Capillary structure, vapor chamber and electronic product
By using a capillary mesh formed by tightly arranged multiple bundles of filaments and a multi-layer stacked design, the problem of high thermal resistance in existing capillary structures is solved, achieving efficient heat management and heat dissipation capabilities, making it suitable for high-performance computing and high-density power electronic devices.
Patent Information
- Application Number
- CN202422926418.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Existing capillary structures have high thermal resistance, and the complexity and limitations of conventional capillary networks result in insufficient heat transfer channels, affecting the effective distribution of heat and making it difficult to meet the thermal management requirements of high-performance computing and high-density power electronic devices.
A capillary network is formed by tightly arranged multiple bundles of filaments, creating countless tiny, dense channels that significantly increase the density of the capillary channels. By carefully controlling the spacing between the filaments, the number of capillary channels increases exponentially, enhancing the liquid transfer and dispersion capabilities. Combined with a multi-layer stacked design and a seamlessly welded fixed frame, a highly efficient capillary network is formed.
It significantly improves heat dissipation capacity, enhances liquid transfer and dispersion capabilities, improves equipment operational stability and durability, meets the heat dissipation requirements of high-power electronic components, and reduces assembly costs and long-term operating costs.
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Figure CN223710354U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of uniform temperature plate, and particularly, it is especially related to a capillary structure, a uniform temperature plate and an electronic product. BACKGROUND
[0002] Although the traditional uniform temperature plate has played an important role in the past, it is still insufficient in the face of the increasing demand for high-performance computing, high-density power electronic devices and other fields. These fields are characterized by generating a large amount of heat load, and require the uniform temperature plate to have higher level of heat transfer efficiency and uniform temperature performance. However, the existing capillary structure has high thermal resistance, and the complexity and limitation of the conventional capillary network result in insufficient smoothness of the heat energy transmission channel, affecting the effective distribution of heat, which needs to be improved. SUMMARY
[0003] Therefore, the utility model provides a capillary structure, the capillary network is formed by closely arranging a plurality of wire bundles, and the gap forms numerous small and dense channels, which constitutes an efficient capillary network, realizes exponential growth of the number of capillary channels, and is equivalent to laying more "capillary tubes" in the same unit area, greatly enhances the capillary effect, strengthens the liquid transfer and dispersion capacity, and improves the heat dissipation capacity.
[0004] The utility model discloses the following technical scheme realizes the purpose:
[0005] A capillary structure comprises a capillary network, and the capillary network comprises a plurality of wire bundles.
[0006] The capillary network is formed by closely arranging a plurality of wire bundles, and the gap forms numerous small and dense channels, which constitutes an efficient capillary network. The dense arrangement of the wire bundles substantially greatly improves the density of the capillary channels, and this measure directly strengthens the exertion of the capillary force. The capillary force is derived from the molecular attraction between the liquid-solid contact surface, which promotes the liquid substance to flow against gravity along the extremely narrow channel. By carefully controlling the spacing of each wire bundle, the designer realizes exponential growth of the number of capillary channels, which is equivalent to laying more "capillary tubes" in the same unit area, greatly enhances the capillary effect, strengthens the liquid transfer and dispersion capacity, and improves the heat dissipation capacity. The innovation is not only in the leap in intrinsic performance, but also in the outstanding appearance design. Through the process of closely arranging the monofilaments side by side, the thickness of the overall structure reaches an amazing 0.02 millimeters, which is rarely seen in similar products.
[0007] Preferably, the single-layer plane formed by the plurality of wire bundles arranged side by side is a single-layer capillary network, and a plurality of single-layer capillary networks can be stacked in parallel to form a multi-layer capillary network.
[0008] As a basic unit, the single-layer capillary mesh is composed of multiple bundles of closely arranged filaments, forming a uniform distribution of capillary channel grid. By optimizing the filament spacing, the channel density is effectively improved, which means more capillary paths, thereby enhancing the liquid transfer and dispersion capacity, especially in heat management. The concept of multi-layer capillary mesh further expands the achievements of single-layer, through the innovative way of parallel stacking, forming a multi-layer capillary network, not only greatly increasing the coverage and depth of the capillary structure, but also ingeniously solving the capacity and strength limitations of single-layer mesh. Multi-layer superposition enhances the overall heat conduction area and path diversity, effectively accelerating the heat diffusion rate, adapting to the heat dissipation needs of high-power electronic components, and improving the stability of equipment operation. The multi-layer design facilitates customization of the number of layers according to different application scenarios, realizing personalized configuration, meeting the diversified product design requirements, and having both practical and economic considerations.
