Laser processing head and laser processing equipment

Abstract

The utility model is suitable for the technical field of laser processing, and provides a laser processing head and laser processing equipment. The processing light path lens group is arranged on the processing head shell and is provided with at least one optical device; a connecting member; the moving driving assembly is provided with a moving part and a driving part, and the driving part is connected to the moving part to drive the moving part to move so as to drive the connecting part to push at least one optical device relative to the machining head shell; the moving part is fixedly connected to or kept abutting against the connecting part, and the connecting part is fixedly connected to or kept abutting against at least one optical device. The laser processing head provided by the embodiment of the utility model can realize accurate adjustment.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and more particularly relates to a laser processing head and a laser processing device. BACKGROUND

[0002] With the development of manufacturing industry, laser processing is widely applied. The laser processing head is an important component of the laser processing device. The laser processing head can emit laser to process workpieces. When the laser processing head processes workpieces, the laser beam and the nozzle need to be coaxial. The conventional method is that an operator manually adjusts a screw to push any lens in the optical path to change the position of the laser beam, so as to ensure the coaxiality of the laser beam and the nozzle. However, when the operator manually adjusts, a large adjustment error is prone to occur. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the application provide a laser processing head and a laser processing device, which can realize accurate adjustment.

[0004] In a first aspect, embodiments of the application provide a laser processing head, comprising:

[0005] a processing head shell;

[0006] a processing optical path lens group, disposed in the processing head shell, and having at least one optical device;

[0007] a connecting component;

[0008] a moving drive assembly, having a moving component and a driving component, the driving component being connected to the moving component to drive the moving component to move, thereby driving the connecting component to push at least one optical device relative to the processing head shell;

[0009] the moving component is fixedly connected to or abuts against the connecting component, and the connecting component is fixedly connected to or abuts against at least one optical device.

[0010] In some possible implementation manners of the first aspect, the surface roughness of the connecting component is smaller than the surface roughness of the moving component.

[0011] In some possible implementation manners of the first aspect, the driving component is disposed in the processing head shell.

[0012] The laser processing head further comprises:

[0013] a resilient component, pressing the connecting component and at least one optical device tightly, so that the connecting component abuts against at least one optical device.

[0014] In some possible implementation manners of the first aspect, the elastic component is connected to the connecting component and the at least one optical device;

[0015] Alternatively, the driving component is fixedly arranged on the machining head shell, and the elastic component is connected to the machining head shell and the at least one optical device.

[0016] In some possible implementation manners of the first aspect, the moving component is a lead screw, and the driving component is capable of driving the lead screw to move relative to the machining head shell along a length direction of the lead screw.

[0017] In some possible implementation manners of the first aspect, the laser machining head further comprises:

[0018] a first circuit board arranged on the machining head shell;

[0019] a camera arranged on the first circuit board and located around the machining optical path mirror group;

[0020] a power supply main circuit board arranged on the machining head shell and connected to the first circuit board to supply power to the first circuit board.

[0021] In some possible implementation manners of the first aspect, the machining optical path mirror group comprises:

[0022] a beam splitter arranged on the machining head shell;

[0023] a machining focusing mirror located around the beam splitter to focus light passing through the beam splitter;

[0024] a camera focusing mirror located around the beam splitter to focus light reflected by the beam splitter;

[0025] the camera is located around the camera focusing mirror to receive light passing through the camera focusing mirror.

[0026] In some possible implementation manners of the first aspect, the machining optical path mirror group further comprises:

[0027] a camera protection mirror located between the camera focusing mirror and the camera;

[0028] a machining protection mirror located on a side of the machining focusing mirror away from the beam splitter.

[0029] In some possible implementation manners of the first aspect, the laser machining head further comprises:

[0030] a nozzle arranged on the machining head shell and located on a side of the machining focusing mirror away from the beam splitter;

[0031] The camera can take a picture of the molten pool of the workpiece via the inside of the nozzle to obtain an image of the molten pool and an image of the inside of the nozzle.

[0032] In some possible implementation manners of the first aspect, the connecting components and the moving driving assemblies are equal in number and are multiple; different connecting components are fixedly connected to or abut against different positions of the at least one optical device.

