Current sensor
By combining the circuit board with a snap-fit design and a potting compound to secure it to the outer periphery and with a support strip design, the problem of magnetic core and circuit board misalignment during current sensor assembly was solved, resulting in a compact structural design and good sealing performance.
Patent Information
- Application Number
- CN202423015440.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-06
AI Technical Summary
During the assembly process, the magnetic core and circuit board of existing current sensors are prone to positional displacement, leading to product quality issues, and the overall structure is also relatively large.
The circuit board is fixed to the inner wall of the housing by snap-fit on the outer periphery. The electromagnetic induction element abuts against the circuit board and the housing. The circuit board and electromagnetic induction element are wrapped with potting compound. Combined with the design of support strips and ribs, the assembly is stable and airtight.
It achieves a stable setting of the circuit board and electromagnetic induction components, avoiding positional displacement. The overall structure is compact, small in size, and has good sealing and installation stability.
Smart Images

Figure CN223679260U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of sensors, in particular to a current sensor. BACKGROUND
[0002] With the continuous development of power supply technology, current sensors are increasingly widely used in power supply design. The current sensor is a detection device that can sense the information of the measured current and convert the sensed information into an electrical signal or other required form of information output according to certain rules to meet the requirements of information transmission, processing, storage, display, recording and control.
[0003] In related technologies, the current sensor includes a shell, a magnetic core and a circuit board and the like. The shell is provided with an opening and a cover plate which is openably arranged at the opening. In the assembly process, the magnetic core and the circuit board are both arranged in the interior of the shell through the opening. In order to improve the installation stability of the magnetic core and the circuit board in the interior of the shell, there are usually two ways in related technologies: way one, the interior of the shell is provided with a back-shaped recess, and the magnetic core is fixed in the back-shaped recess. The cover plate is provided with a clamping head, and the clamping head abuts against the top of the magnetic core, so that the magnetic core is limited and fixed in the interior of the shell. In addition, the circuit board is arranged on one side of the interior of the shell, and the interior of the shell is also provided with a containing groove and a positioning boss, and the circuit board is installed and fixed through the containing groove and the positioning boss. However, the overall size of the shell is relatively large. Way two, the magnetic core and the circuit board are arranged in the interior of the shell, and the interior of the shell is provided with a potting glue. After the potting glue is solidified, the magnetic core and the circuit board can be effectively fixed in the interior of the shell. However, in the process of pouring the potting glue into the interior of the shell, the height position of the circuit board in the interior of the shell will be offset, thereby causing quality problems of the current sensor product. CONTENT OF THE UTILITY MODEL
[0004] Therefore, it is necessary to overcome the defects of the prior art and provide a current sensor which can make the overall structure compact and small in size, and the magnetic core and the circuit board are stably arranged in the interior of the shell, so as to effectively prevent the position offset defects of the magnetic core and the circuit board in the assembly process.
[0005] A current sensor, comprising:
[0006] a shell;
[0007] a circuit board, which is located in the interior of the shell, and the outer periphery of the circuit board is clamped and fixed on the inner wall of the shell;
[0008] an electromagnetic induction element, which is located in the interior of the shell, and the electromagnetic induction element is electrically connected with the circuit board, and the two opposite end faces of the electromagnetic induction element respectively abut against the circuit board and the shell; and
[0009] potting glue is arranged inside the shell, and the potting glue wraps at least part of the circuit board and at least part of the electromagnetic induction element.
[0010] In one of the embodiments, support strips and ribs are arranged on the inner wall of the shell, the support strips and the ribs are arranged with intervals along the thickness direction of the circuit board, the intervals of the support strips and the ribs along the thickness direction of the circuit board are less than or equal to the thickness of the circuit board, and the outer periphery of the circuit board is clamped at the intervals.
[0011] In one of the embodiments, the support strips are multiple and arranged with intervals along the circumferential direction of the inner wall of the shell; and / or, the ribs are multiple and arranged on opposite sides of the inner wall of the shell.
[0012] In one of the embodiments, positioning strips are arranged on the inner wall of the shell, first positioning grooves are arranged on the outer periphery of the circuit board, and the positioning strips are arranged inside the first positioning grooves; and / or, second positioning grooves are arranged on the inner wall of the shell, positioning blocks are arranged on the outer periphery of the circuit board, and the positioning blocks are arranged inside the second positioning grooves.
