Flexible tactile sensor and manipulator

Abstract

The utility model discloses a flexible tactile sensor. The flexible tactile sensor comprises a sensing layer module and a sensor bracket, the sensing layer module comprises a flexible touch sensing layer; the flexible touch sensor further comprises a first elastic buffer layer, and the first elastic buffer layer is arranged on the sensor support. The sensing layer module is installed on the first elastic buffer layer and the sensor support, and the first elastic buffer layer is located between the sensing layer module and the sensor support. The utility model further discloses a manipulator with the flexible touch sensor.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of robots, and more particularly relates to a flexible tactile sensor and a mechanical hand. BACKGROUND

[0002] As an artificial electronic device that can imitate the human tactile perception function, the tactile sensor has been paid more and more attention with the development of robot technology. In the field of robots, it is usually necessary to confirm whether the execution end such as a mechanical hand has contacted with an object and to carry out force sensing and detection. For example, when the execution end such as a mechanical hand of a robot accurately picks up an object, it is particularly important to sense the mechanics through a tactile sensor. Therefore, the technical personnel in the field need to provide a flexible tactile sensor for a robot mechanical hand, and realize scalable production and manufacturing. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the technical problems of the prior art, the present application provides a flexible tactile sensor and a mechanical hand comprising the flexible tactile sensor.

[0004] To achieve the above object, the technical scheme adopted by the present application is:

[0005] The present application provides a flexible tactile sensor, comprising a sensing layer module and a sensor support; the sensing layer module comprises a flexible tactile sensing layer; the flexible tactile sensor further comprises a first elastic buffer layer, the first elastic buffer layer is arranged on the sensor support; the sensing layer module is installed on the first elastic buffer layer and the sensor support, and the first elastic buffer layer is located between the sensing layer module and the sensor support.

[0006] According to an embodiment provided by the present application, the first elastic buffer layer has a plurality of first micropores.

[0007] According to an embodiment provided by the present application, the first micropore is a first microneedle hole structure, the upper opening of the first microneedle hole structure is arranged towards the flexible tactile sensing layer of the sensing layer module, and the cross section of the first microneedle hole structure is in a tapered shape with a large upper part and a small lower part.

[0008] According to an embodiment provided by the present application, the first elastic buffer layer and the sensor support are in an embedded structure, a cross-linked structure or a glued structure.

[0009] According to an embodiment provided by the present application, the sensing layer module comprises a flexible insulating substrate and a flexible tactile sensing layer formed on the flexible insulating substrate.

[0010] According to an embodiment provided by the present application, the sensing layer module further comprises a support plate arranged on the flexible insulating substrate away from the flexible tactile sensing layer; the support plate is attached to the back of the flexible insulating substrate.

[0011] According to an embodiment provided by the present application, the first elastic buffer layer has a second positioning portion, and the support plate of the sensing layer module is located in the second positioning portion.

[0012] According to an embodiment provided by the present application, the sensing layer module further comprises a reinforcing plate arranged on the flexible insulating substrate, the sensor support has a first positioning portion, and the sensing layer module is installed in the first positioning portion through the reinforcing plate.

[0013] According to an embodiment provided by the present application, the sensing layer module further comprises an FPC wiring portion formed on the flexible insulating substrate; the sensor support and / or the first elastic buffer layer is provided with a penetrating portion, and the sensing layer module at the FPC wiring portion penetrates through the penetrating portion and forms a bending structure at the penetrating portion.

[0014] According to an embodiment provided by the present application, the flexible tactile sensor comprises a flexible skin layer located on the sensing layer module.

[0015] According to an embodiment provided by the present application, the flexible tactile sensor further comprises an encapsulation structure; the encapsulation structure comprises at least one of the following:

[0016] a first encapsulation film layer covering the sensing layer module;

[0017] a glue structure or a cross-linking structure between the sensing layer module and the flexible skin layer;

[0018] a glue structure or a cross-linking structure between the sensing layer module and the sensor support;

[0019] a second encapsulation layer at the pad of the sensing layer module.

[0020] According to an embodiment provided by the present application, the flexible skin layer comprises a flexible tactile contact layer and a second elastic buffer layer located below the flexible tactile contact layer; part of the sensing layer module is located between the second elastic buffer layer and the first elastic buffer layer.