[0033] In the second aspect, the embodiments of the present application provide a laser processing device, comprising the laser processing head in any of the above.

[0034] The embodiments of the present application have the following beneficial effects:

[0035] The moving component is fixedly connected to or abut against the connecting component, and the connecting component is fixedly connected to or abut against the at least one optical device, so that the gap between the moving component and the connecting component is zero or almost zero, and the gap between the connecting component and the optical device is zero or almost zero. The moving component is driven to move by the driving component, so as to push the connecting component, and the connecting component pushes the at least one optical device of the processing optical path mirror group. The optical device is pushed in a moving manner, so as to instantly push the optical device and accurately adjust the position of the optical device of the processing optical path mirror group, thereby achieving accurate adjustment. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0037] Figure 1 A structural schematic diagram of the laser processing head from one angle according to an embodiment of the present application;

[0038] Figure 2 A structural schematic diagram of the laser processing head from another angle according to an embodiment of the present application;

[0039] Figure 3 A partial structural schematic diagram of the laser processing head from one angle according to an embodiment of the present application;

[0040] Figure 4 A partial structural schematic diagram of the laser processing head from another angle according to an embodiment of the present application;

[0041] Figure 5A structure diagram of a machining light path mirror set, a connecting component and a moving driving assembly of a laser machining head provided by an embodiment of the present application is shown in the figure;

[0042] Figure 6 A perspective view of a part of structure of a laser machining head provided by an embodiment of the present application is shown in the figure;

[0043] Figure 7 A structure diagram of a first circuit board and a camera of a laser machining head provided by an embodiment of the present application is shown in the figure;

[0044] Figure 8 A structure diagram of a machining light path mirror set and a camera of a laser machining head provided by an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0045] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application. Figures 1 to 8

[0046] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0047] It should be understood that the terms “length”, “width”, “upper”, “lower”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer” and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0048] It should be understood that the term “and / or” used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0049] In addition, the terms “first”, “second” are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with “first”, “second” can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of “plurality” is two or more, unless otherwise specifically limited.

[0050] ​Embodiments of the present application provide a laser processing head for laser processing. The laser processing head can be a laser cutting head, a laser welding head, or a laser marking head, etc.

[0051] Figure 1 Figure 1 shows a structural schematic diagram of a laser processing head according to an embodiment of the present application from one angle; Figure 2 Figure 2 shows a structural schematic diagram of a laser processing head according to an embodiment of the present application from another angle; Figure 3 Figure 3 shows a partial structural schematic diagram of a laser processing head according to an embodiment of the present application from one angle; Figure 4 Figure 4 shows a partial structural schematic diagram of a laser processing head according to an embodiment of the present application from another angle; Figure 5 Figure 5 shows a structural schematic diagram of a processing optical path mirror group, a connecting component and a moving driving assembly of a laser processing head according to an embodiment of the present application. Referring to Figures 1 to 5 Embodiments of the present application provide a laser processing head including a processing head shell 1, a processing optical path mirror group 2, a connecting component 8 and a moving driving assembly 9.

[0052] The processing head shell 1 is a frame of the laser processing head.

[0053] The processing optical path mirror group 2 is used for accessing laser and focusing or shaping the laser. The processing optical path mirror group 2 is arranged in the processing head shell 1.

[0054] The processing optical path mirror group 2 includes one or more optical devices. The optical devices can specifically include optical elements (such as lenses or protective mirrors) and mirror seats, and the optical elements are arranged in the mirror seats; wherein the mirror seats are optional.

[0055] At least one optical device of the processing optical path mirror group 2 is movably arranged in the processing head shell 1, i.e. at least one optical device of the processing optical path mirror group 2 is arranged in the processing head shell 1 and can move relative to the processing head shell 1.

[0056] The connecting component 8 can be fixedly connected to the moving driving assembly 9, or can be fixedly connected to at least one optical device of the processing optical path mirror group 2.

[0057] The connecting component 8 can be a rod or a block.

[0058] The moving driving assembly 9 can be a step-screw motor, or can be a linear motor.