[0013] In one of the embodiments, the positioning strips are two and arranged with intervals side by side, the first positioning grooves are two and arranged one by one corresponding to the two positioning strips; and / or, the positioning blocks are two and arranged with intervals side by side, the second positioning grooves are two and arranged one by one corresponding to the two positioning blocks.
[0014] In one of the embodiments, the shell is provided with an opening and an end cover detachably arranged at the opening;
[0015] The electromagnetic induction element is located on the side of the circuit board away from the end cover, the potting glue is filled in the internal area of the shell on the side of the circuit board away from the end cover; or, the potting glue is filled in the whole internal area of the shell.
[0016] In one of the embodiments, the outer periphery of the end cover is provided with one or more first clamping parts, the inner wall of the shell is provided with one or more second clamping parts, and each first clamping part is correspondingly clamped and arranged on each second clamping part.
[0017] In one of the embodiments, the outer periphery of the end cover is provided with a first step, the mouth wall of the opening is provided with a second step, and the first step and the second step are in abutting fit with each other.
[0018] In one of the embodiments, the electromagnetic induction element comprises a magnetic core and one or more coils wound on the magnetic core; opposite ends of the coil are electrically connected with the circuit board.
[0019] In one of the embodiments, the current sensor further comprises an electrical connector electrically connected with the circuit board, and a window is formed on the shell, and the electrical connector extends out of the shell through the window.
[0020] The current sensor described above, before the potting glue is poured into the interior of the shell, the circuit board and the electromagnetic induction element are installed in the interior of the shell, and then the outer periphery of the circuit board is clamped and fixed to the inner wall of the shell, and the two opposite end surfaces of the electromagnetic induction element are respectively abutted with the circuit board and the shell, that is, the circuit board and the electromagnetic induction element are preliminarily fixed in the interior of the shell. Further, during the process of pouring the potting glue into the interior of the shell, the circuit board and the electromagnetic induction element will not be lifted up to cause position deviation defects due to the pouring of the potting glue. After the potting glue is solidified, the circuit board and the electromagnetic induction element can be stably arranged in the interior of the shell, and have good sealing performance. In addition, the electromagnetic induction element and the circuit board are arranged along the axial direction, and the circuit board is preliminarily fixed by clamping the outer periphery of the circuit board to the inner wall of the shell, so that the overall structure is compact and has small size. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 It is a structural view of the current sensor of one embodiment of the present application.
[0022] Figure 2 It is a structural view of the current sensor of one embodiment of the present application. Figure 1 It is a sectional view of the structure shown.
[0023] Figure 3 It is a structural view of the current sensor of one embodiment of the present application. Figure 1 It is a structural view of the current sensor of one embodiment of the present application.
[0024] Figure 4 It is a structural view of the current sensor of one embodiment of the present application. Figure 1 It is a structural view of the current sensor of one embodiment of the present application.
[0025] Figure 5 It is a structural view of the current sensor of one embodiment of the present application.
[0026] Figure 6 It is a structural view of the current sensor of one embodiment of the present application. Figure 5 It is a structural view of the current sensor of one embodiment of the present application.
[0027] Figure 7 It is a structural view of the current sensor of one embodiment of the present application.
[0028] Figure 8 It is a structural view of the current sensor of one embodiment of the present application. Figure 7 It is a sectional view of the structure shown.
[0029] 10, housing; 11, support strip; 12, rib; 13, positioning strip; 14, opening; 141, second step; 15, second clamping portion; 16, window; 17, through hole; 18, interval; 20, circuit board; 21, first positioning groove; 22, gap; 30, electromagnetic induction element; 31, magnetic core; 32, coil; 40, potting adhesive; 50, end cover; 51, first clamping portion; 52, first step; 60, electrical connector. DETAILED DESCRIPTION
[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways beyond the specific embodiments described and claimed herein, and it is therefore intended that the present application not be limited to the embodiments disclosed but will include all embodiments falling within the scope of the present application.
