Semiconductor carrier tape sealing dustproof system and taping machine

Abstract

The utility model discloses a semiconductor carrier tape sealing dustproof system and a braider, and relates to the technical field of semiconductors, the semiconductor carrier tape sealing dustproof system comprises a carrier tape cleaning device and a sealing tape cleaning device, the carrier tape cleaning device is provided with a first air cleaning ring, the middle of the first air cleaning ring is provided with a carrier tape cavity used for guiding and cleaning a carrier tape, and the sealing tape cleaning device is provided with a second air cleaning ring. Carrier tape cleaning holes are formed in the peripheral side of the carrier tape cavity; the sealing belt cleaning device is provided with a second air cleaning ring, a sealing belt cavity used for guiding and cleaning the sealing belt is formed in the middle of the second air cleaning ring, and sealing belt cleaning holes are formed in the peripheral side of the sealing belt cavity. According to the dustproof system for the semiconductor carrier tape and the sealing tape, the carrier tape cleaning device and the sealing tape cleaning device are arranged, the carrier tape and the sealing tape are cleaned through the air cleaning ring and the cleaning hole, foreign matter attachment is effectively reduced, and therefore the packaging quality is improved, and the problems that sealing is not firm, character recognition is wrong, and product weldability is reduced due to foreign matter are solved; and the reliability and the production efficiency of the semiconductor braid packaging system are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a semiconductor carrier tape cover tape dustproof system and a taping machine. BACKGROUND

[0002] In the field of semiconductor packaging, taping packaging is a widely used packaging method for semiconductor chips and other electronic components. The taping packaging system usually includes a carrier tape and a cover tape, where the carrier tape is used to carry and fix the components, and the cover tape is used to package the components to prevent external pollution and damage. With the continuous advancement of semiconductor manufacturing process, the requirement for packaging quality is also getting higher and higher, which makes the foreign matter protection problem in the taping packaging system more prominent.

[0003] In the existing taping packaging system, foreign matters are easily brought into the carrier tape and the cover tape during use. These foreign matters may come from residual substances in the manufacturing process of the carrier tape or the cover tape, such as dust, fibers, adhesive residues, etc., or may come from particles in the air. The existence of these foreign matters can seriously affect the packaging quality, for example, causing poor sealing, forming bubbles, affecting character recognition, and even falling on the pins of the components, affecting the solderability of the product. Especially at the taping vision window, the entry of foreign matters may directly interfere with the visual recognition system, causing misjudgment or wrong operation. These problems not only reduce the production efficiency, but also may cause quality problems in the subsequent process, affecting the performance and reliability of the product. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a semiconductor carrier tape cover tape dustproof system. By setting a carrier tape cleaning device and a cover tape cleaning device, the carrier tape and the cover tape are cleaned by using an air cleaning ring and a cleaning hole, effectively reducing the attachment of foreign matters, thereby improving the packaging quality, reducing the problems of poor sealing, character recognition error and product solderability caused by foreign matters, and improving the reliability and production efficiency of the semiconductor taping packaging system. Another purpose of the present application is to provide a taping machine.

[0005] To achieve the above-mentioned purpose, the present application provides a semiconductor carrier tape cover tape dustproof system, comprising:

[0006] The carrier tape cleaning device is provided with a first air cleaning ring, the middle part of the first air cleaning ring has a carrier tape cavity for guiding and cleaning the carrier tape, and the periphery of the carrier tape cavity is provided with a carrier tape cleaning hole;

[0007] The cover tape cleaning device is provided with a second air cleaning ring, the middle part of the second air cleaning ring has a cover tape cavity for guiding and cleaning the cover tape, and the periphery of the cover tape cavity is provided with a cover tape cleaning hole.

[0008] In some embodiments, the tape cleaning device further comprises:

[0009] A cleaning brush in contact with the tape, the cleaning brush cleaning the adhered foreign matter by contacting the fed tape.

[0010] In some embodiments, the first air cleaning ring is provided with an inlet and an outlet communicating with the tape cavity, the tape entering the tape cavity from the inlet and leaving the tape cavity from the outlet; the cleaning brush is located at the inlet; and / or,

[0011] The cleaning brush comprises at least one set of brush bodies arranged in opposition, and the tape passes between the brush bodies arranged in opposition.

[0012] In some embodiments, the second air cleaning ring is located upstream of the sealing tape path on the feeding path of the sealing tape;

[0013] The sealing tape cleaning device is further provided with a third air cleaning member, the third air cleaning member being located downstream of the sealing tape path, the third air cleaning member being provided with sealing tape blowing holes, the sealing tape blowing holes being arranged towards the sealing tape side facing the tape.

[0014] In some embodiments, the third air cleaning member is in the shape of a rod, the sealing tape blowing holes being arranged linearly on the third air cleaning member, the distance between the sealing tape blowing holes at the two ends being greater than the width of the sealing tape; and / or,

[0015] The third air cleaning member is located below the sealing tape.