[0021] According to an embodiment provided by the present application, the second elastic buffer layer has a plurality of second micropores.

[0022] According to an embodiment provided in the present application, the second micropores are second microneedle hole structures arranged at intervals; or the second elastic buffer layer comprises a plurality of micropore layers arranged in layers, and the micropore layers are provided with a plurality of second micropores arranged in an array structure.

[0023] According to an embodiment provided in the present application, the flexible tactile contact layer and the second elastic buffer layer are formed as an integrated structure.

[0024] The present application also provides a mechanical hand comprising the flexible tactile sensor.

[0025] The present application has the following advantages:

[0026] The flexible tactile sensor has the advantages of high adaptability and high sensitivity.

[0027] The flexible tactile sensor can detect and perceive the contact with an object, and is particularly suitable for the surface of a mechanical hand; the surface of the flexible tactile sensor is beneficial to be designed as a curved surface structure, and the curvature can be customized.

[0028] The first elastic buffer layer of the flexible tactile sensor has a plurality of first micropores, has a deformation avoidance space when deformed, has excellent resilience, and can further increase the range of sensing response of the flexible tactile sensor.

[0029] The flexible skin layer of the flexible tactile sensor comprises the flexible tactile contact layer and the second elastic buffer layer, and has good softness and elasticity, and can have a deep and complex concave shape when in contact with an object; when the flexible tactile sensor is used in a mechanical hand, the flexible skin layer can be in full contact with an object during the operation of the mechanical hand, and can adapt to the shape of the object; the second elastic buffer layer has good concave and rebound performance, and is beneficial to avoid interference stress caused by the drift of the stress point when pressed from the outside.

[0030] The second elastic buffer layer and the first elastic buffer layer are arranged on the upper and lower sides of the sensing layer module respectively, forming a sandwich structure, and the second elastic buffer layer and the first elastic buffer layer simultaneously play the role of elastic buffering.

[0031] The support plate is arranged on the side of the flexible insulating substrate away from the flexible tactile sensing layer, which not only realizes the accurate positioning of the sensing layer module, but also prevents the interference stress caused by the concave deformation of the flexible tactile sensing layer due to uneven installation, thereby prolonging the service life of the flexible tactile sensing layer. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0033] Figure 1 A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1.

[0034] Figure 2 A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1. Figure 1

[0035] Figure 3 A structural schematic diagram of a first elastic buffer layer and a sensor support of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 2.

[0036] Figure 4 A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1. Figure 3

[0037] A schematic diagram of a sensing layer module provided by an embodiment of the present application is shown in FIG. 3. Figure 5

[0038] A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1. Figure 6

[0039] A schematic diagram of a second elastic buffer layer provided by an embodiment of the present application is shown in FIG. 4. Figure 7

[0040] A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1. Figure 8 Figure 7 A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1.

[0041] Figure 9 Figure 8 A partial structural schematic diagram of a flexible tactile sensor provided by an embodiment of the present application is shown in FIG. 1.

[0042] Figure 10 A schematic diagram of a finger unit of a mechanical hand provided by an embodiment of the present application is shown in FIG. 5.

[0043] In the drawings, various reference signs represent:

[0044] ​​​The sensor support (10), the first elastic buffer layer (20), the induction layer module (30), the insertion part (11), the first positioning part (13), the third positioning part (12), the second positioning part (21), the first micropore (22), the flexible tactile induction layer (31), the support plate (32), the reinforcing plate (33), the PCB circuit board (34), the bending structure (35), the flexible skin layer (40), the flexible tactile contact layer (41), the second elastic buffer layer (42), the second micropore (421), the knuckle body (50). DETAILED DESCRIPTION

[0045] In order to make the technical problems to be solved by the present application, the technical solutions and beneficial effects clearer, the present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0047] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0048] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0049] Please refer to Figures 1-10 , now a flexible tactile sensor and a robot hand comprising the flexible tactile sensor provided by the present application will be described.

[0050] Embodiment one

[0051] As Figures 1-9 shown is a flexible tactile sensor provided by the embodiment of the present application.

[0052] The flexible tactile sensor comprises a sensing layer module (30) and a sensor support (10). The sensing layer module (30) comprises a flexible tactile sensing layer (31).