[0031] Referring to Figure 1 , Figure 2 and Figure 5 , Figure 1 a structural diagram of a current sensor according to an embodiment of the present application is shown. Figure 2 a sectional structural diagram of the structure shown in Figure 1 is shown. Figure 5 A structural diagram of a circuit board 20 and an electromagnetic induction element 30 according to an embodiment of the present application is shown. A current sensor according to an embodiment of the present application includes a housing 10, a circuit board 20, an electromagnetic induction element 30 and a potting adhesive 40. The circuit board 20 is located inside the housing 10, and the outer periphery of the circuit board 20 is clamped and fixed to the inner wall of the housing 10. The electromagnetic induction element 30 is located inside the housing 10, and the electromagnetic induction element 30 is electrically connected to the circuit board 20. The two opposite end faces of the electromagnetic induction element 30 respectively abut against the circuit board 20 and the housing 10. The potting adhesive 40 is provided inside the housing 10, and the potting adhesive 40 wraps at least part of the circuit board 20 and at least part of the electromagnetic induction element 30.
[0032] The current sensor described above, before the potting glue 40 is poured into the inside of the shell 10, since the circuit board 20 and the electromagnetic induction element 30 are arranged in the inside of the shell 10 after that, the outer periphery of the circuit board 20 is clamped and fixed on the inner wall of the shell 10, and the two opposite end faces of the electromagnetic induction element 30 are respectively abutted with the circuit board 20 and the shell 10, that is, the circuit board 20 and the electromagnetic induction element 30 are preliminarily fixed in the inside of the shell 10. Further, in the process of pouring the potting glue 40 into the inside of the shell 10, the circuit board 20 and the electromagnetic induction element 30 will not be lifted up to cause positional deviation defects due to the pouring of the potting glue 40. After the potting glue 40 is solidified, the circuit board 20 and the electromagnetic induction element 30 can be stably arranged in the inside of the shell 10, and have good sealing performance. In addition, the electromagnetic induction element 30 and the circuit board 20 are arranged along the axial direction, and the circuit board 20 is preliminarily fixed by clamping the outer periphery of the circuit board 20 on the inner wall of the shell 10, so that the overall structure is compact and the size is small.
[0033] Among them, the clamping and fixing mode of the outer periphery of the circuit board 20 on the inner wall of the shell 10 is more, as long as the clamping and fixing of the outer periphery of the circuit board 20 on the inner wall of the shell 10 can be realized, the specific form can be flexibly adjusted and set according to the actual demand, which is not limited here.
[0034] Please refer to Figure 2 , Figure 3 , Figure 7 and Figure 8 , as an example, the inner wall of the shell 10 is provided with a support strip 11 and a rib 12. The support strip 11 and the rib 12 are provided with a spacing 18 along the thickness direction of the circuit board 20. The rib 12 is used to clamp the circuit board 20 in cooperation with the support strip 11, which can prevent the circuit board 20 from being lifted up with the rising of the glue level during the glue pouring process, and can avoid the inclination of the circuit board 20. Among them, the support strip 11 and the rib 12 can be arranged in alignment along the direction parallel to the central axis Z, or can be arranged in mutual misalignment.
[0035] In addition, in order to improve the clamping and fixing effect of the support strip 11 and the rib 12 on the outer periphery of the circuit board 20, specifically, the spacing of the support strip 11 and the rib 12 along the thickness direction of the circuit board 20 is less than or equal to the thickness of the outer periphery of the circuit board 20. The outer periphery of the circuit board 20 is clamped at the spacing 18, that is, the support strip 11 abuts against one side of the circuit board 20, and the rib 12 abuts against the other side of the circuit board 20 to realize the installation and positioning of the circuit board 20 on the inner wall of the shell 10.
[0036] The number of support strips 11 is, for example, one or more, and the number of multiple support strips 12 is, for example, two, three or other numbers. The number of support strips 11 can be the same as or different from the number of support strips 12, and can be one or at least two, which is not limited herein. The more the number of support strips 12 and support strips 11, the better the mounting stability of the circuit board 20 on the inner wall of the shell 10.
[0037] Specifically, the support strips 11 are multiple and arranged in sequence and at intervals in the circumferential direction of the inner wall of the shell 10. The multiple support strips 11 synchronously support the circuit board 20, thereby stably supporting the circuit board 20 and improving the mounting stability of the circuit board 20 on the inner wall of the shell 10. In addition, the multiple support strips 12 are arranged, for example, on opposite sides of the inner wall of the shell 10, so that the opposite sides of the outer periphery of the circuit board 20 are fixed to the support strips 11, and the circuit board 20 has good mounting stability on the inner wall of the shell 10. Of course, the support strips 12 can also be arranged in sequence and at intervals in the circumferential direction of the inner wall of the shell 10.