[0059] Referring to Figure 5 The moving driving assembly 9 has a moving component 91 and a driving component 92.

[0060] The driving component 92 is arranged in the processing head shell 1.

[0061] The driving component 92 is connected to the moving component 91 to drive the moving component 91 to move, specifically to drive the moving component 91 to move along the length direction L of the moving component 91, so as to drive the connecting component 8 to push at least one optical device of the machining optical path mirror set 2 along the length direction L relative to the machining head housing 1, to realize the adjustment of the position of the optical device.

[0062] The moving component 91 is fixedly connected to or abuts against the connecting component 8, and the connecting component 8 is fixedly connected to or abuts against the at least one optical device, so as to eliminate or substantially eliminate the gap between the moving component 91 and the connecting component 8, and to eliminate or substantially eliminate the gap between the connecting component 8 and the optical device. Specifically, the moving component 91 is fixedly connected to or abuts against one end of the connecting component 8, and the other end of the connecting component 8 is fixedly connected to or abuts against the at least one optical device.

[0063] The abutting against can be achieved by the elastic component pressing the moving component 91 and the connecting component 8 tightly, and the elastic component pressing the connecting component 8 and the optical device tightly, or by the adsorption (such as magnetic adsorption or vacuum adsorption) of the moving component 91 and the connecting component 8 tightly, and the adsorption (such as magnetic adsorption or vacuum adsorption) of the connecting component 8 and the optical device tightly.

[0064] According to the above, the moving component 91 is fixedly connected to or abuts against the connecting component 8, and the connecting component 8 is fixedly connected to or abuts against the at least one optical device, so as to make the gap between the moving component 91 and the connecting component 8 be zero or almost zero, and to make the gap between the connecting component 8 and the optical device be zero or almost zero. The driving component 92 drives the moving component 91 to move, so as to push the connecting component 8, and the connecting component 8 pushes at least one optical device of the machining optical path mirror set 2. The moving mode of pushing the optical device can instantly push the optical device, and can realize the accurate adjustment of the position of the optical device of the machining optical path mirror set 2, so as to realize the accurate adjustment.

[0065] In addition, the connecting component 8 and the moving component 91 are independent components, and the surface roughness of the connecting component 8 can be smaller than that of the moving component 91, so as to more accurately push the optical device, and to further improve the adjustment accuracy.

[0066] The moving component 91 can be a lead screw, and the driving component 92 can drive the lead screw to move along the length direction of the lead screw. The lead screw has higher moving accuracy, and can further improve the adjustment accuracy.

[0067] In some other embodiments, the movable component 91 can move to abut against the connecting component 8 and can move to separate from the connecting component 8; driven by the movable component 91, the connecting component 8 can move to abut against at least one optical device and can move to separate from at least one optical device.

[0068] The number of the aforementioned connecting components 8 and the moving drive components 9 can be the same and there can be multiple of them.

[0069] Different connecting parts 8 are fixedly connected to or held against different positions of at least one optical device to push the optical device from different directions, enabling the position of the optical device to be adjusted from different positions for easy adjustment.

[0070] Figure 6 This is a perspective view of a portion of the structure of a laser processing head provided in one embodiment of this application. (Reference) Figure 6 The laser processing head may also include an elastic component 11.

[0071] The elastic member 11 is used to press the connecting member 8 against the optical device. Specifically, the elastic member 11 is connected to at least one optical device of the connecting member 8 and the processing optical path mirror assembly 2, so that after the optical device is pushed, it can move back to its original position under the restoring force of the elastic member 11, and can press the connecting member 8 against the optical device to further eliminate gaps.

[0072] In some other embodiments, the elastic member 11 is connected to at least one optical component of the processing head housing 1 and the processing optical path mirror assembly 2.

[0073] Since the driving component 92 of the moving drive assembly 9 is fixedly disposed on the processing head housing 1, and the moving component 91 is fixedly connected to or held against the connecting component 8, the elastic component 11 is connected to at least one optical device of the processing head housing 1 and the processing optical path mirror assembly 2, which can also achieve the pressing of the connecting component 8 and the optical device.

