Mask structure, mask belt and mold spraying device

Abstract

The utility model discloses a mask structure, a mask belt and a mold spraying device, and belongs to the technical field of electroplating. The mask structure comprises a mask frame, a mask base island and a connecting piece, the mask base island is nested in the mask frame; the connector connects the mask base island and the mask frame. According to the mask structure, the mask base island and the mask frame are connected into a whole through the connecting piece, the annular electroplating area is formed between the mask base island and the mask frame, splicing of a plurality of molds is not needed, the problems that electroplating liquid permeates into splicing seams and a non-electroplating area is polluted are solved, the product quality is guaranteed, and meanwhile the connecting piece can further enhance the strength of the mask structure and improve the stability of the mask structure. The mask base island and the mask frame are provided with the bosses and the grooves and can be matched with a backflow structure on a mold spraying device, so that the mask structure and the backflow structure are connected more firmly, the problem that the mask structure and the backflow structure deviate under washing of electroplating liquid is solved, and the electroplating liquid is prevented from overflowing to a non-electroplating area and polluting the non-electroplating area.

Description

Technical Field

[0001] This utility model relates to a mask structure, a mask strip, and a spraying device, belonging to the field of electroplating technology. Background Technology

[0002] In recent years, with the rapid development of microelectronics and communication technologies, electronic products such as semiconductor leadframes, LEDs, and electronic connectors require electroplating to achieve interconnection between chips and circuit boards, as well as soldering. A ring-shaped disc plating mold is a specialized mold for electroplating integrated circuit leadframes. It includes a mold body, positioning holes, ceramic positioning pins, a reflow structure, and a mask structure. Using this mold, precise electroplating of integrated circuit leadframes can be achieved, improving their electrical performance and reliability, and meeting the high-quality and high-reliability requirements of electronic products.

[0003] To meet the demands of manufacturing integrated circuit semiconductor components, certain areas of the lead frame surface of integrated circuits require electroplating with precious metals. During electroplating, a mask structure is needed to protect the areas on the surface that do not require electroplating. In traditional ring-shaped electroplating processes, a splicing method is typically used, where four molds are joined together, and the mask structure is mounted on the upper surface of the molds. During electroplating, the electroplating solution easily seeps into the splicing areas, corroding the non-plated areas, affecting product quality. Furthermore, installation is cumbersome and difficult to replace. If the connection between the mask structure and the reflow structure is not secure, the electroplating solution ejected from the nozzle can easily cause the mask structure to deviate from or even detach from the reflow structure, resulting in electroplating solution overflowing into the non-plated areas and damaging them. Utility Model Content

[0004] This invention provides a mask structure, a mask tape, and a spraying device. The mask structure, mask tape, and spraying device can prevent electroplating solution from seeping into the joints, ensuring product quality. They are also easy to install and replace, and can solve the problems of weak connection with the return structure and the mask structure deviating from or detaching from the return structure.

[0005] This utility model is achieved through the following technical solution:

[0006] In a first aspect, this utility model provides a mask structure, comprising:

[0007] Mask frame;

[0008] The mask base island is nested within the mask frame;

[0009] A connector that connects the mask base island and the mask frame.

[0010] In one embodiment of this invention, the mask base island is provided with a second protrusion and a second groove. The second protrusion is arranged around the outer contour of the mask base island to prevent electroplating solution from leaking into non-electroplating areas.

[0011] In one embodiment of this invention, the mask frame is provided with a first boss and a first groove. The first boss is arranged around the perimeter of the mask frame to prevent electroplating solution from leaking into non-electroplating areas.

[0012] In one embodiment of this invention, a groove is formed between the connector, the mask base island, and the mask frame. This facilitates the flow of the electroplating solution within the electroplating area, forming a complete annular electroplating area.

[0013] In one embodiment of this utility model, an electroplating area is formed between the mask base island and the mask frame, and the electroplating area has a ring structure.

[0014] Secondly, this utility model provides a mask strip, including the aforementioned mask structure.

[0015] In one embodiment of this invention, the mask tape is provided with guide posts. This enables rapid positioning of the mask tape and facilitates its installation and replacement.

[0016] Thirdly, this utility model provides a spraying device, including the aforementioned mask belt.

[0017] In one embodiment of this utility model, a reflow structure is also included, and the mask tape is wrapped around the reflow structure.

[0018] In one embodiment of this utility model, the reflux structure includes a third boss and a third groove, the third boss abutting against the first groove and the second groove, and the third groove abutting against the connector.

