Fan device and computing equipment

Abstract

The embodiment of the utility model provides a fan device and computing device.The fan device comprises a shell and a fan module, the shell comprises a bottom shell and a housing arranged on the bottom shell, the housing and the bottom shell define an air duct, the housing is provided with a support, the support defines a clamping groove, and the fan module is contained in the clamping groove; the fan module generates airflow flowing along the air channel in the operation process. The fan module is accommodated in the clamping groove, so that the assembly of the fan module can be simplified, and the assembly difficulty is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation, and in particular to a fan device and a computing device. BACKGROUND

[0002] Electronic equipment generates a large amount of heat during operation, and an effective heat dissipation structure can ensure that the electronic equipment operates within a safe temperature range and prevents performance degradation and hardware damage due to overheating.

[0003] In related technologies, a fan is used to dissipate heat from electronic equipment, but the installation structure of the fan is relatively complex and not easy to operate. UTILITY MODEL CONTENT

[0004] Embodiments of the present application provide a fan device and a computing device to solve or alleviate one or more technical problems in the prior art.

[0005] As an aspect of the embodiments of the present application, the embodiments of the present application provide a fan device, comprising:

[0006] A housing comprising a bottom shell and a cover shell arranged on the bottom shell, the bottom shell and the cover shell defining an air duct, the cover shell having a bracket, the bracket defining a clamping groove;

[0007] A fan module accommodated in the clamping groove, the fan module generating an airflow flowing along the air duct during operation.

[0008] In an embodiment, the bracket comprises at least two partitions, the at least two partitions being distributed at intervals in a first direction, and adjacent two partitions defining the clamping groove.

[0009] In an embodiment, the cover shell has a shell plate opposite the bottom shell, the partitions extending from the inner side of the shell plate toward the bottom shell, adjacent two partitions defining two first walls of the clamping groove, and the region between the adjacent two partitions defining a second wall of the clamping groove.

[0010] In an embodiment, the edges of the adjacent two partitions in the direction toward the bottom shell define a clamping entrance of the clamping groove, the clamping entrance being used for clamping the fan module into the clamping groove.

[0011] In an embodiment, the bracket further comprises a baffle, the baffle being arranged at a side of the clamping groove in a second direction and connected between the sides of the adjacent two partitions in the second direction.

[0012] The baffle has a ventilation gap facing away from the shell plate of the cover shell, the ventilation gap being used for the airflow to pass through.

[0013] In an embodiment, the clamping groove has baffles arranged at opposite sides thereof in the second direction.

[0014] In an embodiment, the number of fan modules is at least two, the number of partitions is at least three, the at least three partitions define at least two slots, and the at least two fan modules correspond to the at least two slots one by one.

[0015] In an embodiment, the fan device further comprises a flexible protection member, the flexible protection member is arranged on the outer peripheral wall of the fan module which is not passed through by the airflow, and the part of the flexible protection member between the fan module and the slot abuts against the inner wall of the slot, so that the fan module is clamped in the slot.

[0016] In an embodiment, the shell plate of the cover has a guide member extending towards the bottom shell, and the bottom shell has a guide matching member matched with the guide member.

[0017] In an embodiment, the guide member is arranged on the first side of the partition of the support in the second direction, and the guide member is connected with the corresponding partition and the baffle of the support through the connecting plate.

[0018] In an embodiment, the end of the fan module away from the shell plate of the cover defines a wire clamping notch on the first side in the second direction, and the connecting line of the fan module is clamped in the wire clamping notch and extends to the side of the fan module away from the shell plate of the cover.

[0019] In an embodiment, the air duct has an air inlet and an air outlet, and the cover defines the air inlet and the air outlet.

[0020] In an embodiment, the air inlet and the air outlet are distributed in the second direction, the air outlet is adjacent to the first side of the support in the second direction, and the air inlet is adjacent to the second side of the support in the second direction.

[0021] In an embodiment, the fan device further comprises a guide plate, the guide plate is connected to the inner side of the shell plate of the cover and extends in the airflow direction from the outer side of the support in the first direction.

[0022] In an embodiment, in the airflow direction, the guide plate comprises a first guide section adjacent to the fan module, a second guide section extending outwardly from the first guide section, and a third guide section extending away from the fan module from the second guide section.

[0023] As an aspect of the embodiments of the present application, the embodiments of the present application provide a computing device, comprising:

[0024] The fan device of any one of the above;

[0025] A computing module is arranged in the air duct of the fan device.

[0026] In an embodiment, in the airflow direction, the computing module is located downstream of the fan module of the fan device.

[0027] In an embodiment, the computing module is arranged at the inner side of the bottom shell of the fan device.

[0028] In an embodiment, the computing device further comprises a filtering assembly arranged at the air inlet, the filtering assembly comprising a filtering frame and a filtering member arranged at the filtering frame, the filtering member being configured to filter the airflow flowing therethrough.

[0029] In an embodiment, the cover of the fan device has an air inlet panel, the air inlet panel being formed with the air inlet;

[0030] The bracket of the fan device and the air inlet panel define a receiving space, the cover and the bottom shell of the housing of the fan device define a plug-in opening in communication with the receiving space, and the filtering assembly is plugged into the receiving space through the plug-in opening.

[0031] In an embodiment, the filtering frame has a plug-in end and a closed end, the plug-in end being plugged into the receiving space through the plug-in opening, and the closed end covering the plug-in opening.

[0032] In an embodiment, the closed end is clamped to the bottom shell.

[0033] In an embodiment, the computing device further comprises an air outlet guide assembly, the air outlet guide assembly comprising an air outlet grille panel arranged at the outer side of the air outlet and configured to guide the air outlet, and the non-air-outlet area of the air outlet grille panel is provided with a magnetic member;

[0034] The cover has an air outlet panel defining the air outlet, the non-air-outlet area of the air outlet panel is provided with a magnetic cooperating member corresponding to the magnetic member, and the magnetic member and the magnetic cooperating member generate a mutual magnetic force of adsorption to retain the air outlet grille panel on the air outlet panel.

[0035] In an embodiment, the air outlet guide assembly further comprises a decorative strip arranged at the non-air-outlet area of the air outlet grille panel and configured to cover the magnetic member.

[0036] In an embodiment, the computing device further comprises a control module arranged in the air duct.

[0037] In an embodiment, the control module is located downstream of the fan module in the airflow direction.

[0038] In an embodiment, the control module is arranged at the inner side of the shell panel of the cover of the fan device.

[0039] In an embodiment, the computing device further comprises a data plug connected to the control module, and the cover of the fan device has a plug mounting portion defining a plug mounting slot, and the data plug is clamped in the plug mounting slot.

[0040] In an embodiment, the plug mounting portion is arranged at the outer side of the bracket of the fan device in the first direction.

[0041] In an embodiment, the air inlet plate of the housing has an insertion hole in communication with the plug mounting slot, the insertion hole being used for inserting the data line to connect with the data plug.

[0042] In an embodiment, the computing device further comprises a light emitting member and a light guide member, the light emitting member and the light guide member being disposed in the interior of the housing adjacent to the air outlet, the light emitting member being disposed on the light guide member, and the light guide member being clamped with the housing.

[0043] In an embodiment, the housing defines a mounting space on the inner side of the air outlet plate, the light guide member is clamped in the mounting space, and the inner side of the air outlet plate has a first limiting portion, the end surface of the light guide member facing the bottom shell abutting against the first limiting portion.

[0044] In an embodiment, the computing device further comprises a temperature sensor, the inner side of the air outlet plate further has a second limiting portion, the end surface of the light guide member facing the bottom shell has a third limiting portion, the third limiting portion and the second limiting portion defining a limiting space, and the temperature sensor is clamped in the limiting space.

[0045] In an embodiment, the computing device further comprises a transparent cover plate and a display screen, the shell plate is formed with a display hole, the shell plate is formed with a inwardly protruding protection portion on the inner side periphery of the display hole, the transparent cover plate and the display screen are accommodated in the space defined by the protection portion and the display hole, and the transparent cover plate covers the outer side of the display screen.

[0046] In an embodiment, the computing device further comprises a display protection member, the display protection member covers the inner side of the display screen.

[0047] In an embodiment, the computing module comprises a circuit board and at least one heat dissipation member, at least one surface of the circuit board is provided with the heat dissipation member.

[0048] In an embodiment, the heat dissipation member comprises a heat conduction plate and a plurality of heat dissipation fins, at least one surface of the circuit board is covered with the heat conduction plate, and the plurality of heat dissipation fins are arranged at intervals on the side of the heat conduction plate away from the circuit board.

[0049] In an embodiment, a heat dissipation channel is formed between adjacent heat dissipation fins, and the heat dissipation channel extends in the airflow direction.

[0050] In an embodiment, the bottom shell of the fan device has a plurality of guide matching members distributed at intervals in a first direction, and the heat conduction plate and the circuit board are respectively formed with avoiding notches avoiding the plurality of guide matching members.

[0051] In an embodiment, the guide matching member is provided with a reinforcing plate on the side adjacent to the avoiding notch in a second direction, and the reinforcing plate abuts against the avoiding notch.

[0052] In one embodiment, the surface of the circuit board away from the bottom shell of the fan device has a first functional area and a second functional area distributed in a first direction, the first functional area is provided with a plurality of computing chips, and the second functional area is provided with an electrical connector for connecting with the control module.

[0053] The first functional area is covered with a heat dissipation member, and the second functional area is exposed to the outside of the heat dissipation member.

[0054] In one embodiment, the heat dissipation member covering the first functional area has a first heat dissipation area away from the second functional area and a second heat dissipation area adjacent to the second functional area, and the height dimension of the fins of the second heat dissipation area extending away from the bottom shell is smaller than that of the first heat dissipation area.

[0055] In one embodiment, the control module is located on the side of the second heat dissipation area and the second functional area away from the bottom shell.

[0056] In one embodiment, the control module is provided with a connection matching part corresponding to and matching with the electrical connector of the second functional area.

[0057] In one embodiment, one of the electrical connector and the connection matching part is a pin, and the other is a socket.

[0058] In one embodiment, the heat dissipation member is two, one of which covers the first functional area, and the other covers the surface of the circuit board facing the bottom shell.

[0059] In one embodiment, the heat conduction plate of the heat dissipation member has a positioning part and the other has a positioning matching part, and the positioning part and the positioning matching part are matched and connected.

[0060] In one embodiment, the heat conduction plate adjacent to the bottom shell has a fixing area at both ends in the first direction, respectively, and the fixing area is not provided with fins; the side of the fixing area adjacent to the first functional area is provided with a positioning column, and the circuit board and the heat conduction plate away from the bottom shell have a positioning hole corresponding to the positioning column, and the positioning column and the positioning hole are adapted to be inserted.

[0061] In one embodiment, the positioning column is formed with a first connecting hole penetrating through the heat conduction plate in the thickness direction of the heat conduction plate;

[0062] The inner surface of the bottom shell has a plurality of fixing columns, part of which corresponds to the positioning column and has a first fixing hole corresponding to the first connecting hole, and the circuit board and the heat conduction plate are fixed to the bottom shell by fasteners passing through the positioning hole and the first connecting hole in sequence and fastened to the first fixing hole.

[0063] In an embodiment, the fixing area adjacent to the second functional area is formed with a second connecting hole penetrating the heat conduction plate in the thickness direction of the heat conduction plate, and the second functional area is formed with a third connecting hole corresponding to the second connecting hole.

[0064] The partial fixing column has a second fixing hole corresponding to the second connecting hole, and the circuit board and the heat conduction plate are fixed to the bottom shell by fasteners sequentially penetrating the third connecting hole and the second connecting hole and fastened to the second fixing hole.

[0065] In an embodiment, the inner side of the bottom shell is provided with a reinforcing member extending towards the heat dissipation member, and the reinforcing member is connected with the plurality of fixing columns.

[0066] In an embodiment, the reinforcing member includes a reinforcing connecting plate and a reinforcing side plate connected to the outer side of the reinforcing connecting plate in the first direction, and the reinforcing connecting plate includes a connecting section connected between two adjacent fixing columns in the second direction and a reinforcing section connected to the outer side of the fixing columns distributed in the second direction.

[0067] In an embodiment, the circuit board of the computing module includes a board body, a chip array provided on the board body, and a voltage converter, the circuit board is provided with an electrical connector provided on the board body for supplying power to the voltage converter, and the voltage converter is provided on the board body for supplying power to the chip array according to a preset voltage range.

[0068] In an embodiment, the chip array includes at least two rows of chip groups, the at least two rows of chip groups are arranged at intervals in the second direction, and each row of chip groups includes a plurality of computing chips arranged at intervals in the first direction.

[0069] In an embodiment, the row of chip groups adjacent to the electrical connector is a first chip group, the row of chip groups away from the electrical connector is a second chip group, the electrical connector is arranged on the first side of the first chip group in the first direction and located on the side of the first chip group away from the second chip group.

[0070] In an embodiment, the electrical connector has a power input end and a power ground end, the power input end is connected with the second chip group through the voltage converter, the power ground end is connected with the first chip group, and the plurality of computing chips in the chip array are connected in series.

[0071] In an embodiment, the second side of the first chip group in the first direction is electrically connected with the second side of the second chip group in the first direction, the first side of the first chip group in the first direction is connected with the power ground end, and the first side of the second chip group in the first direction is connected with the voltage converter.

[0072] In an embodiment, the electrical connector has a signal connection end, and the signal connection end is connected with the chip array.

[0073] In one embodiment, the signal connection end is connected to the first chip group of the chip array by a signal line, and is connected to the computing chip closest to the signal connection end in the first chip group.

[0074] In one embodiment, the signal line is connected to the computing chip on one side of the computing chip in the second direction, and is connected to the adjacent computing chip on the other side of the computing chip in the second direction.

[0075] In one embodiment, the computing chip farthest from the signal connection end in the first chip group is connected to the computing chip closest to the computing chip in the second chip group.

[0076] In one embodiment, the number of computing chips in the first chip group of the chip array is odd.

[0077] In one embodiment, the voltage converter comprises a voltage regulating module, the voltage regulating module comprises a voltage control chip, an input voltage switching element and an output voltage switching element, the voltage control chip is used to control the on-off of the input voltage switching element and the on-off of the output voltage switching element according to a preset voltage range, respectively.

[0078] In one embodiment, the input voltage switching element and the output voltage switching element are metal oxide semiconductor field effect transistors, respectively.

[0079] In one embodiment, the voltage converter comprises a voltage stabilizing module, the voltage stabilizing module comprises an input capacitor element, an output capacitor element and an inductor element, the input capacitor element is connected between the power input end of the electrical connector and the input end of the input voltage switching element;

[0080] The input end of the inductor element is connected to the output end of the input voltage switching element and the input end of the output voltage switching element, respectively, and the output end of the inductor element is connected to the input end of the output capacitor element and the power supply input end of the chip array, respectively.

[0081] According to the fan device and the computing device, the bracket is designed on the shell, the clamping groove for accommodating the fan module is defined by the bracket, so that the assembly of the fan module is simplified, and the assembly difficulty is reduced.

[0082] The above summary is intended to illustrate only and is not intended to limit in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features will be readily apparent to those skilled in the art by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0083] In the drawings, like reference numerals refer to same or similar components throughout the several views. The drawings are not necessarily to scale. It should be understood that the drawings only depict some embodiments consistent with the disclosure and should not be considered to limit the scope of the disclosure.