[0074] Figure 7 This is a schematic diagram of the structure of the first circuit board and camera of a laser processing head provided in one embodiment of this application. (Reference) Figures 1 to 4 ,as well as Figure 7 The laser processing head may also include a first circuit board 3, a camera 4, and a power supply main circuit board 5.

[0075] The first circuit board 3 is disposed on the processing head housing 1.

[0076] Camera 4 is mounted on the first circuit board 3 and located around the processing optical path mirror group 2 to receive light from the processing optical path mirror group 2.

[0077] refer to Figure 7 The camera 4 is specifically electrically connected to the first circuit board 3, and the first circuit board 3 supplies power to the camera 4.

[0078] The camera 4 can be specifically a CCD (Charge Coupled Device) camera. According to actual needs, the camera 4 can also be specifically a CMOS (Complementary Metal Oxide Semiconductor) camera.

[0079] The power supply main circuit board 5 is used for centralized power supply for each electrical device (such as the camera 4) of the laser processing head. The power supply main circuit board 5 is arranged on the processing head shell 1 and connected to the first circuit board 3 to supply power to the first circuit board 3.

[0080] The power supply main circuit board 5 can be specifically connected to the first circuit board 3 through a contact pin or connected to the first circuit board 3 through a lead wire located inside the laser processing head to realize power supply to the first circuit board 3.

[0081] According to the above, the processing optical path lens group 2 is arranged on the processing head shell 1, the camera 4 is located around the processing optical path lens group 2 to receive light from the processing optical path lens group 2, the camera 4 is arranged on the processing head shell 1 through the first circuit board 3, and the power supply main circuit board 5 arranged on the processing head shell 1 is connected to the first circuit board 3 to supply power to the first circuit board 3, so that the camera 4 is uniformly supplied with power through the power supply main circuit board 5, the exposed cable can be reduced, the overall structure can be more simple, the reliability can be improved, and the structure can be compact.

[0082] Reference Figure 2 The laser processing head can further include a first cover 6.

[0083] The first cover 6 is arranged on the processing head shell 1 and covers the first circuit board 3 and the camera 4, so that the first circuit board 3 and the camera 4 are located inside the laser processing head, the first circuit board 3 and the camera 4 can be prevented from being damaged due to exposure, and the first circuit board 3 and the camera 4 can be protected.

[0084] Reference Figure 1 The laser processing head can further include a second cover 7.

[0085] The second cover 7 is arranged on the processing head shell 1 and covers the power supply main circuit board 5, so that the power supply main circuit board 5 is located inside the laser processing head, the power supply main circuit board 5 can be prevented from being damaged due to exposure, and the power supply main circuit board 5 can be protected.

[0086] Figure 8 A structural schematic diagram of a processing optical path lens group and a camera of a laser processing head is provided for an embodiment of the present application. Reference Figure 8 The processing optical path lens group 2 can include a plurality of optical devices, which are a light splitting mirror 21, a processing focusing mirror 22, and a camera focusing mirror 23, respectively.

[0087] The beam splitter 21 is provided in the machining head housing 1. The beam splitter 21 is a semi-transmissive and semi-reflective beam splitter that can allow light to pass through and can reflect light.

[0088] The beam splitter 21 can be a coated beam splitter that can withstand light of a large power. Of course, the beam splitter 21 can also be a beam splitter that can withstand light of a commonly used power.

[0089] The machining focusing mirror 22 is located around the beam splitter 21 to focus light that passes through the beam splitter 21.

[0090] The camera focusing mirror 23 is located around the beam splitter 21 to focus light reflected by the beam splitter 21.

[0091] The camera 4 is located around the camera focusing mirror 23 to receive light that passes through the camera focusing mirror 23.

[0092] The machining focusing mirror 22 is provided in the machining head housing 1 and can move relative to the machining head housing 1. The optical device that is pushed by the connecting member 8 is the machining focusing mirror 22. Since the machining focusing mirror 22 is located far from the initial position of the laser light entering the machining optical path mirror group 2, a larger adjustment range can be provided. Of course, according to actual needs, other optical devices (such as the beam splitter 21) can also be pushed to achieve adjustment.

