Backlight module capable of avoiding hot burning and tablet computer

Abstract

The utility model discloses an avoiding hot backlight module and a tablet personal computer, the avoiding hot backlight module comprises a lower frame, a rubber frame, a flexible circuit board and an LED lamp strip, the lower frame comprises a bottom plate and a folding edge, the folding edge is formed by bending the edge of the bottom plate upwards, and heat dissipation holes are formed in the bottom plate; the rubber frame is arranged on the edge of the bottom plate and abuts against the folded edge, a first step and a second step are arranged at the bottom of the rubber frame, and the second step is located above the first step; the flexible circuit board is arranged at the first step of the rubber frame and comprises a first covering film, a first copper layer, a base material layer, a second copper layer and a second covering film which are sequentially stacked from top to bottom, a third copper layer is arranged below the second covering film, and the third copper layer is exposed and fixed to the upper surface of the bottom plate located at the heat dissipation holes. The third copper layer completely covers the heat dissipation holes; the LED lamp strip is arranged at the second step and fixed to the upper surface of the flexible circuit board, and the heat dissipation holes and the third copper layer are located below the LED lamp strip.

Description

TECHNICAL FIELD

[0001] The utility model relates to a display technical field more specifically, relate to a kind of backlight module and tablet computer to avoid scorching. BACKGROUND

[0002] Now the size of liquid crystal display is bigger and bigger, in order to guarantee the brightness of liquid crystal display, the power of LED lamp must be increased or the number of LED lamp is increased, these two methods can increase the heat generation of LED lamp, so that the heat of LED lamp gathers and causes the temperature of backlight module to sharply increase, further cause backlight module to scorch and crash, so as to bring unnecessary loss to user. CONTENT OF UTILITY MODEL

[0003] The utility model solves the technical problem that how to avoid scorching of backlight module and avoid crash, further avoid unnecessary loss to user, improve the competitiveness of product.

[0004] The technical problem to be solved by the utility model is realized by the following technical scheme:

[0005] To solve the above technical problem, the utility model provides a kind of backlight module to avoid scorching, it includes lower frame, glue frame, flexible circuit board and LED lamp strip, the lower frame includes bottom plate and folded edge, the folded edge is formed by the bottom plate edge and is bent upwards, and the bottom plate is provided with heat dissipation hole;The glue frame is arranged at the edge of the bottom plate and is in abutment with the folded edge, the bottom of the glue frame is provided with first step and second step, and the second step is located above the first step;The flexible circuit board is arranged at the first step of the glue frame, and the flexible circuit board includes first cover film, first copper layer, substrate layer, second copper layer and second cover film sequentially superimposed from top to bottom, third copper layer is arranged below the second cover film, the third copper layer is exposed and fixed on the upper surface of the bottom plate at the heat dissipation hole, and the third copper layer completely covers the heat dissipation hole;The LED lamp strip is arranged at the second step and is fixed on the upper surface of the flexible circuit board, and the heat dissipation hole and third copper layer are all located below the LED lamp strip.

[0006] As a preferred embodiment of the backlight module to avoid scorching provided by the utility model, the third copper layer is fixed on the upper surface of the bottom plate by double-sided adhesive, and the double-sided adhesive completely covers the heat dissipation hole.

[0007] As a preferred embodiment of the backlight module to avoid scorching provided by the utility model, the double-sided adhesive is heat-conducting double-sided adhesive.

[0008] As a preferred embodiment of the backlight module to avoid scorching provided by the utility model, the double-sided adhesive is conductive double-sided adhesive.

[0009] As a preferred embodiment of the backlight module avoiding overheating provided by the utility model, the lower part of the second covering film is provided with a third covering film, and the third covering film surrounds the third copper layer.

[0010] As a preferred embodiment of the backlight module avoiding overheating provided by the utility model, the outer surface of one end of the first copper layer and the second copper layer is provided with a lamp strip pad, and the outer surface of the first copper layer and the second copper layer at the lamp strip pad is not covered with the first covering film and the second covering film.

