CPO optical module
By increasing the number of silicon photonic engines and optimizing their layout in the CPO optical module, the problems of insufficient number of silicon photonic engines and wasted space in the existing technology are solved, achieving more efficient data transmission and better heat dissipation.
Patent Information
- Application Number
- CN202520221591.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-11
AI Technical Summary
Existing CPO optical modules are insufficient in terms of the number and layout of silicon photonic engines to meet the needs of large-scale data transmission, and they also have insufficient space utilization and poor heat dissipation.
Eight silicon photonics engine groups are arranged in an octagonal pattern around the ASI C chip. Each silicon photonics engine group has four silicon photonics engines, increasing the number of silicon photonics engines and optimizing the layout to form a denser structure.
It increases the total bandwidth of the CPO optical module, reduces space waste, and improves the heat dissipation performance of the silicon photonics engine.
Smart Images
Figure CN223742797U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical module technical field, concretely relates to a CPO optical module. BACKGROUND
[0002] At present, the structure of CPO optical module is as shown in Figure 1 and Figure 2 ASI C chip is generally adopted in the center, four silicon light engine groups are distributed in each direction of the four directions of ASI C chip, each silicon light engine group has four silicon light engines, that is, a total of 16 silicon light engines, and each silicon light engine is interconnected with ASI C chip through a PCB board, each silicon light engine has 8 paths, each path is 100G, 16*8*100G=12800G=12.8T, that is, the total bandwidth is 12.8T, which is more and more difficult to meet the demand of large-scale data transmission, in addition, the type of CPO optical module has a large blank area without layout of silicon light engine at the corner of quadrilateral, which is relatively wasteful of space, and is not friendly to the heat dissipation of silicon light engine. SUMMARY
[0003] The technical problem to be solved by the utility model is to provide a CPO optical module to overcome the deficiencies in the prior art.
[0004] The technical scheme for solving the above technical problem of the utility model is as follows:
[0005] A CPO optical module comprises a PCB board and ASI C chips and silicon light engine groups fixed on the PCB board, each silicon light engine group has four silicon light engines, each silicon light engine is interconnected with the ASI C chip through the PCB board, the number of silicon light engine groups is eight, and the eight silicon light engine groups are distributed in an octagonal manner around the ASI C chip.
[0006] On the basis of the above technical scheme, the utility model can also be improved as follows.
[0007] Further, the eight silicon light engine groups are distributed at equal angles and equal distances in an octagonal manner around the ASI C chip.
[0008] Further, the silicon light engine has eight light paths.
[0009] Further, the silicon light engine has 100G per light path.
[0010] The utility model has the advantages of:
[0011] 1) The number of silicon light engines is expanded from 16 to 32 in the utility model, that is, the number is increased by 1 times, so that the total bandwidth of the CPO optical module can be effectively improved to meet the demand of large-scale data transmission.
[0012] 2) Compared with the CPO optical module in the prior art, by increasing the number of silicon light engines, that is, more dense and more reasonable layout, the waste of space is effectively reduced, and the heat dissipation of the silicon light engine is more friendly. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is a structure diagram of the CPO optical module in the prior art;
[0014] Figure 2 It is a physical diagram of the CPO optical module in the prior art;
[0015] Figure 3 It is a first structure diagram of the CPO optical module in the utility model;
[0016] Figure 4 It is a second structure diagram of the CPO optical module in the utility model;
[0017] Figure 5 It is a third structure diagram of the CPO optical module in the utility model.
[0018] In the drawings, the component list represented by each reference numeral is as follows:
[0019] 1, PCB board, 2, ASI C chip, 3, silicon light engine group. DETAILED DESCRIPTION
[0020] The principles and characteristics of the utility model are described below in combination with the drawings, and the examples are only used to explain the utility model and are not used to limit the scope of the utility model.
[0021] Example 1
[0022] As shown in Figure 3 , Figure 4 , Figure 5 A CPO optical module, comprising:
[0023] PCB board 1, ASI C chip 2 and silicon light engine group 3, ASI C chip 2 and silicon light engine group 3 are fixed on PCB board 1 respectively, each silicon light engine group 3 has four silicon light engines, that is, the number of silicon light engines possessed by each silicon light engine group 3 is still consistent with the prior art, each silicon light engine is interconnected with ASI C chip 2 through PCB board 1, that is, the way of interconnecting each silicon light engine with ASI C chip 2 is still consistent with the prior art, the number of silicon light engine groups 3 is eight, and the eight silicon light engine groups 3 are distributed in an octagonal manner around ASI C chip 2, for Figure 3 , Figure 4 , Figure 5 As shown in the three layouts of , this is only an exemplary description and does not exclude other ways of distribution.
[0024] The number of silicon light engines in the utility model is expanded from 16 to 32, that is, the number is increased by 1 times, so that the total bandwidth of the CPO optical module can be effectively improved to meet the large-scale data transmission demand, compared with the CPO optical module in the prior art, by increasing the number of silicon light engines, that is, more dense, and more reasonable layout is carried out, the waste of space is effectively reduced, and the heat dissipation of the silicon light engine is more friendly.
[0025] In the actual application process, the number of silicon light engine groups 3 cannot be expanded indefinitely, and there are generally only two ways:
[0026] 1) expanding the size of ASI C chip 2, which has the disadvantages of: rapid increase of chip cost, and more difficult heat dissipation;
[0027] 2) expanding the distance between the silicon light engine group 3 and the ASI C chip 2, which has the disadvantage that the high-speed RF line is longer, and the longer the high-speed RF line, the greater the signal attenuation (the core advantage of CPO is that the high-speed RF line is short).
[0028] Embodiment 2
[0029] As shown in Figure 3 , Figure 4 , Figure 5 The embodiment is a further improvement on the basis of embodiment 1, and the specific improvements are as follows:
[0030] Eight silicon light engine groups 3 surround the ASI C chip 2 in an octagonal manner at equal angles and equal distances (the distance of the silicon light engine group 3 from the center of the ASI C chip 2), and all the silicon light engine groups 3 surround the ASI C chip 2 evenly, which is more friendly to the heat dissipation of the silicon light engine.
[0031] Embodiment 3
[0032] As shown in Figure 3 , Figure 4 , Figure 5 The embodiment is a further improvement on the basis of embodiment 1 or 2, and the specific improvements are as follows:
[0033] The silicon light engine has eight light paths, each with 100G, 8x4x8x100G=25600G=25.6T, that is, the total bandwidth 25.6T, which can meet the large-scale data transmission demand.
[0034] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the utility model, and those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the utility model.
Claims
1. A CPO optical module, comprising: PCB board (1) and ASIC chip (2) and silicon light engine group (3) fixed on the PCB board (1), each silicon light engine group (3) has four silicon light engines, each silicon light engine is interconnected with the ASIC chip (2) through the PCB board (1), characterized in that the number of the silicon light engine group (3) is eight, and the eight silicon light engine groups (3) are distributed in an octagonal manner around the ASIC chip (2).
2. The CPO optical module of claim 1, wherein, Eight silicon light engine groups (3) are distributed at equal angles and equal distances in an octagonal manner around the ASIC chip (2).
3. The CPO optical module according to claim 1 or 2, characterized in that, The silicon light engine has eight light paths.
4. The CPO optical module of claim 3, wherein, Each light path of the silicon light engine is 100G.