[0053] The flexible tactile sensor further comprises a first elastic buffer layer (20) disposed on the sensor support (10). The sensing layer module (30) is mounted on the first elastic buffer layer (20) and the sensor support (10). The first elastic buffer layer (20) is located between the sensing layer module (30) and the sensor support (10). The first elastic buffer layer (20) is used to protect the flexible tactile sensing layer (31).

[0054] The first elastic buffer layer (20) has an elastic buffering function. The first elastic buffer layer (20) can be a flexible structure formed of a high polymer material. The material of the first elastic buffer layer (20) can preferably be a soft organic silicone glue, ethylene propylene diene rubber (EPDM), or thermoplastic polyurethane elastomer (TPU), or the like. The first elastic buffer layer (20) can also be other materials having an elastic buffering function.

[0055] Preferably, the first elastic buffer layer (20) has a plurality of first micropores (22). The first micropores (22) on the first elastic buffer layer (20) make the first elastic buffer layer (20) have excellent resilience and have a deformation avoidance space when deformed. In addition, the range of the sensing response of the flexible tactile sensor can be increased.

[0056] Further preferably, the first micropores (22) are preferably first micropin structures. The upper openings of the first micropins are disposed towards the flexible tactile sensing layer (31) of the sensing layer module (30).

[0057] The axis of the first micropin can be perpendicular or substantially perpendicular to the flexible tactile sensing layer (31). The axis of the first micropin can also be inclined, or the axes of a plurality of first micropins can be crosswise disposed.

[0058] In a preferred embodiment, the axis of the first microneedle hole can be perpendicular or substantially perpendicular to the flexible tactile sensing layer (31). The axis of the first microneedle hole can be considered substantially perpendicular to the flexible tactile sensing layer (31) when the angle between the axis of the first microneedle hole and the flexible tactile sensing layer (31) is between 60° and 120°. The cross section of the first microneedle hole is conical with the upper part larger than the lower part. The conical first microneedle hole can deform straight down like a conical spring when pressed vertically, which is beneficial to ensure the deformation direction and regular internal stress decomposition of the first elastic buffer layer (20) during deformation. Under the condition of ensuring the sensitivity of the flexible tactile sensor, the first microneedle hole can avoid the external applied force being transmitted to the flexible tactile sensing layer (31) as local stress. Preferably, the plurality of first microneedle holes of the first elastic buffer layer (20) can be arranged in an array structure.

[0059] The first elastic buffer layer (20) is arranged on the sensor support (10), and preferably, the first elastic buffer layer (20) and the sensor support (10) are combined into an integrated structure. In an embodiment, the first elastic buffer layer (20) is embedded in the sensor support (10) to form an embedded structure between the sensor support (10); or the first elastic buffer layer (20) and the sensor support (10) form a cross-linking structure; or the first elastic buffer layer (20) and the sensor support (10) are a glued structure.

[0060] The integrated structure between the elastic buffer layer and the sensor support (10) can avoid the first elastic buffer layer (20) from sliding or moving under stress and affecting the sensing of the flexible tactile sensor.

[0061] Preferably, the first elastic buffer layer (20) can be prepared on the sensor support (10) by a mold secondary forming injection molding process or a 3D printing process, so that the first elastic buffer layer (20) and the sensor support (10) form an embedded structure. As shown in Figure 2 The first elastic buffer layer (20) includes a microporous region in the middle and an embedded structure at the periphery for combining with the sensor support (10).

[0062] The sensing layer module (30) includes a flexible insulating substrate and a flexible tactile sensing layer (31) formed on the flexible insulating substrate. In a specific embodiment, the flexible tactile sensing layer (31) is in the form of a film. The flexible tactile sensing layer (31) includes an electrode layer and a pressure-sensitive layer. The flexible tactile sensing layer (31) can include a plurality of flexible sensing units.

[0063] In one embodiment, the flexible insulating substrate can be insulating cloth, flexible insulating plastic such as PI, PET, or can also be insulating rubber. The electrode layer is formed on the flexible insulating substrate. The electrode layer is a flexible structure; the electrode layer can be a conductive pattern attached to the flexible substrate. The electrode layer can be formed by printed circuit or printed circuit. The electrode layer can specifically include a first electrode and a second electrode.