[0016] In some embodiments, the semiconductor tape sealing tape dustproof system further comprises:

[0017] A window cleaning device provided with a fourth air cleaning member, the fourth air cleaning member being wrapped around the tape visual window on the machine, the fourth air cleaning member being provided with window air curtain holes, air being blown through the window air curtain holes to form an air curtain covering the tape visual window.

[0018] In some embodiments, the fourth air cleaning member is in the shape of a ring, the window air curtain holes being arranged along the fourth air cleaning member ring, the air curtain being located above the tape visual window.

[0019] In some embodiments, the semiconductor tape sealing tape dustproof system further comprises:

[0020] A window dustproof device provided with a dustproof pad, the dustproof pad being located on the top of the tape identification equipment, the tape visual window on the machine being covered by the projection area of the dustproof pad on the machine.

[0021] In some embodiments, the second air cleaning ring comprises:

[0022] A cleaning ring body;

[0023] An air path interface is arranged on the outer wall of the cleaning ring body.

[0024] A ring-shaped air cavity is arranged in the interior of the cleaning ring body, and the ring-shaped air cavity is communicated with the air path interface.

[0025] The sealing tape cleaning hole is arranged on the inner wall of the cleaning ring body, and the sealing tape cleaning hole is communicated with the ring-shaped air cavity.

[0026] The application also provides a tape winding machine, which comprises a tape winding machine body and the semiconductor carrier tape sealing tape dustproof system.

[0027] With respect to the above background technology, the semiconductor carrier tape sealing tape dustproof system provided by the application mainly comprises a carrier tape cleaning device and a sealing tape cleaning device. The carrier tape cleaning device is provided with a first air cleaning ring, the middle part of the first air cleaning ring is provided with a carrier tape cavity for guiding and cleaning the carrier tape, and the periphery of the carrier tape cavity is provided with a carrier tape cleaning hole. The sealing tape cleaning device is provided with a second air cleaning ring, the middle part of the second air cleaning ring is provided with a sealing tape cavity for guiding and cleaning the sealing tape, and the periphery of the sealing tape cavity is provided with a sealing tape cleaning hole.

[0028] In the process of semiconductor tape packaging, the cleaning degree of the carrier tape and the sealing tape has a crucial influence on the packaging quality. The carrier tape is used to carry semiconductor elements, and the sealing tape is used to package these elements to prevent external pollution and damage. However, in the existing carrier tape packaging system, foreign matters are easily brought into the carrier tape and the sealing tape during use. These foreign matters may come from residual substances in the manufacturing process of the carrier tape or the sealing tape, such as dust, fibers, adhesive residues, etc., or may come from particles in the air. The existence of these foreign matters will seriously affect the packaging quality, for example, causing the sealing to be not firm, forming bubbles, affecting character recognition, and even falling on the pins of the elements, affecting the solderability of the product.

[0029] In order to solve the above problems, the application provides a semiconductor carrier tape sealing tape dustproof system. The system mainly comprises a carrier tape cleaning device and a sealing tape cleaning device. The carrier tape cleaning device is provided with a first air cleaning ring, the middle part of the first air cleaning ring is provided with a carrier tape cavity for guiding and cleaning the carrier tape. The periphery of the carrier tape cavity is provided with a carrier tape cleaning hole, through which the foreign matters on the surface of the carrier tape can be effectively removed. The sealing tape cleaning device is provided with a second air cleaning ring, which has a similar structure to the carrier tape cleaning device. The middle part of the second air cleaning ring is provided with a sealing tape cavity for guiding and cleaning the sealing tape, and the periphery of the sealing tape cavity is provided with a sealing tape cleaning hole for removing the foreign matters on the surface of the sealing tape.

[0030] Through the design, the carrier tape and the sealing tape are first subjected to cleaning treatment by the carrier tape cleaning device and the sealing tape cleaning device before entering the combination link. When the carrier tape passes through the carrier tape cavity of the first air cleaning ring, the carrier tape cleaning hole blows out cleaning gas to remove foreign matters on the surface of the carrier tape. Similarly, when the sealing tape passes through the sealing tape cavity of the second air cleaning ring, the sealing tape cleaning hole also blows out cleaning gas to remove foreign matters on the surface of the sealing tape. The cleaning mode can effectively reduce the attachment of foreign matters on the surfaces of the carrier tape and the sealing tape, thereby improving the packaging quality, reducing problems such as poor sealing, character recognition error and product solderability reduction caused by foreign matters, and improving the reliability and production efficiency of the semiconductor carrier tape packaging system.

[0031] In combination with the above structure and process description, it can be seen that the semiconductor carrier tape sealing tape dustproof system has at least the following beneficial effects: the semiconductor carrier tape sealing tape dustproof system is provided with the carrier tape cleaning device and the sealing tape cleaning device, and the air cleaning ring and the cleaning hole are used to clean the carrier tape and the sealing tape, effectively reducing the attachment of foreign matters, thereby improving the packaging quality, reducing problems such as poor sealing, character recognition error and product solderability reduction caused by foreign matters, and improving the reliability and production efficiency of the semiconductor carrier tape packaging system. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of the provided drawings.

