High-strength rigid-flex circuit board

Abstract

The high-strength rigid-flex circuit board comprises a substrate, a printed circuit layer is arranged on the bottom surface of the substrate, a plurality of supporting blocks are arranged on the bottom surface of the printed circuit layer, a plurality of heat dissipation needles are fixedly connected to the bottom surface of the printed circuit layer, and anti-interference layers are arranged on the bottom surfaces of the supporting blocks. Compared with the prior art, by arranging the supporting blocks, the heat dissipation needles, the anti-interference layer, the protection layer and other structures, the anti-interference layer is supported by the supporting blocks, so that a certain space is obtained between the printed circuit layer and the anti-interference layer, and heat dissipation is facilitated. And the heat dissipation needles can outwards dissipate heat on the printed circuit layer, so that the printed circuit layer is kept at a proper working temperature. According to the circuit board, the heat-conducting glue layer is arranged on the substrate, the reinforcing layer is bonded on the protective layer through the heat-conducting glue layer, and heat-conducting glue has excellent heat-conducting property, so that a high-guarantee heat dissipation coefficient can be provided for the circuit board, the stable use of the circuit board is ensured, and the service life of the circuit board can be prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, especially a kind of soft and hard combination circuit board of high strength. BACKGROUND

[0002] Soft and hard combination circuit board is very different from general circuit board, mainly reflected in the difference of processing technology, the difference of used material, the difference of function three aspects.Processing technology of soft and hard combination circuit board is added with more new technology in addition to using general process method, and compared with general hard board, new material flexible board material, low flow degree prepreg, cover film are added in material aspect.

[0003] Because of the complicated manufacturing process of soft and hard combination circuit board, it is difficult to improve production quality, and soft and hard combination board is usually sensitive to environmental factors such as temperature and humidity, so it needs to be controlled in the use process.In the working of circuit board, the heat generated is difficult to dissipate quickly, which is not conducive to the long-term use of circuit board.For this reason, a kind of soft and hard combination circuit board of high strength is proposed to improve. SUMMARY

[0004] The utility model aims at solving at least one of the technical defects.

[0005] Therefore, one purpose of the utility model is to provide a kind of soft and hard combination circuit board of high strength to solve the problems mentioned in the background art and overcome the deficiencies in the prior art.

[0006] In order to achieve the above-mentioned purpose, the embodiment of the utility model provides a kind of soft and hard combination circuit board of high strength, including substrate, the bottom surface of the substrate is provided with printed circuit layer, the bottom surface of the printed circuit layer is provided with several supporting blocks, the bottom surface of the printed circuit layer is fixedly connected with several heat dissipation needles, the bottom surface of the supporting block is provided with anti-interference layer, the bottom surface of the anti-interference layer is provided with protective layer.

[0007] The top surface of the substrate is provided with heat-conducting adhesive layer, the top surface of the heat-conducting adhesive layer is provided with reinforcing layer, the top surface of the reinforcing layer is fixedly connected with heat dissipation layer, and a plurality of heat dissipation holes are formed in the heat dissipation layer.

[0008] It is preferred that, according to any one of the above-mentioned schemes, the several supporting blocks are evenly arranged on the bottom surface of the printed circuit layer, and the several heat dissipation needles are evenly arranged on the bottom surface of the printed circuit layer.

[0009] It is preferred that, according to any one of the above-mentioned schemes, the heat dissipation needle is arranged through the anti-interference layer and the protective layer, and the protective layer is made of silica gel material.

[0010] The technical scheme is as follows: the substrate is a printed circuit layer and a heat-conducting adhesive layer platform, so that the printed circuit layer can work stably. The printed circuit layer is an important part of the circuit board and is responsible for the calculation and processing of the circuit board. The support blocks provide support for the anti-interference layer and ensure the stability of the anti-interference layer. The support blocks are evenly arranged on the printed circuit layer, so that the anti-interference layer is balanced in stress and more stable. The heat dissipation needles can dissipate the heat on the printed circuit layer outward, so that the printed circuit layer maintains a suitable working temperature. The support blocks support the anti-interference layer, so that a certain space is obtained between the printed circuit layer and the anti-interference layer, which is beneficial to heat dissipation.

[0011] Preferably, according to any one of the above schemes, the thickness of the protective layer is not less than the thickness of the substrate, and the reinforcing layer comprises a plurality of vertical reinforcing ribs, horizontal reinforcing ribs and cross reinforcing ribs.

[0012] Preferably, according to any one of the above schemes, the heat-conducting adhesive layer adopts epoxy AB glue at the positions provided with the vertical reinforcing ribs, the horizontal reinforcing ribs and the cross reinforcing ribs.