[0084] FIG. 1A An exploded structural schematic view of a computing device according to an embodiment of the present application is provided;

[0085] FIG. 1B A structural schematic view of a computing device according to an embodiment of the present application is provided from one perspective;

[0086] FIG. 1C A structural schematic view of a computing device according to an embodiment of the present application is provided from another perspective;

[0087] FIG. 2 An exploded structural schematic view of a computing device according to an embodiment of the present application is provided;

[0088] FIG. 3A A structural schematic view of a computing device according to an embodiment of the present application is provided from one perspective;

[0089] FIG. 3B A structural schematic view of a computing device according to an embodiment of the present application is provided from another perspective;

[0090] FIG. 3C A structural schematic view of a cover of a fan device of a computing device according to an embodiment of the present application is provided;

[0091] FIG. 4 An exploded structural schematic view of a computing device according to an embodiment of the present application is provided;

[0092] FIG. 5A A structural schematic view of a filter assembly of a computing device according to an embodiment of the present application is provided;

[0093] FIG. 5B An exploded structural schematic view of a filter assembly and a cover of a computing device according to an embodiment of the present application is provided;

[0094] FIG. 5C A structural schematic view of an assembly of a filter assembly and a cover of a computing device according to an embodiment of the present application is provided;

[0095] FIG. 6 An exploded structural schematic view of an air outlet guide assembly of a computing device according to an embodiment of the present application is provided;

[0096] FIG. 7A A structural schematic view of a combination of a bottom case, a computing module and a heat dissipating member of a computing device according to an embodiment of the present application is provided;

[0097] FIG. 7B An exploded structural schematic view of a bottom shell, a computing module and a heat dissipation piece of a computing device according to an embodiment of the present application is shown;

[0098] FIG. 8A A front structural schematic view of a circuit board of a computing device according to an embodiment of the present application is shown;

[0099] FIG. 8B A three-dimensional structural schematic view of a circuit board of a computing device according to an embodiment of the present application is shown;

[0100] FIG. 8C A front structural schematic view of a circuit board of a computing device according to an embodiment of the present application is shown.

[0101] Legend of reference numerals:

[0102] 100 - computing device, 10 - control module, 11 - connection fitting part, 20 - computing module, 21 - circuit board, 211 - electrical connector, 212 - positioning hole, 213 - computing chip, 214 - first functional area, 215 - second functional area, 216 - third connecting hole, 217 - fitting hole, 22 - heat dissipation piece, 221 - heat conduction plate, 2211 - positioning column, 22111 - first connecting hole, 2212 - second fixing hole, 2213 - second connecting hole, 222 - heat dissipation fin, 2221 - first fixing hole, 2222 - heat dissipation channel, 223 - first heat dissipation area, 224 - second heat dissipation area, 2201 - avoiding gap;

[0103] 30 - fan module, 31 - wire clamping gap, 32 - flexible protection piece, 40 - data plug, 50 - display screen, 51 - transparent cover plate, 52 - display protection piece, 60 - wifi plug, 70 - light emitting piece, 71 - light guide piece, 711 - third limiting part, 712 - bayonet, 80 - temperature sensor, 90 - connecting line;

[0104] 1000 - shell, 1101 - air duct, 110 - cover shell, 111 - shell plate, 1111 - display hole, 1112 - protection part, 15 - flow guide plate, 151 - first flow guide section, 152 - second flow guide section, 153 - third flow guide section;

[0105] 112 - air inlet plate, 1121 - air inlet, 1122 - insertion hole, 113 - air outlet plate, 1131 - air outlet, 1132 - fitting groove, 1133 - first limiting part, 1134 - second limiting part, 1135 - connecting plate, 11351 - protrusion, 1136 - magnetic fitting piece, 114 - side plate, 1141 - through hole;

[0106] 115 - support, 1151 - clamping slot, 1152 - clamping entrance, 1153 - partition, 1154 - baffle, 1155 - ventilation gap, 1156 - connecting plate, 116 - accommodating space, 117 - plug mounting portion, 118 - guide, 119 - first screw column;

[0107] 120 - bottom shell, 121 - guide fitting, 1211 - reinforcing plate, 122 - second screw column, 123 - fixing column, 1231 - first fixing channel, 1232 - second fixing channel, 124 - insertion entrance, 125 - reinforcing member, 1251 - reinforcing connecting plate, 12511 - connecting section, 12512 - reinforcing section, 1252 - reinforcing side plate;

[0108] 130 - filter assembly, 131 - filter frame, 1311 - air flow passing port, 1312 - clamping protrusion, 1313 - insertion end, 1314 - closed end, 132 - filter member;

[0109] 140 - air outlet air guide assembly, 141 - air outlet grille plate, 1411 - mounting hole, 1412 - air deflector, 142 - decorative strip, 143 - magnetic member;

[0110] 2111 - power input terminal, 2112 - power ground terminal, 2113 - signal connection terminal, 210 - board body, 22 - chip set, 23 - first chip set, 24 - second chip set, 25 - conductive row, 251 - first conductive row, 252 - second conductive row, 253 - power supply input terminal, 254 - power supply output terminal, 26 - intermediate conductive member;

[0111] 27 - voltage converter, 271 - input voltage switching element, 272 - output voltage switching element, 273 - voltage control main chip, 274 - voltage control auxiliary chip, 275 - diode, 276 - resistance element, 277 - input capacitance element, 278 - inductance element, 279 - output capacitance element;

[0112] L1 - first direction, L2 - second direction, L3 - power supply line, L4 - signal line. DETAILED DESCRIPTION

[0113] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0114] The following is combined FIGS. 1A-8C The fan device and the computing device 100 of the embodiments of the present application are specifically described.

[0115] FIG. 1A FIG. 1 shows a perspective view of an exemplary computing device 100 according to embodiments of the present application, FIG. 1B FIG. 2 shows a view of an exemplary computing device 100 according to embodiments of the present application, FIG. 1C FIG. 3 shows another view of an exemplary computing device 100 according to embodiments of the present application, FIG. 2 FIG. 4 shows an exploded view of an exemplary computing device 100 according to embodiments of the present application, FIG. 3A FIG. 5 shows a perspective view of an exemplary computing device 100 according to embodiments of the present application, FIG. 3B FIG. 6 shows another perspective view of an exemplary computing device 100 according to embodiments of the present application, FIG. 3C FIG. 7 shows a view of a cover 110 of a fan device of an exemplary computing device 100 according to embodiments of the present application, FIG. 4 FIG. 8 shows an exploded view of an exemplary computing device 100 according to embodiments of the present application.

[0116] As shown in FIGS. 1, 2, 3, 4, 5, 6, 7 and 8, the computing device 100 according to embodiments of the present application can include a fan device and a computing module 20 disposed in an air duct 1101 of the fan device, the fan device can generate an airflow along the air duct 1101 during operation to improve the heat dissipation efficiency of the computing module 20. FIG. 1A , FIG. 2 and FIG. 3A As shown in FIGS. 1, 2, 3, 4, 5, 6, 7 and 8, the computing device 100 according to embodiments of the present application can include a fan device and a computing module 20 disposed in an air duct 1101 of the fan device, the fan device can generate an airflow along the air duct 1101 during operation to improve the heat dissipation efficiency of the computing module 20.

[0117] As shown in FIGS. 1, 2, 3, 4, 5, 6, 7 and 8, the computing device 100 according to embodiments of the present application can include a fan device and a computing module 20 disposed in an air duct 1101 of the fan device, the fan device can generate an airflow along the air duct 1101 during operation to improve the heat dissipation efficiency of the computing module 20. FIG. 1A , FIG. 3A and FIG. 4 As shown in FIGS. 1, 2, 3, 4, 5, 6, 7 and 8, the computing device 100 according to embodiments of the present application can include a fan device and a computing module 20 disposed in an air duct 1101 of the fan device, the fan device can generate an airflow along the air duct 1101 during operation to improve the heat dissipation efficiency of the computing module 20.

[0118] It should be noted that there are various implementation manners for the combination of the bracket 115 and the cover 110.

[0119] In some examples, the bracket 115 can be integrally formed with the cover 110 to improve the structural strength and assembly efficiency. In other examples, the bracket 115 can be designed separately from the cover 110 and fixed to the cover 110 by welding or fasteners, etc. Of course, the examples of the combination of the bracket 115 and the cover 110 are not limited to this.

[0120] For example, referring to FIG. 3C The bracket 115 includes at least two partitions 1153, which are spaced apart in the first direction L1, and adjacent two partitions 1153 define a clamping slot 1151 for limiting the fan module 30 in the first direction L1, facilitating assembly of the fan module 30. Of course, the structure of the bracket 115 is not limited to this example, and other structural examples capable of accommodating the fan module 30 are also possible.

[0121] In some examples, referring to FIG. 3C The shell 110 has a shell plate 111 opposite the bottom shell 120, the partitions 1153 extend from the inner side of the shell plate 111 toward the bottom shell 120, and adjacent two partitions 1153 define two first walls of the clamping slot 1151, and the area between the adjacent two partitions 1153 defines a second wall of the clamping slot 1151. That is, the shell plate 111 of the bottom shell 120 and the partitions 1153 of the bracket 115 cooperatively define the clamping slot 1151, reducing the number of components of the bracket 115, simplifying the design of the bracket 115, and increasing the compactness between the shell 110 and the bottom shell 120.

[0122] In other examples, the bracket 115 can further include a wall plate arranged on the shell plate 111 of the bottom shell 120, and the wall plate constitutes the second wall of the clamping slot 1151, that is, the wall plate and the adjacent two partitions 1153 define the clamping slot 1151.

[0123] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the structure of the bracket 115 defining the clamping slot 1151 can also include a sliding rail structure, a spring clamping structure, etc., and is not limited to this.

[0124] In some examples, referring to FIG. 3C The edges of the adjacent two partitions 1153 in the direction toward the bottom shell 120 define a clamping entrance 1152 of the clamping slot 1151, and the clamping entrance 1152 is used for clamping the fan module 30 into the clamping slot 1151, that is, the edges of the adjacent two partitions 1153 in the direction toward the bottom shell 120 are open without obstruction, and the fan module 30 can be quickly clamped into the clamping slot 1151 through the opening, i.e., the clamping entrance 1152, facilitating assembly and easy operation.

[0125] In other examples, the edges of the adjacent two partitions 1153 in the direction toward the bottom shell 120 can be connected with a cover plate, and the cover plate is provided with the clamping entrance 1152, and the fan module 30 can be clamped into the clamping slot 1151 through the clamping entrance 1152, and the cover plate can provide partial limitation for the fan module 30 clamped into the clamping slot 1151. In other examples, the edges of the adjacent two partitions 1153 in the direction toward the bottom shell 120 can be connected with a cover plate, and the cover plate is provided with the clamping entrance 1152, and the fan module 30 can be clamped into the clamping slot 1151 through the clamping entrance 1152, and the cover plate can provide partial limitation for the fan module 30 clamped into the clamping slot 1151.

[0126] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the card entrance 1152 can also have other limiting forms, for example, the adjacent two partitions 1153 are connected between the sides of the bottom shell 120 in the direction of the bottom shell 120. The closing plate can be connected with the partition 1153 through a hinge or a buckle connection, etc. The closing plate is opened to expose the card entrance 1152, so as to card the fan module 30 into the card slot 1151, and the closing plate is closed to close the card entrance 1152, so as to limit the fan module 30. Here, only an example is given, and the limiting form of the card entrance 1152 is not limited to this.

[0127] For example, referring to FIG. 3C The bracket 115 also includes a baffle 1154 disposed on the side of the card slot 1151 in the second direction L2 and connected between the sides of the adjacent two partitions 1153 in the second direction L2. The baffle 1154 has a ventilation gap 1155 facing away from the shell plate 111 of the cover shell 110, and the ventilation gap 1155 is used for airflow. The baffle 1154 provides limiting for the fan module 30 without blocking the airflow, thereby ensuring smooth flow of the airflow.

[0128] In some examples, the edge of the baffle 1154 can define the ventilation gap 1155, and the shape of the ventilation gap 1155 can be an arc shape protruding in the direction of the shell plate 111 to form an area for airflow in the direction away from the shell plate 111, thereby increasing the airflow area. In addition, the shape of the ventilation gap 1155 can also be a regular shape such as a rectangle, a square, a circle, an ellipse, or other irregular shapes, and is not limited to this.

[0129] In other examples, the ventilation gap 1155 can be an opening formed in the non-edge area of the baffle 1154, and the shape of the ventilation gap 1155 can be, for example, a rectangle, a square, a circle, an ellipse, or other irregular shapes, and is not limited to this.

[0130] For example, the opposite sides of the card slot 1151 in the second direction L2 can be respectively provided with baffles 1154 to respectively limit the fan module 30 in the second direction L2, thereby improving the assembly stability of the fan module 30.

[0131] For example, referring to FIG. 4 The outer peripheral wall of the fan module 30 which is not passed through by the airflow can be provided with a flexible protection piece 32. When the fan module 30 is carded into the card slot 1151, the part of the flexible protection piece 32 between the fan module 30 and the card slot 1151 abuts against the inner wall of the card slot 1151, so as to tightly card the fan module 30 in the card slot 1151.

[0132] It can be understood that the outer periphery of the air flow passing area of the fan module 30 cannot be blocked by an object to ensure smooth flow of the air flow. The flexible protective member 32 provided on the outer periphery wall of the fan module 30 in the present example can fill the gap between the fan module 30 and the clamping groove 1151, so that the fan module 30 is clamped with the clamping groove 1151, and the stability of the fan module 30 can be ensured without screw fixation, thereby simplifying the assembly of the fan module 30 and reducing the assembly difficulty. In addition, the flexible protective member 32 plays a protection and shock absorption role for the fan module 30, and the noise in the operation process of the fan module 30 is reduced.

[0133] In some examples, the flexible protective member 32 can be an EVA anti-collision cotton, and the flexible protective member 32 is bonded to the outer periphery wall of the fan module 30 which is not passed through by the air flow, thereby simplifying the connection of the flexible protective member 32 and the fan module 30. In other examples, the flexible protective member 32 can also be foam rubber, polyurethane foam, etc. It should be noted that this is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the flexible protective member 32 can also be silicone, polypropylene foam, memory foam, etc., and is not limited thereto.

[0134] In some examples, referring to FIG. 3B and FIG. 4 , the end of the fan module 30 away from the shell plate 111 of the cover 110 defines a wire clamping notch 31 on the first side in the second direction L2, and the connection line 90 of the fan module 30 is clamped in the wire clamping notch 31 and extends to the side of the fan module 30 away from the shell plate 111 of the cover 110. By designing the wire clamping notch 31 at the end of the fan module 30, the connection line 90 can be arranged in order to avoid disordered arrangement. In addition, by arranging the wire clamping notch 31 and the connection line 90 on the side of the fan module 30 away from the shell plate 111, the space between the fan module 30 and the bottom shell 120 can be utilized to avoid blocking the air flow and affecting the arrangement of other components inside the fan device.

[0135] In some examples, the connection line 90 can extend in the first direction L1 on the side of the fan module 30 away from the shell plate 111 of the cover 110.