[0033] Figure 1 A schematic diagram of a semiconductor carrier tape sealing tape dustproof system provided by an embodiment of the present application;

[0034] Figure 2 A schematic diagram of a carrier tape cleaning device provided by an embodiment of the present application;

[0035] Figure 3 A schematic diagram of a sealing tape cleaning device provided by an embodiment of the present application Figure 1 ;

[0036] Figure 4 A schematic diagram of a first air cleaning ring provided by an embodiment of the present application;

[0037] Figure 5 A schematic diagram of a sealing tape cleaning device provided by an embodiment of the present application Figure 2 ;

[0038] Figure 6 A schematic diagram of a window cleaning device provided by an embodiment of the present application;

[0039] Figure 7 A schematic view of a window dustproof device provided by an embodiment of the present application.

[0040] Wherein:

[0041] A semiconductor carrier tape sealing tape dustproof system 100,

[0042] A carrier tape cleaning device 1, a first air cleaning ring 11, a carrier tape cavity 1101, a carrier tape cleaning hole 111, a cleaning brush 12, a brush body 121,

[0043] A sealing tape cleaning device 2, a second air cleaning ring 21, a sealing tape cavity 2101, a sealing tape cleaning hole 211, a cleaning ring body 212, an air path interface 213, a ring-shaped air cavity 214, a third air cleaning element 22, a sealing tape blowing hole 221,

[0044] A window cleaning device 3, a fourth air cleaning element 31, a window air curtain hole 311,

[0045] A window dustproof device 4, a dustproof pad 41,

[0046] A carrier tape 5,

[0047] A sealing tape 6,

[0048] A machine table 7,

[0049] A carrier tape visual window 8,

[0050] A carrier tape identification device 9. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0052] In order for those skilled in the art to better understand the solutions of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0053] Please refer to Figures 1 to 3 Wherein, Figure 1 A schematic view of a semiconductor carrier tape sealing tape dustproof system provided by an embodiment of the present application, Figure 2 A schematic view of a carrier tape cleaning device provided by an embodiment of the present application, Figure 3 A schematic view of a sealing tape cleaning device provided by an embodiment of the present application Figure 1 .

[0054] In a first specific embodiment, the semiconductor tape and sealant dustproof system 100 provided by the application mainly comprises a tape cleaning device 1 and a sealant cleaning device 2. The tape cleaning device 1 is provided with a first air cleaning ring 11, and the middle part of the first air cleaning ring 11 is provided with a tape cavity 1101 for guiding and cleaning the tape 5. The periphery of the tape cavity 1101 is provided with a tape cleaning hole 111. The sealant cleaning device 2 is provided with a second air cleaning ring 21, and the middle part of the second air cleaning ring 21 is provided with a sealant cavity 2101 for guiding and cleaning the sealant 6. The periphery of the sealant cavity 2101 is provided with a sealant cleaning hole 211.

[0055] In the process of semiconductor tape packaging, the cleaning degree of the tape 5 and the sealant 6 has a crucial influence on the packaging quality. The tape 5 is used to carry semiconductor elements, and the sealant 6 is used to package these elements to prevent external pollution and damage. However, in the existing tape packaging system, the tape 5 and the sealant 6 are easy to bring in foreign matters in the process of use. These foreign matters may come from residual substances in the manufacturing process of the tape 5 or the sealant 6, such as dust, fibers, adhesive residues, etc., or may come from particles in the air. The existence of these foreign matters will seriously affect the packaging quality, for example, causing the seal to be not firm, forming bubbles, affecting character recognition, and even falling on the pins of the elements, affecting the solderability of the product.

[0056] In order to solve the above problems, the application provides a semiconductor tape and sealant dustproof system 100. The system mainly comprises a tape cleaning device 1 and a sealant cleaning device 2. The tape cleaning device 1 is provided with a first air cleaning ring 11, and the middle part of the first air cleaning ring 11 is provided with a tape cavity 1101 for guiding and cleaning the tape 5. The periphery of the tape cavity 1101 is provided with a tape cleaning hole 111, through which the foreign matters on the surface of the tape 5 can be effectively removed. The sealant cleaning device 2 is provided with a second air cleaning ring 21, which is similar in structure to the tape cleaning device. The middle part of the second air cleaning ring 21 is provided with a sealant cavity 2101 for guiding and cleaning the sealant 6. The periphery of the sealant cavity 2101 is provided with a sealant cleaning hole 211 for removing the foreign matters on the surface of the sealant 6.

