Wafer drying device

Abstract

The utility model discloses a wafer drying device which comprises a chamber, and one side of the chamber is provided with an opening and closing door for a manipulator to enter. The wafer placing frame is arranged at the bottom of the cavity and is used for placing a plurality of wafers; the gas spraying assembly is arranged at the top of the cavity and used for enabling the cavity to isolate oxygen after gas is sprayed out; the heating assemblies are distributed on the two sides of the wafer placing frame and used for heating water on the surfaces of the wafers in the wafer placing frame; the exhaust pipeline is communicated with the bottom of the cavity and used for exhausting gas sprayed out by the gas spraying assembly. According to the wafer drying device provided by the utility model, after a plurality of wafers are placed in the wafer placing frame, air in the chamber is exhausted through the exhaust pipeline by hot nitrogen sprayed by the air spraying assembly, the interior of the chamber is in a dust-free and oxygen-free environment, and then the plurality of wafers are synchronously heated in the environment, so that the wafer drying efficiency is improved. In this way, not only can the wafers be prevented from being polluted, but also the multiple wafers can be dried quickly and effectively, and the actual use requirements are met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a drying device, especially a drying device for wafer. BACKGROUND

[0002] At present, in the semiconductor processing, the drying treatment of wafer usually adopts the centrifugal dehydration mode, that is, the drying operation of wafer is realized by the way of high-speed rotating wafer in the drying chamber full of mixed steam. However, when the wafer is taken out from the chamber by the mechanical hand after being spun dry by the rotating table, the upper surface of the wafer will be left with water mist due to the high humidity in the chamber, which will make the wafer unable to dry, cause adverse effects on the wafer, and reduce the yield of the wafer. Therefore, the existing method cannot meet the drying requirements of the wafer. SUMMARY

[0003] The utility model aims at overcoming the defects of prior art and provides a wafer drying device, which has simple structure, can quickly and effectively dry multiple wafers, and has low cost.

[0004] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of a wafer drying device, characterized by comprising:

[0005] A chamber, one side of the chamber is provided with an opening and closing door for the mechanical hand to enter;

[0006] A wafer placing frame is arranged at the bottom of the chamber to place multiple wafers;

[0007] A gas injection assembly is arranged at the top of the chamber to inject gas and isolate the chamber from oxygen;

[0008] A heating assembly is distributed on both sides of the wafer placing frame to heat the surface moisture of the wafer in the wafer placing frame;

[0009] An exhaust duct is communicated with the bottom of the chamber to exhaust the gas injected by the gas injection assembly.

[0010] In an embodiment, the wafer placing frame comprises support columns, and multiple accommodation plates are sequentially arranged on the support columns; the accommodation plates are provided with positioning pins for clamping wafers.

[0011] In an embodiment, the gas injection assembly comprises gas injection pipes arranged at the four edges of the top of the chamber, and the gas injection pipes are provided with multiple linearly distributed injection heads.

[0012] In an embodiment, the heating assembly comprises lamp pipe racks located on both sides of the inner wall of the chamber; the lamp pipe racks are provided with multiple parallelly distributed heating pipes, and the heating area of the heating pipes covers the wafers in the wafer placing frame.

[0013] In an embodiment, the top of the lamp holder is provided with a light-reflecting plate; the light-reflecting plate is distributed along the length direction of the heating tube, and the light-reflecting plate is arranged upwardly inclined towards one side of the wafer.

[0014] In an embodiment, the exhaust duct is further provided with an automatic damper capable of adjusting the exhaust size.

[0015] Thanks to the above technical scheme, the wafer drying device has the following advantages compared with the prior art:

[0016] The wafer drying device of the utility model, after multiple wafers are placed in the wafer placing frame, first, hot nitrogen gas sprayed by the air injection assembly is used to exhaust the air in the chamber through the exhaust duct, the inside of the chamber is in a dust-free and oxygen-free environment, then the surface moisture of the multiple wafers is synchronously heated in this environment, so that the moisture is evaporated, which not only prevents the wafers from being polluted, but also quickly and effectively dries the multiple wafers, meeting the actual use requirement. BRIEF DESCRIPTION OF DRAWINGS

[0017] The technical scheme of the utility model will be further described below in combination with the drawings:

[0018] Figure 1 It is a three-dimensional structure schematic view of an embodiment of the utility model;

[0019] Figure 2 It is a three-dimensional structure schematic view of another view of Figure 1