[0038] On the basis of the foregoing embodiments, the support strips 12 are arranged in reverse buckling, which facilitates the downward clamping of the outer periphery of the circuit board 20 on the inner wall of the shell 10.
[0039] In some embodiments, the inner wall of the shell 10 is not limited to the clamping structure formed by the support strips 11 and the support strips 12, but can also be, for example, provided with a clamping groove, and the outer periphery of the circuit board 20 is clamped and fixed in the clamping groove.
[0040] Please refer to Figure 3 and Figure 6 In some embodiments, the inner wall of the shell 10 is provided with a positioning strip 13, and the outer periphery of the circuit board 20 is provided with a first positioning groove 21. The positioning strip 13 is arranged inside the first positioning groove 21. In this way, the positioning strip 13 plays a positioning role on the circuit board 20, which can prevent the circuit board 20 from being displaced inside the shell 10.
[0041] Please refer to Figure 3 and Figure 6 Specifically, the positioning strip 13 is provided in two and arranged in parallel and at intervals. The first positioning groove 21 is correspondingly provided in two, and the two first positioning grooves 21 and the two positioning strips 13 are arranged one by one. In this way, compared with the structure in which one positioning strip 13 and one first positioning groove 21 are matched with each other, the positioning strip 13 and the first positioning groove 21 in the present embodiment are both provided in two, so that the positioning effect of the circuit board 20 inside the shell 10 is better.
[0042] The positioning strip 13 extends along the thickness direction of the circuit board 20, that is, parallel to Figure 2The direction of the central axis Z is arranged to extend. In this way, during the process of installing the circuit board 20 into the shell 10, the first positioning groove 21 is aligned with the positioning strip 13, and then the circuit board 20 is installed into the shell 10 downwards, and the positioning strip 13 and the first positioning groove 21 are matched with each other, thereby guiding and limiting the circuit board 20 downwards.
[0043] In some optional solutions, a second positioning groove is arranged on the inner wall of the shell 10, and a positioning block is arranged on the outer periphery of the circuit board 20. The positioning block is arranged in the second positioning groove. In this way, the installation stability of the circuit board 20 in the shell 10 can be improved, so that the position deviation of the circuit board 20 in the shell 10 can be prevented. Alternatively, two positioning blocks are arranged in parallel and spaced apart, and two second positioning grooves are arranged, and the two second positioning grooves and the two positioning blocks are arranged one by one.
[0044] The potting glue 40 can be filled in the entire area inside the shell 10, so that the circuit board 20 and the electromagnetic induction element 30 are packaged and fixed inside the shell 10. Alternatively, the potting glue 40 can be filled in only part of the area inside the shell 10, and the circuit board 20 and the electromagnetic induction element 30 are packaged and fixed inside the shell 10.
[0045] In some embodiments, the shell 10 is provided with an opening 14 and an end cover 50 arranged at the opening 14. Alternatively, the end cover 50 can be detachably arranged at the opening 14 of the shell 10, or can be non-detachably arranged at the opening 14 of the shell 10. In this embodiment, in order to facilitate the assembly of the end cover 50 on the shell 10, the end cover 50 is detachably arranged at the opening 14 of the shell 10 in a clamping manner.
[0046] The opening 14 is arranged on one of the end faces of the shell 10 along the central axis Z, and the other end face of the shell 10 along the central axis Z is arranged as a closed end. In addition, the peripheral side wall of the shell 10 is closed, and the peripheral side wall encloses the opening 14.
[0047] Since the end cover 50 is detachably arranged at the opening 14 of the shell 10, during the assembly step, the end cover 50 is first opened, the electromagnetic induction element 30 and the circuit board 20 are arranged into the shell 10 through the opening 14, then the potting glue 40 is poured into the shell 10, and finally the cover plate is arranged at the opening 14 of the shell 10.
[0048] On the basis of the foregoing embodiment, the electromagnetic induction element 30 is located on the side of the circuit board 20 away from the end cover 50, and the potting glue 40 fills the internal region of the shell 10 on the side of the circuit board 20 away from the end cover 50. In this way, the potting glue 40 does not need to completely fill the interior of the shell 10, but only fills the region on the side of the circuit board 20 away from the end cover 50, that is, the amount of the potting glue 40 is less, and the cost is lower; meanwhile, the potting glue 40 can also realize the packaging and fixing of the electromagnetic induction element 30 and the circuit board 20 in the interior of the shell 10, and has better sealing lines and fixing.