[0057] Through this design, the carrier tape 5 and the sealing tape 6 first pass through the cleaning treatment of the carrier tape cleaning device 1 and the sealing tape cleaning device 2 before entering the combination link. When the carrier tape 5 passes through the carrier tape cavity 1101 of the first air cleaning ring 11, the carrier tape cleaning hole 111 blows out cleaning gas to remove foreign matter on the surface of the carrier tape 5. Similarly, when the sealing tape 6 passes through the sealing tape cavity 2101 of the second air cleaning ring 21, the sealing tape cleaning hole 211 also blows out cleaning gas to remove foreign matter on the surface of the sealing tape 6. This cleaning method can effectively reduce the attachment of foreign matter on the surface of the carrier tape 5 and the sealing tape 6, thereby improving the packaging quality, reducing problems such as poor sealing, character recognition errors, and product solderability decline caused by foreign matter, and improving the reliability and production efficiency of the semiconductor carrier tape packaging system.

[0058] In combination with the above structure and process description, it can be seen that the semiconductor carrier tape sealing tape dustproof system 100 has at least the following beneficial effects: the semiconductor carrier tape sealing tape dustproof system 100 is provided with the carrier tape cleaning device 1 and the sealing tape cleaning device 2, and the carrier tape 5 and the sealing tape 6 are cleaned by the air cleaning ring and the cleaning hole, thereby effectively reducing the attachment of foreign matter, improving the packaging quality, reducing problems such as poor sealing, character recognition errors, and product solderability decline caused by foreign matter, and improving the reliability and production efficiency of the semiconductor carrier tape packaging system.

[0059] It should be noted that the working principle of the first air cleaning ring 11 and the second air cleaning ring 21 is based on the high-efficiency cleaning mechanism of compressed gas. The two air cleaning rings introduce high-pressure gas through the compressed gas input port, and the gas forms a high-speed airflow in the carrier tape cavity 1101 and the sealing tape cavity 2101, which is sprayed to the surface of the carrier tape 5 and the sealing tape 6 through the cleaning hole (carrier tape cleaning hole 111 and sealing tape cleaning hole 211). These high-speed airflows can effectively blow away dust, fibers, and other foreign matter on the surface of the carrier tape and the sealing tape, achieving non-contact high-efficiency cleaning. This cleaning method is not only fast and efficient, but also avoids mechanical damage to the carrier tape and the sealing tape, thereby ensuring the quality and reliability of the packaging process.

[0060] Specifically, for the first air cleaning ring 11, the first air cleaning ring 11 is provided with a gas chamber communicated with the carrier tape cleaning hole 111, and the first air cleaning ring 11 supplies gas to the gas chamber through the interface, and the gas source outside is connected through the interface.

[0061] Please refer to Figure 4 , Figure 4 The schematic diagram of the first air cleaning ring provided by the embodiment of the application.

[0062] In some embodiments, the second air cleaning ring 21 includes:

[0063] The cleaning ring body 212;

[0064] The air path interface 213 is arranged on the outer wall of the cleaning ring body 212.

[0065] The annular air cavity 214 is arranged inside the cleaning ring body 212, and the annular air cavity 214 communicates with the air path interface 213.

[0066] The sealing tape cleaning hole 211 is arranged on the inner wall of the cleaning ring body 212, and the sealing tape cleaning hole 211 communicates with the annular air cavity 214.

[0067] In this embodiment, the second air cleaning ring 21 realizes the high-efficiency cleaning function of the sealing tape 6 through its unique structural design. The cleaning ring is composed of a cleaning ring body 212, which is internally designed with an annular air cavity 214 for storing and distributing compressed air. The outer wall of the cleaning ring body 212 is provided with an air path interface 213 as an input channel for compressed air, ensuring that the gas can stably enter the annular air cavity 214. The annular air cavity 214 communicates with the sealing tape cleaning hole 211, which is uniformly distributed on the inner wall of the cleaning ring body 212, so that the compressed air can be sprayed out from the cleaning hole in the form of high-speed airflow, directly acting on the surface of the sealing tape 6, thereby realizing effective cleaning of the sealing tape. This design not only improves the cleaning efficiency, but also avoids physical damage to the sealing tape through non-contact cleaning method, ensuring the quality and performance of the sealing tape in the subsequent packaging process.

[0068] Please continue to refer to Figure 2 In some embodiments, the carrier tape cleaning device 1 further comprises:

[0069] The cleaning brush 12 is in contact with the carrier tape 5, and the cleaning brush 12 cleans the attached foreign matter by contacting the fed carrier tape 5.

[0070] In this embodiment, the design of the carrier tape cleaning device 1 is further optimized by introducing the cleaning brush 12, which enhances the cleaning effect of the carrier tape 5. The cleaning brush 12 directly contacts the carrier tape 5, and its main function is to remove stubborn foreign matter attached to the surface of the carrier tape through physical contact. This design utilizes the friction between the bristles of the cleaning brush and the surface of the carrier tape, which can effectively remove dust, fibers and other impurities on the carrier tape, thereby improving the cleanliness of the carrier tape.

