Stamping die for trimming of lead frame

Abstract

The utility model relates to the technical field of stamping dies, and discloses a stamping die for lead frame rib cutting, which comprises a lower die plate and an upper die plate, the bottom of the lower die plate is fixedly connected with an absorption hopper, the bottom of the absorption hopper is connected with a conveying component in a penetrating manner, a cooling pipe is sleeved in the upper die plate, and the cooling pipe is connected with the lower die plate in a penetrating manner. And one end of the cooling pipe is connected with a cooling assembly in a penetrating mode, a groove is formed in the top of the lower die plate, a stamping die plate is fixedly connected to the bottom of the upper die plate, cutting blocks are fixedly connected to the two sides of the bottom of the upper die plate, and the conveying assembly comprises a connecting pipe connected to the bottom of the absorption hopper in a penetrating mode. According to the stamping die for lead frame rib cutting, through the arrangement of the conveying assembly, the effect of absorbing and treating sweeps is achieved, the situation that in the lead frame stamping process, the sweeps are adsorbed or blocked on a lead frame, the stamping precision is reduced is prevented, and the production quality of the stamping die for lead frame rib cutting is improved.

Description

Technical Field

[0001] This utility model relates to the field of stamping die technology, and in particular to a stamping die for cutting lead wire frame reinforcement. Background Technology

[0002] Leadframes are commonly used in electronic products, such as circuit boards, batteries, and connectors. Their main functions are to provide support, conductivity, and other electrical connections. Stamping dies are used to process metal materials into leadframes of specific shapes and sizes, and simultaneously perform rib cutting (i.e., rib trimming) operations. Leadframe rib cutting stamping dies are specialized dies used to manufacture leadframes (typically the support structures used to connect electrical components in electronic products) and cut ribs. They use stamping processes to cut, shape, and trim metal materials (such as copper, aluminum, and steel) to produce various leadframes with ribs.

[0003] In actual use, the existing stamping dies for cutting lead frame tendons are prone to excessive heat on the surface of the stamping die due to prolonged stamping, which can cause metal fatigue and reduce the service life of the stamping die.

[0004] A search of existing patents revealed a stamping die for lead frame production (Publication No.: CN213671406U), comprising a support block, a conveying assembly, a first support column, and a die assembly. A second motor is fixedly connected to the center of the bottom of the inner wall of the support block, and the die assembly is fixedly connected to the center of the bottom of the support block. The bottom side of the support block is fixedly connected to the top of the first support column, and a pad is fixedly connected to the bottom of the first support column. A conveying assembly is placed between the first support columns, and second support columns are fixedly connected to both sides of the front side of the conveying assembly. A collection box is placed at the lower part of one side of the second support column, and a pad is fixedly connected to the upper part of one side of the second support column. This invention solves the problems of overly cumbersome processing steps in existing stamping dies, the risk of workers' hands being pinched during operation, and the overly cumbersome installation and disassembly steps when changing dies.

[0005] While the aforementioned patent solves the problems of overly cumbersome processing steps in existing stamping dies, the risk of workers' hands getting caught during operation, and the cumbersome installation and disassembly steps when changing dies, the problem remains that waste chips are easily attracted to or blocked on the lead frame during the stamping process, reducing stamping accuracy.

[0006] Therefore, it is necessary to invent a stamping die for cutting lead wire frames to solve the above problems. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] The purpose of this invention is to provide a stamping die for cutting lead wire frames, which solves the problem mentioned in the background art that waste chips are easily adsorbed or blocked on the lead wire frame during the stamping process, reducing the stamping accuracy.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: a stamping die for cutting lead wire frames, comprising a lower die and an upper die. An absorption hopper is fixedly connected to the bottom of the lower die, and a conveying assembly is connected through the bottom of the absorption hopper. A cooling pipe is sleeved inside the upper die, and a cooling assembly is connected through one end of the cooling pipe. A groove is provided at the top of the lower die, and a stamping die is fixedly connected to the bottom of the upper die. Cutting blocks are fixedly connected to both sides of the bottom of the upper die. The conveying assembly includes a connecting pipe that extends through the bottom of the absorption hopper, and a negative pressure pump is connected through one end of the connecting pipe. A collection box is connected through the output end of the negative pressure pump. The cooling assembly includes a conveying pump that extends through one end of the cooling pipe, and a water tank is connected through the input end of the conveying pump. A semiconductor cooling chip is fixedly connected to the front of the water tank, and several sets of heat sinks are fixedly connected to the front of the semiconductor cooling chip.

[0011] As a further embodiment of this utility model, a protective shell is fixedly connected to the surface of the water tank, and a cooling fan is fitted onto the front of the protective shell to facilitate the dissipation of heat from inside the protective shell.

[0012] As a further embodiment of this utility model, support plates are fixedly connected to both sides of the protective shell. Threaded holes are opened on the surfaces of the support plates and the upper template. Threaded bolts pass through the interior of the threaded holes, and the threaded bolts facilitate the connection between the support plates and the upper template.