[0013] The technical scheme is as follows: the protective layer can provide protection for the anti-interference layer, and by controlling the thickness of the protective layer, the protection effect can be ensured. The protective layer is made of silica gel material and can deform to a certain extent, which is beneficial to improve the toughness of the circuit board. The heat-conducting adhesive layer bonds the reinforcing layer to the protective layer. The heat-conducting adhesive has excellent heat-conducting performance, provides a high-safety heat dissipation coefficient for electronic products, ensures stable use of the products and prolongs the service life. The vertical reinforcing ribs, the horizontal reinforcing ribs and the cross reinforcing ribs can reinforce the substrate from all directions. At the same time, spaces are left between the reinforcing layer and the heat-conducting adhesive layer, which facilitates heat dissipation outward. The epoxy AB glue has the advantages of rapid bonding, high-strength adhesion and bonding force, stable chemical properties, corrosion resistance and weather resistance, etc., which can ensure the stability of the vertical reinforcing ribs, the horizontal reinforcing ribs and the cross reinforcing ribs during bonding.

[0014] Preferably, according to any one of the above schemes, the heat-conducting adhesive layer adopts organic silicon heat-conducting adhesive at positions not provided with the vertical reinforcing ribs, the horizontal reinforcing ribs and the cross reinforcing ribs.

[0015] Preferably, according to any one of the above schemes, a plurality of the heat dissipation holes are evenly arranged in the heat dissipation layer, and the heat dissipation layer is made of a glass fiber plate.

[0016] The organic silicon heat-conducting glue has good heat-conducting performance, high and low temperature resistance, easy use and environmental protection, and has many advantages, and the organic silicon heat-conducting glue is coated at positions where no vertical reinforcing ribs, horizontal reinforcing ribs and cross reinforcing ribs are arranged, so that heat on the substrate can be quickly dissipated outward. The heat dissipation layer protects the reinforcing layer and the heat-conducting glue layer, and also has a certain heat dissipation function. A plurality of heat dissipation holes are uniformly arranged on the heat dissipation layer, so that heat inside the heat dissipation layer can be easily dissipated outward.

[0017] Compared with the prior art, the high-strength soft and hard combined circuit board has the advantages and beneficial effects that:

[0018] 1. The high-strength soft and hard combined circuit board is supported by the supporting block to the anti-interference layer, so that a certain space is obtained between the printed circuit layer and the anti-interference layer, which is beneficial to heat dissipation. The heat dissipation needle can dissipate heat on the printed circuit layer outward, so that the printed circuit layer maintains a suitable working temperature. The heat-conducting glue layer not only bonds the reinforcing layer to the protective layer, but also provides a high heat dissipation coefficient for the circuit board due to the excellent heat-conducting performance of the heat-conducting glue, thereby ensuring stable use of the circuit board and prolonging the service life of the circuit board.

[0019] 2. The high-strength soft and hard combined circuit board is supported by the supporting block to the anti-interference layer, so that a certain space is obtained between the printed circuit layer and the anti-interference layer, which is beneficial to heat dissipation. The heat dissipation needle can dissipate heat on the printed circuit layer outward, so that the printed circuit layer maintains a suitable working temperature. The heat-conducting glue layer not only bonds the reinforcing layer to the protective layer, but also provides a high heat dissipation coefficient for the circuit board due to the excellent heat-conducting performance of the heat-conducting glue, thereby ensuring stable use of the circuit board and prolonging the service life of the circuit board.

[0020] Additional aspects and advantages of the present application will be described in the following description, some of which will become apparent to those skilled in the art from the following description, or can be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description, taken in conjunction with the following drawings, in which:

[0022] Fig. 1 is a schematic diagram of the overall structure of the present application;

[0023] Fig. 2 is a schematic diagram of the reinforcing layer of the present application.

[0024] In the diagram: 1-substrate, 2-printed circuit layer, 3-support block, 4-heat dissipation pin, 5-anti-interference layer, 6-protective layer, 7-thermal conductive adhesive layer, 8-reinforcing layer, 801-vertical reinforcing rib, 802-cross reinforcing rib, 803-horizontal reinforcing rib, 9-heat dissipation layer, 10-heat dissipation hole. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] like Figs. 1-2 As shown, this utility model includes a substrate 1, a printed circuit layer 2 is provided on the bottom surface of the substrate 1, a plurality of support blocks 3 are provided on the bottom surface of the printed circuit layer 2, a plurality of heat dissipation pins 4 are fixedly connected to the bottom surface of the printed circuit layer 2, an anti-interference layer 5 is provided on the bottom surface of the support blocks 3, and a protective layer 6 is provided on the bottom surface of the anti-interference layer 5.