[0093] Reference Figure 8 The machining optical path mirror group 2 described above can further include a camera protection mirror 24.

[0094] The camera protection mirror 24 is located between the camera focusing mirror 23 and the camera 4 and can play a dustproof role to protect the camera focusing mirror 23.

[0095] The number of the camera protection mirror 24 can be one layer or multiple layers.

[0096] Reference Figure 8 The machining optical path mirror group described above can further include a machining protection mirror 25.

[0097] The machining protection mirror 25 is located on the side of the machining focusing mirror 22 that is away from the beam splitter 21 and can play a dustproof role and ensure air tightness to protect the machining focusing mirror 22.

[0098] The number of the machining protection mirror 25 can be one layer or multiple layers.

[0099] Reference Figure 8 The machining optical path mirror group described above can further include a collimating mirror 26.

[0100] The collimating mirror 26 is located on the side of the beam splitter 21 to maintain the collimation of the light beam that is irradiated to the beam splitter 21.

[0101] Reference Figure 8The machining light path mirror set can further include the upper protective mirror 27.

[0102] The upper protective mirror 27 is located on the side of the collimating mirror 26 away from the beam splitter 21 to achieve dustproof of the machining light path mirror set 2.

[0103] The number of the upper protective mirror 27 can be one or more.

[0104] In actual application, in the height direction H of the laser machining head, the laser first irradiates to the upper protective mirror 27 and then irradiates to the collimating mirror 26 through the upper protective mirror 27, irradiates to the beam splitter 21 through the collimating mirror 26, irradiates to the machining focusing mirror 22 through the beam splitter 21, is focused by the machining focusing mirror 22 and then irradiates to the workpiece through the machining protective mirror 25, and then irradiates to the workpiece to process the workpiece so that a molten pool is formed on the surface of the workpiece. The light reflected by the molten pool passes through the machining protective mirror 25 and the machining focusing mirror 22 in turn, irradiates to the beam splitter 21, is reflected by the beam splitter 21 to the camera focusing mirror 23, and then is received by the camera 4 through the camera protective mirror 24.

[0105] Reference Figures 1 to 4 , and Figure 8 The laser machining head can further include the nozzle 10.

[0106] The nozzle 10 is arranged on the machining head housing 1 and located on the side of the machining focusing mirror 22 away from the beam splitter 21.

[0107] As described above, when the laser processes the workpiece, a molten pool is formed on the surface of the workpiece.

[0108] The camera 4 can capture the molten pool of the workpiece through the inside of the nozzle 10 to obtain the image of the molten pool and the image of the inside of the nozzle 10 to control the movement driving assembly 9 to drive the connecting component 8 to push at least one optical device so that the light beam emitted from the machining light path mirror set 2 is coaxial with the nozzle 10.

[0109] The inside of the nozzle 10 has a hole for the laser to pass through, and the camera 4 captures the molten pool of the workpiece through the hole in the inside of the nozzle 10, which can capture the molten pool of the workpiece and the hole in the inside of the nozzle 10, thereby obtaining the image of the molten pool of the workpiece and the image of the hole in the inside of the nozzle 10.

[0110] The camera 4 can obtain the image of the molten pool and the image of the inside of the nozzle 10 at the same time by capturing once.

[0111] According to the image of the molten pool and the image of the inside of the nozzle 10, the degree of coaxiality of the light beam emitted from the machining light path mirror set 2 with the nozzle 10 can be determined, and the offset of the light beam relative to the nozzle 10 can be determined, which is used to generate a signal to control the movement driving assembly 9 to drive the connecting component 8 to push at least one optical device.

[0112] When the workpiece is processed by the laser, the light reflected by the molten pool of the workpiece propagates to the beam splitter 21, is reflected by the beam splitter 21 to the camera focusing lens 23, and is received by the camera 4 through the camera focusing lens 23. Since the camera 4 is arranged on the machining head housing 1 through the first circuit board 3, the camera 4 can move with the machining head housing 1. The camera 4 captures the molten pool of the workpiece through the inside of the nozzle 10, so as to obtain the image of the molten pool and the inside image of the nozzle 10. The camera 4 can avoid being damaged or hindered by the laser used for processing. The position of the at least one optical device can be adjusted in real time, so that the light beam emitted from the machining optical path lens group 2 is coaxial with the nozzle 10.

