulation seal 134 for the wire 120.

[0061] In one specific example, the second sleeve 133 can be provided in a cylindrical shape and sleeved on the outer periphery of the wire 120. One end of the second sleeve 133 can abut against the first sleeve 131, and the other end of the second sleeve 133 can be provided with a second opening through which a material for forming the second insulation seal 134 can be filled into the interior of the second sleeve 133.

[0062] In some embodiments, the second sleeve 133 can be formed of a heat-shrinkable tube or other element having a plasticizing function, and the second insulation seal 134 can be glue. The glue can be injected into the interior of the heat-shrinkable tube, and when the heat-shrinkable tube is heated and shrinks, the glue can completely wrap the wire 120, thereby improving the sealing performance.

[0063] In some embodiments, the second insulation seal 134 can be formed of heat-curing glue. In this way, when the heat-shrinkable tube is heated and plasticized, the heat-curing glue can be simultaneously cured and shaped, thereby reducing the manufacturing process.

[0064] Optionally, the heat-shrinkable tube can be a glue-coated heat-shrinkable tube or a glue-free heat-shrinkable tube, and the glue can be UV glue, UV heat-curing glue, or other glue.

[0065] Correspondingly, it can be understood that an element having a relatively stable shape can also be used to plasticize the insulation seal, such as a plastic tube, a rubber tube, or a silica gel tube sleeved on the outer periphery of the circuit board 110 and / or the wire 120. A material for forming the insulation seal can be filled into the interior of the rubber tube or the silica gel tube, and the filled material can be cured to form a sealed assembly. In this design, the rubber tube or the silica gel tube can be retained or removed to reduce the volume of the image capturing module 100. The shape and size of the non-plastic element can remain consistent. Therefore, plasticizing the insulation seal using an element having a relatively stable shape can further improve the consistency of the sealed product.

[0066] In some embodiments, the pads 111 are multiple, and the wire 120 includes a power line 121 and a data line 122. One end of the power line 121 is welded to one pad 111, and one end of the data line 122 is welded to another pad 111. The power line 121 is used to supply power to the image capturing module 100, and the data line 122 is used for data transmission. Of course, the wire can also include other lines, such as a signal line, which will not be described here.

[0067] The portions of the power line 121 and the data line 122 welded to the portions of the soldering pad 111 are wrapped in the first insulation seal 132, while the remaining portions of the power line 121 and the data line 122, or the portions close to the first insulation seal 132 and exposed outside the first insulation seal 132, are wrapped in the second insulation seal 134. In this way, the second insulation seal 134 can not only organize the wire harness composed of multiple wires with different functions and avoid the wire harness from being disordered, but also keep the different wires in the wire harness insulated from each other and avoid the different wires from being short-circuited by being overlapped.

[0068] Since the outer contour of the circuit board 110 is generally different from the outer contour of the wire 120. Influenced by the shapes of the circuit board 110 and the wire 120, the shape of the first sleeve 131 is different from the shape of the second sleeve 133, the shape of the first insulation seal 132 is influenced by the first sleeve 131, and the shape of the second insulation seal 134 is influenced by the second sleeve 133, so that the shape of the first insulation seal 132 is different from the shape of the second insulation seal 134. Therefore, the first sleeve 131 and the second sleeve 133 can be independently set respectively, and the first insulation seal 132 and the second insulation seal 134 can be independently set respectively. Of course, in some cases, when the circuit board 110 is designed to be smaller or has a shape of a long strip extending along the extension direction of the wire 120, the shapes of the first sleeve 131 and the second sleeve 133 can also be set to be the same.

[0069] In some embodiments, the first sleeve 131 and the second sleeve 133 can also be configured as an integrated structure, and the first insulation seal 132 and the second insulation seal 134 are also configured as an integrated structure. For example, an integrated sleeve having two portions, one portion constituting the first sleeve 131 and the other portion constituting the second sleeve 133, can be formed by injection molding, cutting, or the like. Then, by filling the integrated sleeve with a material for forming the first insulation seal 132 and the second insulation seal 134, the integrated first insulation seal 132 and the second insulation seal 134 are formed after the material is shaped. By setting the first sleeve 131 and the second sleeve 133 as an integrated structure and setting the first insulation seal 132 and the second insulation seal 134 as an integrated structure, the sealing performance of the sealing assembly 130 can be improved, and the mechanical strength of the connection between the circuit board 110 and the wire 120 can also be improved.

[0070] Of course, in some embodiments, the first sleeve 131 and the second sleeve 133 are also independently set with respect to each other, and the first insulation seal 132 and the second insulation seal 134 can also be independently set with respect to each other. That is, the first sleeve 131 and the first insulation seal 132 can constitute an independent sealing unit, and the second sleeve 133 and the second insulation seal 134 can constitute another independent sealing unit.