[0136] In other examples, the connection line 90 can extend from the side of the wire clamping notch 31 in the second direction L2 of the fan module 30.

[0137] It should be noted that this is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection line 90 can also have other arrangement positions, such as extending in the first direction L1 or in the second direction L2 on the side of the fan module 30 toward the shell plate 111, and is not limited thereto.

[0138] For example, in order to increase the air flow in the air duct 1101, the number of fan modules 30 can be at least two. In addition, for example, in order to enhance the compactness of the fan module 30 and the bracket 115, reduce the space occupation, the number of partitions 1153 can be at least three, and the at least three partitions 1153 define at least two clamping slots 1151, and the at least two fan modules 30 correspond to the at least two clamping slots 1151 one by one.

[0139] For example, as shown in FIGS. 2-4 , the number of fan modules 30 is three, the bracket 115 includes four partitions 1153, the four partitions 1153 define three clamping slots 1151, and the flexible protective member 32 is three, and each fan module 30 is wrapped with a flexible protective member 32. It should be noted that this is only an example and does not limit the present application, and the number of fan modules 30 can also be two, four or five, etc., and is not limited to this.

[0140] In some examples, referring to FIG. 1A , FIG. 3C and FIG. 4 , the shell plate 111 of the cover shell 110 has a guide 118 extending towards the bottom shell 120, and the bottom shell 120 has a guide matching part 121 matched with the guide 118, that is, the guide 118 and the corresponding guide matching part 121 provide positioning and guiding for the assembly of the bottom shell 120 and the cover shell 110, the guide matching part 121 on the bottom shell 120 and the guide 118 of the cover shell 110 are inserted and connected, guiding the installation of the bottom shell 120 and the cover shell 110, thereby on the one hand, the assembly process of the combination of the cover shell 110 and the bottom shell 120 can be simplified, preventing misassembly and misoperation, improving the reliability of assembly, ensuring assembly accuracy, on the other hand, the structural strength of the connection between the cover shell 110 and the bottom shell 120 can be enhanced, improving the firmness and stability of the connection, enhancing the durability and impact resistance of the shell 1000.

[0141] For example, as shown in FIG. 3C , the guide 118 can be arranged on the first side of the partition 1153 of the bracket 115 in the second direction L2, and the guide 118 is connected with the corresponding partition 1153 and the baffle 1154 of the bracket 115 through the connecting plate 1156, that is, the partition 1153 and the baffle 1154 of the bracket 115 are connected with the guide 118 through the connecting plate 1156, so as to enhance the stability of the guide 118 and the bracket 115, and improve the compactness of the overall structure.

[0142] In some examples, the guide 118 can also be independently arranged with respect to the two baffles 1154 adjacent to the first direction L1.

[0143] In other examples, the guide 118 can be connected between two adjacent baffles 1154 in the first direction L1 by a connecting plate 1156.

[0144] It should be noted that the connection between the partition plate 1153, the connecting plate 1156 and the two adjacent baffles 1154 connected thereto can form a cross shape to enhance the overall strength. In addition, the connection between the connecting plate 1156 and the two adjacent baffles 1154 connected thereto can also form an X shape, a cross shape, etc., and is not limited thereto.

[0145] For example, the number of guides 118 can be one or more, and the plurality of guides 118 are spaced apart in the first direction L1. Referring to FIG. 3C , the number of guides 118 is two, and the guide 118 is connected to the corresponding adjacent two partition plates 1153 and the corresponding adjacent two baffles 1154 by the corresponding connecting plate 1156. Herein, only an example is provided, and the number of guides 118 can also be three, four, etc., and is not limited thereto.

[0146] In some examples, FIG. 4 The guide 118 shown can be integrally formed with the shell plate 111 of the cover shell 110, and the guide fitting 121 (shown by FIG. 7A ) can be integrally formed with the bottom shell 120 to improve the structural strength and assembly efficiency.

[0147] In other examples, FIG. 4 The guide 118 shown can be connected separately with the shell plate 111, and the guide fitting 121 (shown by FIG. 7A ) can be connected separately with the bottom shell 120, for example, by welding or fasteners, etc., and is not limited thereto.

[0148] In some examples, referring to FIG. 4 and FIG. 7A , one of the guide 118 and the guide fitting 121 can be a guide column, and the other can be a guide sleeve. The guide column and the guide sleeve are inserted and fitted to provide positioning and guidance for the assembly of the cover shell 110 and the bottom shell 120.

[0149] In other examples, one of the guide 118 and the guide fitting 121 is a protrusion, and the other is a groove, and the protrusion and the groove are inserted and fitted.

[0150] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the assembly positioning of the cover shell 110 and the bottom shell 120 can also be achieved by the cooperation of buckles and locks, the cooperation of latches and sockets, or magnetic guidance, etc., and is not limited thereto.

[0151] In some examples, the cover 110 and the bottom shell 120 can be connected by fasteners. For example, the inside of the cover 110 has a first screw post 119 (see FIG. 3B ), the inside of the bottom shell 120 has a second screw post 122 (see FIG. 7A ) opposite to the first screw post 119, and the cover 110 and the bottom shell 120 are assembled by screws passing through the first screw post 119 and the second screw post 122.

[0152] The number of the first screw post 119 and the second screw post 122 can be plural, for example, the inside of the cover 110 has one first screw post 119 at each of four corner regions, and the inside of the bottom shell 120 has one second screw post 122 at each of four corner regions, so as to increase the stability of the assembly of the cover 110 and the bottom shell 120. The first screw post 119 can be integrally formed with the cover 110 or connected separately, and the second screw post 122 can be integrally formed with the bottom shell 120 or connected separately.

[0153] In other examples, the cover 110 and the bottom shell 120 can be connected by buckles (not shown in the drawings).

[0154] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the cover 110 and the bottom shell 120 can also be connected by rivets, latches, hinges or magnetic means, and are not limited thereto.

[0155] In some examples, referring to FIG. 3A and FIG. 4 , the cover 110 defines an air inlet 1121 and an air outlet 1131 of an air duct 1101. In other examples, one of the cover 110 and the bottom shell 120 defines the air inlet 1121, and the other defines the air outlet 1131. Here, only an example is described, and the air inlet 1121 and the air outlet 1131 can also be arranged at other positions, for example, on the bottom shell 120, and are not limited thereto.

[0156] In some examples, referring to FIG. 4 , the air inlet 1121 and the air outlet 1131 are distributed in the second direction L2, the air outlet 1131 is adjacent to a first side of the bracket 115 in the second direction L2, and the air inlet 1121 is adjacent to a second side of the bracket 115 in the second direction L2. That is, the air flow flows from the second side of the bracket 115 in the second direction L2 to the first side opposite to the second side, forming an axial flow. Accordingly, the fan module 30 can be an axial fan with reference to the relationship between the direction of the air flow and the axial direction of the fan module 30.

[0157] In other examples, the air inlets 1121 and the air outlets 1131 can be distributed in different directions, and accordingly, the fan module 30 can be a centrifugal fan, an axial fan or a cross-flow fan, etc., and is not limited thereto.

[0158] As shown in FIG. 3B and FIG. 3C , the inner side of the shell plate 111 of the cover 110 can be connected with a guide plate 15, which is extended along the air flow direction by the outer side of the bracket 115 in the first direction L1 to guide the air flow in the air duct 1101. The outer side of the bracket 115 in the first direction L1 can be understood as the side of the bracket 115 in the first direction L1 away from the center of the bracket 115.

[0159] In some examples, referring to FIG. 3B , along the air flow direction, the guide plate 15 includes a first guide section 151 adjacent to the fan module 30, a second guide section 152 extending outwardly from the first guide section 151, and a third guide section 153 extending away from the fan module 30 from the second guide section 152, i.e., along the air flow direction, the guide plate 15 first expands outwardly to diffuse the air flow, reduce the speed and pressure of the air flow, and make the air flow fully contact the computing module 20 to improve the heat dissipation effect of the computing module 20. When the guide plate 15 changes from outward expansion to inward contraction, the air flow can be re-accelerated to flow out quickly. The above design of the guide plate 15 can help the air flow to gradually transition, reduce the formation of turbulence and vortex, and thus make the air flow smooth and uniform.

[0160] In other examples, along the air flow direction, the guide plate 15 can first extend gradually and then extend gradually. It should be noted that the above is only for example and does not constitute a limitation on the present application. As those skilled in the art can understand, the shape of the guide plate 15 can also have other forms, such as a curved shape, an airfoil shape, etc., and is not limited thereto.

[0161] As those skilled in the art can understand, the above examples of the fan device can be combined in any way without departing from the spirit or scope of the present application to achieve specific design requirements and functions.

[0162] In the computing device 100 of the present embodiment, in some examples, along the air flow direction, the computing module 20 can be located downstream of the fan module 30, i.e., the external cold air enters the air duct 1101 through the air inlet 1121, first passes through the fan module 30, then passes through the computing module 20 to absorb the heat of the computing module 20, and then flows out through the air outlet 1131.

[0163] In other examples, referring to FIG. 3A , FIG. 4 and FIG. 7AIn some examples, the computing module 20 can be located upstream of the fan module 30, i.e., the external cold air enters the air duct 1101 through the air inlet 1121, passes through the computing module 20 first, and then passes through the fan module 30 to flow out of the air outlet 1131.

[0164] The air outlet 1131 can be in communication with an external heat recovery system or directed to a heat utilization area. In this way, the computing device 100 can not only implement computing functions but also serve as a heater, so that the hot air output from the air outlet 1131 can be recovered and utilized, thereby saving energy.

[0165] In some examples, referring to FIG. 7A , the computing module 20 can be arranged on the inner side of the bottom shell 120. In this way, the positions of the fan module 30 and the computing module 20 are reasonably distributed, which reduces the interference of the fan module 30 and the computing module 20 with the assembly of the cover shell 110 and the bottom shell 120, reduces the assembly difficulty, and improves the overall compactness of the computing device 100. In other examples, the computing module 20 can be arranged inside the cover shell 110. It should be noted that this is only an example and does not limit the present application. The computing module 20 can also be arranged outside the cover shell 110, and is not limited thereto.

[0166] For example, referring to FIG. 3A and FIG. 3B , the air duct 1101 can be provided with the control module 10 to dissipate heat of the control module 10.

[0167] In some examples, along the air flow direction, the control module 10 is located downstream of the fan module 30, i.e., the external cold air enters the air duct 1101 through the air inlet 1121, passes through the fan module 30 first, and then passes through the control module 10 to flow out of the air outlet 1131.

[0168] In other examples, the control module 10 can be located upstream of the fan module 30, i.e., the external cold air enters the air duct 1101 through the air inlet 1121, passes through the control module 10 first, and then passes through the fan module 30 to flow out of the air outlet 1131.

[0169] In examples in which the computing module 20 and the control module 10 are arranged in the air duct 1101, the positional relationship between the control module 10 and the computing module 20 relative to the air flow direction can be flexibly arranged, for example, the control module 10 is located downstream or upstream of the computing module 20, and the air flow simultaneously flows through the control module 10 and the computing module 20, and the like, and is not limited thereto.

[0170] For example, referring to FIG. 3A and FIG. 3B , the control module 10 can be arranged on the inner side of the shell plate 111 of the cover shell 110 to fully utilize the space inside the cover shell 110 and facilitate electrical connection between the control module 10 and the computing module 20.

[0171] It can be understood that the control module 10 is electrically connected with the computing module 20 and the fan module 30 respectively, so as to realize signal transmission and power transmission between the control module 10 and the computing module 20 and the fan module 30.

[0172] In some examples, the control module 10 can be connected with the fan module 30 and / or the computing module 20 through a wire. In other examples, the control module 10 can be electrically connected with the fan module 30 and / or the computing module 20 through the cooperation of a socket and a plug. Here, only for example, and does not constitute a limitation to the present application. It can be understood by those skilled in the art that the connection mode of the control module 10 and the fan module 30 can also adopt pin connection, wireless connection, terminal connection, etc., and is not limited thereto.

[0173] For example, referring to FIG. 4 , the shell 110 has an air inlet plate 112 and an air outlet plate 113, the air inlet plate 112 is formed with an air inlet 1121, and the air outlet plate 113 is formed with an air outlet 1131. The design of the air inlet 1121 and the air outlet 1131 can be various, for example, the air inlet plate 112 and the air outlet plate 113 are respectively formed with a plurality of small round holes arranged in an array, the plurality of small round holes of the air inlet plate 112 constitute the air inlet 1121 to uniformly disperse the air inlet, increase the flow-through area of the air inlet inside the shell 1000, and improve the heat dissipation effect. The plurality of small round holes of the air outlet plate 113 constitute the air outlet 1131 to uniformly disperse the air outlet and increase the diffusion area of the air outlet. For another example, the air inlet plate 112 and the air outlet plate 113 are respectively formed with a plurality of long strip-shaped openings, and the plurality of long strip-shaped openings of the air inlet plate 112 and the air outlet plate 113 respectively constitute the air inlet 1121 and the air outlet 1131. The foregoing is only for example, and does not constitute a limitation to the present application. It can be understood by those skilled in the art that the design form of the air inlet 1121 and the air outlet 1131 can also be square holes, polygonal holes, irregular holes or mixed holes of multiple types, etc., and is not limited thereto.

[0174] It can be understood that the relative positions of the air inlet 1121 and the air outlet 1131 are related to the structure type of the fan module 30.

[0175] In some examples, as shown in FIG. 3A , FIG. 3B and FIG. 4 , the fan module 30 is of an axial flow type, that is, the flow direction of the airflow in the air duct 1101 is parallel to the shaft of the fan module 30. Correspondingly, the air inlet 1121 and the air outlet 1131 can be relatively distributed in the airflow direction, that is, the air inlet plate 112 and the air outlet plate 113 can be relatively distributed in the airflow direction.

[0176] In some examples, the fan module 30 can be a centrifugal structure, the airflow direction is perpendicular to the axis of the fan module 30, and accordingly, the air inlet 1121 and the air outlet 1131 can be vertically distributed, that is, the extension direction of the air inlet plate 112 is perpendicular to the extension direction of the air outlet plate 113.

[0177] It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that, according to the structure type of the fan module 30, the positions of the air inlet plate 112, the air outlet plate 113, and the air inlet 1121 and the air outlet 1131 can be changed accordingly, and are not limited to the above examples.

[0178] FIG. 5A An exemplary structural diagram of the filtering assembly 130 of the computing device 100 according to an embodiment of the present application is provided, FIG. 5B An exemplary exploded structural diagram of the filtering assembly 130 and the housing 110 of the computing device 100 according to an embodiment of the present application is provided, FIG. 5C An exemplary assembled structural diagram of the filtering assembly 130 and the housing 110 of the computing device 100 according to an embodiment of the present application is provided.

[0179] Referring to FIGS. 5A-5C As shown, the air inlet 1121 can be provided with a filtering assembly 130, which includes a filtering frame 131 and a filtering element 132 arranged in the filtering frame 131. The filtering element 132 is used to filter the airflow flowing therethrough. In this way, on the one hand, external dust, particles and other impurities can be prevented from entering the fan module 30 to affect the normal operation of the fan module 30, thereby improving the operation reliability and service life of the fan module 30. On the other hand, the impurities can be prevented from affecting the normal operation of the control module 10 and the computing module 20 in the air duct 1101. In addition, the cleanliness of the airflow output from the air outlet 1131 can also be improved.

