Efficient heat dissipation cold compress fan

Abstract

The utility model discloses an efficient heat dissipation cold compress fan which comprises a fan shell, an air passing channel is formed in the fan shell, an internal support is arranged in the air passing channel, a motor base and a heat dissipation piece base are arranged on the internal support, a fan blade group is installed on the motor base, a heat dissipation piece is fixedly arranged on the heat dissipation piece base, and a fan blade group is installed on the fan blade group. One side, facing the fan blade group, of the motor base is provided with an air collection enclosure bulkhead and a ventilation hole, the maximum outer diameter of the fan blade base on the fan blade group is set as D, the inner diameter of the air collection enclosure bulkhead is set as L, and D is less than L. According to the utility model, the heat dissipation channel is arranged on the path of the heat dissipation piece, so that the heat dissipation efficiency is improved; when the driving fan blade group works, part of air flow is guided into the heat dissipation channel and can directly act on the heat dissipation piece, so that heat on the heat dissipation piece is efficiently taken out in time, the efficient heat dissipation effect is achieved, meanwhile, in the structure, the heat dissipation piece does not need to be provided with radial heat dissipation wings, and the manufacturing cost of the heat dissipation piece is greatly saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to fan technical field, concretely is a kind of high-efficiency heat dissipation cold compress fan. BACKGROUND

[0002] Cold compress fan refers to the cold compress assembly being provided at fan air outlet, cold compress assembly works and is cooled by heat conduction mode to refrigeration, so that the cooled conduction piece can be contacted with human body, and the effect of cold compress nursing is achieved.

[0003] Cold compress assembly generally uses semiconductor refrigeration sheet as refrigeration source, semiconductor refrigeration sheet works while one side working surface refrigeration, and the other side working surface will heat simultaneously, therefore, when using semiconductor refrigeration sheet as refrigeration source, the heat dissipation mode of the other side working surface needs to be designed, and the existing heat dissipation mode is that heat conduction is provided with heat dissipation piece on the heating working surface of semiconductor refrigeration sheet, heat is conducted and diffused by heat dissipation piece, then follow the wind direction and dissipate outward, the heat dissipation piece structure basically used in fan air duct is the heat dissipation piece with circumferential radiation fin, the heat dissipation piece of this shape not only has high cost, but also the heat generated by semiconductor refrigeration sheet needs to be conducted to the fin on the radiation, and then wind flow is taken out to realize heat dissipation, and the heat dissipation efficiency is relatively slow, therefore, when the heat dissipation piece with this structure works for a long time, or the working power is large, the fan body will also appear the phenomenon of heating, which seriously affects the user's experience. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of high-efficiency heat dissipation cold compress fan, heat dissipation channel is provided on the path of heat dissipation piece, part of wind flow is guided to enter heat dissipation channel when driving fan blade group works, can be directly acted on heat dissipation piece, to efficiently take out the heat on heat dissipation piece in time, the effect of high-efficiency heat dissipation is achieved, simultaneously, in this structure, heat dissipation piece does not need to be provided as radiating heat dissipation fin, and the cost of heat dissipation piece is greatly saved, the problem proposed in the above background technique is solved.

[0005] To achieve the above object, the utility model provides the following technical scheme: an efficient heat dissipation cold compress fan, fan shell is formed with the wind channel in the inside, the one end of wind channel is in communication with the air inlet setting, the other end is in communication with the air outlet setting, the inside support is arranged in the wind channel, the motor base is provided on the side of the inside support to the air inlet, the fan blade group is installed on the motor base, the heat dissipation piece base is provided on the side of the motor base to the air outlet, the heat dissipation piece is fixed on the heat dissipation piece base, the semiconductor support is provided at the air outlet, the semiconductor refrigeration piece is fixed on the semiconductor support, the semiconductor refrigeration piece one side working surface is in heat conduction connection with the heat dissipation piece towards the heat dissipation piece, the semiconductor refrigeration piece side working surface is in heat conduction connection with the conducting piece away from the heat dissipation piece, the semiconductor support is formed with the sub air outlet, the motor base is formed annular wind collecting wall in the part body axial extension towards the fan blade group side, the motor base is provided with the ventilation hole in the wind collecting wall surrounded area, the ventilation hole is in communication with the heat dissipation piece base internal area setting, the heat dissipation piece base internal area is in communication with the sub air outlet setting, the fan blade group includes the fan blade base and the fan blade that surrounds the fan blade base and is uniformly arranged, the maximum outer diameter of the fan blade base is set as D, the wind collecting wall inner diameter is set as L, satisfies D < L.