[0011] As a preferred embodiment of the backlight module avoiding overheating provided by the utility model, the heat dissipation holes are multiple, and the positions and the number of the heat dissipation holes correspond to the positions and the number of the LED lamps on the LED lamp strip.

[0012] As a preferred embodiment of the backlight module avoiding overheating provided by the utility model, one LED lamp on the LED lamp strip is provided with two heat dissipation holes.

[0013] As a preferred embodiment of the backlight module avoiding overheating provided by the utility model, the heat dissipation holes are multiple, and the positions and the number of the heat dissipation holes correspond to the positions and the number of the LED lamps on the LED lamp strip.

[0014] The utility model provides a kind of tablet computer, it includes the backlight module avoiding overheating as any one of the above.

[0015] The utility model has the following beneficial effects:

[0016] Since the lower part of the second covering film is provided with the third copper layer, and the third copper layer is exposed and covers the heat dissipation hole, the two-layer copper layer FPC in the traditional scheme is changed to three-layer copper layer FPC, so that the heat of the LED lamp strip is quickly transmitted to the lower frame through the exposed copper skin of the third copper layer, and then is quickly dissipated to the air through the heat dissipation hole of the lower frame, avoiding the heat being blocked by the lower frame, and since the third copper layer covers the lower frame opening, dust can be prevented from entering the inside of the backlight module. It can avoid overheating of the backlight module and avoid downtime, thereby avoiding unnecessary loss to users and improving the competitiveness of products. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the scheme in the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 The utility model provides a structure schematic diagram of back light module of avoiding scalding.

[0019] Figure 2 For Figure 1 The improved structure schematic diagram of flexible circuit board.

[0020] Explanation of the drawings:

[0021] Lower frame 1, glue frame 2, flexible circuit board 3, LED lamp strip 4, bottom plate 11, folding edge 12, heat dissipation hole 13, first step 21, second step 22, first cover film 31, first copper layer 32, base material layer 33, second copper layer 34, second cover film 35, third copper layer 36, third cover film 37, lamp strip pad 38. Specific implementation

[0022] In order to make the personnel in the technical field better understand the utility model scheme, the technical scheme in the embodiment of the utility model will be described clearly and completely in the embodiment of the utility model below, obviously, the described embodiment is only a part of the embodiment of the utility model, not all. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the utility model.

[0023] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" are based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the indicated device or element must have a particular orientation, structure and operation, therefore, it cannot be understood as the limitation of the utility model.

[0024] In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", "third" can explicitly or implicitly include at least one feature. In the description of the utility model, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0025] The utility model provides a kind of backlight module that avoids overheating, it includes lower frame, glue frame, flexible circuit board and LED lamp strip, the lower frame includes bottom plate and flange, the flange is formed by the bottom plate edge upward bending, and the bottom plate is equipped with heat dissipation hole;The glue frame is arranged at the edge of the bottom plate and is abutted with the flange, the bottom of the glue frame is equipped with first step and second step, and the second step is located above the first step;The flexible circuit board is arranged at the first step of the glue frame, and the flexible circuit board includes first cover film, first copper layer, substrate layer, second copper layer and second cover film sequentially stacked from top to bottom, third copper layer is arranged below the second cover film, the third copper layer is exposed and fixed on the upper surface of the bottom plate at the heat dissipation hole, and the third copper layer completely covers the heat dissipation hole;The LED lamp strip is arranged at the second step and is fixed on the upper surface of the flexible circuit board, and the heat dissipation hole and third copper layer are all located below the LED lamp strip.