[0180] In some examples, the filtering element 132 can be filter cotton, which can accommodate dust inside to improve the filtering effect. The material of the filter cotton can be cotton fiber, polyurethane foam, polyester fiber, polypropylene fiber, etc., and is not limited thereto. In other examples, the filtering element 132 can be a filter screen, filter paper or membrane filtration, etc. This is only an example and does not constitute a limitation on the present application.

[0181] In some examples, as FIG. 5B As shown, the filtering element 132 can be attached to the filtering frame 131 and can be easily detached for replacement. In other examples, the filtering element 132 can be clamped to the filtering frame 131. This is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the filtering element 132 can also be connected by insertion, compression, etc., and is not limited thereto.

[0182] Exemplarily, referring toFIG. 5A The filter frame 131 should have airflow inlets 1311, and there can be multiple airflow inlets 1311. The filter element 132 can cover the inside or outside of the airflow inlets 1311. A filter screen can be covered at the airflow inlets 1311, and the filter screen can be located inside the filter element 132 to perform secondary filtration on the airflow filtered by the filter element 132, thereby improving the filtration effect.

[0183] The number and arrangement direction of airflow through the ports 1311 can be consistent with the number and arrangement direction of the fan modules 30. For example, in an example where multiple fan modules 30 are arranged in the first direction L1, see [reference needed]. FIG. 4 , FIGS. 5A-5C Multiple airflow passages 1311 of the filter frame 131 are arranged sequentially in the first direction L1.

[0184] In some examples, the filter assembly 130 can be plugged into the housing 1000. See specifically... FIG. 4 and FIG. 5B The bracket 115 of the computing device 100 and the air inlet plate 112 define an accommodating space 116. The housing 110 and the bottom shell 120 define an insertion port 124 communicating with the accommodating space 116. The filter assembly 130 is inserted into the accommodating space 116 through the insertion port 124. In this example, the accommodating space 116 for the filter assembly 130 is defined by the bracket 115 for accommodating the fan module 30 and the air inlet plate 112 for the housing 110, which realizes the plug-in installation and removal of the filter assembly 130, improves the convenience of replacing the filter element 132, increases the compactness of the structure, and improves the utilization rate of the internal space of the housing 1000.

[0185] For example, see FIG. 5B The filter frame 131 has an insertion end 1313 and a closing end 1314. The insertion end 1313 is inserted into the accommodating space 116 through the insertion port 124, and the closing end 1314 covers the insertion port 124. That is, the closing end 1314 cooperates with the bottom shell 120 and the cover 110 to close the insertion port 124, so as to maintain the airtightness of the insertion port 124 and prevent air leakage.

[0186] For example, see FIG. 5B The insertion port 124 is defined by a notch formed on the bottom shell 120 and the cover 110. That is, a notch is formed on the bottom shell 120. After the bottom shell 120 and the cover 110 are assembled, the notch of the bottom shell 120 and the cover 110 form the insertion port 124. After the filter assembly 130 is inserted into the receiving space 116 through the insertion port 124, the closed end 1314 of the filter frame 131 closes the insertion port 124.

[0187] To increase the stability of the connection between the filter assembly 130 and the housing 1000, the filter frame 131 of the filter assembly 130 can be clamped with the housing 1000. For example, referring to FIG. 5B , the closed end 1314 of the filter frame 131 is clamped with the bottom shell 120. For example, the two sides of the filter frame 131 in the extending direction of the closed end 1314 are respectively provided with clamping protrusions 1312 (see FIG. 5A ), and the bottom shell 120 is provided with limiting protrusions matched with the clamping protrusions 1312. The clamping protrusions 1312 and the limiting protrusions are in abutting fit, limiting the filter assembly 130 and improving the stability of the filter assembly 130.

[0188] In other examples, the filter assembly 130 can be installed in the housing 1000 by fastening or the like. It should be noted that this is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the filter assembly 130 and the housing 1000 can also be connected by magnetic attraction, buckle connection, etc., and are not limited thereto.

[0189] FIG. 6 An exploded structural schematic view of the air outlet guide assembly 140 of the computing device 100 according to an example of the present application is shown

[0190] As shown in FIG. 6 , in combination with FIGS. 1A-4 , the air outlet guide assembly 140 can be provided at the air outlet 1131. The air outlet guide assembly 140 includes an air outlet grille plate 141, which is arranged outside the air outlet 1131 to guide the air outlet airflow and make the air outlet airflow diffuse uniformly to the outside.

[0191] In some examples, the air outlet grille plate 141 can be magnetically connected with the cover shell 110. Specifically, referring to FIG. 6 , the non-air-outlet area of the air outlet grille plate 141 is provided with a magnetic member 143, and the non-air-outlet area of the air outlet plate 113 of the cover shell 110 is provided with a magnetic matching member 1136 corresponding to the magnetic member 143 (see FIG. 3B ). The magnetic member 143 and the magnetic matching member 1136 generate a mutual adsorbing magnetic force to keep the air outlet grille plate 141 on the air outlet plate 113 of the cover shell 110. In this way, the assembly of the air outlet grille plate 141 and the cover shell 110 is simplified, and the air outlet grille plate 141 is easy to disassemble. The air outlet plate 113 of the cover shell 110 can be formed with a matching groove 1132 (see FIG. 4 ) adapted to the air outlet grille plate 141. The air outlet grille plate 141 is accommodated in the matching groove 1132 to avoid the air outlet grille plate 141 protruding outward to affect the appearance and reduce the volume of the housing 1000.

[0192] For example, referring to FIG. 3B and FIG. 6The non-air outlet area of ​​the air outlet grille 141 may have mounting holes 1411, and the magnetic component 143 is embedded in the mounting holes 1411. The non-air outlet area of ​​the air outlet plate 113 of the cover 110 and the area corresponding to the mounting holes 1411 may have mounting openings, and the magnetic mating component 1136 is embedded in the mounting openings.

[0193] It is understandable that the magnetic component 143 and the magnetic mating component 1136 are two components capable of generating magnetic attraction. For example, one of the magnetic component 143 and the magnetic mating component 1136 may be a magnet and the other may be an iron sheet, but this is not a limitation.

[0194] The number of magnetic components 143 and magnetic mating components 1136 can be multiple, in FIG. 3B and FIG. 6 In the example shown, a magnetic element 143 is provided at each of the four corner areas of the air outlet grille 141, and a magnetic mating element 1136 is provided at each of the four corner areas of the air outlet plate 113, so as to enhance the adsorption force between the air outlet grille 141 and the air outlet plate 113 and improve the stability of the air outlet grille 141 in the air outlet plate 113.

[0195] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the position, quantity, and shape of the magnetic element 143 and the magnetic mating element 1136 can also take other forms. For example, the magnetic element 143 and the magnetic mating element 1136 can be elongated to enhance the adsorption force; for example, the magnetic element 143 can be disposed on any one or more sides of the air outlet grille plate 141, and correspondingly, the magnetic mating element 1136 can be disposed on any one or more sides of the air outlet plate 113, and is not limited thereto.

[0196] For example, see FIG. 6 The air outlet guide assembly 140 also includes a decorative strip 142, which is disposed in the non-air outlet area of ​​the air outlet grille 141 to cover the magnetic element 143 in order to maintain the aesthetic appearance of the air outlet guide assembly 140.

[0197] In other examples, the air vent grille 141 and the housing 110 can also be connected by fasteners. It should be noted that this is only an example and does not constitute an illustration of this application. Those skilled in the art will understand that the air vent grille 141 and the housing 110 can also be connected by riveting, pin connection, snap-fit ​​connection or welding, etc., and are not limited to these methods.

[0198] See in some examples FIG. 6 The air outlet grille 141 may include a frame and a guide vane 1412 disposed within the frame.

[0199] Exemplarily, the guide vane 1412 can be one, and the guide vane 1412 can be vertically arranged or horizontally arranged. For example, the guide vane 1412 is vertically arranged, and the guide vane 1412 extends obliquely relative to the direction of the air flow out of the air outlet 1131, so as to diffuse the air flow to a larger space. It should be noted that this is only an example, and does not constitute a limitation on the present application. When the guide vane 1412 is horizontally arranged, the guide vane 1412 can extend horizontally or obliquely relative to the direction of the air flow out of the air outlet 1131, and is not limited to this.

[0200] Exemplarily, the guide vane 1412 can be multiple, and the multiple guide vanes 1412 are arranged in sequence to form a grid structure. The guide vane 1412 can be integrally formed with the frame or connected separately.

[0201] In some examples, the extension directions of the multiple guide vanes 1412 are the same, the air flow is guided to the same direction, and the temperature of the local concentrated area is improved.

[0202] In another example, the multiple guide vanes 1412 can be divided into a first guide group and a second guide group. The guide vanes 1412 in the first guide group extend along a direction parallel to one direction, and the guide vanes 1412 in the second guide group extend along a direction parallel to another direction, so as to guide the air flow to different directions, so that the blown air flow is more dispersed and uniform.

[0203] The user can manually flip the air outlet grid plate 141, for example, up and down, left and right, or inside and outside, to change the air outlet direction, achieve different air outlet effects, and meet different air outlet needs.

[0204] Exemplarily, as shown in FIG. 3B and FIG. 4 The inside of the cover 110 can also be provided with a light emitting piece 70 and a light guide piece 71 adjacent to the air outlet 1131. The light emitting piece 70 is arranged on the light guide piece 71, and the light guide piece 71 is clamped with the cover 110, so as to guide the light emitted by the light emitting piece 70 to the air outlet 1131, facilitate the user to observe, and improve the display effect.

[0205] The light emitting piece 70 can be connected with the control module 10, display different colors according to different air outlet temperatures, so as to provide more intuitive temperature indication for the user.

[0206] In some examples, the light emitting piece 70 can be a lamp strip, and the light guide piece 71 can be a light guide strip. In another example, the light emitting piece 70 can be an LED bulb, and the light guide piece 71 can be a light guide plate. It should be noted that this is only an example, and does not constitute a limitation on the present application. Those skilled in the art can understand that the light emitting piece 70 can also be an OLED panel, an electroluminescent (EL) panel, a fluorescent lamp, and the like, and is not limited to this. The light guide piece 71 can also be a light guide prism, a light guide film, a reflecting sheet, an optical lens, and the like, and is not limited to this.

[0207] In some examples, the light emitting member 70 and the light guide member 71 can be connected by bonding, banding, or buckling, but are not limited thereto.

[0208] In some examples, referring to FIG. 3B , the cover 110 defines a mounting space inside the air outlet plate 113, the light guide member 71 is buckled in the mounting space, and the inner side of the air outlet plate 113 has a first limiting portion 1133. The end surface of the light guide member 71 towards the bottom shell 120 (see FIG. 7A ) abuts against the first limiting portion 1133, that is, the light guide member 71 is buckled in the mounting space, and the first limiting portion 1133 of the air outlet plate 113 limits the end surface of the light guide member 71 towards the bottom shell 120, thereby limiting different positions of the light guide member 71 and ensuring the stability of the installation of the light guide member 71.

[0209] In FIG. 3B , the air outlet plate 113 of the cover 110 and the two first screw columns 119 adjacent to the two ends thereof respectively have connecting plates 1135, and the air outlet plate 113, the two connecting plates 1135, the two first screw columns 119, and the shell plate of the cover 110 define a mounting groove. The light guide member 71 is long strip-shaped and extends along the length direction of the shell 1000, and the two ends of the light guide member 71 in the extension direction are respectively buckled with the two connecting plates 1135, thereby realizing the buckling of the light guide member 71 with the cover 110. For example, the two ends of the light guide member 71 respectively have buckling openings 712, the two connecting plates 1135 respectively have protrusions 11351 corresponding to the two buckling openings 712, and the buckling openings 712 and the corresponding protrusions 11351 are matched to buckle the light guide member 71 on the connecting plates 1135.

[0210] In other examples, the light guide member 71 can be fixed in the mounting space of the cover 110 by fasteners, bonding, rivet connection, or the like, but is not limited thereto.

[0211] For example, the computing device 100 further includes a temperature sensor 80, as shown in FIG. 3B and FIG. 4 , the inner side of the air outlet 1131 can be provided with the temperature sensor 80 to detect the air outlet temperature. It can be understood that the temperature sensor 80 is connected with the control module 10, the control module 10 acquires the air outlet temperature information detected by the temperature sensor 80, and the control module 10 controls the light emitting member 70 to change the color and / or illumination brightness based on different air outlet temperatures, thereby helping the user to intuitively understand the current air outlet temperature.

[0212] In some examples, the temperature sensor 80 can also be arranged at the air inlet 1121 to monitor the air inlet temperature. Here, only as an example, and without any limitation to the present application, it can be understood by those skilled in the art that the temperature sensor 80 is not limited to the above-mentioned positions, for example, the temperature sensor 80 can be arranged at a heat source (for example, the computing module 20) of the computing device 100, or at any different position, and the like, and is not limited thereto.

[0213] As shown in the example of FIG. 3B , the inner side of the air outlet plate 113 also has a second limiting portion 1134, and the end face of the light guide member 71 towards the bottom shell 120 has a third limiting portion 711, the third limiting portion 711 and the second limiting portion 1134 define a limiting space, and the temperature sensor 80 is clamped in the limiting space, so that the temperature sensor 80 can be installed without using fasteners or tools, and is easy to operate and stable in installation.

[0214] For example, referring to FIG. 4 , the computing device 100 further includes a transparent cover plate 51 and a display screen 50, and the shell plate of the cover shell 110 is formed with a display hole 1111, and the inner side of the shell plate at the inner periphery of the display hole 1111 is formed with a protective portion 1112 protruding inwardly, the transparent cover plate 51 and the display screen 50 are accommodated in the space defined by the protective portion 1112 and the display hole 1111, and the transparent cover plate 51 covers the outer side of the display screen 50. The protective portion 1112 not only provides protection for the display screen 50 and the transparent cover plate 51, but also provides an installation area for the display screen 50 and the transparent cover plate 51. The transparent cover plate 51 and the display screen 50 are located on the inner side of the display hole 1111, which can avoid the transparent cover plate 51 and the display screen 50 from being collided by external objects, and ensure the safety of the transparent cover plate 51 and the display screen 50.

[0215] Continuing to refer to FIG. 4 , the protective portion 1112 and the inner periphery of the display hole 1111 define a mounting surface. In some examples, the transparent cover plate 51 can be bonded to the mounting surface. In other examples, the transparent cover plate 51 can be fixed to the mounting surface by screws or buckles, and the like, and is not limited thereto.

[0216] For example, referring to FIG. 1A and FIG. 4 , the inner side of the display screen 50 can be covered with a display protection member 52 to provide cushioning and protection for the display screen 50, and prevent components inside the cover shell 110 from damaging the display screen 50.

[0217] In some examples, the display protection member 52 can be an EVA cotton sheet, and the display protection member 52 can be bonded to the inner surface of the display screen 50. In other examples, the display protection member 52 can be a glass protective film, a silica gel protective sleeve, a silica gel gasket, and the like, and is not limited thereto.

