Multilayer circuit board
By using a split circuit board structure and UV adhesive design, the problem of difficult repair of multi-layer circuit boards is solved, enabling convenient repair of localized damage and saving resources.
Patent Information
- Application Number
- CN202520027766.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-07
AI Technical Summary
Existing multilayer circuit boards are difficult to repair when electronic components are short-circuited or damaged, resulting in the scrapping of the entire circuit board and serious waste of resources.
Design a split circuit board structure that uses a combination of reinforcing plate, mounting plate, separator ring and UV adhesive to allow for individual replacement and repair of electronic components, and ensure circuit connectivity through the curing of UV adhesive.
It enables convenient repair when the circuit board is partially damaged, reduces resource waste, and maintains the overall connectivity and performance of the circuit board.
Smart Images
Figure CN223694062U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, specifically to a multilayer circuit board. Background Technology
[0002] A multilayer circuit board is a highly complex printed circuit board (PCB) consisting of three or more conductive layers that are isolated from each other by insulating material (prepreg). By stacking multiple layers, more circuitry can be accommodated in a smaller space, reducing the number of components and connectors, which helps to reduce overall weight and provide better electrical performance, including lower impedance and higher frequency response. Due to these advantages, multilayer circuit boards play a vital role in the design and manufacture of modern electronic products.
[0003] However, when using current multilayer circuit boards, the circuit boards are bonded together at high temperatures, and the electronic components are installed on the circuit boards by soldering. If an electronic component is damaged by high temperature due to a short circuit or other circuit failure, replacing the electronic component may affect the continued use of the circuit board, reduce the circuit board's performance, and in severe cases, cause the circuit board to be scrapped, requiring the replacement of the entire circuit board, which increases resource consumption.
[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content
[0005] The purpose of this invention is to provide a multilayer circuit board to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: It includes a circuit board substrate one, a reinforcing plate connected to the bottom end of the circuit board substrate one, a circuit board substrate two connected to the bottom end of the reinforcing plate, a mounting area plate on one side of both the circuit board substrate one and the circuit board substrate two, a through hole on one side of the reinforcing plate, a mounting ring connected to the inner side of the through hole, a separator ring connected to the inner side of the mounting ring, a protective layer adhered to both sides of the reinforcing plate, and an insulating plate connected to the other side of the protective layer.
[0007] Preferably, the mounting area board has a semi-circular hole on the side close to the circuit board substrate one and the circuit board substrate two, and the semi-circular hole and the inner side of the partition ring are connected by the same copper cladding layer.
[0008] Preferably, the space between the through hole and the spacer ring is filled with UV adhesive.
[0009] Preferably, the circuit board substrate one, the circuit board substrate two and the mounting area plate surface are coated with an insulating coating, and are provided with printed circuits, one end of the printed circuits being connected with the copper clad layer.
[0010] Preferably, the UV glue solution is mixed with conductive particles.
[0011] Preferably, the mounting area plate has multiple groups and is distributed on one side of the corresponding circuit board substrate one and the circuit board substrate two.
[0012] In summary, the present application has the following beneficial technical effects:
[0013] Through the split type arrangement between the mounting area plate and the circuit board substrate one and the circuit board substrate two, the damaged part of the circuit board can be removed, replaced and repaired, so as to reduce the loss of resources, the separation ring and the protective layer in the reinforcing plate can pre-store the UV glue solution in the circuit board, without affecting the application effect, and through the arrangement of the UV glue solution, the power-on effect and the overall connectivity of the repaired circuit board can be ensured. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the multilayer circuit board of the present application;
[0015] Figure 2 It is a schematic diagram of the side sectional structure of the multilayer circuit board of the present application;
[0016] Figure 3 It is Figure 2 It is a schematic diagram of the enlarged structure of part A.
[0017] In the figure: 1, circuit board substrate one; 11, insulating coating; 12, printed circuit; 13, copper clad layer; 2, reinforcing plate; 21, mounting ring; 22, separation ring; 23, protective layer; 24, UV glue solution; 25, insulating plate; 3, circuit board substrate two; 4, mounting area plate. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0019] Please refer to Figures 1-3The utility model provides a technical scheme: including circuit board substrate one 1, the bottom end connection setting reinforcing plate 2 of circuit board substrate one 1, the bottom end connection setting has circuit board substrate two 3 of reinforcing plate 2, and one side of circuit board substrate one 1 and circuit board substrate two 3 is equipped with installation area board 4 to form the whole of circuit board, and installation area board 4 is embedded in corresponding circuit board substrate one 1 and circuit board substrate two 3, and reinforcing plate 2 one side is provided with through -hole, and through -hole inner side connection is provided with mounting ring 21, and mounting ring 21 inner side connection is provided with partition ring 22, and reinforcing plate 2 both sides are all adhesively provided with protective layer 23, and protective layer 23 other side connection is provided with insulating plate 25.