[0013] As a further embodiment of this utility model, the inside of the collection box is slidably connected to a drawer, and the front of the drawer is fixedly connected to a handle, which facilitates pulling the drawer.

[0014] As a further embodiment of this utility model, a lower mold base is fixedly connected to the bottom of the lower mold template, and four sets of positioning columns are fixedly connected to the top of the lower mold base in a rectangular array, which facilitates support and positioning.

[0015] As a further embodiment of this utility model, a telescopic spring is sleeved on the top surface of the positioning post, and a positioning sleeve is slidably connected to the top of the positioning post, which facilitates sliding on the surface of the positioning post.

[0016] As a further embodiment of this utility model, the top of the positioning sleeve is fitted with an upper mold base, and the bottom of the upper mold base is fixedly connected with a fixing plate. The fixing plate is fixedly connected to the top of the upper template, and the fixing plate facilitates the connection of the upper template.

[0017] (III) Beneficial Effects

[0018] This utility model provides a stamping die for cutting lead wire frame tendons, which has the following advantages:

[0019] 1. This lead frame cutting die, through the setting of the conveying component, when the die is pressed down to cut, the waste generated by the lead frame cutting falls into the groove of the lower template. Then, the negative pressure pump is activated to extract the air inside the absorption hopper, thereby generating suction to suck the waste along the edge of the groove and transport it to the collection box. After a period of time, the drawer is pulled to periodically process the waste, thereby achieving the effect of absorbing and processing the waste. This prevents the waste from adhering to or blocking the lead frame during the lead frame cutting process, reducing the stamping accuracy and improving the production quality of the lead frame cutting die.

[0020] 2. The stamping die for cutting the lead frame utilizes a cooling system. During prolonged stamping, the stamping die and the cutter generate heat, which is transferred through the upper die to the internal cooling pipes. The coolant in the cooling pipes absorbs the heat, and a pump then delivers the heated coolant to the water tank. A semiconductor cooling chip is activated to cool the water tank. The hot surface of the semiconductor cooling chip increases the heat dissipation area through heat sinks, and the heat is exhausted into the protective shell by a cooling fan. This effectively cools the stamping die and the cutter, preventing excessive heat from prolonged stamping that could cause metal fatigue and reduce the lifespan of the stamping die. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the disassembled structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the protective shell and cooling fan structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the conveying component structure of this utility model;

[0025] Figure 5 This is a schematic diagram of the cooling component structure of this utility model.

[0026] In the diagram: 1. Lower template; 2. Upper template; 3. Absorption hopper; 4. Conveying assembly; 401. Connecting pipe; 402. Negative pressure pump; 403. Collection box; 5. Cooling pipe; 6. Cooling assembly; 601. Conveying pump; 602. Water tank; 603. Semiconductor cooling chip; 604. Heat sink; 7. Stamping template; 8. Cutting block; 9. Protective shell; 10. Cooling fan; 11. Support plate; 12. Threaded bolt; 13. Drawer; 14. Handle; 15. Lower mold base; 16. Positioning post; 17. Telescopic spring; 18. Positioning sleeve; 19. Upper mold base; 20. Fixing plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0028] Please see Figures 1 to 5 This utility model provides a technical solution: a stamping die for cutting lead frame reinforcing bars, including a lower die 1 and an upper die 2. An absorption hopper 3 is fixedly connected to the bottom of the lower die 1, and a conveying assembly 4 is connected through the bottom of the absorption hopper 3. The conveying assembly 4 absorbs and processes waste material, preventing it from adsorbing or blocking the lead frame during stamping, thus reducing stamping accuracy and improving the production quality of the stamping die. A cooling pipe 5 is fitted inside the upper die 2, and a cooling assembly 6 is connected through one end of the cooling pipe 5. The cooling assembly 6 cools the stamping die 7 and the cutting block 8, preventing them from overheating during prolonged stamping. Excessive height causes metal fatigue and reduces the service life of the stamping die. The top of the lower template 1 is provided with a groove. The bottom of the upper template 2 is fixedly connected to the stamping template 7. Both sides of the bottom of the upper template 2 are fixedly connected to the cutting blocks 8. The conveying component 4 includes a connecting pipe 401 that passes through the bottom of the absorption hopper 3. One end of the connecting pipe 401 is connected to a negative pressure pump 402. The output end of the negative pressure pump 402 is connected to a collection box 403. The cooling component 6 includes a conveying pump 601 that passes through one end of the cooling pipe 5. The input end of the conveying pump 601 is connected to a water tank 602. The front of the water tank 602 is fixedly connected to a semiconductor cooling chip 603. The front of the semiconductor cooling chip 603 is fixedly connected to several sets of heat sinks 604.

[0029] A protective shell 9 is fixedly connected to the surface of the water tank 602. A cooling fan 10 is fitted onto the front of the protective shell 9. The cooling fan 10 is used to dissipate heat from inside the protective shell 9.