[0064] The pressure-sensitive layer can have both conductivity and good pressure-sensitive properties. In one specific application embodiment, the pressure-sensitive layer, for example, is a porous structure pressure-sensitive film or a pressure-sensitive pattern, which can be filled or adsorbed with conductive material in the elastic porous structure; the conductive material can be any one or a mixture of multiple of carbon nanotubes, carbon fibers, conductive graphite, graphene, gold powder, silver powder, nickel powder, ferroferric oxide, inorganic nanoparticles, and indium tin oxide. Alternatively, in another specific application embodiment, the pressure-sensitive layer can also be formed by dispensing printing of a composite material with conductivity and pressure-sensitive properties. The pressure-sensitive layer as a mechanical sensing unit can be in contact with the first electrode and the second electrode to form a conduction path. After the pressure-sensitive layer is pressed and elastically deformed, the resistance value changes, and the change in resistance value can be detected and used to characterize the force received by the tactile sensor; therefore, the flexible sensing module can detect mechanical signals.

[0065] The sensing layer module (30) can be fixedly installed on the first elastic buffer layer (20) and the sensor support (10).

[0066] The sensing layer module (30) provided by the embodiments of the present application further includes a support plate (32), which is arranged on the flexible insulating substrate away from one side of the flexible tactile sensing layer (31), and the support plate (32) is attached to the back of the flexible insulating substrate. The first elastic buffer layer (20) is located between the support plate (32) and the sensor support (10). The material of the support plate (32) is not limited, and in one specific embodiment, stainless steel sheet or FR4 sheet can be used. The body of the flexible tactile sensing layer (31) is not resistant to tearing and is easy to break. By attaching the flexible tactile sensing layer (31) to the support plate (32), such as a stainless steel support sheet, the hardness and flatness of the support plate (32) can not only achieve accurate positioning of the sensing layer module (30), but also prevent the flexible tactile sensing layer (31) from generating interference stress due to uneven installation, and improve the service life of the flexible tactile sensing layer (31). The first elastic buffer layer (20) can have a second positioning portion (21) such as a positioning groove, and the support plate (32) of the sensing layer module (30) is located in the second positioning portion (21).

[0067] The sensing layer module (30) further comprises at least one reinforcing plate (33) disposed on the flexible insulating substrate, which can be disposed on one side or the periphery of the flexible tactile sensing layer (31). The reinforcing plate (33) is used for mounting and fixing the sensing layer module (30). The sensor support (10) has a first positioning portion (13), and the sensing layer module (30) can be fixedly mounted on the first positioning portion (13) through the reinforcing plate (33). The material of the reinforcing plate (33) is not limited. In a more specific embodiment, the first positioning portion (13) of the sensor support (10) comprises but is not limited to a positioning protruding structure, and the reinforcing plate (33) of the sensing layer module (30) can be mounted on the first positioning portion (13) of the sensor support (10) through a positioning hole.

[0068] The sensing layer module (30) further comprises an FPC wiring portion formed on the flexible insulating substrate. The first end of the FPC wiring portion is electrically connected with the flexible tactile sensing layer (31). The second end of the FPC wiring portion can be directly connected with an external circuit.

[0069] Alternatively, as a preferred solution, the sensing layer module (30) can further comprise a PCB circuit board (34), and the second end of the FPC wiring portion can be connected with the PCB circuit board (34). The PCB circuit board (34) can be electrically connected with the outside.

[0070] When the sensing layer module (30) is connected with an external circuit, a packaging structure can be disposed at the pad of the electrical connection position of the sensing layer module (30) to form a second packaging layer.

[0071] A penetrating portion (11) can be disposed on the sensor support (10) and / or the first elastic buffer layer (20), and when the sensing layer module (30) is mounted, the sensing layer module (30) at the FPC wiring portion can penetrate through the penetrating portion (11) and form a bending structure (35) at the penetrating portion (11).

[0072] When the sensing layer module (30) further comprises a PCB circuit board (34), the PCB circuit board (34) can be a hard plate structure. The sensor support (10) has a third positioning portion (12) on the back surface, and the PCB circuit board (34) can be mounted on the third positioning portion (12) through a positioning structure. In a more specific embodiment, the third positioning portion (12) of the sensor support (10) comprises but is not limited to a positioning protruding structure. The positioning structure of the PCB circuit board (34) comprises but is not limited to a positioning hole.