[0071] The design of the cleaning brush 12 takes into account the feeding direction and speed of the carrier tape 5, ensuring that the bristles can continuously contact the surface of the carrier tape during the movement of the carrier tape. This contact cleaning method combined with the non-contact cleaning method of the air cleaning ring forms a comprehensive cleaning system. The air cleaning ring blows away larger particles of foreign matter through high-speed airflow, while the cleaning brush removes smaller particles or foreign matter with strong adhesion through physical friction, and the two work together to significantly improve the cleaning effect of the carrier tape.

[0072] In addition, the use of the cleaning brush 12 also takes into account the material and surface characteristics of the carrier tape 5 to ensure that no damage is caused to the carrier tape during cleaning. The material and hardness of the bristles are carefully selected to effectively remove foreign matter without scratching the surface of the carrier tape. This design not only improves the cleaning quality of the carrier tape, but also prolongs the service life of the carrier tape and reduces production costs.

[0073] In some embodiments, the first air cleaning ring 11 is provided with an inlet and an outlet communicating with the carrier tape cavity 1101, and the carrier tape 5 enters the carrier tape cavity 1101 from the inlet and exits the carrier tape cavity 1101 from the outlet; the cleaning brush 12 is located at the inlet.

[0074] In this embodiment, the design of the first air cleaning ring 11 further optimizes the cleaning process of the carrier tape 5. Specifically, the first air cleaning ring 11 is designed to have an inlet and an outlet communicating with the carrier tape cavity 1101, which allows the carrier tape 5 to smoothly enter the carrier tape cavity 1101 from the inlet and exit from the outlet after completing the cleaning process. This optimized process ensures smooth passage of the carrier tape 5 during cleaning, avoiding carrier tape jamming or damage caused by improper design of the cleaning device.

[0075] In addition, the cleaning brush 12 is ingeniously arranged at the inlet position. The key to this design is that the carrier tape 5 first contacts the cleaning brush 12 before entering the carrier tape cavity 1101. The cleaning brush 12 functions to remove larger particles of foreign matter attached to the surface of the carrier tape 5 through physical contact. This pre-cleaning step can significantly improve the effectiveness of subsequent pneumatic cleaning, as larger foreign matter can interfere with the normal flow of air if it enters the carrier tape cavity 1101 directly, reducing cleaning efficiency.

[0076] By placing the cleaning brush 12 at the inlet, the carrier tape 5 is preliminarily cleaned before entering the carrier tape cavity 1101, which not only improves the overall cleaning effect, but also prolongs the service life of the air cleaning ring, as the cleaning brush has removed most of the larger foreign matter, reducing the potential damage to the internal structure of the air cleaning ring. The ingenuity of this design lies in its combination of physical contact cleaning and pneumatic cleaning, achieving efficient cleaning of the carrier tape 5 while ensuring smoothness and reliability throughout the cleaning process.

[0077] In some embodiments, the cleaning brush 12 includes at least one set of brush bodies 121 arranged in opposition, and the carrier tape 5 passes between the brush bodies 121 arranged in opposition.

[0078] In this embodiment, the design of the cleaning brush 12 employs at least one set of oppositely arranged brush bodies 121, which enables simultaneous cleaning of both sides of the tape 5. Specifically, when the tape 5 passes through the cleaning brush 12, it will pass between the two oppositely arranged brush bodies 121. These two brush bodies 121 are located on the front and back sides of the tape 5, respectively, and can effectively remove foreign matter attached to both sides of the tape through contact with the tape surface.

[0079] This design of oppositely arranged brush bodies 121 has significant advantages. First, it ensures that both sides of the tape 5 are thoroughly cleaned without the need for additional equipment or complex operation procedures. This design not only improves cleaning efficiency but also reduces the complexity and cost of equipment. Second, oppositely arranged brush bodies 121 can provide more uniform cleaning, as both sides of the tape 5 are cleaned simultaneously when passing through, avoiding the problem of incomplete or uneven cleaning caused by single-sided cleaning.

[0080] Please refer to Figure 5 , Figure 5 the schematic diagram of the tape cleaning device provided in this embodiment Figure 2 .

[0081] In some embodiments, the second air cleaning ring 21 is located upstream of the tape path on the feeding path of the tape 6;

[0082] The tape cleaning device 2 is also provided with a third air cleaning element 22, which is located downstream of the tape path. The third air cleaning element 22 is provided with tape blowing holes 221 facing the side of the tape 6 facing the tape 5.

[0083] In this embodiment, the design of the tape cleaning device 2 introduces a double cleaning function to ensure that the tape 6 reaches a higher cleaning standard before entering the packaging process. Specifically, the second air cleaning ring 21 is arranged upstream of the tape 6 feeding path, while the third air cleaning element 22 is arranged downstream of the tape path. This layout allows the tape 6 to pass through two different cleaning processes in sequence when passing through the cleaning device, thereby more effectively removing surface foreign matter.