[0006] Preferably, the semiconductor support is provided with a semiconductor through hole penetrating through the front and back sides, and the semiconductor refrigeration piece is installed in the semiconductor through hole.

[0007] Preferably, the fan blade group is provided with a booster cover, opposite ends of the booster cover are provided as openings, and an inner diameter of the booster cover gradually increases from the air inlet to the air outlet.

[0008] Preferably, the fan shell is integrally connected with a fan handle, the fan handle includes a handle front shell and a handle rear shell connected with each other, a cavity is formed between the handle front shell and the handle rear shell, a circuit board assembly and a storage battery are arranged in the cavity, and the storage battery is electrically connected with the circuit board assembly.

[0009] Preferably, a display screen is electrically connected to the circuit board assembly, a through hole is formed on the handle front shell at a position corresponding to the display screen, a light-transmitting cover plate is packaged in the through hole, and display content of the display screen is displayed outward through the light-transmitting cover plate.

[0010] Preferably, a speed regulating switch is electrically connected to the circuit board assembly, the speed regulating switch is a roller switch, and a part of the roller switch is arranged outside the handle front shell.

[0011] Preferably, a cold compress switch is electrically connected to the circuit board assembly, the cold compress switch is arranged in a preset through hole of the handle front shell and extends outward from the through hole.

[0012] Preferably, the circuit board assembly is electrically connected with a USB interface arranged in a pre-set through hole of the handle front shell and extending outward from the through hole.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] The utility model discloses, set up the heat dissipation channel on the path of heat dissipation spare, part wind flow is guided into the heat dissipation channel when the work of driving fan blade group, can directly act on heat dissipation spare, to high -efficiently take out the heat on heat dissipation spare in time, play the effect of high -efficient heat dissipation, simultaneously, in this structure, heat dissipation spare need not set up as the radiating heat dissipation wing, greatly save the cost of heat dissipation spare. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 For the utility model structure explosion Figure 1 ;

[0016] Figure 2 For the utility model structure explosion Figure 2 ;

[0017] Figure 3 For the utility model structure schematic diagram;

[0018] Figure 4 For the utility model shell A-A section position schematic diagram;

[0019] Figure 5 For the utility model shell A-A section view;

[0020] Figure 6 For the utility model driving fan blade group structure schematic diagram;

[0021] Figure 7 For the utility model wind collecting wall structure schematic diagram.

[0022] In the drawing: 11 conducting piece;12 semiconductor refrigeration piece;13 semiconductor support;131 semiconductor through -hole;132 sub air outlet;14 heat dissipation spare;15 internal support;151 motor base;152 heat dissipation spare base;153 wind collecting wall;154 ventilation hole;16 driving fan blade group;161 fan blade base;162 driving blade;17 booster cover;18 fan shell;181 air inlet;182 air outlet;21 handle front shell;22 handle rear shell;23 circuit board assembly;24 battery;25 display screen;26 speed regulating switch;27 cold compress switch;28 USB interface. DETAILED DESCRIPTION