[0073] In one embodiment, the PCB circuit board (34) and the reinforcing plate (33) can be respectively located at two ends of the sensing layer module (30); or in other embodiments, the PCB circuit board (34) and the reinforcing plate (33) can be respectively located at different positions of the sensing layer module (30).

[0074] The flexible tactile sensor can further comprise a flexible skin layer (40). The flexible skin layer (40) is located on the sensing layer module (30).

[0075] The flexible tactile sensor further comprises a packaging structure for sealing the sensing layer module (30). The packaging structure comprises at least one of the following:

[0076] a first packaging film layer covering the sensing layer module (30);

[0077] a glue structure or a cross-linking structure between the sensing layer module (30) and the flexible skin layer (40);

[0078] a glue structure or a cross-linking structure between the sensing layer module (30) and the sensor support (10);

[0079] a second packaging layer at the bonding pad of the sensing layer module (30).

[0080] In a preferred embodiment, after the sensing layer module (30) is installed on the first elastic buffer layer (20) and the sensor support (10), the sensing layer module (30) can be sealed by a first packaging film layer covering the sensing layer module (30). In one embodiment, the first packaging film layer covers the exposed part of the sensing layer module (30), such as the flexible tactile sensing layer (31), and the position of the first elastic buffer layer (20) adjacent to the sensing layer module (30); or the first packaging film layer covers the sensing layer module (30), the first elastic buffer layer (20) and part of the sensor support (10).

[0081] In one embodiment of the flexible skin layer (40), the flexible skin layer (40) comprises a flexible tactile contact layer (41), and the outer surface of the flexible tactile contact layer (41) can have a friction texture.

[0082] The flexible tactile contact layer (41) can be a flexible structure formed by a high molecular material. The flexible tactile contact layer (41) can preferably use an elastomer such as soft silicone glue, ethylene propylene diene rubber (EPDM), thermoplastic polyurethane elastomer (TPU) or polyurethane (PU).

[0083] The applicant finds that the flexible skin layer (40) only including the flexible tactile contact layer (41) can be relatively soft when the flexible skin layer (40) has a certain thickness, but cannot be completely concave when pressed externally, and the stress point can drift and interference stress can be easily generated.

[0084] As a further preferred solution, in one specific embodiment of the flexible skin layer (40), the flexible skin layer (40) not only includes the flexible tactile contact layer (41), but also includes a second elastic buffer layer (42) located below the flexible tactile contact layer (41). The flexible tactile contact layer (41) and the second elastic buffer layer (42) are stacked and at least partially cover the flexible tactile contact layer (41).

[0085] The second elastic buffer layer (42) plays a role of elastic buffering, and the second elastic buffer layer (42) in the application can be concave and rebound, which is beneficial to avoid interference stress generated by the drift of the stress point when pressed externally; in addition, the flexible skin layer (40) with the second elastic buffer layer (42) is soft and has good elasticity, and can be deeply and complexly concave when in contact with an object, and the flexible skin layer (40) can be fully contacted with the object and adapt to the shape of the object when the flexible tactile sensor is used for a robot hand.

[0086] The second elastic buffer layer (42) can be a flexible structure formed by a high polymer material. The second elastic buffer layer (42) can preferably use a soft silicone gel, ethylene-propylene-diene rubber (EPDM), or thermoplastic polyurethane elastomer (TPU) or other materials such as elastomers. It can be understood that the second elastic buffer layer (42) can also be other materials with elastic buffering function.

[0087] The materials of the flexible tactile contact layer (41) and the second elastic buffer layer (42) can be the same or different, and the hardness of the two can be the same or different.

[0088] Part of the sensing layer module (30) such as the flexible tactile sensing layer (31) is located between the second elastic buffer layer (42) and the first elastic buffer layer (20). Preferably, the thickness of the second elastic buffer layer (42) is preferably greater than that of the flexible tactile contact layer (41).

[0089] Preferably, the second elastic buffer layer (42) has a plurality of second micropores (421).