[0084] First, the tape 6 passes through the second air cleaning ring 21 during the feeding process. The cleaning ring sprays compressed air onto the tape surface through the annular air cavity 214 and the tape cleaning hole 211 inside, thereby removing dust, fibers, and other large particle foreign matter on the tape surface. This preliminary cleaning step provides a foundation for subsequent fine cleaning.

[0085] Subsequently, the sealing tape 6 continues to move along the feeding path to the position of the third air cleaning element 22. The third air cleaning element 22 also utilizes compressed gas for cleaning, but its sealing tape blowing hole 221 is designed to face the side of the sealing tape 6 facing the carrier tape 5. The key of this design is that it can focus on cleaning the surface of the sealing tape 6 that will contact the carrier tape 5 and semiconductor elements in the subsequent packaging process. In this way, the third air cleaning element 22 can further remove fine foreign matter that may be left on the surface of the sealing tape, ensuring that the surface cleanliness of the sealing tape 6 reaches the best state when combined with the carrier tape 5.

[0086] This design of double cleaning function not only improves the cleaning effect of the sealing tape 6, but also ensures the efficiency and reliability of the cleaning process through phased cleaning. The cooperation of the second air cleaning ring 21 and the third air cleaning element 22 enables the sealing tape 6 to minimize the attachment of surface foreign matter before entering the packaging link, thereby reducing packaging quality problems caused by foreign matter, such as poor sealing, bubble formation, etc. Through this optimized cleaning process, the sealing tape cleaning device 2 can significantly improve the overall quality and reliability of semiconductor packaging.

[0087] In some embodiments, the third air cleaning element 22 is in the shape of a rod, and the sealing tape blowing holes 221 are arranged in a straight line on the third air cleaning element 22, with the distance between the sealing tape blowing holes 221 at the two ends being greater than the width of the sealing tape 6.

[0088] In this embodiment, the design of the third air cleaning element 22 further optimizes the cleaning effect of the sealing tape 6. The third air cleaning element 22 is in the shape of a rod, which makes it more flexible to arrange on the feeding path of the sealing tape 6. The sealing tape blowing holes 221 are arranged in a straight line on the third air cleaning element 22, which ensures that the blowing gas can uniformly cover the surface of the sealing tape 6.

[0089] Particularly noteworthy is that the distance between the sealing tape blowing holes 221 at the two ends is designed to be greater than the width of the sealing tape 6. The key of this design is to ensure that the blowing gas can cover the entire width of the sealing tape 6, thereby achieving comprehensive cleaning of the sealing tape surface. In this way, no matter where the foreign matter is attached to the sealing tape, it can be effectively removed by the blowing gas.

[0090] This design not only improves the comprehensiveness and efficiency of cleaning, but also ensures the stability and reliability of the cleaning process by optimizing the layout of the blowing holes. The third air cleaning element 22 can clean the sealing tape 6 in all directions through its rod-shaped structure and straight-line arrangement of blowing holes, thereby significantly reducing the attachment of foreign matter on the surface of the sealing tape. This is particularly important for the subsequent packaging process, as it ensures that the surface cleanliness of the sealing tape 6 reaches the best state when combined with the carrier tape 5, thereby improving the overall quality and reliability of the packaging.

[0091] In some embodiments, the third air cleaning member 22 is located below the tape 6.

[0092] In the present embodiment, the third air cleaning member 22 is arranged below the tape 6, which has important functions and advantages. Since the lower side of the tape 6 is the surface in direct contact with the carrier tape 5 and the semiconductor components 7, ensuring the cleanliness of this side is crucial for packaging quality.

[0093] Firstly, such a layout can effectively prevent the adhesion of foreign matter on the lower side of the tape 6. During the packaging process, if foreign matter adheres to the lower side of the tape 6, it may cause poor sealing, bubble formation or other quality problems in the subsequent packaging process.

[0094] By arranging the third air cleaning member 22 below the tape 6, the blowing hole 221 can blow upward and directly act on the lower side of the tape 6. Such upward blowing design not only effectively removes the foreign matter that has already adhered to the lower side of the tape, but also further prevents the adhesion of new foreign matter on the lower side of the tape. This dual effect ensures that the cleanliness of the lower surface of the tape 6 reaches the highest standard before entering the packaging link.

[0095] In addition, such a design also has structural advantages. By arranging the third air cleaning member 22 below the tape 6, the space can be fully utilized, making the layout of the entire cleaning device more compact and reasonable. Such a compact layout not only saves space of the equipment, but also improves the overall efficiency and reliability of the equipment.

[0096] In particular, the feeding path of the tape 6 near the third air cleaning member 22 is not completely horizontal or completely vertical, but has a certain inclination angle with the horizontal direction and the vertical direction, which can also reduce the adhesion of foreign matter.