[0023] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0024] Please refer to Figures 1-7 A high-efficiency heat dissipation cold compress fan, comprising a fan shell 18, a through air duct is formed inside the fan shell 18, one end of the through air duct is in communication with an air inlet 181, and the other end is in communication with an air outlet 182, an internal support 15 is arranged in the through air duct, a motor base 151 is arranged on one side of the internal support 15 facing the air inlet 181, a fan blade set 16 is installed on the motor base 151, a heat dissipation piece base 152 is arranged on one side of the motor base 151 facing the air outlet 182, a heat dissipation piece 14 is fixedly arranged on the heat dissipation piece base 152, a semiconductor support 13 is arranged at the air outlet 182, a semiconductor refrigeration piece 12 is fixedly arranged on the semiconductor support 13, a semiconductor through hole 131 penetrating through the front and back sides is formed in the semiconductor support 13, the semiconductor refrigeration piece 12 is installed in the semiconductor through hole 131, one side working surface of the semiconductor refrigeration piece 12 facing the heat dissipation piece 14 is in thermal conduction connection with the heat dissipation piece 14, the other side working surface of the semiconductor refrigeration piece 12 away from the heat dissipation piece 14 is in thermal conduction connection with a conduction piece 11, a sub-air outlet 132 is formed in the semiconductor support 13, a part of the body of the motor base 151 is axially extended to form an annular air collecting surrounding wall 153 on one side of the motor base 151 facing the fan blade set 16, a ventilation hole 154 is arranged in the air collecting surrounding wall 153, the ventilation hole 154 is in communication with the internal region of the heat dissipation piece base 152, the internal region of the heat dissipation piece base 152 is in communication with the sub-air outlet 132, the fan blade set 16 comprises a fan blade base 161 and a plurality of fan blades 162 arranged uniformly around the fan blade base 161, the maximum outer diameter of the fan blade base 161 is D, the inner diameter of the air collecting surrounding wall 153 is L, and D < L is satisfied, under this condition, the air flow generated by the fan blade set 16 during operation is collected by the air collecting surrounding wall 153 and then flows into the heat dissipation piece base 152 through the ventilation hole 154 to directly act on the heat dissipation piece 14, so that the heat on the heat dissipation piece 14 can be efficiently taken out from the sub-air outlet 132, and the heat dissipation effect of the heat dissipation piece 14 is realized.

[0025] The fan blade set 16 is surrounded by a booster cover 17, the two ends of the booster cover 17 are both open, the inner diameter of the booster cover 17 gradually increases from the air inlet 181 to the air outlet 182 at least in part, and the booster cover 17 can effectively compress the air flow passage inner diameter and has the effect of gathering and boosting pressure.

[0026] The fan handle is integrally connected with the fan housing 18, and comprises a handle front shell 21 and a handle rear shell 22 which are connected with each other in a cover-hung manner, and a cavity is formed between the handle front shell 21 and the handle rear shell 22, and an electric circuit board assembly 23 and a storage battery 24 are arranged in the cavity, and the storage battery 24 is electrically connected with the electric circuit board assembly 23. A display screen 25 is arranged on the electric circuit board assembly 23 in an electrically connected manner, a through hole is formed on the handle front shell 21 at a position corresponding to the display screen 25, a light-transmitting cover plate is encapsulated in the through hole, and the display content of the display screen 25 is displayed outward through the light-transmitting cover plate, and the display screen 25 can be used to display the real-time power of the storage battery 24 and / or the working state of the fan blade set 16 and the semiconductor refrigeration fin 12. A speed regulating switch 26 is arranged on the electric circuit board assembly 23 in an electrically connected manner, the speed regulating switch 26 is a roller switch, and a part of the body of the roller switch is arranged outside the handle front shell 21, and the speed regulating switch 26 is used to adjust the working rotating speed and the working start-stop state of the fan blade set 16. A cold compress switch 27 is arranged on the electric circuit board assembly 23 in an electrically connected manner, the cold compress switch 28 is arranged in a preset through hole of the handle front shell 21 and extends outward from the through hole, and the cold compress switch 28 is used to control the working start-stop state of the semiconductor refrigeration fin 12. A USB interface 28 is arranged on the electric circuit board assembly 23 in an electrically connected manner, the USB interface 28 is arranged in a preset through hole of the handle front shell 21 and extends outward from the through hole, and when the USB interface 28 is externally connected with an external power supply through a charging wire, the storage battery 24 can be charged to supplement the electric energy.

[0027] In summary: the heat dissipation passage is arranged on the path of the heat dissipation piece 14, and part of the airflow is guided into the heat dissipation passage when the fan blade set 16 works, and can directly act on the heat dissipation piece 14, so that the heat on the heat dissipation piece 14 is efficiently taken out in time, and the effect of efficient heat dissipation is achieved, and meanwhile, in this structure, the heat dissipation piece 14 does not need to be arranged as a radial heat dissipation wing, and the manufacturing cost of the heat dissipation piece 14 is greatly saved.

