Intelligent acoustic positioning imager

Abstract

The utility model relates to the technical field of pickup equipment, in particular to an intelligent acoustic positioning imager. The sound source positioning device comprises a lower shell, a sealing rubber mat and a microphone main board, the lower shell, the sealing rubber mat and the microphone main board are sequentially connected from outside to inside to form a sound source positioning assembly, and a plurality of digital silicon microphone structures are distributed on the sound source positioning assembly in an array mode. Each digital silicon microphone structure comprises a lower shell pickup port arranged on the lower shell, a rubber mat opening arranged on the sealing rubber mat and a mainboard pickup port arranged on the microphone mainboard, the microphone, the lower shell pickup port, the rubber mat opening and the mainboard pickup port are sequentially butted and communicated, the microphone is positioned on the microphone mainboard and is aligned with the mainboard pickup port, and the lower shell pickup port is positioned on the lower shell and is aligned with the mainboard pickup port. The digital silicon microphone structures are mutually independent. Multiple paths of high-sensitivity digital silicon microphones are arranged in an array mode to form a recording system for cooperative work, and the functions of sound source positioning, noise suppression and the like are achieved. And a stepped pickup channel is adopted, so that the direction and the distance to a sound source can be accurately positioned.

Description

TECHNICAL FIELD

[0001] The utility model relates to a pickup equipment technical field, especially a kind of intelligent acoustic positioning imaging instrument. BACKGROUND

[0002] In the industrial sites such as automobile production, power inspection, petrochemical, gas, railway, through the voiceprint of power system, pressure pipeline gas leakage, rail transit wheel rail noise, work factory environmental noise in middle and far distance Test monitoring function, can provide real-time picture, video data and alarm signal.For being able to portable, real-time monitoring, handheld acoustic imager is widely used, but the existing acoustic imager is only through the pickup of simple pickup to obtain sound source, and the influence of pickup distribution structure on sound source position accurate acquisition is not fully considered, leading to the complexity of imaging algorithm after obtaining inaccurate sound source information, the system needs to consume a lot of resources to carry out complex operation, increases the data interaction amount between control module in imager, increases power consumption. UTILITARIAN CONTENT

[0003] The utility model provides a kind of intelligent acoustic positioning imaging instrument, to solve the problem of low accuracy when the pickup structure of existing imager obtains sound source information.

[0004] The utility model provides a kind of intelligent acoustic positioning imaging instrument, including lower shell, sealing rubber pad, microphone mainboard, the lower shell, sealing rubber pad, microphone mainboard are sequentially connected from outside to inside and constitute sound source positioning assembly, multiple digital silicon microphone structures are distributed in array on the sound source positioning assembly, each digital silicon microphone structure includes the lower shell pickup port of being arranged on lower shell, the rubber pad opening of being arranged on sealing rubber pad, the mainboard pickup port of being arranged on microphone mainboard, microphone, the lower shell pickup port, rubber pad opening, mainboard pickup port are sequentially docked and communicate, the microphone is located on microphone mainboard and aligns mainboard pickup port, each digital silicon microphone structure is independent of each other.

[0005] As a further improvement of the utility model, the lower shell pickup port is conical opening shape, and the lower shell pickup port converges from the direction of the outer surface of the lower shell to the mainboard pickup port.

[0006] As a further improvement of the utility model, the lower shell pickup port outside the multiple lower shell pickup ports on the lower shell forms a pickup plane, and the included angle between the pickup plane and the lower shell plane is less than 1 °.

[0007] As a further improvement of the utility model, the array distribution structure of multiple digital silicon microphone structures comprises a circular pickup area in the center and an arc pickup area, one end of the arc pickup area is connected to the circular pickup area, the other end of the arc pickup area extends away from the outer edge of the circular pickup area, and multiple digital silicon microphone structures are arranged on the circular pickup area and the arc pickup area.

[0008] As a further improvement of the utility model, the density of the multiple digital silicon microphone structures close to the center of the circular pickup area is greater than the density of the multiple digital silicon microphone structures at the edge of the circular pickup area.