[0097] Please refer to Figure 6 , Figure 6 The schematic diagram of the window cleaning device provided in the present embodiment.

[0098] In some embodiments, the semiconductor carrier tape dust prevention system 100 further comprises:

[0099] The window cleaning device 3 is provided with a fourth air cleaning member 31, which is wrapped around the tape vision window 8 on the machine 7. The fourth air cleaning member 31 is provided with a window air curtain hole 311, through which air is blown to form an air curtain that encloses the tape vision window 8.

[0100] It is noted that the tape identification device 9 is located above the tape vision window 8, and the semiconductor elements move below the tape vision window 8, and the tape identification device 9 detects the semiconductor elements through the tape vision window 8. In the semiconductor testing process, foreign matter in the air, including dust, fibers, particles or other impurities, can fall into the tape vision window 8 through air flow.

[0101] In this embodiment, the semiconductor tape sealing dust prevention system 100 further optimizes the protection measures for the tape vision window 8 by introducing the vision window cleaning device 3. The core component of the vision window cleaning device 3 is the fourth air cleaning piece 31, which is designed to be wrapped around the tape vision window 8 on the machine 7, and further ensures the cleaning and clarity of the vision window through its unique function.

[0102] The fourth air cleaning piece 31 is provided with window air curtain holes 311, and the function of these air curtain holes is to form an air curtain around the tape vision window 8 by blowing air. The formation of the air curtain is achieved by blowing air from the window air curtain holes 311, which forms a continuous air flow barrier around the vision window. This air flow barrier can effectively block dust, fibers and other small particles from the outside.

[0103] The advantage of this design is that it provides an active cleaning and protection mechanism, rather than just passively preventing foreign matter from entering. Through continuous air flow sweeping, the vision window cleaning device 3 can remove foreign matter in real time, thereby ensuring the stability and reliability of the vision system. This is crucial for the highly accurate vision recognition and detection tasks in the semiconductor packaging process. In this way, the semiconductor tape sealing dust prevention system 100 not only improves the cleanliness of the packaging process, but also enhances the operating efficiency and reliability of the entire system.

[0104] In some embodiments, the fourth air cleaning piece 31 is annular, and the window air curtain holes 311 are arranged along the annular fourth air cleaning piece 31, and the air curtain is located above the tape vision window 8.

[0105] In this embodiment, the fourth air cleaning piece 31 is designed as an annular structure, which allows the window air curtain holes 311 to be evenly arranged along the annular surface of the fourth air cleaning piece 31. Through such a layout, the air blown from the window air curtain holes 311 can form a 360-degree air curtain around the tape vision window 8. The air curtain is located above the tape vision window 8, and its function is to block foreign matter in the air, such as dust, fibers, particles, etc., from falling into the tape vision window 8 through air flow, thereby interfering with the detection work of the tape identification device 9.

[0106] The advantage of this circular design is that it ensures uniform distribution of the air curtain, providing all-around protection. The shape of the air curtain can be varied, such as spiral, tornado, or other forms, depending on the arrangement of the window air curtain holes 311 and the blowing speed of the gas. These different air shapes can effectively form a dynamic barrier to block the entry of foreign matter.

[0107] Please refer to Figure 7 , Figure 7 The schematic diagram of the window dustproof device provided in the embodiment of the application.

[0108] In some embodiments, the semiconductor tape sealing tape dustproof system 100 further comprises:

[0109] The window dustproof device 4 is provided with a dustproof pad 41, which is located on the top of the tape identification device 9, and the tape visual window 8 on the machine table 7 is covered by the projection area of the dustproof pad 41 on the machine table 7.

[0110] In this embodiment, the semiconductor tape sealing tape dustproof system 100 further enhances the protection of the tape visual window 8, which is realized by introducing the window dustproof device 4. The core component of the window dustproof device 4 is the dustproof pad 41, which is designed to be installed on the top of the tape identification device 9. This design enables the dustproof pad 41 to completely cover the tape visual window 8 through its projection area on the machine table 7, thereby forming a physical barrier in the height direction and effectively blocking the entry of foreign matter from the outside.

[0111] The material of the dustproof pad 41 can be selected in various ways, such as felt pad, etc. The felt pad can effectively capture dust, fibers and other tiny particles in the air due to its good flexibility and adsorption, preventing these foreign matter from entering through the tape visual window 8. The choice of such material not only provides efficient dustproof effect, but also ensures the durability and reliability of the dustproof pad 41 in long-term use.

[0112] The application also provides a tape machine, which comprises a tape machine body and the above-mentioned semiconductor tape sealing tape dustproof system 100.

[0113] The tape machine should have all the beneficial technical effects of the above-mentioned semiconductor tape sealing tape dustproof system 100, which will not be repeated here.