[0090] The second micropore (421) can provide a deformation avoidance space for the second elastic buffer layer (42) when deformed, and excellent resilience. Compared with the flexible skin layer (40) including only the flexible tactile contact layer (41), the flexible skin layer (40) including the flexible tactile contact layer (41) and the second elastic buffer layer (42) has a structure closer to human skin and is functionally decoupled. The flexible tactile contact layer (41) can play a role of sealing, wear resistance and tear resistance. The second elastic buffer layer (42) simulates the dermis layer of the skin and has higher elasticity and good concave rebound performance compared with the flexible tactile contact layer (41).

[0091] In one embodiment, the second micropore (421) of the second elastic buffer layer (42) can be similar to the microporous structure of a porous sponge, and a plurality of second micropores (421) are irregularly arranged in a porous structure on the second elastic buffer layer (42).

[0092] In another embodiment, a plurality of the second micropores (421) are arranged in a substantially uniform distribution on the second elastic buffer layer (42). In a more specific embodiment, a plurality of the second micropores (421) of the second elastic buffer layer (42) are arranged in a second microneedle hole structure. The second microneedle hole has a certain depth. The second elastic buffer layer (42) can be realized by a mold forming injection molding process, or by a 3D printing process.

[0093] Alternatively, in another embodiment, the second elastic buffer layer (42) can include a plurality of micropore layers arranged in layers, each of the micropore layers having a plurality of second micropores (421) arranged in an array structure. The second micropores (421) on the plurality of micropore layers arranged in layers can be misaligned in the height direction.

[0094] Preferably, the flexible tactile contact layer (41) and the second elastic buffer layer (42) are formed in an integrated structure.

[0095] Specifically, the flexible tactile contact layer (41) and the second elastic buffer layer (42) are in a mosaic structure, a cross-linking structure or a gluing structure.

[0096] The flexible tactile sensor of the present application includes a flexible skin layer (40) including a flexible tactile contact layer (41) and a second elastic buffer layer (42) located below the flexible tactile contact layer (41). The flexible skin layer (40) is soft and has good elasticity, and can have a deep and complex shape when in contact with an object. When the flexible tactile sensor is used for a robot hand, the flexible skin layer (40) can be in full contact with the object and adapt to the shape of the object when the robot hand is working.

[0097] The flexible skin layer (40) of the present application is preferably a curved structure, and the curvature of the flexible skin layer (40) can be designed as customized.

[0098] As a preferred solution, the sensing layer module (30) and the flexible skin layer (40) have a glue structure or a cross-linking structure, which is beneficial to seal the sensing layer module (30) and avoid the interference of the sensing layer module (30) caused by the relative movement between the flexible skin layer (40) and the sensing layer module (30) after the deformation of the flexible skin layer (40) under stress.

[0099] Embodiment two

[0100] The present application also provides a robot hand, which comprises the flexible tactile sensor as described above.

[0101] As shown in Figure 10 The robot hand can comprise a finger unit, and the flexible tactile sensor is arranged on the finger unit. The finger unit comprises a knuckle body (50).

[0102] The sensor support (10) described in the present application can be at least a part of the knuckle body (50); or the sensor support (10) can be fixedly connected with the knuckle body (50) as a separate component, so as to arrange the flexible tactile sensor on the finger unit.

[0103] The robot hand can comprise a palm unit, and the flexible tactile sensor is arranged on the palm unit.

[0104] The present application has the following advantages:

[0105] The flexible tactile sensor of the present application has the advantages of strong adaptability and high sensitivity;

[0106] The flexible tactile sensor can detect and perceive the contact with an object, and is particularly suitable for the surface of a robot hand; the surface of the flexible tactile sensor is beneficial to be designed as a curved structure, and the curvature can be designed as customized.

[0107] The first elastic buffer layer of the flexible tactile sensor has a plurality of first micropores, has a deformation avoidance space when deformed, has excellent resilience, and can further increase the range of sensing response of the flexible tactile sensor.