[0026] Since third copper layer is arranged below the second cover film, and the third copper layer is exposed and covers the heat dissipation hole, two copper layers of FPC in the conventional scheme are changed to three copper layers of FPC, so that the heat of the LED lamp strip is quickly transmitted to the lower frame through the exposed copper skin of the third copper layer, and then is quickly dissipated to the air through the heat dissipation hole of the lower frame, so as to avoid the heat being blocked by the lower frame, and since the third copper layer covers the lower frame opening, dust can be prevented from entering the interior of the backlight module. It can avoid overheating of the backlight module and avoid downtime, thereby avoiding unnecessary loss to users and improving the competitiveness of products.

[0027] In order to enable the personnel in the art to better understand the present application scheme, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings. The utility model will be described in detail below in conjunction with the drawings and embodiments, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the utility model, and cannot be understood as a limitation on the utility model.

[0028] Embodiment 1, please refer to Figure 1 And Figure 2The utility model provides a kind of backlight module to avoid scorching, it includes lower frame 1, glue frame 2, flexible circuit board 3 and LED lamp strip 4, lower frame 1 includes bottom plate 11 and folded edge 12, folded edge 12 is formed by bending upwards from bottom plate 11 edge, bottom plate 11 is equipped with heat dissipation hole 13;Glue frame 2 is arranged at the edge of bottom plate 11 and with folded edge 12 abuts, the bottom of glue frame 2 is equipped with first step 21 and second step 22, second step 22 is located above first step 21;Flexible circuit board 3 is arranged at the first step 21 of glue frame 2, and flexible circuit board 3 includes first cover film 31, first copper layer 32, substrate layer 33, second copper layer 34 and second cover film 35 sequentially stacked from top to bottom, second cover film 35 is equipped with third copper layer 36 below, third copper layer 36 is exposed and fixed on the upper surface of bottom plate 11 at heat dissipation hole 13, and third copper layer 36 completely covers heat dissipation hole 13;LED lamp strip 4 is arranged at second step 22 and is fixed on the upper surface of flexible circuit board 3, and heat dissipation hole 13 and third copper layer 36 are all located below LED lamp strip 4.Because second cover film 35 is equipped with third copper layer 36 below, and third copper layer 36 is exposed and covers heat dissipation hole 13, the two copper layers of traditional scheme are changed into three copper layers FPC, so that the heat of LED lamp strip 4 is quickly transmitted to lower frame 1 through the exposed copper of third copper layer 36, and then is accelerated to air through the heat dissipation hole 13 of lower frame 1, to avoid the heat being blocked by lower frame 1, and because third copper layer 36 covers the opening of lower frame 1, dust can be prevented from entering the inside of backlight module.It can avoid scorching of backlight module and avoid downtime, to avoid unnecessary loss to user, and improve the competitiveness of product.

[0029] Further, the third copper layer 36 is fixed on the upper surface of the bottom plate 11 by the double-sided adhesive, and the double-sided adhesive completely covers the heat dissipation hole 13 to fix the flexible circuit board 3 on the upper surface of the bottom plate 11.

[0030] Further, the double-sided adhesive is a heat-conducting double-sided adhesive, so that the third copper layer 36 can quickly transmit heat to the lower frame 1 through the heat-conducting double-sided adhesive to improve the heat dissipation efficiency. In other embodiments, to improve the anti-static capability, the double-sided adhesive can also be a conductive double-sided adhesive, and the lower frame 1 is an iron frame. The LED lamp strip 4 is grounded through the FPC and the conductive double-sided adhesive to increase the anti-static capability of the backlight module.

[0031] Further, the third copper layer 36 is fixed on the upper surface of the bottom plate 11 by the double-sided adhesive, and the double-sided adhesive completely covers the heat dissipation hole 13 to fix the flexible circuit board 3 on the upper surface of the bottom plate 11.

[0032] Further, the outer surface of the first copper layer 32 and one end of the second copper layer 34 is provided with a lamp strip pad 38, and the outer surface of the first copper layer 32 and the second copper layer 34 at the lamp strip pad 38 is not covered with the first cover film 31 and the second cover film 35, so as to be welded and fixed through the lamp strip pad 38.