[0114] In this embodiment, the application further expands its application range and provides a tape machine, which not only includes a tape machine body, but also integrates the above-mentioned semiconductor tape sealing tape dustproof system 100. This integrated design enables the tape machine to fully utilize the functions of the semiconductor tape sealing tape dustproof system 100 during the process of tape packaging of semiconductor components, thereby significantly improving the overall performance and reliability of the tape machine.

[0115] Due to the semiconductor tape carrier tape sealing dustproof system 100 has realized the effective cleaning of the carrier tape and the sealing tape and the protection of the carrier tape visual window through its unique design and function, the integration of these functions enables the carrier tape machine to reduce the problems of poor sealing, character recognition error and product solderability reduction caused by foreign matter during operation. Therefore, when packaging semiconductor components, the carrier tape machine can ensure higher packaging quality, improve production efficiency, and reduce production failures and defective rates caused by foreign matter pollution.

[0116] It should be noted that many components mentioned in the present application are general standard components or components known to those skilled in the art, the structure and principle of which can be known by the technical personnel through the technical manual or through the conventional experimental method.

[0117] It should be noted that in the present specification, the relationship terms such as first and second are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between the entities.

[0118] The above provides a detailed description of the semiconductor tape carrier tape sealing dustproof system and the carrier tape machine provided by the present application. The principles and implementation modes of the present application are described by applying specific examples in this paper, and the above description of the examples is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A semiconductor carrier tape encapsulation dust prevention system, characterized by, The application relates to a carrier tape cleaning device and a seal tape cleaning device. The carrier tape cleaning device comprises a first air cleaning ring, the middle part of the first air cleaning ring is provided with a carrier tape cavity for guiding and cleaning the carrier tape, and the periphery of the carrier tape cavity is provided with a carrier tape cleaning hole. The seal tape cleaning device comprises a second air cleaning ring, the middle part of the second air cleaning ring is provided with a seal tape cavity for guiding and cleaning the seal tape, and the periphery of the seal tape cavity is provided with a seal tape cleaning hole.

2. The semiconductor carrier tape encapsulation dust prevention system according to claim 1, wherein, The carrier tape cleaning device further comprises: A cleaning brush in contact with the carrier tape, the cleaning brush is used for cleaning the attached foreign matters by being in contact with the fed carrier tape.

3. The semiconductor carrier tape encapsulation dust prevention system according to claim 2, wherein, The first air cleaning ring is provided with an inlet and an outlet communicated with the carrier tape cavity, the carrier tape enters the carrier tape cavity from the inlet and then leaves the carrier tape cavity from the outlet; the cleaning brush is located at the inlet; and / or The cleaning brush comprises at least one group of brush bodies arranged oppositely, and the carrier tape passes between the oppositely arranged brush bodies.

4. The semiconductor carrier tape belt dust prevention system according to claim 1, wherein, The second air cleaning ring is located upstream of the seal tape path in the feeding path of the seal tape. The seal tape cleaning device is further provided with a third air cleaning part, the third air cleaning part is located downstream of the seal tape path, the third air cleaning part is provided with a seal tape blowing hole, and the seal tape blowing hole is arranged on the side of the seal tape facing the carrier tape.

5. The semiconductor carrier tape belt dust prevention system according to claim 4, wherein The third air cleaning part is in the shape of a rod, the seal tape blowing holes are linearly arranged on the third air cleaning part, and the distance between the seal tape blowing holes at the two ends is greater than the width of the seal tape; and / or The third air cleaning part is located below the seal tape.

6. The semiconductor carrier tape belt dust prevention system according to claim 1, wherein The application further relates to a window cleaning device and a window dustproof device. The window cleaning device is provided with a fourth air cleaning part, the fourth air cleaning part is wrapped outside a seal tape visual window on a machine table, and the fourth air cleaning part is provided with a window air curtain hole, air is blown through the window air curtain hole to form an air curtain covering the seal tape visual window.

7. The semiconductor carrier tape belt dust prevention system according to claim 6, wherein The fourth air cleaning part is in the shape of a ring, the window air curtain holes are linearly arranged along the fourth air cleaning part, and the air curtain is located above the seal tape visual window.

8. The semiconductor carrier tape belt dust prevention system according to claim 1, wherein, The window dustproof device is provided with a dustproof pad, the dustproof pad is located on the top of a seal tape identification device, and a seal tape visual window on a machine table is covered by a projection area of the dustproof pad on the machine table. The second air cleaning ring comprises:

9. The semiconductor carrier tape belt dust prevention system according to claim 1, wherein, A cleaning ring main body; An air path interface arranged on the outer wall of the cleaning ring main body; A ring-shaped air cavity arranged in the interior of the cleaning ring main body, and the ring-shaped air cavity is communicated with the air path interface; The seal tape cleaning hole is arranged on the inner wall of the cleaning ring main body, and the seal tape cleaning hole is communicated with the ring-shaped air cavity. The application further relates to a seal tape cleaning device and a window cleaning device.

10. A beading machine characterized in that, The application further relates to a seal tape cleaning device and a window cleaning device.

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