[0009] As a further improvement of the utility model, the density distribution of the multiple digital silicon microphone structures on the arc pickup area gradually increases from the end of the arc pickup area close to the circular pickup area to the other end of the arc pickup area away from the circular pickup area.

[0010] As a further improvement of the utility model, the intelligent acoustic positioning imaging instrument further comprises a PCB board, the PCB board is connected with the microphone main board, and the microphone is closely attached to the PCB board.

[0011] As a further improvement of the utility model, the PCB board is provided with a 5G communication module.

[0012] As a further improvement of the utility model, the intelligent acoustic positioning imaging instrument further comprises a support, a face shell, a battery, a touch screen and a camera assembly, the support is connected in the lower shell, the PCB board, the microphone main board and the sealing rubber pad are connected between the support and the lower shell, the face shell is connected with the lower shell, the touch screen is installed on the face shell, the battery is installed in the space between the face shell and the lower shell, the camera assembly is connected between the face shell and the lower shell, and the camera assembly is connected with the PCB board.

[0013] The utility model discloses the beneficial effect is: adopt multiple high sensitivity digital silicon microphones, in the structural design, these digital silicon microphones are arranged in an array to form a recording system, through the collaborative work of multiple array microphones, realize sound source positioning, noise suppression, reverberation elimination and other functions. The lower shell pickup port, the rubber pad opening and the mainboard pickup port form a stepped pickup channel, ensure that the phase difference and time difference of the sound signals received by different microphones of the microphone array are more accurate, and the direction and distance of the sound source can also be accurately positioned. BRIEF DESCRIPTION OF DRAWINGS

[0014] Fig. 1 It is the structure front view of the utility model intelligent acoustic positioning imaging instrument;

[0015] Fig. 2 It is the structure sectional view of the utility model intelligent acoustic positioning imaging instrument;

[0016] Fig. 3 is the structure of the sound source positioning assembly of the utility model;

[0017] Fig. 4 is the structure of the utility model intelligent acoustic positioning imaging instrument. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model is further explained in detail below with the help of drawings and examples.

[0019] As shown in Figs. 1 to 4 The utility model discloses an intelligent acoustic positioning imaging instrument, which comprises a lower shell 1, a sealing rubber pad 2 and a microphone mainboard 3, the lower shell 1, the sealing rubber pad 2 and the microphone mainboard 3 are sequentially connected from outside to inside and form a sound source positioning assembly, a plurality of digital silicon microphone structures 4 are arranged in an array on the sound source positioning assembly, each digital silicon microphone structure 4 comprises a lower shell pickup opening 41 arranged on the lower shell 1, a rubber pad opening 42 arranged on the sealing rubber pad 2, a mainboard pickup opening 43 arranged on the microphone mainboard 3 and a microphone 44, the lower shell pickup opening 41, the rubber pad opening 42 and the mainboard pickup opening 43 are sequentially connected and communicated, the microphone 44 is located on the microphone mainboard 3 and is aligned with the mainboard pickup opening 43, and each digital silicon microphone structure 4 is independent of each other.

[0020] The scheme adopts up to 196 high-sensitivity digital silicon microphones. In the structural design, these array silicon microphones are arranged according to the rules required in the FPGA algorithm, form an audio recording system, realize sound source positioning, noise suppression, reverberation elimination and other functions through the cooperative work of the 196 microphones 44. Each silicon microphone is completely independent, each silicon microphone has a unique pickup hole, and each silicon microphone has an independent sound collecting function. The direction of the sound source can be accurately judged through the pickup result of each independent silicon microphone.

[0021] The lower shell pickup opening 41 is in the shape of a conical opening, and the lower shell pickup opening 41 converges from the outer surface of the lower shell 1 to the direction of the mainboard pickup opening 43. Through the shape of the conical opening, the larger opening at the upper end is more conducive to collecting sound, and the structure of the lower end gradually converging is conducive to concentrating the collected sound into the mainboard pickup opening 43 and being picked up by the microphone 44. The structure shell also performs stepped processing on the pickup channel, the outer wall is wide and deep, the inner wall is narrow and shallow, and the sealing rubber pad 2, the reasonable PCB opening layer and the like are further matched, so that the phase difference and the time difference of the sound signals received by the microphone 44 array are more accurate, and the direction and distance of the sound source can be more accurately positioned.