[0033] Further, the heat dissipation holes 13 are multiple, the positions and the quantity of the heat dissipation holes 13 correspond to the positions and the quantity of the LED lamps on the LED lamp strip 4, one LED lamp on the LED lamp strip 4 is provided with two heat dissipation holes 13 in correspondence, and the outer dimension of the heat dissipation holes 13 is smaller than that of the LED lamp on the LED lamp strip 4, so that the size of the heat dissipation holes 13 can be smaller, the heat dissipation holes 13 are prevented from being blocked by large foreign matters, and the large foreign matters are prevented from entering the inside of the backlight module through the heat dissipation holes 13 when the FPC is damaged after a long service life of the product.

[0034] In the embodiment 2, the backlight module capable of avoiding overheating is provided.

[0035] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do the broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated, can be mechanical connection, also can be electric connection or each other can communicate, can be directly connected, also can indirectly connect through the intermediate medium, can be the communication of two elements or the interaction of two elements, unless another definite limitation. For the ordinary skilled in the art, the above-mentioned terms can be understood according to the specific meaning of the utility model.

[0036] Obviously, the above-described embodiments are only some embodiments of the present application, not all the embodiments, and the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the foregoing embodiments, the skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or make equivalent replacement to some technical features. Any equivalent structure made by using the contents of the specification and drawings, directly or indirectly applied in other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A backlight module to avoid overheating, characterized in that, It comprises: a lower frame comprising a bottom plate and a folded edge formed by bending upward the edge of the bottom plate, the bottom plate being provided with heat dissipation holes; a glue frame provided at the edge of the bottom plate and abutting against the folded edge, the bottom of the glue frame being provided with a first step and a second step, the second step being located above the first step; a flexible circuit board provided at the first step of the glue frame, the flexible circuit board comprising a first cover film, a first copper layer, a base material layer, a second copper layer and a second cover film sequentially stacked from top to bottom, a third copper layer being provided below the second cover film, the third copper layer being exposed and fixed on the upper surface of the bottom plate at the heat dissipation holes, the third copper layer completely covering the heat dissipation holes; an LED light strip provided at the second step and fixed on the upper surface of the flexible circuit board, the heat dissipation holes and the third copper layer being located below the LED light strip.

2. The back light unit according to claim 1, wherein The third copper layer is fixed on the upper surface of the bottom plate by double-sided adhesive, the double-sided adhesive completely covering the heat dissipation holes.

3. The back light unit of claim 2, wherein the light source is a light emitting diode (LED) and the phosphor layer is disposed on the LED. The double-sided adhesive is a heat-conductive double-sided adhesive.

4. The back light unit of claim 2, wherein the light source is a light emitting diode (LED). The double-sided adhesive is a conductive double-sided adhesive.

5. The back light unit of claim 1, wherein the light source is a light emitting diode (LED). A third cover film is provided below the second cover film, the third cover film surrounding the third copper layer.

6. The back light unit of claim 1, wherein the phosphor layer is formed on the light emitting diode. The outer surface of one end of the first copper layer and the second copper layer is provided with a light bar pad, the outer surface of the first copper layer and the second copper layer at the light bar pad not being covered with the first cover film and the second cover film.

7. The back light unit of claim 1, wherein the phosphor layer is formed on the light emitting diode. The heat dissipation holes are multiple, the positions and the number of the heat dissipation holes corresponding to the positions and the number of LED lights on the LED light strip.

8. The back light unit of claim 7, wherein the phosphor layer is disposed on the light emitting diode chip. Two heat dissipation holes are provided corresponding to one LED light on the LED light strip.

9. The back light unit of claim 1, wherein the phosphor layer is formed on the light emitting diode. The size of the heat dissipation holes is smaller than the size of the LED lights on the LED light strip.

10. A tablet computer, comprising: It comprises the anti-overheating backlight module as claimed in any one of claims 1-9.

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