[0218] For example, referring toFIG. 4 The control module 10 is covered on the display shield 52 on the side of the display shield 52 facing the bottom shell 120, and the control module 10 is electrically connected with the display screen 50 to realize signal transmission between the control module 10 and the display screen 50. The display screen 50 can display the air temperature, the computing power of the computing module 20, the power consumption, the IP information and the like. The inner side of the shell plate of the cover shell 110 can be provided with a plurality of screw columns around the protection part 1112, and the control module 10 is fixed on the shell plate of the cover shell 110 by the screws fastened on the screw columns.

[0219] For example, the cover shell 110 has a plug mounting part 117 which is defined with a plug mounting slot, and the data plug 40 is clamped in the plug mounting slot to realize plug-in connection of the data plug 40 with the computing device 100, without the need of fasteners such as screws for fixation, facilitating disassembly and assembly. FIG. 3A FIG. 4 For example, the plug mounting part 117 can be arranged on the outer side of the support 115 in the first direction L1 to utilize the space between the support 115 and the cover shell 110 to improve the space utilization.

[0220] For example, the plug mounting part 117 can be arranged on the outer side of the support 115 in the first direction L1 to utilize the space between the support 115 and the cover shell 110 to improve the space utilization. FIG. 3A FIG. 4 For example, the plug mounting part 117 can be arranged on the outer side of the support 115 in the first direction L1 to utilize the space between the support 115 and the cover shell 110 to improve the space utilization.

[0221] For example, the plug mounting part 117 can be arranged on the outer side of the support 115 in the first direction L1 to utilize the space between the support 115 and the cover shell 110 to improve the space utilization. FIG. 1B The air inlet plate 112 of the cover shell 110 has an insertion hole 1122 which is in communication with the plug mounting slot and is used for insertion of a data line to be connected with the data plug 40 to realize connection of the control module 10 with an external power supply and data transmission.

[0222] For example, the control module 10 of the computing device 100 can communicate with external devices through a wireless network such as wifi, Bluetooth and the like, or through a wired network such as Ethernet, power line and the like, without being limited thereto.

[0223] In a specific example, the control module 10 communicates with external devices through wifi. For example, FIG. 1A FIG. 4 The computing device 100 can include a wifi plug 60 connected with the control module 10, and the side plate 114 of the cover shell 110 is formed with a through hole 1141 for insertion of the wifi plug 60, and the wifi plug 60 is inserted into the inside of the cover shell 110 through the through hole 1141 to be connected with the control module 10 to realize wireless signal transmission and wiring between the control module 10 and external devices.

[0224] FIG. 1A ​​​The computing device 100 is shown in a state where the wifi plug 60 is installed, i.e., the computing device 100 communicates with external devices through the external wifi plug 60. This is merely an example and does not limit the present application. Those skilled in the art can understand that the structure for implementing wifi communication between the computing device 100 and external devices can be the external wifi plug as described above, or a wifi module arranged inside the computing device 100, and is not limited thereto.

[0225] As shown in FIG. 7A and 7B , the computing module 20 includes a circuit board 21 and at least one heat dissipation piece 22, and at least one surface of the circuit board 21 is provided with the heat dissipation piece 22.

[0226] In some examples, one surface of the circuit board 21 is provided with the heat dissipation piece 22, for example, the heat dissipation piece is arranged on the surface of the circuit board provided with the computing chip 213 (see FIG. 8A ). In other examples, both surfaces of the circuit board 21 are provided with the heat dissipation piece to improve the heat dissipation effect. It should be noted that the above is merely an example and does not limit the present application. Those skilled in the art can understand that the heat dissipation piece 22 can also be arranged at the end of the circuit board 21, and is not limited thereto.

[0227] For example, as shown in FIG. 7B , the heat dissipation piece 22 includes a heat conduction plate 221 and a plurality of heat dissipation fins 222, at least one surface of the circuit board 21 is covered with the heat conduction plate 221, and the plurality of heat dissipation fins 222 are arranged at the side of the heat conduction plate 221 away from the circuit board 21 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0228] For example, as shown in FIG. 7B , a heat dissipation channel 2222 is formed between adjacent heat dissipation fins 222 to allow airflow to pass through, thereby improving the heat dissipation efficiency.

[0229] In some examples, the heat dissipation channel 2222 extends along the airflow direction, i.e., the heat dissipation channel 2222 is parallel to the airflow direction to ensure that the heat dissipation airflow can uniformly cover all the heat dissipation fins 222. For example, the extension direction of the heat dissipation fin 222 is parallel to the wind direction, and the plurality of heat dissipation fins 222 are arranged in sequence and at intervals in a direction perpendicular to the wind direction to form a heat dissipation channel extending along the airflow direction between adjacent heat dissipation fins 222, thereby improving the heat dissipation efficiency.

[0230] In other examples, the heat dissipation channel 2222 can intersect the airflow direction to increase the complexity of the flow path, thereby improving the heat exchange efficiency.

[0231] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the heat dissipation channel 2222 and the airflow direction can also be partially parallel and partially intersecting, and are not limited thereto.

[0232] As shown in the example where the bottom shell 120 has a plurality of guide fittings 121 spaced apart in the first direction, the heat dissipation plate 221 and the circuit board 21 are respectively formed with a plurality of avoiding notches 2201 to avoid interference between the heat dissipation plate 221 and the circuit board 21 and the guide fittings 121 while increasing the compactness of each component. FIG. 7B

[0233] In some examples, as shown in FIG. 7B and FIG. 8A , the avoiding notches 2201 are L-shaped, i.e., the heat dissipation plate 221 and the circuit board 21 form notches in the area where the guide fittings 121 pass through, and remain intact in the area that does not interfere with the guide fittings 121 to ensure the size of the heat dissipation plate 221 and the circuit board 21.

[0234] In other examples, the shape of the avoiding notches 2201 can match the outer shape of the guide fittings 121, for example, the guide fittings 121 are cylindrical, and the avoiding notches 2201 are semicircular notches to minimize the size of the avoiding notches and leave more size space for the heat dissipation plate 221 and the circuit board 21.

[0235] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the avoiding notches 2201 can also be square notches, U-shaped notches, or irregularly shaped notches, and are not limited thereto.

[0236] For example, as shown in FIG. 7B , the guide fittings 121 are provided with a reinforcing plate 1211 adjacent to one side of the avoiding notches 2201 in the second direction L2, and the reinforcing plate 1211 abuts against the avoiding notches 2201, which not only enhances the stability of the guide fittings 121, but also makes the arrangement of each component more compact.

[0237] In some examples, the reinforcing plate 1211 can be integrally formed with the guide fittings 121 to improve structural strength and assembly efficiency. In other examples, the reinforcing plate 1211 can be designed separately from the guide fittings 121, for example, the reinforcing plate 1211 is fixed to the guide fittings 121 by welding or fasteners, and is not limited thereto.

[0238] For example, as shown in FIG. 7B ​The surface of the circuit board 21 away from the bottom shell 120 has a first functional area 214 and a second functional area 215 distributed in the first direction L1, the first functional area 214 is provided with a plurality of computing chips 213, and the second functional area 215 is provided with an electrical connector 211 for connecting with the control module 10, the first functional area 214 is covered with a heat dissipation member 22, and the second functional area 215 is exposed outside the heat dissipation member 22. In this way, the computing chips 213 on the first functional area 214 are cooled by the heat dissipation member 22, ensuring stable operation of the computing chips 213, while facilitating connection of the electrical connector 211 on the second functional area 215 with the control module 10, and avoiding interference of the heat dissipation member 22 with connection between the circuit board 21 and the control module 10.

[0239] The computing chip 213 can be any one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a neural network processor (NPU), etc., and is not limited thereto.

[0240] The circuit board 21 can also be provided with a power management unit, a clock and timer circuit, a capacitor, an inductor, a resistor, etc., and is not limited thereto, to form a complete computing unit together with the chip. These elements can be provided in the second functional area 215 or partially in the first functional area 214 and partially in the second functional area 215. Relative to the heat dissipation amount of the chip, the heat dissipation amount of these elements is small, and even if they are provided in the second functional area 215 without being covered by the heat dissipation member 22, they can also meet their heat dissipation requirements through natural convection.

[0241] In the example where the heat dissipation member 22 is two, see FIG. 7B One of the heat dissipation members 22 can cover the first functional area 214, and the other heat dissipation member 22 can cover the surface of the circuit board 21 facing the bottom shell 120, i.e., part of the surface of the circuit board 21 away from the bottom shell 120, i.e., the first functional area 214, is covered with the heat dissipation member 22, and the surface of the circuit board 21 facing the bottom shell 120 can be partially or entirely covered with the heat dissipation member 22 to enhance the heat dissipation effect.

[0242] For example, see FIG. 7BThe heat dissipation member 22 covering the first functional area 214 has a first heat dissipation area 223 away from the second functional area 215 and a second heat dissipation area 224 adjacent to the second functional area 215. The height dimension of the fins 222 of the second heat dissipation area 224 extending away from the bottom shell 120 is smaller than that of the first heat dissipation area 223. That is, the fins 222 of the second heat dissipation area 224 are closer to the shell plate 111 of the shell 110 than the fins 222 of the first heat dissipation area 223, so as to reserve a space for arranging the control module 10 between the second heat dissipation area 224 and the shell plate 111, avoiding interference between the fins 222 and the control module 10, and improving the compactness of the computing device 100 to save space.

[0243] For example, the control module 10 can be located on the side of the second heat dissipation area 224 and the second functional area 215 away from the bottom shell 120, that is, part of the control module 10 is located on the side of the second heat dissipation area 224 away from the bottom shell 120, and the other part extends to the side of the second functional area 215 away from the bottom shell 120, so as to meet the size requirement of the control module 10 and facilitate the connection between the control module 10 and the circuit board 21.

[0244] In some examples, referring to FIG. 4 and FIG. 7A The control module 10 is provided with a connection matching part 11 corresponding to and matched with the electrical connector 211 of the second functional area 215. The electrical connector 211 is matched with the connection matching part 11 to connect the control module 10 with the circuit board 21.

[0245] The electrical connector 211 and the connection matching part 11 can be a socket matched with a pin to improve the convenience of the electrical connection between the control module 10 and the circuit board 21. The electrical connector 211 and the connection matching part 11 can also be a board-to-board connection or an interface connection, and are not limited thereto.

[0246] In other examples, the control module 10 and the computing module 20 can be connected by wires.

[0247] It should be noted that the above is only an example for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the connection mode of the control module 10 and the computing module 20 can also be wireless connection, USB connection, magnetic connection, and the like, and is not limited thereto.

[0248] For example, one of the heat dissipation member 22 and the circuit board 21 is provided with a positioning part, and the other is provided with a positioning matching part. The positioning hole part and the positioning matching part are matched to provide positioning for the installation of the circuit board 21 and the heat dissipation member 22, facilitating the assembly of the circuit board 21 and the heat dissipation member 22.

[0249] In some examples, as shown inFIG. 7B and FIG. 8A As shown, one of the positioning part and the positioning mating part can be a positioning post 2211, and the other can be a positioning hole 212. The positioning post 2211 and the positioning hole 212 are inserted and mated to realize the installation and positioning of the circuit board 21 and the heat sink 22.

[0250] In other examples, the positioning part and the positioning mating part can be a fit between a protrusion and a groove.

[0251] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the positioning part and the positioning mating part can also be a mating of a pin and a hole, a mating of a latch and a lock, or magnetic positioning, etc., and are not limited to these.

[0252] For example, see FIG. 7B The heat-conducting plate 221 adjacent to the bottom shell 120 has a fixing area at each of its two ends in the first direction L1. No heat sink 222 is provided in the fixing area. A positioning post 2211 is provided on the side of the fixing area adjacent to the first functional area 214 facing the first functional area 214. The circuit board 21 and the heat-conducting plate 221 away from the bottom shell 120 have positioning holes 212 corresponding to the positioning posts 2211. The positioning posts 2211 are fitted into the positioning holes 212. That is, by cooperating with the positioning posts 2211 at the ends of the heat-conducting plate 221 adjacent to the bottom shell 120 and the corresponding positioning holes 212 of the circuit board 21 and the other heat-conducting plate 221, positioning is provided for the installation of the circuit board 21 and the heat sink 22.

[0253] See in some examples FIG. 7B The circuit board 21 and the heat sink 22 are fixed together by fasteners. For example, a first fixing hole 2221 is defined between multiple heat sinks 222 of the heat sink 22, the heat-conducting plate 221 of the heat sink 22 has a second fixing hole 2212 corresponding to the first fixing hole 2221, and the circuit board 21 is defined with a corresponding mating hole 217 (e.g., FIG. 8A As shown, the circuit board 21 and the heat sink 22 are fixed by fasteners that pass through the first fixing hole 2221, the mating hole 217 and the second fixing hole 2212 in sequence. The number of the first fixing hole 2221, the mating hole 217 and the second fixing hole 2212 can be one or more to enhance the stability of the fixation between the circuit board 21 and the heat sink 22.

[0254] In other examples, the circuit board 21 and the heat sink 22 are fixed together by an adhesive, such as thermally conductive adhesive.

[0255] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the circuit board 21 and the heat sink 22 can also be fixed by riveting, snap-fit ​​connection, or welding, and are not limited to these methods.

[0256] The fixing manner of the circuit board 21 and the heat sink 22 to the bottom shell 120 can also be various.

[0257] In some examples, referring to FIG. 7B , the circuit board 21 and the heat sink 22 are fixed to the bottom shell 120 by fasteners, specifically, the positioning column 2211 is formed with a first connecting hole 22111 penetrating the heat conduction plate 221 in the thickness direction of the heat conduction plate 221, the inner surface of the bottom shell 120 is provided with a plurality of fixing columns 123, part of the fixing columns 123 correspond to the positioning column 2211 and are provided with a first fixing hole 1231 corresponding to the first connecting hole 22111, and the circuit board 21 and the heat conduction plate 221 are fixed to the bottom shell 120 by fasteners sequentially penetrating the positioning hole 212 and the first connecting hole 22111 and fastened to the first fixing hole 1231. That is, the positioning column 2211 can realize the fixing of the circuit board 21 and the heat sink 22 to the bottom shell 120 by cooperating with part of the fixing columns 123 of the bottom shell 120 corresponding thereto.

[0258] In other examples, continuing to refer to FIG. 7B , the fixing area adjacent to the second functional area 215 is formed with a second connecting hole 2213 penetrating the heat conduction plate 221 in the thickness direction of the heat conduction plate 221, the second functional area 215 is formed with a third connecting hole 216 corresponding to the second connecting hole 2213 (also refer to FIG. 8A ), and part of the fixing columns 123 are provided with a second fixing hole 1232 corresponding to the second connecting hole 2213, and the circuit board 21 and the heat conduction plate 221 are fixed to the bottom shell 120 by fasteners sequentially penetrating the third connecting hole 216 and the second connecting hole 2213 and fastened to the second fixing hole 1232. Thus, the cooperation of the second connecting hole 2213 of the heat conduction plate 221, the third connecting hole 216 of the second functional area 215 of the circuit board 21 and part of the fixing columns 123 of the bottom shell 120 corresponding thereto can realize the fixing of the circuit board 21 and the heat sink 22 to the bottom shell 120.