[0020] Figure 3 It is an internal structure schematic view of an embodiment of the utility model;

[0021] Figure 4 It is a three-dimensional structure schematic view of another view of Figure 3

[0022] Figure 5 It is a side sectional view of an embodiment of the utility model;

[0023] Figure 6 It is a use state view of an embodiment of the utility model when the mechanical hand puts in the wafer;

[0024] Wherein: 1, chamber; 2, wafer placing frame; 3, air injection assembly; 4, heating assembly; 5, exhaust duct; 6, FFU; 7, maintenance cover plate; 8, shutter; 9, wafer; 10, opening and closing door; 11, mechanical hand; 20, support column; 21, containing plate; 22, positioning PIN; 30, air injection pipe; 31, spray head; 40, lamp holder; 41, heating tube; 42, light-reflecting plate; 50, automatic damper. DETAILED DESCRIPTION​​

[0025] In order to make the person skilled in the art better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0026] The utility model provides a kind of wafer drying device, to solve the problem of the prior art due to humidity in chamber, water mist can not dry wafer, adversely affect wafer, wafer yield low.

[0027] For easy understanding, the specific process in the embodiments of the present application will be described below, please refer to Figures 1 to 4 The utility model discloses a kind of wafer drying device, including chamber 1, wafer placing frame 2, air injection component 3, heating component 4 and exhaust duct 5;The side of chamber 1 is equipped with open-close door 10 for mechanical hand 11 to enter;The wafer placing frame 2 is set in the bottom of chamber 1, to place multiple wafers 9;Air injection component 3 is set in the top of chamber 1, to spray out gas to let chamber 1 be isolated oxygen, heating component 4 is distributed in the both sides of wafer placing frame 2, to heat the surface moisture of wafer 9 located in wafer placing frame 2, so that moisture evaporates;Exhaust duct 5 is communicated with the bottom of chamber 1, to exhaust the gas sprayed by air injection component 3.

[0028] The wafer drying device of the utility model, multiple wafers 9 are placed in wafer placing frame 2 by mechanical hand 1, then air and impurity are discharged from exhaust duct 5 after aeration by air injection component 3, so that the inside of chamber 1 is in dustless and oxygen-free environment, to prevent impurity and oxidation from causing pollution to wafer, then the moisture on the surface of wafer is heated using heating component, so that moisture evaporates, wafer can be quickly dried, it is easy to operate, simple structure, improve the yield of wafer.

[0029] In an embodiment, referring to Figures 3 to 5 The placing frame 2 includes four support columns 20 arranged at the bottom of the chamber 1, and three bearing plates 21 are sequentially arranged on the four support columns 20 and are equidistantly distributed vertically.

[0030] In an embodiment, referring toFigures 3 to 6 The jetting assembly 3 comprises four jetting pipes 30 arranged at the four sides of the top of the chamber, the four jetting pipes 30 are rectangularly arranged at the top of the chamber 1, and a plurality of jetting heads 31 are linearly arranged on the jetting pipes 30 towards one side of the chamber 1. In this embodiment, the jetting heads 31 jet hot N2, and the plurality of jetting heads 31 quickly jet hot N2 into the chamber 1, so that the air in the chamber 1 is exhausted through the exhaust pipe 5, and the chamber 1 is in a dust-free and oxygen-free environment, thereby preventing the wafer from being polluted.

[0031] In an embodiment, referring to Figures 3 to 5 The heating assembly 4 comprises a lamp holder 40 arranged at the two sides of the inner wall of the chamber 1, and a plurality of heating pipes 41 are arranged in parallel on the lamp holder 40, and the heating area of the heating pipes 41 covers the wafer 9 arranged in the wafer placing frame 2. In this embodiment, the heating pipes 41 adopt infrared heating, and when working, the two sides of the heating pipes 41 quickly heat, so as to heat the moisture on the surface of the wafer 9 arranged in the wafer placing frame 2, and the moisture is evaporated, thereby realizing quick drying of the wafer in a dust-free and oxygen-free environment, and the drying efficiency is high. In addition, the absorption rate of water to different wavelengths of infrared light is different, and the medium and long waves are most easily absorbed, so the heating pipes 41 in this embodiment adopt medium and long wave infrared light.