[0049] Please refer to Figures 1 to 3 , in order to realize that the potting glue 40 is filled into the region on the side of the circuit board 20 away from the end cover 50, optionally, a gap 22 is arranged between the outer periphery of the circuit board 20 and the inner wall of the shell 10, and the potting glue 40 enters the region on the side of the circuit board 20 away from the end cover 50 through the gap 22. In the embodiment, at least one corner or all corners of the circuit board 20 are provided with bevelled corners, so that the corners of the circuit board 20 and the inner wall of the shell 10 form the gap 22.
[0050] On the premise that the circuit board 20 is provided with bevelled corners, the side edges of the circuit board 20 can abut against the inner wall of the shell 10, thereby having better sealing performance.
[0051] Of course, the side edges of the circuit board 20 can also form the gap 22 with the inner wall of the shell 10, so that the potting glue 40 can also enter the region on the side of the circuit board 20 away from the end cover 50 from the gap 22 formed between the side edges of the circuit board 20 and the inner wall of the shell 10. In this case, the corners of the circuit board 20 can also not be provided with bevelled corners.
[0052] After the circuit board 20 and the electromagnetic induction element 30 are assembled into the shell 10, the potting glue 40 is filled into the shell 10 from the bottom wall side of the circuit board 20 away from the shell 10, and the injection amount of the potting glue 40 completely covers the circuit board 20, which can guarantee the sealing effect. In the case that the flowability of the potting glue 40 is good, the potting glue 40 can completely wrap the circuit board 20 and the electromagnetic induction element 30. Of course, in some cases, due to the flowability problem, the potting glue 40 can only wrap part of the circuit board 20 and part of the electromagnetic induction element 30, but the sealing performance can still be improved.
[0053] In one embodiment, one or more first clamping portions 51 are arranged on the outer periphery of the end cover 50, and one or more second clamping portions 15 are arranged on the inner wall of the shell 10. Each first clamping portion 51 is correspondingly clamped and arranged on each second clamping portion 15.
[0054] Please refer to Figure 3 and Figure 4Specifically, the opposite sides of the end cover 50 are respectively provided with one or more first clamping portions 51. The opposite sides of the inner wall of the shell 10 are respectively provided with one or more second clamping portions 15. When each first clamping portion 51 is clamped on each second clamping portion 15, the end cover 50 can be stably clamped and arranged at the opening 14 of the shell 10.
[0055] The first clamping portion 51 includes, but is not limited to, a clamping strip or a clamping groove, and the second clamping portion 15 is correspondingly provided as a clamping groove or a clamping strip.
[0056] Please refer to Figures 2 to 4 In an embodiment, the outer periphery of the end cover 50 is provided with a first step 52, and the mouth wall of the opening 14 is provided with a second step 141. The first step 52 and the second step 141 abut each other. In this way, when the end cover 50 is arranged at the opening 14, the first step 52 and the second step 141 abut each other, and have good sealing performance.
[0057] Please refer to Figure 5 In an embodiment, the electromagnetic induction element 30 includes a magnetic core 31 and one or more coils 32 wound on the magnetic core 31. The opposite ends of the coil 32 are electrically connected to the circuit on the circuit board 20.
[0058] The number of coils 32 is, for example, one, two, three or other numbers, which can be flexibly adjusted and arranged according to actual needs. For example, when the number of coils 32 is 1, the current sensor can be a conventional current sensor; when the number of coils 32 is 2, the current sensor can be a fluxgate current sensor, which is not exhaustive here.
[0059] Please refer to Figure 1 , Figure 4 and Figure 5 In an embodiment, the current sensor further includes an electrical connector 60. The electrical connector 60 is electrically connected to the circuit board 20, and the shell 10 is formed with a window 16, which is specifically formed on the end cover 50. The electrical connector 60 extends out of the shell 10 through the window 16, and after the electrical connector 60 extends out of the window 16, it can be electrically connected to an external device.