[0019] Beneficial effects

[0020] The mask structure provided by this utility model includes a connector, a mask base island, and a mask frame. The connector links the mask base island and the mask frame into a single unit, forming an annular electroplating area between them. This eliminates the need for multiple molds, solving the problem of electroplating solution seeping into the seams and contaminating non-electroplated areas, thus ensuring product quality. Simultaneously, the connector also strengthens the mask structure and improves its stability. Grooves are formed between the connector, the mask base island, and the mask frame to facilitate the flow of electroplating solution. Bosses and grooves are provided on the mask base island and the mask frame, preventing electroplating solution from leaking into non-electroplated areas and allowing it to cooperate with the return structure on the annular disc spray mold. The mask structure covers the return structure, making the connection between the mask structure and the return structure more secure and solving the problem of misalignment between the mask structure and the return structure under the scouring of electroplating solution, preventing electroplating solution from overflowing into non-electroplated areas and contaminating them. Multiple mask structures are combined to form a mask strip, which is equipped with guide posts to enable the mask strip to be quickly installed onto the annular disc spray mold, facilitating the installation and replacement of the mask structure. Attached Figure Description

[0021] Figure 1 A perspective view of the mask strip provided by this utility model.

[0022] Figure 2 A perspective view of the mask structure provided by this utility model.

[0023] Figure 3 This is a three-dimensional view of the mask strip provided by this utility model.

[0024] Figure 4 for Figure 3 A magnified view of a portion of point A in the middle.

[0025] Figure 5 A partial perspective view of the spraying device provided by this utility model.

[0026] In the figure: 1. Mask structure; 11. Connector; 12. Mask base island; 13. Mask frame; 14. First boss; 15. Second boss; 16. First groove; 17. Second groove; 2. Reflow structure; 21. Third boss; 22. Third groove; 3. Electroplating area; 4. Guide post; 100. Spraying device; 200. Mask strip. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] like Figures 1 to 4 As shown, this application provides a mask structure 1 used to protect the parts of the surface of an electroplated product that do not need to be electroplated during electroplating, preventing the electroplating solution from flowing into the non-electroplated areas. The mask structure 1 includes a connector 11, a mask base island 12, and a mask frame 13. The mask base island 12 is located inside the mask frame 13, and the side of the mask base island 12 closest to the electroplated product is flush with the mask frame 13. The mask base island 12 is connected to the mask frame 13 via the connector 11, forming a single unit, i.e., mask structure 1, which can shield the areas of the electroplated product that do not need to be electroplated, preventing the electroplating solution from contaminating the non-electroplated areas. An electroplating area 3 is formed between the mask base island 12 and the mask frame 13. The electroplating area 3 is the area of ​​the electroplated product that needs to be electroplated, and its shape and size can be adapted according to the shape and size of the electroplated product. Specifically, in this embodiment, the electroplating area 3 is a ring-shaped structure.

[0031] Furthermore, in some embodiments, the connector 11 has a cross structure or an X-shaped cross structure and is located on the side of the mask base island 12 facing away from the electroplated product. A groove is formed between the side of the connector 11 closest to the electroplated product and the mask base island 12 and mask frame 13, facilitating the flow of electroplating solution within the electroplating area 3 to form a complete annular electroplating area. The thickness of the connector 11 is less than the thickness of the mask frame 13. The connector 11 connects the mask base island 12 and the mask frame 13 into a single unit, which not only strengthens the mask structure 1 and improves its stability, but also eliminates the need for splicing, solving the problem of electroplating solution seeping into non-electroplated areas through splicing seams and contaminating them, thus ensuring product quality. In addition, the mask base island 2 and the mask frame 3 are integrated, forming a complete annular electroplating area between them. This eliminates the need for multiple molds to assemble the annular electroplating area, reducing the precision requirements of the molds and thus lowering production costs.

[0032] Optionally, in this embodiment, the thickness of the connector 11 is less than 0.8 mm to prevent the groove between the connector 11 and the mask base island 12 and the mask frame 13 from being too small, which would affect the flow of the electroplating solution or result in less electroplating solution in the corresponding electroplating area at the groove, making it impossible for the electroplating area 3 to obtain sufficient metal ions to complete the electroplating, resulting in uneven electroplating in the electroplating area 3 and affecting the quality of the product.