[0028] A thermally conductive adhesive layer 7 is provided on the top surface of the substrate 1, a reinforcing layer 8 is provided on the top surface of the thermally conductive adhesive layer 7, a heat dissipation layer 9 is fixedly connected to the top surface of the reinforcing layer 8, and a plurality of heat dissipation holes 10 are provided on the heat dissipation layer 9.

[0029] In the embodiment 1, the plurality of supporting blocks 3 are evenly arranged on the bottom surface of the printed circuit layer 2, and the plurality of heat dissipation needles 4 are evenly arranged on the bottom surface of the printed circuit layer 2. The heat dissipation needles 4 pass through the anti-interference layer 5 and the protection layer 6, and the protection layer 6 is made of silica gel material. The substrate 1 is the printed circuit layer 2 and the heat-conducting adhesive layer 7, so that the printed circuit layer 2 can stably work. The printed circuit layer 2 is an important part of the circuit board, and is responsible for the calculation and processing of the circuit board. The supporting blocks 3 provide support for the anti-interference layer 5 to ensure the stability of the anti-interference layer 5. The plurality of supporting blocks 3 are evenly arranged on the printed circuit layer 2, so that the anti-interference layer 5 is balanced in stress, and the anti-interference layer 5 is more stable. The heat dissipation needles 4 can dissipate the heat on the printed circuit layer 2 outward, so that the printed circuit layer 2 maintains a suitable working temperature. The supporting blocks 3 support the anti-interference layer 5, so that a certain space is obtained between the printed circuit layer 2 and the anti-interference layer 5, which is beneficial to heat dissipation.

[0030] In the embodiment 2, the thickness of the protection layer 6 is not less than the thickness of the substrate 1, and the reinforcing layer 8 includes a plurality of vertical reinforcing ribs 801, horizontal reinforcing ribs 803 and cross reinforcing ribs 802. The heat-conducting adhesive layer 7 is made of epoxy resin AB glue at the positions where the vertical reinforcing ribs 801, the horizontal reinforcing ribs 803 and the cross reinforcing ribs 802 are arranged. The protection layer 6 can protect the anti-interference layer 5, and the protection effect can be ensured by controlling the thickness of the protection layer 6. The protection layer 6 is made of silica gel material, which can deform to a certain extent, and is beneficial to improve the toughness of the circuit board. The heat-conducting adhesive layer 7 bonds the reinforcing layer 8 to the protection layer 6, and the heat-conducting adhesive has excellent heat-conducting performance, which provides a high heat dissipation coefficient for electronic products, ensures the stable use of the products and prolongs the service life. The vertical reinforcing ribs 801, the horizontal reinforcing ribs 803 and the cross reinforcing ribs 802 can reinforce the substrate 1 from all directions. At the same time, a space is left between the reinforcing layer 8 and the heat-conducting adhesive layer 7, which is convenient for heat dissipation outward. The epoxy resin AB glue has the advantages of rapid bonding, high strength adhesion and bonding force, stable chemical properties, corrosion resistance and weather resistance, which can ensure the stability of the vertical reinforcing ribs 801, the horizontal reinforcing ribs 803 and the cross reinforcing ribs 802 during bonding.

[0031] In the embodiment 3, the heat-conducting adhesive layer 7 is made of organic silicon heat-conducting adhesive at the positions where the vertical reinforcing ribs 801, the horizontal reinforcing ribs 803 and the cross reinforcing ribs 802 are not arranged. A plurality of heat dissipation holes 10 are evenly arranged in the heat dissipation layer 9, and the heat dissipation layer 9 is made of glass fiber plate. The organic silicon heat-conducting adhesive has the advantages of good heat-conducting performance, high and low temperature resistance, easy to use and environmental protection, and the like. The organic silicon heat-conducting adhesive is coated at the positions where the vertical reinforcing ribs 801, the horizontal reinforcing ribs 803 and the cross reinforcing ribs 802 are not arranged, which is beneficial to the rapid dissipation of heat on the substrate 1 outward. The heat dissipation layer 9 protects the reinforcing layer 8 and the heat-conducting adhesive layer 7, and also has a certain heat dissipation function. A plurality of heat dissipation holes 10 are evenly arranged on the heat dissipation layer 9, which is convenient for the heat inside the heat dissipation layer 9 to dissipate outward.

