Multi-channel optical module TOSA

Abstract

The utility model relates to the technical field of optical communication, and provides a multi-channel optical module TOSA, which comprises an adapter and an optical transmitting assembly, the optical transmitting assembly is provided with a first shell, an array lens block and a plurality of laser chips, a plurality of lenses are integrated on the array lens block, the lenses are matched with the laser chips in a one-to-one correspondence manner, and the first shell is provided with a plurality of light sources; the array lens block and the laser chips are all packaged in the first shell body. A plurality of lenses are integrated on one array lens block, a plurality of light sources share one array lens block to realize light path coupling, a traditional 40G / 100G BOX type high-cost kovar alloy airtight shell and a ZBLOCK or AWG type MUX assembly are omitted, and multiple characteristics and benefits of high performance, low manufacturing difficulty and low cost are realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical communication technical field, concretely is a kind of multi-channel optical module TOSA. BACKGROUND

[0002] Traditional multi-channel TOSA mostly uses multiple lenses to cooperate with multiple light sources to complete optical path coupling, needs to configure BOX package type high-cost Kovar airtight shell, MUX component of ZBLOCK or AWG type, so cost, difficulty are very high, and product performance cannot be promoted. INVENTION CONTENTS

[0003] The utility model aims at providing a kind of multi-channel optical module TOSA, at least can solve the partial defects in prior art.

[0004] To achieve the above-mentioned purpose, the utility model embodiment provides the following technical scheme: a kind of multi-channel optical module TOSA, including adapter and light emitting component, the light emitting component has first shell, array lens block and multiple laser chips, the array lens block is integrated by multiple lenses, each lens is matched with each laser chip one-to-one, the array lens block and each laser chip are packaged in the first shell.

[0005] Further, the array lens block is a molded glass block, and each lens is pressed on the molded glass block.

[0006] Further, it further includes the FA light combiner for combining multiple laser beams passing through the array lens block, and the FA light combiner is packaged in the second shell of the adapter.

[0007] Further, it further includes an adjusting ring sleeved on the second shell of the adapter.

[0008] Further, it further includes a ceramic substrate assembled with each laser chip.

[0009] Further, it further includes a heat dissipation assembly for dissipating heat of each laser chip, and the heat dissipation assembly is arranged in the first shell.

[0010] Further, the heat dissipation assembly includes a heat dissipation column for conducting heat of the laser chip.

[0011] Further, the heat dissipation column is mounted with a semiconductor refrigerator.

[0012] Further, a thermistor is arranged on the heat dissipation column.

[0013] Further, the first shell is a closed space, and the closed space is filled with nitrogen.

[0014] Compared with the prior art, the beneficial effects of the utility model are that: through design one array lens block is integrated with multiple lenses, multiple light sources share an array lens block to realize optical coupling, the traditional 40G / 100G BOX type high-cost Kovar airtight shell, ZBLOCK or AWG type MUX assembly are omitted, high performance, low manufacturing difficulty, low cost multiple characteristics and benefits are realized. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A top view angle schematic view of a multi-channel optical module TOSA provided by the utility model embodiment is provided;

[0016] Figure 2 A bottom view angle schematic view of a multi-channel optical module TOSA provided by the utility model embodiment is provided;

[0017] Figure 3 A side view angle schematic view of a multi-channel optical module TOSA provided by the utility model embodiment is provided;

[0018] Figure 4 A vertical section schematic view of Figure 3 ;

[0019] In the figure, 1 is a second shell, 2 is a fiber core, 3 is an adjusting ring, 4 is a FA light combiner, 5 is an array lens block, 6 is a laser chip, 7 is a ceramic substrate, 8 is a thermistor, 9 is a heat dissipation column, 10 is a semiconductor refrigerator, 11 is a base, and 12 is a first shell. DETAILED DESCRIPTION