[0033] Furthermore, in some embodiments, one side of the mask base island 12 is a plane that abuts against the electroplated product to shield non-electroplated areas. A second protrusion 15 and a second groove 17 are provided on the side opposite to this plane. The second protrusion 15 is arranged around the outer contour of the mask base island 12 to prevent electroplating solution from leaking into non-electroplated areas.

[0034] Furthermore, in some embodiments, the side of the mask frame 13 flush with the mask base island 12 is a plane that abuts against the electroplated product to shield the non-electroplated area. A first boss 14 and a first groove 16 are provided on the opposite side. The first boss 14 is arranged around the perimeter of the mask frame 13 to prevent electroplating solution from leaking into the non-electroplated area.

[0035] like Figure 1 and Figure 3 As shown, in some embodiments, multiple mask structures 1 are connected to form a mask strip 200. The mask strip 200 is provided with guide posts 4, which can provide positioning for the mask structure 1. When the mask strip 200 is installed on the spraying device 100, the guide posts 4 are inserted into the guide holes on the spraying device 100, which can realize the rapid positioning of the mask strip 200 and facilitate the installation and replacement of the mask strip 200.

[0036] like Figure 5As shown, this application also provides a spraying device 100, which includes a mask structure 1 and a return structure 2. The mask structure 1 is mounted on the return structure 2 to shield the non-electroplated areas of the electroplated product, preventing the electroplating solution from flowing into the non-electroplated areas. The return structure 2 is provided with a third boss 21 and a third groove 22. When the mask structure 1 is connected to the return structure 2, the third boss 21 abuts against the first groove 16 and the second groove 17 respectively, and the connector 11 abuts against the third groove 22. The mask structure 1 covers the outside of the return structure 2, making the connection between the mask structure 1 and the return structure 2 more secure.

[0037] Optionally, a protrusion can be provided on the side of the connector 11 that abuts against the third groove 22, which can improve the sealing between the mask structure 1 and the return structure 2 by compression.

[0038] Optionally, the mask structure 1 is made of silicone material, which has a certain degree of elasticity and is corrosion resistant, and can better cover the reflow structure 2.

[0039] The working principle of this utility model is as follows: The mask structure 1 includes a connector 11, a mask base island 12, and a mask frame 13. The mask base island 12 and the mask frame 13 are connected as a whole by the connector 11, forming an annular electroplating area 3 between the mask base island 12 and the mask frame 13. This eliminates the need for multiple molds to form an annular structure, solving the problem of electrode liquid leakage at the seams, which affects product quality. The mask base island 12 and the mask frame 13 are respectively provided with a second boss 15 and a first boss 14, which can prevent electroplating liquid from leaking into non-electroplating areas. The mask base island 12 and the mask frame 13 are also respectively provided with a second groove 17 and a first groove 16. The second groove 17 and the first groove 16 abut against a third boss 21, and the connector 11 abuts against the third groove 22, making the connection between the mask structure 1 and the reflow structure 2 more secure. Multiple mask structures 1 are connected to form a mask belt 200. The mask belt 200 is provided with guide posts 4. The guide posts 4 can provide positioning for the installation of the mask belt 200, and can quickly install the mask belt 200 on the spraying device 100, realizing the rapid installation and replacement of the mask belt 200.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

[0042] This document uses specific embodiments to illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A mask structure, characterized by, The application relates to a mask structure. The mask structure comprises: a mask frame (13); a mask base island (12) nested in the mask frame (13); 2. The masking structure of claim 1, wherein a connecting piece (11) connecting the mask base island (12) and the mask frame (13).

3. The masking structure of claim 1, wherein The mask base island (12) is provided with a second boss (15) and a second groove (17).

4. The masking structure of claim 1, wherein, The mask frame (13) is provided with a first boss (14) and a first groove (16).

5. The masking structure of claim 1, wherein The connecting piece (11) is provided with a groove between the mask base island (12) and the mask frame (13).

6. A mask band, characterized by The mask base island (12) and the mask frame (13) form an electroplating area (3) therebetween, and the electroplating area (3) is in a ring structure.

7. The masking tape of claim 6, wherein, The application further relates to a mask structure.

8. A die casting apparatus characterized by comprising: The mask belt (200) is provided with a guide column (4).

9. An apparatus as claimed in claim 8, wherein, The application further relates to a mask belt.

10. A die casting apparatus as defined in claim 9, wherein The mask belt (200) is coated on a reflow structure (2). The reflow structure (2) comprises a third boss (21) and a third groove (22), the third boss (21) abuts against the first groove (16) and the second groove (17), and the third groove (22) abuts against the connecting piece (11).

Images