[0022] The multiple lower shell pickup openings 41 on the lower shell 1 form a pickup plane outside, and the included angle between the pickup plane and the plane of the lower shell 1 is less than 1°. The sound collecting openings are located in the same plane, and the included angle between the plane and the plane of the structural shell is less than 1°. The sound collecting opening structure in the same plane can more concentratedly capture the direction of the sound source, and the small included angle design can reduce the error caused by the large angle deviation of the pickup openings in different positions.

[0023] The array type distribution structure composed of multiple digital silicon microphone structures 4 includes a circular pickup area 45 in the center and an arc pickup area 46. One end of the arc pickup area 46 is connected to the circular pickup area 45, and the other end of the arc pickup area 46 extends away from the outer edge of the circular pickup area 45. Multiple digital silicon microphone structures 4 are arranged on the circular pickup area 45 and the arc pickup area 46.

[0024] The density of the multiple digital silicon microphone structures 4 near the center of the circular pickup area 45 is greater than the density of the multiple digital silicon microphone structures 4 at the edge of the circular pickup area 45. In the circular pickup area 45, the digital silicon microphone structures 4 with a larger density near the center can fill the pickup blind area in the center, and the digital silicon microphone structures 4 at the edge of the circular pickup area 45 can cooperate with the digital silicon microphone structures 4 on the multiple arc pickup areas 46 to perform pickup, so the density here is smaller.

[0025] The density distribution of the multiple digital silicon microphone structures 4 on the arc pickup area 46 gradually increases from the end of the arc pickup area 46 near the circular pickup area 45 to the other end away from the circular pickup area 45. In the arc pickup area 46, the pickup area at the edge needs to cover a wider pickup range, so it needs digital silicon microphone structures 4 with a higher density to more accurately obtain the direction of the sound source. The pickup range of the position near the center is relatively small, and there are multiple arc pickup areas 46 converging, so digital silicon microphone structures 4 with a smaller density can be used.

[0026] The intelligent acoustic positioning imaging instrument also includes a PCB board 5, which is connected with the microphone main board 3, and the microphone 44 is tightly attached to the PCB board 5. All silicon microphones are of the BOTTOM opening type and are tightly attached to the PCB board 5, which improves the space utilization rate and allows the signal between the microphone 44 and the PCB board 5 to be transmitted faster.

[0027] The PCB board 5 is provided with a 5G communication module. The 5G communication module can use a high-performance 5G main chip. After the intelligent acoustic positioning imaging instrument collects pickup sensor data and processes it through a high-speed FPGA chip algorithm, it is transmitted to the high-performance 5G main chip, combined with other sensors, and detailed positioning data is displayed on the screen.

[0028] The optimized pickup structure layout reduces the complexity of the FPGA algorithm, improves the speed of the algorithm, saves the resources and power consumption of the system, reduces the amount of data interaction between the main control module and the FPGA, and lays a foundation for the stability and reliability of 5G gimbal transmission.

[0029] The intelligent acoustic positioning imaging instrument further comprises a support 6, a surface shell 7, a battery 8, a touch screen 71, and a camera assembly 9, the support 6 is connected in the lower shell 1, the PCB 5, the microphone mainboard 3 and the sealing rubber pad 2 are connected between the support 6 and the lower shell 1, the surface shell 7 is connected with the lower shell 1, the touch screen 71 is installed on the surface shell 7, the battery 8 is installed in the space between the surface shell 7 and the lower shell 1, the camera assembly 9 is connected between the surface shell 7 and the lower shell 1, and the camera assembly 9 is connected with the PCB 5. The camera assembly 9 is used for recording real-time high-definition video pictures, the touch screen 71 is used for displaying an acoustic image cloud picture and facilitating user control operation, the battery 8 is used for power supply of the whole machine, and the support 6 is used for fixing the PCB 5, the microphone mainboard 3 and the sealing rubber pad 2 and the like in the inside of the shell, so that the components are more firmly installed in the shell.