[0032] In an embodiment, referring to Figures 3 to 5 The top of the lamp holder 40 is provided with a reflecting plate 42, the reflecting plate 42 is arranged along the length direction of the uppermost heating pipe 41, and the side of the reflecting plate 42 towards the wafer 9 is arranged to be inclined upwards. In this way, when the heating pipe 41 generates light during heating, the reflecting plate is used to reflect the light to the wafer, thereby improving the heating effect and efficiency.

[0033] In an embodiment, referring to Figure 6 The exhaust pipe 5 is further provided with an automatic damper 50 for adjusting the exhaust size. The automatic damper 50 is used to adjust the exhaust size of the exhaust pipe 5, so as to ensure that the exhaust amount is less than the nitrogen amount jetted by the jetting assembly, thereby enabling the chamber 1 to be filled with nitrogen.

[0034] In an embodiment, referring to Figure 4 and Figure 5 The chamber 1 is further provided with a shutter 8 and an FFU 6 arranged above the shutter. When the shutter is opened, the environment in the chamber can be filtered through the FFU, so as to ensure that the internal environment is clean. In addition, the left side of the chamber 1 is further provided with a maintenance cover plate 7, through which the chamber can be maintained and installed, which is convenient and practical.

[0035] Referring to Figures 1 to 6 An embodiment is listed below to illustrate the specific process.

[0036] When the opening and closing door 10 is opened, the mechanical arm 11 places the wafers 9 on the three bearing plates 21 inside the chamber 1 in sequence and positions them through the corresponding positioning PIN 22.

[0037] The shutter 8, the FFU 6 and the automatic air door 50 are all in the open state, and after being opened for a period of time, the air inside the chamber 1 is purified;

[0038] The mechanical arm 11 exits the chamber 1, and the shutter 8 and the FFU 6 are closed, at which time the inside of the chamber 1 is in a sealed state, the nozzle 31 sprays hot N2, and at the same time the automatic air door 50 adjusts the exhaust amount of the exhaust duct 5 to ensure that the flow of hot N2 is greater than the exhaust flow of the exhaust duct 5;

[0039] After a certain period of time, the hot N2 fills the chamber 1, the air in the chamber 1 is completely squeezed out of the chamber 1 by the N2, and the inside of the chamber 1 is in a dust-free and oxygen-free environment, at which time the automatic air door 50 is closed, the heating pipe 41 is opened, and the surface moisture of the wafers inside the chamber is infrared heated, so that the moisture evaporates, thereby quickly and effectively completing the drying treatment of multiple wafers, which is convenient, fast and efficient.

[0040] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer drying apparatus characterized by comprising: The utility model relates to a wafer drying device, which comprises: a chamber (1) with an opening and closing door (10) on one side for the entry of a mechanical hand (11); a wafer placing frame (2) arranged at the bottom of the chamber (1) for placing a plurality of wafers (9); a gas injection assembly (3) arranged at the top of the chamber (1) for injecting gas and then isolating the chamber (1) from oxygen; a heating assembly (4) distributed on both sides of the wafer placing frame (2) for heating the surface moisture of the wafers (9) in the wafer placing frame (2); an exhaust duct (5) in communication with the bottom of the chamber (1) for exhausting the gas injected by the gas injection assembly (3).

2. The wafer drying apparatus of claim 1, wherein: The wafer placing frame (2) comprises support columns (20), and a plurality of accommodating plates (21) are sequentially arranged on the support columns (20) in an up-down interval arrangement; the accommodating plates (21) are provided with positioning pins (22) for clamping wafers (9).

3. The wafer drying apparatus of claim 1, wherein: The gas injection assembly (3) comprises gas injection pipes (30) arranged at the top of the chamber (1) on four sides, and a plurality of linearly distributed injection heads (31) are arranged on the gas injection pipes (30).

4. The wafer drying apparatus of claim 1, wherein: The heating assembly (4) comprises lamp holders (40) arranged on the inner walls of the chamber (1) on both sides; a plurality of parallelly distributed heating pipes (41) are arranged on the lamp holders (40), and the heating areas of the heating pipes (41) cover the wafers (9) in the wafer placing frame (2).

5. The wafer drying apparatus of claim 4, wherein: A light-reflecting plate (42) is arranged at the top of the lamp holder (40); the light-reflecting plate (42) is distributed along the length direction of the heating pipes (41), and the light-reflecting plate (42) is arranged to be inclined upward toward one side of the wafers (9).

6. The wafer drying apparatus of claim 1, wherein: An automatic air door (50) for adjusting the exhaust size is further arranged in the exhaust duct (5).

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