[0060] Optionally, a through hole 17 is formed at the middle part of the shell 10. The through hole 17 extends from one end to the other end along the axial direction Z of the shell 10. The conductor to be measured is arranged in the through hole 17. When the conductor to be measured is electrified, the current can be sensed by the electromagnetic induction element 30, and the electromagnetic induction element 30 outputs the detection signal to the external device through the circuit board 20 and the electrical connector 60.
[0061] It should be noted that the "supporting strips 11, rib strips 12" in the embodiment can be "a part of the shell 10", that is, the "supporting strips 11, rib strips 12" are integrally formed with "other parts of the shell 10"; or can be a separate component that can be separated from "other parts of the shell 10", that is, the "supporting strips 11, rib strips 12" can be independently manufactured, and then combined with "other parts of the shell 10" to form an integral whole.
[0062] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0063] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0064] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connection", "connection", "fixing" and the like appear, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0065] In the present application, unless specifically defined otherwise, if there is an expression "on" or "under" or similar, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "on", "above" and "over" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0066] It should be noted that if an element is referred to as being "fixed" or "attached" to another element, it can be directly on the other element or there can be an intervening element. If an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements can be present. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions as used herein are for purposes of explanation only and are not intended to be limiting.
[0067] The technical features of the above-described embodiments can be combined in any manner, and in order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not contradict each other, they should be considered to be within the scope of the present application.
[0068] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A current sensor, characterized by The current sensor comprises: a housing; a circuit board located inside the housing, and the outer periphery of the circuit board is clamped and fixed to the inner wall of the housing; an electromagnetic induction element located inside the housing, the electromagnetic induction element is electrically connected with the circuit board, and the two opposite end faces of the electromagnetic induction element are respectively abutted with the circuit board and the housing; and potting glue provided inside the housing, and the potting glue wraps at least part of the circuit board and at least part of the electromagnetic induction element.
2. The current sensor of claim 1, wherein, The inner wall of the housing is provided with support strips and ribs, the support strips and the ribs are provided with intervals along the thickness direction of the circuit board, the interval of the support strips and the ribs along the thickness direction of the circuit board is less than or equal to the thickness of the circuit board, and the outer periphery of the circuit board is clamped at the interval.
3. The current sensor of claim 2, wherein, The support strips are a plurality of and are arranged in sequence and spaced apart along the circumferential direction of the inner wall of the housing; and / or, the ribs are a plurality of and are arranged on opposite sides of the inner wall of the housing.
4. The current sensor of claim 1, wherein, The inner wall of the housing is provided with a positioning strip, the outer periphery of the circuit board is provided with a first positioning groove, and the positioning strip is located inside the first positioning groove; and / or, the inner wall of the housing is provided with a second positioning groove, the outer periphery of the circuit board is provided with a positioning block, and the positioning block is located inside the second positioning groove.
5. The current sensor of claim 4, wherein, The positioning strips are two and are arranged in parallel and spaced apart, the first positioning grooves are two, and the two first positioning grooves and the two positioning strips are one-to-one correspondingly arranged; and / or, the positioning blocks are two and are arranged in parallel and spaced apart, the second positioning grooves are two, and the two second positioning grooves and the two positioning blocks are one-to-one correspondingly arranged.
6. The current sensor of claim 1, wherein, The housing is provided with an opening and an end cover detachably arranged at the opening; The electromagnetic induction element is located on the side of the circuit board away from the end cover, the potting glue fills the internal area of the housing on the side of the circuit board away from the end cover; or, the potting glue fills all the internal areas of the housing.
7. The current sensor of claim 6, wherein, The outer periphery of the end cover is provided with one or more first clamping portions, the inner wall of the housing is provided with one or more second clamping portions, and each first clamping portion is correspondingly clamped and arranged on each second clamping portion.
8. The current sensor of claim 6, wherein, The outer periphery of the end cover is provided with a first step, the mouth wall of the opening is provided with a second step, and the first step and the second step are abutted and matched with each other.
9. The current sensor of claim 1, wherein, The electromagnetic induction element comprises a magnetic core and one or more coils wound on the magnetic core; the opposite ends of the coil are electrically connected with the circuit on the circuit board.
10. The current sensor of any one of claims 1 to 9, wherein, The current sensor further comprises an electrical connector electrically connected with the circuit board, a window is formed on the housing, and the electrical connector extends to the outside of the housing through the window.