[0030] The intelligent acoustic positioning imaging instrument is a portable intelligent handheld acoustic imaging instrument with 5G, has 196 channel MEMS sensors, has a sampling rate of 192 kHz, and can effectively measure ultrahigh frequency ultrasonic signals. The acoustic field distribution in a certain range is collected and measured in real time, real-time sound source positioning analysis and calculation are performed by using beam forming technology, after the sound source position distribution data are obtained, the sound source position distribution data are combined with the real-time high-definition video pictures recorded by the high-definition camera, color acoustic image cloud pictures are produced by fusion, and finally the sound source dynamic is presented on the high-definition display screen of the imaging instrument. Good test results can be obtained for steady-state or high-transient sound sources, stationary or moving sound sources. The intelligent acoustic positioning imaging instrument can be widely applied to power partial discharge detection, gas leakage detection under pressure or vacuum conditions, air tightness detection, equipment abnormal sound positioning and other industrial application occasions.

[0031] The above content is a further detailed description of the utility model made in combination with specific preferred embodiments, and cannot be regarded as the specific implementation of the utility model being limited to these descriptions. For ordinary skilled persons in the technical field to which the utility model belongs, without departing from the concept of the utility model, a number of simple deductions or substitutions can be made, and all of them should be regarded as belonging to the protection scope of the utility model.

Claims

1. An intelligent acoustic positioning imager, characterized in that, The device includes a lower shell, a sealing gasket, and a microphone motherboard. The lower shell, sealing gasket, and microphone motherboard are connected sequentially from the outside to the inside to form a sound source positioning component. Multiple digital silicon microphone structures are arranged in an array on the sound source positioning component. Each digital silicon microphone structure includes a lower shell pickup port on the lower shell, a gasket opening on the sealing gasket, a motherboard pickup port on the microphone motherboard, and a microphone. The lower shell pickup port, the gasket opening, and the motherboard pickup port are connected sequentially. The microphone is located on the microphone motherboard and aligned with the motherboard pickup port. Each digital silicon microphone structure is independent of the others.

2. The intelligent acoustic positioning imager according to claim 1, characterized in that, The lower shell microphone is in the shape of a cone, and the lower shell microphone converges from the outer surface of the lower shell towards the microphone on the motherboard.

3. The intelligent acoustic positioning imager according to claim 1, characterized in that, The outer surface of the plurality of lower shell pickup ports on the lower shell forms a pickup plane, and the angle between the pickup plane and the lower shell plane is less than 1°.

4. The intelligent acoustic positioning imager according to claim 1, characterized in that, The array-like distribution structure composed of multiple digital silicon microphone structures includes a circular pickup area and an arc pickup area located at the center. One end of the arc pickup area is connected to the circular pickup area, and the other end of the arc pickup area extends away from the outer edge of the circular pickup area. Multiple digital silicon microphone structures are provided on both the circular pickup area and the arc pickup area.

5. The intelligent acoustic positioning imager according to claim 4, characterized in that, The density of multiple digital silicon microphone structures near the center of the circular pickup area is greater than the density of multiple digital silicon microphone structures at the edge of the circular pickup area.

6. The intelligent acoustic positioning imager according to claim 4, characterized in that, The density distribution of the multiple digital silicon microphone structures on the arc pickup area gradually increases from one end of the arc pickup area closer to the circular pickup area to the other end farther away from the circular pickup area.

7. The intelligent acoustic positioning imager according to claim 1, characterized in that, It also includes a PCB board, which is connected to the microphone motherboard, and the microphone is attached to the PCB board.

8. The intelligent acoustic positioning imager according to claim 7, characterized in that, The PCB board is equipped with a 5G communication module.

9. The intelligent acoustic positioning imager according to claim 7, characterized in that, It also includes a bracket, a front shell, a battery, a touch screen, and a camera assembly. The bracket is connected inside the lower shell. The PCB board, microphone motherboard, and sealing gasket are connected between the bracket and the lower shell. The front shell and the lower shell are connected. The touch screen is mounted on the front shell. The battery is installed in the space between the front shell and the lower shell. The camera assembly is connected between the front shell and the lower shell and is connected to the PCB board.

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