[0071] In some embodiments, the second sleeve 133 has a size of 5mm-15mm in the extension direction of the wire 120. In this range, the imaging module 100 can be provided with good sealing effect, the connection strength between the circuit board 110 and the wire 120 can be enhanced, and the size of the sealing assembly 130 can be avoided to be too large. For example, when the size of the second sleeve 133 in the extension direction of the wire 120 is 5mm, 6mm, 7mm, the second sleeve 133 and the second insulating sealing member 134 can have a smaller size, which is beneficial to realize the miniaturization design of the imaging module 100, and meanwhile, the assembly of the imaging module 100 will not be affected. When the size of the second sleeve 133 in the extension direction of the wire is 8mm, 9mm, 10mm, 11mm, the small size and sealing performance of the second insulating sealing member 134 can be balanced. When the size of the second sleeve 133 in the extension direction of the wire is 12mm, 13mm, 14mm, 15mm, the sealing performance of the second insulating sealing member 134 can be improved.

[0072] Referring to Figure 8 , Figure 8 is a perspective structural schematic diagram of a terminal device according to an embodiment of the present application. The second aspect of the present application provides a terminal device 200, which comprises the imaging module 100 according to any one of the embodiments of the first aspect. The terminal device 200 has a body 210, and the imaging module 100 is arranged on the body 210.

[0073] In some embodiments, the terminal device 200 can be a mobile terminal, such as a mobile phone, a tablet computer, a notebook computer, a car, etc. Taking the terminal device as a mobile phone as an example, the body of the terminal device can include a mobile phone shell, a circuit board and a battery arranged inside the mobile phone shell, etc., the imaging module 100 can be arranged on the mobile phone shell and electrically connected to the circuit board through the wire 120. The circuit board can be provided with a processor, a power control circuit, etc., and the wire 120 can be electrically connected to the processor and the power control circuit.

[0074] In some embodiments, the terminal device 200 can also be a fixed terminal, such as a monitoring device, a security device, etc. Taking the terminal device as a monitoring device as an example, the body of the terminal device can include a shell and a circuit board arranged inside the shell, and the imaging module 100 can be arranged on the shell and electrically connected to the circuit board through the wire 120. The circuit board can be provided with a processor, a rectifier module, etc., and the wire 120 can be electrically connected to the processor and the rectifier module.

[0075] The above has carried on the detailed introduction to the image taking module and the terminal device disclosed by the embodiment of the application, the principle and the implementation mode of the application are described by using an example in this paper, the above embodiment is only used for helping understanding the image taking module and the terminal device of the application and the core idea; at the same time, for the general technical personnel in the art, according to the idea of the application, the specific implementation mode and the application range will have the change, and the above is described, the content of the specification should not be understood as the limitation of the application.

Claims

1. An image acquisition module, characterized in that, include: A circuit board having solder pads; A wire, wherein the wire is soldered to the pad; A sealing assembly includes a first sleeve and a first insulating seal, wherein at least a portion of the circuit board having the solder pads is embedded inside the first insulating seal, and the first sleeve is fitted around the outer periphery of the first insulating seal to enclose the first insulating seal.

2. The imaging module according to claim 1, characterized in that, The sealing assembly further includes a second sleeve and a second insulating seal, the second insulating seal wrapping around the portion of the conductor near the circuit board, the conductor passing through the second insulating seal to be soldered to the pad, and the second sleeve being fitted around the outer periphery of the second insulating seal.

3. The imaging module according to claim 2, characterized in that, The pads are multiple, and the wires include power lines and data lines. The power lines are soldered to one pad, and the data lines are soldered to another pad. The first insulating seal encloses the multiple pads and a portion of the power lines and a portion of the data lines soldered to the pads. The second insulating seal encloses the power line and the data line, both of which pass through the second insulating seal to be soldered to the pads.

4. The imaging module according to claim 2, characterized in that, The first sleeve and the second sleeve are constructed as a single unit, and the first insulating seal and the second insulating seal are constructed as a single unit.

5. The imaging module according to any one of claims 2-4, characterized in that, The second sleeve has a dimension of 5mm-15mm in the direction of extension of the conductor.

6. The imaging module according to any one of claims 2-4, characterized in that, The second sleeve is a heat shrink tubing, and adhesive is provided in the second sleeve. The heat shrink tubing is configured to be thermoformed to shape the adhesive to form the second insulating seal.

7. The imaging module according to claim 6, characterized in that, The adhesive is a thermosetting adhesive.

8. The imaging module according to any one of claims 1-4, characterized in that, The first sleeve is a heat shrink tubing, and the first insulating sealant is adhesive disposed inside the heat shrink tubing.

9. The imaging module according to claim 8, characterized in that, The adhesive is a thermosetting adhesive.

10. A terminal device, characterized in that, Includes the imaging module as described in any one of claims 1-9.

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