[0009] Preferably, it also includes a fixed frame for stabilizing the capillary mesh. The fixed frame allows the filaments to be arranged in order, avoiding the disintegration of the capillary mesh filaments, and the fixed frame includes one or more frame bodies designed to fit the edges of the capillary mesh according to the internal cavity of the vapor chamber.
[0010] The fixed frame fits the edges of the capillary mesh, reducing the influence of external factors such as vibration or impact, effectively preventing the risk of filament displacement or even breakage due to external forces, greatly enhancing the durability and reliability of the entire system.
[0011] Preferably, the contact position between the frame body and the capillary mesh is fixedly connected through a welding process.
[0012] Through seamless welding technology, the frame body and the capillary mesh are tightly combined to form an integrated structure, greatly simplifying the assembly process. No additional clamps or adhesives are needed to fix the components, saving time and cost, and reducing the potential installation error rate. In addition, once installed, the system exhibits excellent sealing and corrosion resistance, requiring little daily maintenance, further reducing long-term operating costs.
[0013] Preferably, the frame body can be polygonal designed according to the inner cavity shape.
[0014] Customized polygonal design allows the frame body to fit the inner cavity shape more closely, meeting even the most unique or irregular space requirements, and achieving efficient and stable capillary mesh arrangement even in space-limited or geometrically demanding situations.
[0015] A vapor chamber including the capillary structure as described above. The vapor chamber made of the capillary structure described above has excellent heat dissipation capacity.
[0016] An electronic product comprises the vapor chamber as described above. The electronic product made of the vapor chamber has excellent heat dissipation capacity.
[0017] The utility model discloses the beneficial effect compared with prior art is:
[0018] The capillary structure of the utility model, the capillary net is formed by the close arrangement of multiple silk threads, and the gap forms numerous small and dense channels, which constitutes a high-efficiency capillary network. The dense arrangement of silk threads substantially greatly improves the capillary groove density, and this measure directly enhances the exertion of capillary force. Capillary force, originating from the molecular attraction between the liquid-solid contact surface, promotes liquid substances to move against gravity and flow along extremely narrow channels. By carefully controlling the spacing of each silk thread, the designer realizes exponential growth of the number of capillary grooves, which is equivalent to laying more "capillary tubes" in the same unit area, greatly enhancing the capillary effect, strengthening the liquid transfer and dispersion capacity, and improving the heat dissipation capacity. The innovation is not only in the leap in intrinsic performance, but also in the outstanding appearance design. Through the process of close arrangement of parallel monofilaments, the overall structure thickness reaches an astonishing 0.02 millimeters, which is a rare level of thinness in the current similar products. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.
[0020] Figure 1 The structure diagram of the capillary structure of an embodiment of the utility model.
[0021] Figure 2 The structure diagram of the single-layer capillary net of an embodiment of the utility model.
[0022] Figure 3 The structure diagram of the multi-layer capillary net of an embodiment of the utility model. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will describe the technical solutions in the embodiments of the present application clearly and completely with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0024] The following detailed description of embodiments of the application in the drawings provided in the accompanying drawings is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the application.
[0025] It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In the description of the embodiments of the application, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application.
[0026] It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other without conflict.
[0027] The technical solutions in the application will be described below in conjunction with the drawings.
[0028] The embodiment provides a capillary structure, which comprises a capillary mesh 10 and a fixing frame 20 for stabilizing the capillary mesh 10, and the capillary mesh 10 comprises a plurality of bundles of silk threads 11, the plurality of bundles of silk threads 11 are arranged side by side and closely to form a plane, and the groove between adjacent silk threads 11 forms a capillary. The fixing frame 20 enables the silk threads 11 to be arranged in order, so that the silk threads 11 of the capillary mesh 10 are prevented from being scattered, and the fixing frame 20 comprises one or more frame bodies which are designed according to the internal cavity of the uniform temperature plate and are closely arranged at the edges of the capillary mesh 10.