[0028] It should be noted that, in the present document, the terms such as first and second, and the like, are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Moreover, the terms "comprising", "including", or any other variant are intended to cover non-exclusive inclusions, so that processes, methods, articles, or apparatuses that include a series of elements not only include those elements, but also include other elements not explicitly listed, or inherent to such processes, methods, articles, or apparatuses.

[0029] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation cooling fan, comprising a fan housing (18), wherein an air passage is formed inside the fan housing (18), one end of the air passage is connected to an air inlet (181), and the other end is connected to an air outlet (182), an internal support (15) is provided inside the air passage, a motor base (151) is provided on the side of the internal support (15) facing the air inlet (181), a fan blade assembly (16) is mounted on the motor base (151), and a heat sink base is provided on the side of the motor base (151) facing the air outlet (182). (152), a heat sink (14) is fixedly mounted on the heat sink base (152), a semiconductor support (13) is provided at the air outlet (182), a semiconductor cooling chip (12) is fixedly mounted on the semiconductor support (13), the working surface of the semiconductor cooling chip (12) facing the heat sink (14) is thermally connected to the heat sink (14), and the working surface of the semiconductor cooling chip (12) away from the heat sink (14) is thermally connected to a conductive element (11), and a sub-air outlet (132) is formed on the semiconductor support (13), characterized in that: The motor base (151) extends axially towards the side of the fan blade assembly (16) to form an annular air-collecting wall (153). The motor base (151) is provided with ventilation holes (154) within the area surrounded by the air-collecting wall (153). The ventilation holes (154) are connected to the internal area of ​​the heat sink base (152). The internal area of ​​the heat sink base (152) is connected to the sub-air outlet (132). The fan blade assembly (16) includes a fan blade base (161) and fan blades (162) evenly arranged around the fan blade base (161). The maximum outer diameter of the fan blade base (161) is set to D, and the inner diameter of the air-collecting wall (153) is set to L, satisfying D < L.

2. The high-efficiency heat dissipation cooling fan according to claim 1, characterized in that: The semiconductor support (13) has a semiconductor through hole (131) extending through both the front and rear sides, and the semiconductor cooling chip (12) is installed in the semiconductor through hole (131).

3. The high-efficiency heat dissipation cooling fan according to claim 1, characterized in that: The fan blade assembly (16) is surrounded by a pressure boosting cover (17), which has openings at both ends. The inner diameter of the pressure boosting cover (17) gradually increases from the air inlet (181) to the air outlet (182).

4. The high-efficiency heat dissipation cooling fan according to claim 1, characterized in that: The fan housing (18) is integrally connected to a fan handle. The fan handle includes a front handle shell (21) and a rear handle shell (22) that are connected to each other. A cavity is formed between the front handle shell (21) and the rear handle shell (22). A circuit board assembly (23) and a battery (24) are disposed in the cavity. The battery (24) is electrically connected to the circuit board assembly (23).

5. The high-efficiency heat dissipation cooling fan according to claim 4, characterized in that: The circuit board assembly (23) is electrically connected to a display screen (25). A through hole is provided on the front shell (21) of the handle at the position corresponding to the display screen (25). A light-transmitting cover is encapsulated in the through hole, and the display content of the display screen (25) is displayed to the outside through the light-transmitting cover.

6. The high-efficiency heat dissipation cooling fan according to claim 4, characterized in that: A speed control switch (26) is electrically connected to the circuit board assembly (23). The speed control switch (26) is a roller switch, and part of the roller switch body extends out of the handle front shell (21).

7. The high-efficiency heat dissipation cooling fan according to claim 4, characterized in that: The circuit board assembly (23) is electrically connected to a cold compress switch (27), which is located in a pre-set through hole in the front shell (21) of the handle and extends outward from the through hole.

8. The high-efficiency heat dissipation cooling fan according to claim 4, characterized in that: The circuit board assembly (23) is electrically connected to a USB interface (28), which is located in a pre-set through hole in the front shell (21) of the handle and extends outward from the through hole.

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