[0113] The laser processing head can further comprise a detection probe (not shown in the figure).

[0114] The detection probe is arranged on the machining head housing 1 and connected to the power supply main circuit board 5, and is powered by the power supply main circuit board 5.

[0115] The number of detection probes can be one or more.

[0116] The laser processing head can further comprise a focusing motor (not shown in the figure).

[0117] The focusing motor is arranged on the machining head housing 1 and connected to the power supply main circuit board 5, and is powered by the power supply main circuit board 5.

[0118] The embodiment of the present application further provides a laser processing device, which comprises the laser processing head provided by any of the above embodiments. The laser processing device can be a laser cutting machine, a laser welding machine, or a laser marking machine.

[0119] The laser processing device can further comprise a computer.

[0120] The computer is configured to control the movement driving assembly 9 to drive the connecting component 8 to push the at least one optical device, so as to make the light beam emitted from the machining optical path lens group 2 coaxial with the nozzle 10, according to the image of the molten pool and the inside image of the nozzle 10.

[0121] The laser processing device provided by the embodiment of the present application can realize remote automatic calibration of the coaxiality of the laser light beam and the nozzle 10.

[0122] The above merely describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser machining head, characterized by, The laser processing head comprises: a processing head housing; a processing optical path mirror set arranged in the processing head housing and comprising at least one optical device; a connecting component; a moving driving assembly comprising a moving component and a driving component, the driving component being connected to the moving component to drive the moving component to move, thereby driving the connecting component to push the at least one optical device relative to the processing head housing; the moving component is fixedly connected to or abuts against the connecting component, and the connecting component is fixedly connected to or abuts against the at least one optical device.

2. The laser machining head of claim 1, wherein The surface roughness of the connecting component is smaller than that of the moving component.

3. The laser machining head of claim 1, wherein, The driving component is arranged in the processing head housing. The laser processing head further comprises: an elastic component for pressing the connecting component and the at least one optical device, so that the connecting component abuts against the at least one optical device.

4. The laser machining head of claim 3, wherein The elastic component is connected to the connecting component and the at least one optical device. Alternatively, the driving component is fixedly arranged in the processing head housing, and the elastic component is connected to the processing head housing and the at least one optical device.

5. The laser machining head of claim 1, wherein The moving component is a lead screw, and the driving component is capable of driving the lead screw to move along the length direction of the lead screw relative to the processing head housing.

6. The laser machining head of claim 1, wherein The laser processing head further comprises: a first circuit board arranged in the processing head housing; a camera arranged on the first circuit board and located around the processing optical path mirror set; a power supply main circuit board arranged in the processing head housing and connected to the first circuit board to supply power to the first circuit board.

7. The laser machining head of claim 1, wherein The processing optical path mirror set comprises: a beam splitter arranged in the processing head housing; a processing focusing mirror located around the beam splitter to focus light transmitted through the beam splitter; a camera focusing mirror located around the beam splitter to focus light reflected by the beam splitter; the camera is located around the camera focusing mirror to receive light transmitted through the camera focusing mirror; a camera protection mirror located between the camera focusing mirror and the camera; a processing protection mirror located on the side of the processing focusing mirror away from the beam splitter.

8. The laser machining head of claim 7, wherein, The laser processing head further comprises: a nozzle arranged in the processing head housing and located on the side of the processing focusing mirror away from the beam splitter; the camera can capture the molten pool of a workpiece through the inside of the nozzle to obtain images of the molten pool and the inside of the nozzle.

9. The laser machining head of any one of claims 1 to 8, wherein, The number of the connecting components is the same as that of the moving driving assemblies, and both are multiple; different connecting components are fixedly connected to or abut against different positions of the at least one optical device.

10. A laser processing apparatus characterized by comprising: The laser processing head comprises the laser processing head according to any one of claims 1 to 9.

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