[0030] Support plates 11 are fixedly connected to both sides of the protective shell 9. Threaded holes are opened on the surface of both the support plates 11 and the upper template 2. Threaded bolts 12 pass through the inside of the threaded holes. The threaded bolts 12 serve to connect the support plates 11 and the upper template 2.

[0031] The collection box 403 has a drawer 13 that slides inside. A handle 14 is fixedly connected to the front of the drawer 13. The handle 14 is used to pull the drawer 13.

[0032] The bottom of the lower template 1 is fixedly connected to the lower mold base 15, and the top of the lower mold base 15 is fixedly connected to four sets of positioning columns 16 in a rectangular array. The positioning columns 16 serve to support and position the components.

[0033] A telescopic spring 17 is sleeved on the top surface of the positioning post 16, and a positioning sleeve 18 is slidably connected to the top of the positioning post 16. The positioning sleeve 18 serves to slide on the surface of the positioning post 16.

[0034] The top of the positioning sleeve 18 is fitted with an upper mold base 19, and the bottom of the upper mold base 19 is fixedly connected with a fixing plate 20. The fixing plate 20 is fixedly connected to the top of the upper template 2. The fixing plate 20 serves to connect the upper template 2.

[0035] In this invention, the working steps of the device are as follows:

[0036] First step: When the stamping die is pressing down and punching, the waste generated by the stamping of the lead frame falls into the groove of the lower template 1, and then the negative pressure pump 402 is started to extract the air inside the absorption bucket 3, thereby generating suction to suck the waste along the edge of the groove and transport it to the collection box 403. After a period of time, the drawer 13 is pulled to periodically process the waste.

[0037] The second step: During the long-term stamping process, the stamping template 7 and the cutting block 8 will generate heat. The heat is transferred to the internal cooling pipe 5 through the upper template 2. The heat is absorbed by the coolant in the cooling pipe 5, and then the coolant carrying the heat is transported to the water tank 602 by the delivery pump 601.

[0038] The third step involves activating the semiconductor cooling chip 603 to cool the water tank 602. The hot surface of the semiconductor cooling chip 603 increases the heat dissipation area through the heat sink 604 and is discharged into the protective shell 9 through the cooling fan 10.

[0039] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0040] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stamping die for cutting lead wire frame reinforcing bars, comprising a lower die (1) and an upper die (2), characterized in that: The bottom of the lower template (1) is fixedly connected to an absorption hopper (3), and the bottom of the absorption hopper (3) is connected through a conveying assembly (4). The upper template (2) is fitted with a cooling pipe (5), and one end of the cooling pipe (5) is connected through a cooling assembly (6). The top of the lower template (1) is provided with a groove. The bottom of the upper template (2) is fixedly connected to a stamping template (7). Both sides of the bottom of the upper template (2) are fixedly connected to cutting blocks (8). The conveying assembly (4) includes a connecting pipe (401) that is connected to the bottom of the absorption hopper (3), one end of the connecting pipe (401) is connected to a negative pressure pump (402), and the output end of the negative pressure pump (402) is connected to a collection box (403). The cooling assembly (6) includes a delivery pump (601) that is connected to one end of the cooling pipe (5). The input end of the delivery pump (601) is connected to a water tank (602). A semiconductor cooling chip (603) is fixedly connected to the front of the water tank (602). Several sets of heat sinks (604) are fixedly connected to the front of the semiconductor cooling chip (603).

2. The stamping die for cutting lead wire frames according to claim 1, characterized in that: A protective shell (9) is fixedly connected to the surface of the water tank (602), and a cooling fan (10) is fitted onto the front of the protective shell (9).

3. The stamping die for cutting lead wire frames according to claim 2, characterized in that: Both sides of the protective shell (9) are fixedly connected to support plates (11). The surfaces of the support plates (11) and the upper template (2) are provided with threaded holes, and threaded bolts (12) pass through the inside of the threaded holes.

4. The stamping die for cutting lead wire frames according to claim 1, characterized in that: The collection box (403) has a drawer (13) slidably connected inside, and a handle (14) is fixedly connected to the front of the drawer (13).

5. A stamping die for cutting lead wire frames according to claim 1, characterized in that: The bottom of the lower template (1) is fixedly connected to a lower mold base (15), and the top of the lower mold base (15) is fixedly connected to four sets of positioning columns (16) in a rectangular array.

6. A stamping die for cutting lead wire frames according to claim 5, characterized in that: A telescopic spring (17) is sleeved on the top surface of the positioning post (16), and a positioning sleeve (18) is slidably connected to the top of the positioning post (16).

7. A stamping die for cutting lead wire frames according to claim 6, characterized in that: The top of the positioning sleeve (18) is fitted with an upper mold base (19), and the bottom of the upper mold base (19) is fixedly connected with a fixing plate (20), which is fixedly connected to the top of the upper template (2).

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