[0259] When the above two examples are combined, a plurality of fixing positions can be formed on the circuit board 21 and the heat sink 22, and the stability of the connection of the circuit board 21 and the heat sink 22 to the bottom shell 120 is enhanced.

[0260] In other examples, the heat sink 22 and the bottom shell 120 can be fixed by an adhesive.

[0261] It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the heat sink 22 and the bottom shell 120 can also be fixed by riveting, buckle connection or welding, etc., and are not limited thereto.

[0262] For example, referring to FIG. 7BThe inner side of the bottom shell 120 is provided with a reinforcing member 125 extending towards the heat dissipation member 22, and the reinforcing member 125 is connected with the plurality of fixing columns 123 to improve the strength and stability of the fixing columns 123.

[0263] In some examples, referring to FIG. 7B The reinforcing member 125 of the bottom shell 120 includes a reinforcing connecting plate 1251 and a reinforcing side plate 1252 connected to the outer side of the reinforcing connecting plate 1251 in the first direction L1, so that the plurality of fixing columns 123 distributed in the second direction L2 are connected through the reinforcing connecting plate 1251, and the stability of the fixing columns 123 is enhanced. The outer side of the reinforcing connecting plate 1251 in the first direction L1 refers to the side of the reinforcing connecting plate 1251 away from the center in the first direction L1.

[0264] In some examples, referring to FIG. 7B The reinforcing connecting plate 1251 can include a connecting section 12511 connected between two adjacent fixing columns 123 in the second direction L2 and a reinforcing section 12512 connected to the outer side of the fixing columns 123 distributed in the second direction L2. The reinforcing side plate 1252 reinforces the reinforcing connecting plate 1251, improves the strength and stability of the reinforcing member 125, and provides support for the heat conducting plate 221 of the heat dissipation member 22, ensuring the overall stability of the bottom shell 120, the heat dissipation member 22 and the circuit board 21.

[0265] In some examples, the reinforcing member 125 and the fixing columns 123 can be integrally formed with the bottom shell 120 to improve the structural strength and assembly efficiency.

[0266] In some examples, the reinforcing member 125 and the fixing columns 123 can be designed separately from the bottom shell 120, for example, fixed on the bottom shell 120 by welding or fasteners, and the like, and not limited thereto.

[0267] In the related art, a separate power supply module is provided to supply power to the circuit board of the computing device. The power supply module provides a voltage within a preset voltage range to the circuit board through voltage regulation to meet the working requirements of the circuit board. However, the provision of the power supply module increases the space occupation and weight, and increases the circuit complexity and cost.

[0268] The circuit board 21 of the embodiment of the present application can eliminate the separate power supply module while meeting the power requirements of the circuit board 21. The circuit board 21 of the embodiment of the present application is described in detail below. FIGS. 8A-8C

[0269] FIG. 8A An example of the front structure schematic diagram of the circuit board 21 of the embodiment of the present application is provided, FIG. 8B ​An exemplary three-dimensional structural diagram of the circuit board 21 according to an embodiment of this application is provided. FIG. 8C A schematic diagram of the front view structure of circuit board 21 according to an embodiment of this application is provided.

[0270] like FIG. 8A As shown, the circuit board 21 in this embodiment includes a board body 210, a chip array disposed on the board body 210, an electrical connector 211, and a voltage converter 27. The electrical connector 211 is disposed on the board body 210 and is used to supply power to the voltage converter 27. The voltage converter 27 is disposed on the board body 210 and is used to supply power to the chip array according to a preset voltage range. The circuit board 21 electrically connects the voltage converter 27 to the control module 10 via the electrical connector 211. The voltage converter 27 adjusts the voltage input from the control module 10 to the voltage required by the circuit board 21, thereby eliminating the need for a power supply module while meeting the power requirements of the circuit board 21.

[0271] like FIG. 8A and combined FIG. 7B As shown, the chip array is disposed on the first functional area 214 of the board body 210 of the circuit board 21 away from the bottom shell 120, the electrical connector 211 and the voltage converter 27 may be disposed on the second functional area 215 of the board body 210 away from the bottom shell 120.

[0272] The voltage converter 27 can be a DC-DC converter, such as a switching buck converter that converts a higher DC voltage to a lower DC voltage, an adjustable output voltage converter, or an AC-DC converter, etc., and is not limited thereto. The electrical connector 211 can be a pin header type, a header type, a USB type, etc., and is not limited thereto.

[0273] For example, the chip array includes at least two rows of chip groups 22, which are spaced apart in a second direction L2. Each row of chip groups 22 includes a plurality of computing chips 213 spaced apart in a first direction L1 to improve computing performance. FIG. 8A In the example shown, the chip array includes two rows of chipsets 22. In other examples, the chip array may include three or more rows of chipsets 22.

[0274] exist FIG. 8A In the example shown, the row of chipsets 22 adjacent to the electrical connector 211 is the first chipset 23, and the row of chipsets 22 away from the electrical connector 211 is the second chipset 24. The electrical connector 211 is disposed on the first side of the first chipset 23 in the first direction L1 and is located on the side of the first chipset 23 away from the second chipset 24. That is, the electrical connector 211 is closer to the first side of the first chipset 23 in the first direction L1, which facilitates the connection between the electrical connector 211 and the chip array.

[0275] In the example where the chip array includes two rows of chip groups 22, one of the rows of chip groups 22 adjacent to the electrical connector 211 is the first chip group 23, and the other row of chip groups 22 is the second chip group 24. In the example where the chip array includes more than two rows of chip groups 22, the row of chip groups 22 closest to the electrical connector 211 is the first chip group 23, and the row of chip groups 22 farthest from the electrical connector 211 is the second chip group 24.

[0276] It can be understood that, as shown in FIG. 8A and FIG. 8C , the electrical connector 211 has a power input end 2111 and a power ground end 2112. The power input end 2111 is connected to the second chip group 24 through the voltage converter 27, and the power ground end 2112 is connected to the first chip group 23, i.e., the power ground end 2112 is connected to the first chip group 23 closer to it through the power supply line L3, which shortens the length of the power supply line L3 connecting the first chip group 23 to the power ground end 2112 and reduces the crossing of the power supply line L3 of the ground end with other lines.

[0277] In some examples, the plurality of computing chips 213 in the chip array are connected in series, i.e., the chip array is powered in series as a whole. In other examples, the plurality of computing chips 213 in the chip array can be connected in parallel or in a series-parallel hybrid form.

[0278] In some examples, each computing chip 213 in the chip array can have the same model. In other examples, each computing chip 213 in the chip array can have the same size. Here, only examples are provided, and the application is not limited in this regard. Each computing chip 213 in the chip array can also have the same specifications or functions, etc., and is not limited to this.

[0279] For example, the second side of the first chip group 23 in the first direction L1 is electrically connected to the second side of the second chip group 24 in the first direction L1 (see the intermediate conductive member 26 shown in FIG. 8A , that is, when the chip array includes two rows of chip groups 22, the second side of the first chip group 23 in the first direction L1 is directly electrically connected to the second side of the second chip group 24 in the first direction L1. When the chip array includes more than two rows of chip groups 22, the second side of the first chip group 23 in the first direction L1 is electrically connected to the second side of the second chip group 24 in the first direction L1 through the chip group 22 between the first chip group 23 and the second chip group 24, thus achieving the series connection of the computing chips 213 in the chip array.

[0280] For example, as shown in FIGS. 8A-8CThe first chip group 23 is connected with the power supply ground end 2112 on the first side in the first direction L1, and the second chip group 24 is connected with the voltage converter 27 on the first side in the first direction L1, that is, the ends of the same side, i.e., the first side, of the first chip group 23 and the second chip group 24 in the first direction L1 are respectively used as the ground end and the power supply end, facilitating the arrangement of the power supply line L3 between the electrical connector 211, the voltage converter 27 and the chip array, increasing the compactness of each component on the circuit board 21, and reducing the overall size of the circuit board 21.

[0281] In some examples, the electrical connection of each computing chip 213 in the chip array can be connected through a conductive member, such as a conductive copper bar, to improve the current carrying capacity and reduce the resistance. In addition, based on the good heat conduction performance of the conductive member, heat dissipation of the chip can be facilitated.

[0282] In other examples, the electrical connection of each computing chip 213 in the chip array can be connected through a power supply line provided on the board body 210. This connection mode occupies a small space, and can realize miniaturization and high integration of the circuit board 21.

[0283] It should be noted that this is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the electrical connection of each computing chip 213 can also be connected through a combination of conductive members and power supply lines, and is not limited thereto.

[0284] In a specific example, as shown in FIG. 8A The electrical connection of each computing chip 213 in the chip array is connected through a conductive member. The board body 210 is provided with at least two conductive bars 25 and an intermediate conductive member 26. The at least two conductive bars 25 correspond to the at least two rows of chip groups 22 one by one. One conductive bar 25 is connected to a plurality of computing chips 213 in the corresponding row of chip groups 22, and the intermediate conductive member 26 is connected between the at least two rows of chip groups 22. That is, each computing chip 213 in the chip group 22 is connected in series through the conductive bar 25, and the computing chips 213 between the chip groups 22 are connected in series through the intermediate conductive member 26.

[0285] In some examples, the conductive bar 25 and the intermediate conductive member 26 can be provided integrally. In other examples, the conductive bar 25 and the intermediate conductive member 26 are provided separately. In examples where the conductive bar 25 and the intermediate conductive member 26 are provided separately, the conductive bar 25 and the intermediate conductive member 26 can respectively include an integral conductive sheet or a plurality of conductive sheets. In examples where the conductive bar 25 includes a plurality of conductive sheets and / or the intermediate conductive member 26 includes a plurality of conductive sheets, a power supply line can be provided in the gap region between the plurality of conductive sheets on the board body 210 to connect the plurality of conductive sheets through the power supply line.

[0286] The fixing of the conductive row 25, the intermediate conductive member 26 and the plate body 210 can be achieved by welding, fasteners or the like, and is not limited thereto.

[0287] In some examples, as shown in FIG. 8A , the voltage converter 27 is connected with the conductive row 25 through a power supply line, and the power ground end 2112 of the electrical connector 211 is connected with the conductive row 25 through the power supply line L3, so as to realize the electrical connection between the chip array and the voltage converter 27 and the electrical connector 211. In other examples, the voltage converter 27 and the power ground end 2112 of the electrical connector 211 are respectively connected with each computing chip 213 of the chip array through the power supply line L3 directly.

[0288] In one specific example, as shown in FIG. 8A and FIG. 8C , one conductive row 25 connected with the plurality of computing chips 213 of the first chip group 23 of the chip array is a first conductive row 251, and one conductive row 25 connected with the plurality of computing chips 213 of the second chip group 24 of the chip array is a second conductive row 252, the second conductive row 252 has a power supply input end 253 located at the first side of the second chip group 24 in the first direction L1, the first conductive row 251 has a power supply output end 254 located at the first side of the first chip group 23 in the first direction L1, the power supply input end 253 of the second conductive row 252 is connected with the voltage converter 27, and the power supply output end 254 of the second conductive row 252 is connected with the power ground end 2112 of the electrical connector 211.

[0289] For example, as shown in FIG. 8A , the intermediate conductive member 26 is arranged at the second side of the at least two rows of chip groups 22 in the first direction L1 and connected between the at least two rows of chip groups 22, so as to connect the second side of each chip group 22 in the first direction L1 in series. At the same time, the intermediate conductive member 26 is arranged separately from the electrical connector 211 and the voltage converter 27 on the first side in the first direction L1, so as to make the layout more reasonable and make full use of the space of the plate body 210.

[0290] For example, as shown in FIG. 8C , the electrical connector 211 has a signal connection end 2113 connected with the chip array, so that the control module and the computing chip 213 of the chip array can transmit data through the electrical connector 211, and the computing chip 213 can perform processing such as calculation and analysis on the data and feedback the data processing result.

[0291] For example, as shown in FIG. 8CThe power ground end 2112, the power input end 2111 and the signal connection end 2113 of the electric connector 211 are arranged in the first direction L1, which facilitates the electrical connection between the electric connector 211 and the voltage converter 27 and the chip array.

[0292] In the example shown in FIG. 8C The electric connector 211 can be in the shape of a long strip extending in the first direction L1, and the electric connector 211 is formed with two rows of pin holes arranged in the second direction L2, and the two rows of pin holes extend in the first direction L1 respectively, and the two rows of pin holes define the power ground end 2112, the power input end 2111 and the signal connection end 2113 arranged in the first direction L1 in sequence respectively.

[0293] In other examples, the electric connector 211 can be in the shape of a long strip extending in the second direction L2, and the electric connector 211 can be in the shape of a pin hole or a pin row.

[0294] It should be noted that the above is only for example and does not constitute a limitation on the present application. Those skilled in the art can understand that the electric connector 211 can also be in the shape of a regular shape such as a circle or a rectangle or an irregular shape, and is not limited to this. The connection form of the electric connector 211 can also be in the form of USB and the like, and is not limited to this.

[0295] As shown in FIG. 8C The signal connection end 2113 is connected to the side of the first chip group 23 of the chip array away from the second chip group 24 through the signal line L4, and is connected to the computing chip 213 closest to the signal connection end 2113 in the first chip group 23, on the one hand, the signal line L4 avoids the power supply line L3 connected to the first chip group 23 and the power ground end 2112, avoiding the interference of ground noise on the signal, ensuring the reliability and stability of the signal; on the other hand, it can shorten the length of the signal line L4, reduce the signal delay and simplify the wiring design.

[0296] The signal line L4 is connected to the computing chip 213 on the first side of the computing chip 213 in the second direction L2, and is further connected to the adjacent computing chip 213 on the second side of the computing chip 213 in the second direction L2, so as to connect the first chip group 23 and the computing chip 213 in the second chip group 24 in series. Referring to FIG. 8A and FIG. 8CIn the first chipset 23, signal line L4 connects the upper side of computing chip 213 (i.e., the side of the second direction L2 away from the second chipset 24) to the rightmost computing chip 213 (i.e., the computing chip 213 closest to the signal connection terminal 2113), the lower side of the rightmost computing chip 213 (i.e., the other side of the second direction L2) to the adjacent computing chip 213 on the left, and then the upper side of the left computing chip 213 to the next computing chip 213 on the left, and so on, thus connecting all computing chips 213 in the first chipset 23 in series. The end computing chip 213 in the first chipset 23 (i.e., the leftmost computing chip 213) is then connected to the computing chips 213 in the second chipset 24, and all computing chips 213 in the second chipset 24 are then connected in series with the first chipset 23.

[0297] In some examples, the computing chip 213 in the first chipset 23 that is farthest from the signal connection terminal 2113 is signal-connected to the computing chip 213 in the second chipset 24 that is farthest from the signal connection terminal 2113. That is, the signal line L4 in the first chipset 23 is transmitted from the nearest computing chip 213 to the farthest computing chip 213, and then from that farthest computing chip 213 to the computing chip 213 in the second chipset 24 that is closest to that farthest computing chip 213, in order to shorten the signal line L4. See reference. FIG. 8A and FIG. 8C The signal line L4 starts from the rightmost computing chip 213 in the first chipset 23, and passes through each computing chip 213 on the left in sequence. Then it passes through the leftmost computing chip 213 to the leftmost computing chip 213 in the second chipset 24, and then passes through each computing chip 213 on the right in sequence, thus completing the signal transmission between the first chipset 23 and the second chipset 24.