[0029] The capillary mesh 10 is formed by closely arranging a plurality of wire bundles 11, and the gaps between the wire bundles 11 form a large number of small and dense channels, thereby forming a high-efficiency capillary network. The close arrangement of the wire bundles 11 substantially greatly increases the density of the capillary channels, which directly enhances the exertion of capillary force. Capillary force, which is derived from the molecular attraction between the contact surfaces of a liquid and a solid, causes liquid substances to flow against gravity along extremely narrow channels. By carefully controlling the spacing of each wire bundle 11, the designer achieves an exponential increase in the number of capillary channels, which is equivalent to laying more "capillary tubes" in the same unit area, thereby greatly enhancing the capillary effect, the liquid transfer and dispersion capacity, and the heat dissipation capacity. The innovation not only lies in the leap in intrinsic performance, but also in the outstanding appearance design. Through the process of closely arranging the single wires side by side, the thickness of the overall structure reaches an astonishing 0.02 millimeters, which is a rare level of thinness among similar products.
[0030] The fixed frame 20 closely abuts the edge of the capillary mesh 10, thereby reducing the influence of external factors on the capillary mesh 10, such as vibration or impact, effectively preventing the risk of displacement or even breakage of the wire bundles 11 due to external forces, and greatly enhancing the durability and reliability of the entire system.
[0031] In the present embodiment, the single layer plane formed by closely arranging a plurality of wire bundles 11 side by side is a single layer capillary mesh, and a plurality of single layer capillary meshes can be stacked in parallel to form a multi-layer capillary mesh.
[0032] As a basic unit, the single layer capillary mesh is formed by closely arranging a plurality of wire bundles 11, thereby forming a uniformly distributed capillary channel grid. By optimizing the spacing of the wire bundles 11, the density of the channels is effectively increased, which means more capillary paths, thereby enhancing the liquid transfer and dispersion capacity, especially in terms of heat management. The concept of a multi-layer capillary mesh further expands the achievements of a single layer. Through the innovative way of parallel stacking, a multi-layer capillary network is formed, which not only greatly increases the coverage and depth of the capillary structure, but also ingeniously solves the capacity and strength limitations of a single layer mesh. The multi-layer stacking enhances the overall heat conduction area and path diversity, effectively accelerating the heat diffusion rate, adapting to the heat dissipation needs of high-power electronic components, and improving the stability of equipment operation. The multi-layer design facilitates customization of the number of layers according to different application scenarios, realizes personalized configuration, meets diversified product design requirements, and has both practicality and economic considerations.
[0033] In the present embodiment, the contact position between the frame and the capillary mesh 10 is fixedly connected through a welding process.
[0034] The frame body is tightly combined with the capillary mesh 10 through a seamless welding technology to form an integrated structure, which greatly simplifies the assembly process. Additional clamps or adhesives are no longer needed to fix the components, which saves time and cost and reduces the potential installation error rate. In addition, once the installation is completed, the system exhibits excellent sealing and corrosion resistance, requiring almost no daily maintenance, further reducing long-term operating costs.
[0035] In the present embodiment, the frame body can be polygonal in design according to the shape of the inner cavity.
[0036] The customized polygonal design allows the frame body to fit the inner cavity shape more closely, meeting even the most unique or irregular space requirements, and achieving efficient and stable capillary mesh 10 arrangement even in space-limited or geometrically demanding situations.
[0037] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A capillary structure, characterized by, The capillary structure comprises a capillary mesh, the capillary mesh comprises a plurality of bundles of filaments, the plurality of bundles of filaments are arranged side by side in close contact to form a plane, and a channel is formed between adjacent filaments of the capillary mesh.
2. The capillary structure of claim 1, wherein, A single layer plane formed by the plurality of bundles of filaments arranged side by side in close contact is a single layer capillary mesh, and a plurality of single layer capillary meshes can be stacked in parallel to form a multi-layer capillary mesh.
3. The capillary structure of claim 1, wherein, The capillary structure further comprises a fixing frame for stabilizing the capillary mesh.
4. The capillary structure of claim 3, wherein, The fixing frame comprises one or more frame bodies in close contact with the edges of the capillary mesh.
5. The capillary structure of claim 4, wherein, The frame bodies and the capillary mesh are fixedly connected through a welding process.
6. The capillary structure of claim 5, wherein, The shape of the frame body can be designed as a polygon.
7. A vapor chamber, characterized by, The heat dissipation device comprises the capillary structure according to any one of claims 1-6.
8. An electronic product, characterized by comprising: The vapor chamber comprises the capillary structure according to claim 7.