[0108] The flexible skin layer of the flexible tactile sensor, including the flexible tactile contact layer and the second elastic buffer layer, is soft and has good elasticity, and can be deeply and complexly indented when in contact with an object; when the flexible tactile sensor is used in a robot hand, the flexible skin layer can be fully in contact with an object and adapt to the shape of the object when the robot hand is working; the second elastic buffer layer has good indentation and rebound performance, and is beneficial to avoiding interference stress caused by drift of a stress point when pressed from outside;

[0109] The second elastic buffer layer and the first elastic buffer layer are respectively arranged on the upper and lower sides of the sensing layer module, forming a sandwich structure, and the second elastic buffer layer and the first elastic buffer layer simultaneously play the role of elastic buffering.

[0110] The support plate is arranged on the side of the flexible insulating substrate away from the flexible tactile sensing layer, which not only can realize accurate positioning of the sensing layer module, but also can prevent interference stress caused by indentation and deformation of the flexible tactile sensing layer due to uneven installation, and improve the service life of the flexible tactile sensing layer.

[0111] The above only describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flexible tactile sensor, comprising a sensing layer module, a sensor support; the sensing layer module comprises a flexible tactile sensing layer; characterized in that, The flexible tactile sensor further comprises a first elastic buffer layer, which is arranged on the sensor support; the sensing layer module is arranged on the first elastic buffer layer and the sensor support, and the first elastic buffer layer is located between the sensing layer module and the sensor support.

2. The flexible tactile sensor of claim 1, wherein, The first elastic buffer layer has a plurality of first micropores.

3. The flexible tactile sensor of claim 2, wherein, The first micropores are first microneedle hole structures, and the upper openings of the first microneedle holes are arranged towards the flexible tactile sensing layer of the sensing layer module; the cross section of the first microneedle hole is in a tapered shape with a large upper part and a small lower part.

4. The flexible tactile sensor of claim 1, wherein, The first elastic buffer layer and the sensor support are in an embedded structure, a cross-linked structure or a glued structure.

5. The flexible tactile sensor of claim 1, wherein, The sensing layer module comprises a flexible insulating substrate and a flexible tactile sensing layer formed on the flexible insulating substrate.

6. The flexible tactile sensor of claim 5, wherein, The sensing layer module further comprises a support plate arranged on the flexible insulating substrate on the side away from the flexible tactile sensing layer; the support plate is attached to the back of the flexible insulating substrate.

7. The flexible tactile sensor of claim 6, wherein, The first elastic buffer layer has a second positioning part, and the support plate of the sensing layer module is located in the second positioning part.

8. The flexible tactile sensor of claim 5, wherein, The sensing layer module further comprises a reinforcing plate arranged on the flexible insulating substrate; the sensor support has a first positioning part, and the sensing layer module is arranged in the first positioning part through the reinforcing plate.

9. The flexible tactile sensor of claim 5, wherein, The sensing layer module further comprises an FPC wiring part formed on the flexible insulating substrate; the sensor support and / or the first elastic buffer layer is provided with a penetrating part, and the sensing layer module at the FPC wiring part penetrates through the penetrating part and forms a bending structure at the penetrating part.

10. The flexible tactile sensor of claim 1, wherein, The flexible tactile sensor comprises a flexible skin layer, which is arranged on the sensing layer module.

11. The flexible tactile sensor of claim 10, wherein, The flexible tactile sensor further comprises a packaging structure; the packaging structure comprises at least one of the following: a first packaging film layer covering the sensing layer module; a glued structure or a cross-linked structure between the sensing layer module and the flexible skin layer; a glued structure or a cross-linked structure between the sensing layer module and the sensor support; a second packaging layer at the bonding pad of the sensing layer module.

12. The flexible tactile sensor of claim 10, wherein, The flexible skin layer comprises a flexible tactile contact layer and a second elastic buffer layer located below the flexible tactile contact layer; part of the sensing layer module is located between the second elastic buffer layer and the first elastic buffer layer.

13. The flexible tactile sensor of claim 12, wherein, The second elastic buffer layer has a plurality of second micropores.

14. The flexible tactile sensor of claim 13, wherein, The second micropores are second microneedle hole structures arranged in an interval; or the second elastic buffer layer comprises a plurality of micropore layers arranged in a stack, and the micropore layers have a plurality of second micropores arranged in an array structure.

15. The flexible tactile sensor of claim 12, wherein, The flexible tactile contact layer and the second elastic buffer layer are formed in an integrated structure.

16. A robot, characterized in that The mechanical hand comprises the flexible tactile sensor according to any one of claims 1-15.

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