[0032] The working principle of the utility model is as follows:

[0033] S1, the support block 3 supports the anti-interference layer 5, so that the printed circuit layer 2 and the anti-interference layer 5 obtain a certain space, and the heat on the printed circuit layer 2 can dissipate outward from the space;

[0034] S2, the heat dissipation needle 4 dissipates the heat on the printed circuit layer 2 outward, so that the printed circuit layer 2 maintains a suitable working temperature;

[0035] S3, the reinforcing layer 8 reinforces the circuit board, improving the strength of the circuit board. The heat dissipation layer 9 is uniformly provided with a plurality of heat dissipation holes 10, facilitating the heat inside the heat dissipation layer 9 to dissipate outward.

[0036] Compared with the prior art, the utility model has the following beneficial effects:

[0037] 1. The high-strength soft and hard combined circuit board is provided with the support block 3, the heat dissipation needle 4, the anti-interference layer 5 and the protective layer 6, the support block 3 supports the anti-interference layer 5, so that the printed circuit layer 2 and the anti-interference layer 5 obtain a certain space, which is beneficial to heat dissipation. The heat dissipation needle 4 can dissipate the heat on the printed circuit layer 2 outward, so that the printed circuit layer 2 maintains a suitable working temperature. The heat-conducting adhesive layer 7 is arranged on the substrate 1, the heat-conducting adhesive layer 7 not only bonds the reinforcing layer 8 to the protective layer 6, but also provides a high guarantee for the heat dissipation coefficient of the circuit board due to the excellent heat-conducting performance of the heat-conducting adhesive, ensuring the stable use of the circuit board and prolonging its service life.

[0038] 2. The high-strength soft and hard combined circuit board is provided with the reinforcing layer 8, the heat dissipation layer 9 and the heat dissipation hole 10, the reinforcing layer 8 is used to reinforce the circuit board, improving the strength of the circuit board. The vertical reinforcing rib 801, the horizontal reinforcing rib 803 and the cross reinforcing rib 802 can reinforce the substrate 1 from various directions. At the same time, the reinforcing layer 8 and the heat-conducting adhesive layer 7 leave a space, facilitating heat dissipation. The heat dissipation layer 9 not only protects the reinforcing layer 8 and the heat-conducting adhesive layer 7, but also has a certain heat dissipation function. The heat dissipation layer 9 is uniformly provided with a plurality of heat dissipation holes 10, facilitating the heat inside the heat dissipation layer 9 to dissipate outward.

Claims

1. A high-strength rigid-flex circuit board, comprising a substrate (1); characterized in that, The bottom surface of the substrate (1) is provided with a printed circuit layer (2), the bottom surface of the printed circuit layer (2) is provided with a plurality of support blocks (3), the bottom surface of the printed circuit layer (2) is fixedly connected with a plurality of heat dissipation pins (4), the bottom surface of the support block (3) is provided with an anti-interference layer (5), and the bottom surface of the anti-interference layer (5) is provided with a protective layer (6). A thermally conductive adhesive layer (7) is provided on the top surface of the substrate (1), a reinforcing layer (8) is provided on the top surface of the thermally conductive adhesive layer (7), a heat dissipation layer (9) is fixedly connected to the top surface of the reinforcing layer (8), and a plurality of heat dissipation holes (10) are provided on the heat dissipation layer (9).

2. The high-strength rigid-flex circuit board as described in claim 1, characterized in that: Several of the support blocks (3) are evenly arranged on the bottom surface of the printed circuit layer (2), and several of the heat dissipation pins (4) are evenly arranged on the bottom surface of the printed circuit layer (2).

3. A high-strength rigid-flex circuit board as described in claim 2, characterized in that: The heat dissipation pin (4) is disposed through the anti-interference layer (5) and the protective layer (6), and the protective layer (6) is made of silicone material.

4. A high-strength rigid-flex circuit board as described in claim 3, characterized in that: The thickness of the protective layer (6) is not less than the thickness of the substrate (1), and the reinforcing layer (8) includes a plurality of vertical reinforcing ribs (801), horizontal reinforcing ribs (803), and cross reinforcing ribs (802).

5. A high-strength rigid-flex circuit board as described in claim 4, characterized in that: The thermally conductive adhesive layer (7) is made of epoxy resin AB glue at the locations where vertical reinforcing ribs (801), horizontal reinforcing ribs (803) and cross reinforcing ribs (802) are provided.

6. A high-strength rigid-flex circuit board as described in claim 5, characterized in that: The thermally conductive adhesive layer (7) uses silicone thermally conductive adhesive where no vertical reinforcing ribs (801), horizontal reinforcing ribs (803), and cross reinforcing ribs (802) are provided.

7. A high-strength rigid-flex circuit board as described in claim 6, characterized in that: A number of heat dissipation holes (10) are evenly arranged in the heat dissipation layer (9), which is made of fiberglass board.

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