[0298] In other examples, signal line L4 can be transmitted from a computing chip 213 located in the middle of the first chipset 23, and then sequentially transmitted to adjacent computing chips 213 and computing chips 213 in the second chipset 24.

[0299] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the transmission path of signal line L4 is not limited to the above examples. For example, signal line L4 may first pass through the second chipset 24 and then be transmitted to the first chipset 23, and then be transmitted sequentially from the computing chip 213 of the second chipset 24 to other computing chips 213 at the signal connection terminal 2113. It is not limited to this.

[0300] In some examples, the number of computing chips 213 in the first chip group 23 can be odd. When the number of computing chips 213 in the first chip group 23 is odd, when the signal line L4 is transmitted to the leftmost computing chip 213 of the first chip group 23, the signal line L4 can be led from the lower side of the computing chip 213 (i.e., the side of the computing chip 213 close to the second chip group 24 in the second direction L2), so that the signal line L4 can continue to be transmitted to the leftmost computing chip 213 of the second chip group 24 from the lower side of the computing chip 213, thereby shortening the signal line L4 and ensuring the stability of signal transmission.

[0301] In other examples, the number of computing chips 213 in the first chip group 23 can be even.

[0302] The total number of computing chips 213 in the chip array can be determined according to the required computing power of the circuit board 21. In addition, the number of computing chips 213 in the first chip group 23 and the number of computing chips 213 in the second chip group 24 can be determined according to the component layout design requirements of the circuit board 21. The number of computing chips 213 in the second chip group 24 can be odd or even, which is not limited in the embodiments of the present application.

[0303] In some examples, the number of computing chips 213 in the first chip group 23 is greater than the number of computing chips 213 in the second chip group 24, that is, the number of computing chips 213 in the first chip group 23 closer to the signal connection end 2113 is more, and the number of computing chips 213 in the second chip group 24 farther from the signal connection end 2113 is less, so as to ensure that the signal can be transmitted to more computing chips 213 in the same time, and improve the signal transmission efficiency.

[0304] In other examples, the number of computing chips 213 in the first chip group 23 can be the same as the number of computing chips 213 in the second chip group 24.

[0305] It should be noted that the above is only for example illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the number of computing chips 213 in the first chip group 23 can also be less than the number of computing chips 213 in the second chip group 24.

[0306] In some examples, the spacing between two adjacent computing chips 213 in the second chip group 24 is greater than the spacing between other adjacent computing chips 213. For example, referring to FIG. 8A , the spacing between adjacent computing chips 213 adjacent to the first side in the first direction L1 in the second chip group 24 is greater than the spacing between adjacent computing chips 213 adjacent to the second side in the first direction L1, that is, the spacing between adjacent computing chips 213 on the right side in the second chip group 24 is greater than the spacing between adjacent computing chips 213 on the left side.

[0307] It can be understood that when the board body 210 reserves the same arrangement space for the first chip group 23 and the second chip group 24, if the number of computing chips 213 in the first chip group 23 is greater than the number of computing chips 213 in the second chip group 24, it is equivalent to reducing the chips of the second chip group 24, that is, removing part of the computing chips 213 in the second chip group 24, and increasing the spacing of the adjacent computing chips 213.

[0308] In the example shown in the figure, the spacing of the adjacent computing chips 213 in the middle region of the second chip group 24 is greater than the spacing of the adjacent computing chips 213 on both sides. It can be understood that the middle region of the second chip group 24 removes two computing chips 213, and the spacing of the adjacent computing chips 213 in the remaining middle region is equivalent to twice the spacing of the other adjacent computing chips 213 and the size of the two computing chips 213. FIG. 8A It should be noted that the above is only for illustration and does not constitute a limitation on the present application. Those skilled in the art can understand that the spacing between the two adjacent computing chips 213 in the second chip group 24 can be uniform or partially uniform, etc., and is not limited thereto.

[0309] For example, as shown in the figure, the relief gap 2201 of the board body 210 is formed on the side of the board body adjacent to the first chip group 23 in the second direction L2, and the relief gap 2201 extends from the second side of the board body 210 in the first direction L1 to the side adjacent to the electrical connector 211.

[0310] FIG. 8A It should be noted that the ratio of the extension size of the board body 210 in the first direction L1 to the extension size of the board body 210 in the second direction L2 can be set according to the actual design requirements of the computing device. For example, the ratio of the extension size of the board body 210 in the first direction L1 to the extension size of the board body 210 in the second direction L2 falls within the ratio range of 1.5:1 to 3.5:1, that is, the length size of the board body 210 and the width size satisfy the aforementioned ratio range, which provides suitable space for the arrangement of the chip array and other electronic components to match the performance requirements and size requirements of the computing device.

[0311] It can be understood that different functional electronic components require different working voltages, and when the computing device uses other electronic components, such as a control module, to supply power to the circuit board 21, it needs to convert the output voltage of the control module to the voltage required by the circuit board 21 through the voltage converter 27.

[0312] It can be understood that different functional electronic components require different working voltages, and when the computing device uses other electronic components, such as a control module, to supply power to the circuit board 21, it needs to convert the output voltage of the control module to the voltage required by the circuit board 21 through the voltage converter 27.

[0313] For example, as shown in the figure, the relief gap 2201 of the board body 210 is formed on the side of the board body adjacent to the first chip group 23 in the second direction L2, and the relief gap 2201 extends from the second side of the board body 210 in the first direction L1 to the side adjacent to the electrical connector 211. FIG. 8A ​As shown, the voltage converter 27 comprises a voltage regulating module, which comprises a voltage control chip, an input voltage switching element 271 and an output voltage switching element 272, and the voltage control chip is configured to control the on-off of the input voltage switching element 271 and the output voltage switching element 272 according to a preset voltage range. The voltage control chip can monitor the output voltage of the voltage converter 27 in real time, and determine whether the actual output voltage is within the preset voltage range. If the output voltage of the voltage converter 27 does not fall within the preset voltage range, the voltage control chip will adjust the on-off time of the input voltage switching element 271 and the output voltage switching element 272, so as to stabilize the output voltage of the voltage converter 27 and make it fall within the preset voltage range, thereby meeting the working requirements of the chip array.

[0314] In some examples, the input voltage switching element 271 and the output voltage switching element 272 can be metal oxide semiconductor field effect transistors, i.e., the input voltage switching element 271 is a high-side MOS field effect transistor and the output voltage switching element 272 is a low-side MOS field effect transistor, so as to reduce the on-resistance and improve the efficiency of the voltage converter 27.

[0315] In other examples, the input voltage switching element 271 can be an insulated gate bipolar transistor (IGBT) or a bipolar junction transistor (BJT), and the output voltage switching element 272 can be a freewheeling diode, and the like.

[0316] It can be understood that the signal connection end 2113 of the electrical connector 211 can output two signals, one of which is transmitted to the chip array to make the computing chip 213 perform operation and analysis, and the other of which is transmitted to the voltage control chip to make the voltage control chip perform control on the input voltage switching element 271 and the output voltage switching element 272.

[0317] For example, the voltage control chip can comprise a voltage control main chip 273 and a voltage control auxiliary chip 274, and the voltage control main chip 273 is responsible for generating a pulse width modulation (PWM) signal to control the on-off of the input voltage switching element 271 and the output voltage switching element 272. The voltage control auxiliary chip 274 can comprise a start-up circuit, a bias power supply and a protection circuit, etc., to provide auxiliary power management and provide stable power supply for the voltage control main chip 273 and other auxiliary circuits.

[0318] The voltage regulating module further comprises a resistive element 276, which can include a voltage dividing resistor, a current monitoring resistor, a start-up resistor, etc., and a diode 275. The voltage regulating module obtains a feedback signal of the output voltage of the voltage converter 27 through the voltage dividing resistor, which is input into an error amplifier in the voltage control main chip 273, compared with a preset voltage range, to generate an error signal, which is input into a PWM control circuit in the voltage control main chip 273. The PWM control circuit adjusts the duty cycle of the PWM according to the error signal, and the duty cycle determines the on and off time of the input voltage switching element 271 and the output voltage switching element 272, so as to adjust the output voltage of the voltage converter 27 to be within the preset voltage range. The current detection resistor monitors the current size through the voltage drop thereon, and provides a current detection signal for overcurrent protection and current mode control. The start-up resistor is used to provide an initial start-up current for the voltage control main chip 273. The diode 275 is used to protect the elements in the circuit from overvoltage or reverse voltage.

[0319] For example, the voltage converter 27 comprises a voltage stabilizing module, which comprises an input capacitor element 277, an output capacitor element 279 and an inductor element 278. The input capacitor element 277 is connected between the power input end 2111 of the electrical connector 211 and the input end of the input voltage switching element 271. The input end of the inductor element 278 is connected to the output end of the input voltage switching element 271 and the input end of the output voltage switching element 272, respectively. The output end of the inductor element 278 is connected to the input end of the output capacitor element 279 and the power supply input end 253 of the chip array, respectively.

[0320] The input capacitor element 277 filters the input voltage of the electrical connector 211 to reduce the ripple of the input voltage. When the input voltage switching element 271 is turned on, the input voltage provides energy to the chip array and the output capacitor element 279 through the inductor element 278. The output capacitor element 279 filters the output voltage to reduce the ripple of the output voltage and provides a stable DC output for the chip array. When the input voltage switching element 271 is turned off and the output voltage switching element 272 is turned on, the energy stored in the inductor element 278 is released through the input voltage switching element 271 to maintain the output voltage. The inductor element 278 is responsible for storing energy and smoothing the current to reduce the transient change of the current and maintain continuous current supply.

[0321] For the convenience of understanding, the voltage regulating and stabilizing process of the voltage converter 27 is described below with a specific example.

[0322] Referring to FIGS. 8A-8C, one end of the input capacitor element 277 is connected to the power input end 2111 of the electric connector 211, and the other end is connected to the drain of the input voltage switch element 271, the source of the input voltage switch element 271 is connected to the drain of the output voltage switch element 272 and the inductor element 278, the gate of the input voltage switch element 271 is connected to the PWM signal output of the voltage control chip; the source of the output voltage switch element 272 is grounded, the drain is connected to the drain of the output voltage switch element 272 and the inductor element 278, and the gate is connected to the PWM output of the voltage control chip; one end of the output capacitor element 279 is connected to the output voltage of the inductor element 278, and the other end is connected to the ground; the power supply input end of the chip array is connected to the output voltage of the inductor element 278, and the power supply output end is connected to the ground.

[0323] In the initial state, the input voltage switch element 271 is turned on, the output voltage switch element 272 is turned off, the input voltage of the electric connector 211 provides current to the output end through the input capacitor element 277, the input voltage switch element 271 and the inductor element 278, charges the output capacitor element 279 and powers the chip array, and the current in the inductor element 278 gradually increases to store energy. During this process, the voltage control chip monitors the output voltage of the voltage converter 27, obtains the output voltage signal through the feedback circuit, and compares it with the preset voltage range. When the output voltage is lower than the preset voltage range, the voltage control chip increases the duty cycle to prolong the conduction time of the input voltage switch element 271; when the output voltage is higher than the preset voltage range, the voltage control chip reduces the duty cycle to shorten the conduction time of the input voltage switch element 271.

[0324] When the PWM signal becomes low, the input voltage switch element 271 is turned off, the output voltage switch element 272 is turned on, the energy of the inductor element 278 is released through the output voltage switch element 272, and continues to provide current to the output end, and the current in the inductor element 278 gradually decreases. When the PWM signal becomes high, the input voltage switch element 271 is turned on, the output voltage switch element 272 is turned off, and the input voltage is transmitted to the output end through the input voltage switch element 271 and the inductor. The input voltage switch element 271 and the output voltage switch element 272 are periodically turned on and off in this way to continuously provide stable output voltage for the chip array, meeting the power supply needs of the chip array.

[0325] In some examples, referring to FIG. 8A , the inductor element 278 is adjacent to the first side of the second chip group 24 of the chip array in the first direction L1, facilitating the connection of the inductor element 278 and the power supply input end 253 of the second chip group 24, and shortening the power supply circuit.

[0326] In some examples, referring to FIG. 8A, the number of input capacitive elements 277 is at least two, and the at least two input capacitive elements 277 are connected in parallel to reduce power supply noise and ripple and improve filtering effect. Meanwhile, the plurality of input capacitive elements 277 can share current, reduce the current load of each input capacitive element 277, and prolong the service life of the input capacitive element 277.

[0327] It can be understood that the at least two input capacitive elements 277 are arranged on the first side of the inductive element 278 in the first direction L1, and the at least two input capacitive elements 277 are spaced apart in the second direction L2, facilitating the connection of the input capacitive element 277 and the inductive element 278.

[0328] In some examples, referring to FIG. 8A , the number of output capacitive elements 279 is at least two, and the at least two output capacitive elements 279 are connected in parallel to reduce power supply noise and ripple and improve filtering effect. The plurality of output capacitive elements 279 can share current, reduce the current load of each output capacitive element 279, and prolong the service life of the output capacitive element 279.

[0329] Continuing to refer to FIG. 8A , part of the output capacitive elements 279 are arranged on the side of the second chip group 24 away from the first chip group 23 of the chip array and on the second side of the inductive element 278 in the first direction L1, and the other part of the output capacitive elements 279 are arranged on the side of the inductive element 278 adjacent to the first chip group 23 in the second direction L2, to better utilize the space of the circuit board 21.

[0330] In some examples, the number of output voltage switching elements 272 is at least two, and the at least two output voltage switching elements 272 are connected in parallel to reduce conduction loss, reduce the current load of each output voltage switching element 272, thereby reducing the power consumption and heat generation of each output voltage switching element 272, providing certain redundancy protection, and improving the efficiency and reliability of the voltage converter 27.

[0331] In some examples, referring to ​ , the input voltage switching element 271 and the output voltage switching element 272 are arranged in the region defined between the input capacitive element 277, the inductive element 278, the output capacitive element 279, and the voltage control chip, and each element is more concentrated, facilitating the connection of each element and improving the space utilization of the circuit board 21.

[0332] In other examples, the distribution positions of the input capacitive element 277, the output capacitive element 279, the input voltage switching element 271, and the output voltage switching element 272 can be freely distributed in the right side region (the first side region in the first direction L1) of the board body 210.

[0333] It should be noted that the above is only an example and does not constitute a limitation on the present application. Those skilled in the art can understand that the distribution position of each element can also be in the upper side area or the lower side area of the plate body 210, and is not limited thereto.

[0334] Other configurations of the computing device 100 of the above exemplary embodiments can be implemented in various technical solutions known to those skilled in the art now and in the future, which are not described in detail here.

[0335] As understood by those skilled in the art, the above examples can be combined in any combination to achieve specific design requirements and functions without departing from the spirit or scope of the present application.