[0020] Referring to Figure 3 As shown in the figure, the mounting area board 4 and the circuit board substrate one 1 and the circuit board substrate two 3 close one side are all provided with semicircular holes, and the semicircular holes are butted and form a circular hole, and the copper-clad layer 13 is arranged in the combined circular hole and the inner side of the partition ring 22.
[0021] Referring to Figure 3 As shown in the figure, a storage cavity is formed between the through hole and the partition ring 22 due to the plugging of the protective layer 23, and the UV glue liquid 24 is filled in the storage cavity, and the UV glue liquid 24 is mixed with conductive particles, so that the UV glue liquid 24 has conductivity, wherein the partition ring 22 can be selected from one of the existing materials of quartz glass or organic glass, or other high-temperature-resistant and high-hardness materials, so as to facilitate the release of the UV glue liquid 24 after damage.
[0022] Referring to Figure 3 As shown in the figure, the surfaces of the circuit board substrate one 1, the circuit board substrate two 3 and the installation area board 4 are coated with an insulating coating 11, and are provided with a printed circuit 12, one end of the printed circuit 12 is connected with the copper-clad layer 13, so as to form a circuit for use.
[0023] Referring to Figure 1 And Figure 2 As shown in the figure, the mounting area board 4 has multiple groups and is distributed on one side of the corresponding circuit board substrate one 1 and the circuit board substrate two 3, so as to facilitate the installation of electronic components on one side of the circuit board substrate one 1 and the circuit board substrate two 3 according to needs, and the 13 is filled with resin, and both ends are connected with a conductive cover plate, which is an existing mature technology, so it is not described in the specification, and the electronic components can be directly welded with the conductive cover plate for power supply.
[0024] The implementation principle of the application is that when the electronic element on the corresponding installation area plate 4 is damaged, the electronic element can be directly replaced, if the corresponding installation area plate 4 is also damaged, the electronic element can be taken down and then the installation area plate 4 is taken down, wherein the installation area plate 4 can be removed by polishing, and then a new installation area plate 4 is buckled in the polished groove, the corresponding position of the separation ring 22 is taken out before the installation area plate 4 is installed, and the inside UV glue 24 can be removed or broken, the UV glue 24 fills the semicircular hole between the newly installed installation area plate 4 and the circuit board substrate one 1 or the circuit board substrate two 3, and the gap between the installation area plate 4 and the circuit board substrate one 1 or the circuit board substrate two 3 is filled, and is connected with the corresponding printed circuit 12, so that the circuit is connected, then the UV glue 24 is solidified by using the ultraviolet lamp, and the replacement is completed.
[0025] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0026] Although the embodiments of the present application have been shown and described, it is to be understood that for the purpose of the present application, the embodiments change, modify, replace and vary in many ways without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A multilayer circuit board comprising a circuit board substrate one (1), characterized by: The bottom end of the circuit board substrate one (1) is connected with a reinforcing plate (2), the bottom end of the reinforcing plate (2) is connected with a circuit board substrate two (3), one side of the circuit board substrate one (1) and the circuit board substrate two (3) is provided with a mounting area plate (4), one side of the reinforcing plate (2) is provided with a through hole, and the inner side of the through hole is connected with a mounting ring (21), the inner side of the mounting ring (21) is connected with a separation ring (22), the two surfaces of the reinforcing plate (2) are connected with a protective layer (23), and the other side of the protective layer (23) is connected with an insulating plate (25).
2. A multi-layered circuit board according to claim 1, wherein: The mounting area plate (4) is provided with a semicircular hole on the side close to the circuit board substrate one (1) and the circuit board substrate two (3), and the inner side of the semicircular hole and the separation ring (22) is connected with the same copper clad layer (13).
3. A multi-layer circuit board according to claim 2, wherein: The through hole and the separation ring (22) are filled with UV glue (24).
4. A multi-layered circuit board according to claim 3, wherein: The surfaces of the circuit board substrate one (1), the circuit board substrate two (3) and the mounting area plate (4) are coated with an insulating coating (11), and are provided with a printed circuit (12), one end of the printed circuit (12) is connected with the copper clad layer (13).
5. A multi-layer circuit board as claimed in claim 4, characterized in that: The UV glue (24) is mixed with conductive particles.
6. The multilayer circuit board of claim 1, wherein: The mounting area plate (4) has multiple groups and is distributed on one side of the corresponding circuit board substrate one (1) and the circuit board substrate two (3).