[0336] In the description of the present application, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "vertical" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0337] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0338] In the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" and the like can be electrically connected, and can also be communicated; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication or interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0339] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include the first and second features in direct contact, or the first and second features not in direct contact but in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0340] The foregoing disclosure provides many different embodiments or examples for implementing different structures of the present application. For simplicity of disclosure, the foregoing description has focused on a specific example of a specific example. It is, of course, contemplated that working examples will vary from these specific examples and that others will occur to those of ordinary skill in the art. It is also contemplated that the various embodiments and / or examples described herein can be implemented in various orderings and / or combinations thereof, and that the ordering and / or combination of various embodiments and / or examples described herein is not limiting.

[0341] The above description is only specific example of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various changes or replacements within the technical scope disclosed by the present application, and these should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A fan device characterized by comprising: The shell comprises a bottom shell and a cover shell arranged on the bottom shell, the bottom shell and the cover shell defining an air duct, the cover shell having a support, the support defining a clamping slot; The fan module is accommodated in the clamping slot, and generates airflow flowing along the air duct during operation. The support comprises at least two partitions, the at least two partitions being spaced apart in a first direction, and adjacent two of the partitions defining the clamping slot.

2. The fan arrangement of claim 1, wherein The cover shell has a shell plate opposite to the bottom shell, the partitions extending from the inner side of the shell plate towards the bottom shell, and adjacent two of the partitions defining two first walls of the clamping slot, and the area between the adjacent two of the partitions defining a second wall of the clamping slot.

3. The fan arrangement of claim 2, wherein, The edges of the adjacent two of the partitions in the direction towards the bottom shell define a clamping entrance of the clamping slot, and the clamping entrance is used for clamping the fan module into the clamping slot.

4. The fan arrangement of claim 2, wherein, The support further comprises a baffle, the baffle being arranged on the side of the clamping slot in a second direction, and connected between the sides of the adjacent two of the partitions in the second direction; 5. The fan arrangement of claim 2, wherein, The baffle has a ventilation gap facing away from the shell plate of the cover shell, and the ventilation gap is used for airflow passing through. The clamping slot is provided with the baffles on opposite sides in the second direction.

6. The fan arrangement of claim 5, wherein, The number of the fan modules is at least two, the number of the partitions is at least three, the at least three of the partitions defining the at least two of the clamping slots, and the at least two of the fan modules corresponding to the at least two of the clamping slots one by one.

7. The fan arrangement of claim 2, wherein, Further comprising a flexible protection piece, the flexible protection piece being arranged on the outer peripheral wall of the fan module through which the airflow does not pass, and the part of the flexible protection piece between the fan module and the clamping slot abutting against the inner wall of the clamping slot, so that the fan module is clamped in the clamping slot.

8. The fan device of claim 1, wherein, The shell plate of the cover shell has a guide arranged extending in the direction towards the bottom shell, and the bottom shell has a guide matching piece matched with the guide.

9. The fan device of claim 1, wherein, The guide is arranged on the first side of the partitions of the support in the second direction, and the guide is connected with the corresponding partitions and the baffles of the support through a connecting plate.

10. The fan arrangement of claim 9, wherein, The end of the fan module facing away from the shell plate of the cover shell defines a clamping wire gap on the first side in the second direction, the connecting line of the fan module is clamped in the clamping wire gap, and the connecting line extends to the side of the fan module facing away from the shell plate of the cover shell.

11. The fan device of claim 1, wherein, The air duct has an air inlet and an air outlet, and the cover shell defines the air inlet and the air outlet.

12. The fan device of claim 1, wherein, The air inlet and the air outlet are distributed in the second direction, the air outlet is adjacent to the first side of the support in the second direction, and the air inlet is adjacent to the second side of the support in the second direction.

13. The fan arrangement of claim 12, wherein, Further comprising a guide plate, the guide plate being connected to the inner side of the shell plate of the cover shell and extending in the airflow direction from the outer side of the support in the first direction.

14. The fan device of claim 1, wherein, In the airflow direction, the guide plate comprises a first guide section adjacent to the fan module, a second guide section extending outwardly from the first guide section, and a third guide section extending away from the fan module from the second guide section.

15. The fan arrangement of claim 14, wherein, The fan device of any one of claims 1 to 15; 16. A computing device, comprising: ​ ​ A computing module is arranged in the air duct of the fan device.

17. The computing device of claim 16, wherein, In the air flow direction, the computing module is located downstream of the fan module of the fan device.

18. The computing device of claim 16, wherein, The computing module is arranged on the inner side of the bottom shell of the fan device.

19. The computing device of claim 16, wherein, A filtering assembly is further arranged at the air inlet of the air duct, the filtering assembly comprising a filtering frame and a filtering element arranged in the filtering frame, the filtering element being configured to filter the air flow passing therethrough.

20. The computing device of claim 19, wherein, The cover of the fan device has an air inlet panel, the air inlet panel being formed with the air inlet; The bracket of the fan device and the air inlet panel define a receiving space, the cover and the bottom shell of the fan device define an insertion opening in communication with the receiving space, and the filtering assembly is inserted into the receiving space through the insertion opening.

21. The computing device of claim 20, wherein, The filtering frame has an insertion end and a closed end, the insertion end being inserted into the receiving space through the insertion opening, and the closed end covering the insertion opening.

22. The computing device of claim 21, wherein, The closed end is clamped with the bottom shell.

23. The computing device of claim 16, wherein, An air outlet guide assembly is further included, the air outlet guide assembly comprising an air outlet grille panel arranged outside the air outlet of the air duct, and configured to guide the air outlet.

24. The computing device of claim 23, wherein, A non-air-outlet region of the air outlet grille panel is provided with a magnetic element; The cover of the fan device has an air outlet panel, the air outlet panel defining the air outlet, a non-air-outlet region of the air outlet panel being provided with a magnetic cooperating element corresponding to the magnetic element, the magnetic element and the magnetic cooperating element being adsorbed and attached to each other to retain the air outlet grille panel on the air outlet panel.

25. The computing device of claim 24, wherein, The air outlet guide assembly further comprises a decorative strip arranged in the non-air-outlet region of the air outlet grille panel, and configured to cover the magnetic element.

26. The computing device of claim 16, wherein, A control module is further included, the control module being arranged in the air duct.

27. The computing device of claim 26, wherein, In the air flow direction, the control module is located downstream of the fan module.

28. The computing device of claim 26, wherein, The control module is arranged on the inner side of the shell panel of the cover of the fan device.

29. The computing device of claim 26, wherein, A data plug connected with the control module is further included, the cover of the fan device has a plug mounting portion, the plug mounting portion defining a plug mounting slot, and the data plug is clamped in the plug mounting slot.

30. The computing device of claim 29, wherein, The plug mounting portion is arranged on the outer side of the bracket of the fan device in the first direction.

31. The computing device of claim 29, wherein, The air inlet panel of the cover has an insertion hole in communication with the plug mounting slot, the insertion hole being configured to insert a data line to connect with the data plug.

32. The computing device of claim 16, wherein, A light emitting element and a light guide element are further included, the light emitting element and the light guide element being arranged inside the cover of the fan device, adjacent to the air outlet of the air duct, the light emitting element being arranged on the light guide element, and the light guide element being clamped with the cover.

33. The computing device of claim 32, wherein, The cover defines a mounting space on the inner side of the air outlet panel of the cover, the light guide element is clamped in the mounting space, the inner side of the air outlet panel has a first limiting portion, and an end surface of the light guide element towards the bottom shell abuts against the first limiting portion.

34. The computing device of claim 33, wherein, A temperature sensor is further included, the inner side of the air outlet panel further has a second limiting portion, an end surface of the light guide element towards the bottom shell has a third limiting portion, the third limiting portion and the second limiting portion define a limiting space, and the temperature sensor is clamped in the limiting space.

35. The computing device of claim 16, wherein, The fan device further comprises a transparent cover plate and a display screen, a shell plate of a housing of the fan device is formed with a display hole, a protective portion protruding inward is formed on an inner side periphery of the display hole, the transparent cover plate and the display screen are accommodated in a space defined by the protective portion and the display hole, and the transparent cover plate covers an outer side of the display screen.

36. The computing device of claim 35, wherein, The fan device further comprises a display protection member, and the display protection member covers an inner side of the display screen.

37. The computing device of claim 16, wherein, The computing module comprises a circuit board and at least one heat dissipation member, and at least one surface of the circuit board is provided with the heat dissipation member.

38. The computing device of claim 37, wherein, The heat dissipation member comprises a heat conduction plate and a plurality of heat dissipation fins, at least one surface of the circuit board is covered with the heat conduction plate, and the plurality of heat dissipation fins are arranged at intervals on a side of the heat conduction plate away from the circuit board.

39. The computing device of claim 38, wherein, Heat dissipation channels are formed between adjacent heat dissipation fins and extend along an airflow direction.

40. The computing device of claim 38, wherein, A bottom shell of the fan device has a plurality of guide matching members arranged at intervals in a first direction, and the heat conduction plate and the circuit board are respectively formed with avoiding notches for avoiding the plurality of guide matching members.

41. The computing device of claim 40, wherein, A reinforcing plate is arranged on a side adjacent to the avoiding notches of the guide matching member in a second direction, and the reinforcing plate abuts against the avoiding notches.

42. The computing device of claim 38, wherein, A surface of the circuit board away from the bottom shell of the fan device has a first functional area and a second functional area arranged in the first direction, the first functional area is provided with a plurality of computing chips, and the second functional area is provided with an electrical connector for connecting with a control module. The first functional area is covered with the heat dissipation member, and the second functional area is exposed to an outer side of the heat dissipation member.

43. The computing device of claim 42, wherein, The heat dissipation member covering the first functional area has a first heat dissipation area away from the second functional area and a second heat dissipation area adjacent to the second functional area, and a height dimension of the heat dissipation fins of the second heat dissipation area extending in a direction away from the bottom shell is smaller than a height dimension of the heat dissipation fins of the first heat dissipation area extending in the direction away from the bottom shell.

44. The computing device of claim 43, wherein, The control module is located on a side of the second heat dissipation area and the second functional area away from the bottom shell.

45. The computing device of claim 44, wherein, The control module is provided with a connection matching portion corresponding to and matching connected with the electrical connector of the second functional area.

46. The computing device of claim 45, wherein, One of the electrical connector and the connection matching portion is a pin, and the other is a socket.

47. The computing device of claim 42, wherein, The heat dissipation member is two, one of which covers the first functional area, and the other covers a surface of the circuit board facing the bottom shell.

48. The computing device of claim 47, wherein, The heat conduction plate of the heat dissipation member has a positioning portion, and one of the circuit board and the heat conduction plate has a positioning matching portion, and the positioning portion and the positioning matching portion are matched and connected.

49. The computing device of claim 47, wherein, Two ends of the heat conduction plate adjacent to the bottom shell in the first direction respectively have fixing areas, and the fixing areas are not provided with the heat dissipation fins; a positioning column is arranged on a side of the fixing area adjacent to the first functional area and facing the first functional area, the circuit board and the heat conduction plate away from the bottom shell have positioning holes corresponding to the positioning column, and the positioning column and the positioning hole are adaptively inserted.

50. The computing device of claim 49, wherein, The positioning column is formed with a first connecting hole penetrating through the heat conduction plate in a thickness direction of the heat conduction plate. The inner surface of the bottom shell has a plurality of fixing columns, some of which correspond to the positioning columns and have first fixing holes corresponding to the first connecting holes, and the circuit board and the heat-conducting plate are fixed to the bottom shell by being sequentially inserted into the positioning holes and the first connecting holes and fastened to the first fixing holes by fasteners.

51. The computing device of claim 50, wherein, The fixing area adjacent to the second functional area is formed with second connecting holes penetrating the heat-conducting plate in the thickness direction of the heat-conducting plate, and the second functional area is formed with third connecting holes corresponding to the second connecting holes. Some of the fixing columns have second fixing holes corresponding to the second connecting holes, and the circuit board and the heat-conducting plate are fixed to the bottom shell by being sequentially inserted into the third connecting holes and the second connecting holes and fastened to the second fixing holes by fasteners.

52. The computing device of claim 51, wherein, The inner side of the bottom shell is provided with a reinforcing member extending towards the heat-dissipating member, and the reinforcing member is connected to a plurality of the fixing columns.

53. The computing device of claim 52, wherein, The reinforcing member includes a reinforcing connecting plate and a reinforcing side plate connected to the outer side of the reinforcing connecting plate in the first direction, the reinforcing connecting plate includes a connecting section connected between two adjacent fixing columns in the second direction and a reinforcing section connected to the outer side of the fixing columns distributed in the second direction.

54. The computing device of claim 16, wherein, The circuit board of the computing module includes a board body, a chip array provided on the board body, and a voltage converter, an electrical connector of the circuit board is provided on the board body and used to supply power to the voltage converter, and the voltage converter is provided on the board body and used to supply power to the chip array according to a preset voltage range.

55. The computing device of claim 54, wherein, The chip array includes at least two rows of chip groups, the at least two rows of chip groups are arranged at intervals in the second direction, and each row of the chip groups includes a plurality of computing chips arranged at intervals in the first direction.

56. The computing device of claim 55, wherein, One row of the chip groups adjacent to the electrical connector is a first chip group, and one row of the chip groups away from the electrical connector is a second chip group, the electrical connector is arranged on a first side of the first chip group in the first direction and located on a side of the first chip group away from the second chip group.

57. The computing device of claim 56, wherein, The electrical connector has a power input end and a power ground end, the power input end is connected to the second chip group through the voltage converter, the power ground end is connected to the first chip group, and the plurality of computing chips in the chip array are connected in series.

58. The computing device of claim 57, wherein, A second side of the first chip group in the first direction is electrically connected to a second side of the second chip group in the first direction, a first side of the first chip group in the first direction is connected to the power ground end, and a first side of the second chip group in the first direction is connected to the voltage converter.

59. The computing device of claim 54, wherein, The electrical connector has a signal connection end, and the signal connection end is connected to the chip array.

60. The computing device of claim 59, wherein, The signal connection end is connected to a side of the first chip group of the chip array away from the second chip group through a signal line and is connected to a computing chip closest to the signal connection end in the first chip group.

61. The computing device of claim 60, wherein, The signal line is connected to the computing chip on one side of the computing chip in the second direction, and connected to the adjacent computing chip on the other side of the computing chip in the second direction.

62. The computing device of claim 61, wherein, The computing chip farthest from the signal connection end in the first chip group is connected to the computing chip closest to the computing chip in the second chip group.

63. The computing device of claim 62, wherein, The number of computing chips in the first chip group of the chip array is odd.

64. The computing device of claim 54, wherein, The voltage converter comprises a voltage regulating module, the voltage regulating module comprises a voltage control chip, an input voltage switching element and an output voltage switching element, and the voltage control chip is used for controlling the on-off of the input voltage switching element and the output voltage switching element according to a preset voltage range respectively.

65. The computing device of claim 64, wherein, The input voltage switching element and the output voltage switching element are metal oxide semiconductor field effect transistors respectively.

66. The computing device of claim 64, wherein, The voltage converter comprises a voltage stabilizing module, the voltage stabilizing module comprises an input capacitor element, an output capacitor element and an inductor element, the input capacitor element is connected between the power input end of the electrical connector and the input end of the input voltage switching element; The input end of the inductor element is connected to the output end of the input voltage switching element and the input end of the output voltage switching element respectively, and the output end of the inductor element is connected to the input end of the output capacitor element and the power supply input end of the chip array respectively.

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