[0020] The technical solutions in the utility model embodiments will be clearly and completely described below with reference to the drawings in the utility model embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The utility model embodiment provides a kind of multi-channel optical module TOSA, including adapter and light emitting component, the light emitting component has first shell 12, array lens block 5 and multiple laser chips 6, multiple lenses are integrated on the array lens block 5, each lens and each laser chip 6 are one-to-one corresponding cooperation, the array lens block 5 and each laser chip 6 are packaged in the first shell 12.In the embodiment, by designing a array lens block 5, multiple lenses are integrated, multiple light sources share a array lens block 5 to realize optical coupling, omit the high cost Kovar hermetic shell of traditional 40G / 100G BOX type, ZBLOCK or AWG type MUX (Wavelength Division Multiplexing) component, realize the multiple characteristics and benefits of high performance, low manufacturing difficulty, low cost.TOSA (light emitting sub-module) is an important component in optical module, and the TOSA is a multi-channel WDM TO-CAN hermetic packaging TOSA, wherein WDM is Wavelength Division Multiplexing, and TO-CAN is a packaging form of existing electronic components, which is different from the traditional BOX packaging, and the BOX packaging is also a packaging form of existing electronic components.ZBLOCK is a micro-optical component used in optical module, mainly used for combining and separating multiple wavelengths, and AWG is Arrayed Wave guide Grating.

[0022] Please refer to Figure 1 、 Figure 2 、 Figure 3 And Figure 4 , the array lens block 5 is a molded glass block, and each lens is pressed on the molded glass block.In the embodiment, the multiple lenses on the array lens block 5 are made by a molded glass process, which is a conventional process, and multiple lenses can be integrally formed on a glass by molding.The number and shape of the lenses can be selected as needed, for example, four rectangular array lenses can be pressed, or multiple circular array lenses can be pressed, and the array form is not limited.In addition, the shape of the lens can be circular, square, or other shapes, and the embodiment does not limit this.The arrangement shape of each laser chip 6 can be consistent with the arrangement shape of the lens, which is beneficial for coupling.Of course, in addition to this, multiple lenses can be formed on a glass by carving, or multiple lenses needed can be bonded on a carrier glass by bonding, but attention should be paid to adaptive coupling.

[0023] Please refer to Figure 1 、 Figure 2 、 Figure 3 And Figure 4The TOSA also comprises a FA optical combiner 4 for combining the multipath laser beams passing through the array lens block 5, which is packaged in the second shell 1. In the embodiment, the FA optical combiner 4 can be a four-in-one FA optical combiner 4 when four laser chips 6 are used. The four incident ends of the four-in-one FA optical combiner 4 are coaxially assembled with the four lenses. The conventional optical combiner MUX is used in the TOSA, which increases the packaging cost. The FA optical combiner 4 of the present application can be used to realize optical coupling by sharing the array lens block 5 with the multipath light source. Preferably, the four-path combining ratio of the four-in-one optical combiner is the same, i.e. 25%. The FA optical combiner 4 is also packaged in the second shell 1. The TOSA also comprises a fiber core 2, which is inputted into the fiber core 2 after being combined by the FA optical combiner 4. The exit end of the FA optical combiner 4 is coaxially arranged with the fiber core 2. Preferably, the FA optical combiner 4 and the fiber core 2 are both 9 μm single-mode fiber cores 2.

[0024] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the TOSA also comprises an adjusting ring 3 which is sleeved on the second shell 1 of the adapter. In the embodiment, the adjusting ring 3 can be used to adjust the focal length. Specifically, the adapter performs the role of Z-axis adjustment when performing automatic optical coupling. After the focal point optical power is found, the adjusting ring 3 is penetrated and welded by laser welding, so as to fix the second shell 1 and the adjusting ring 3 together, thereby stabilizing the focal length. Preferably, the adjusting ring 3 is made of stainless steel. As shown in Figure 4 , the adjusting ring 3 is sleeved on the second shell 1 of the adapter. The light emitting assembly is below the adapter, which is a can-shaped light emitting diode packaging assembly, i.e. TO-CAN, abbreviated as TO. The light emitting assembly is also below the adjusting ring 3, and the bottom surface of the adjusting ring 3 falls on the first shell 12 of the light emitting assembly. The adapter and the light emitting assembly are laser welded together through the outer diameter of the bottom of the adjusting ring 3. Only optical signals penetrate between the adapter and the light emitting assembly. The first shell 12 of the light emitting assembly is a sealed shell, and the light emitting assembly is independently sealed. The nitrogen gas filled in the first shell 12 of the light emitting assembly is sealed in the first shell 12. Only optical signals can penetrate into the second shell 1 through the air-tight packaging array lens block 5.

[0025] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the TOSA also comprises a ceramic substrate 7 which is soldered with each of the laser chips 6. In the embodiment, each of the laser chips 6 is soldered with the ceramic substrate 7 by gold-tin soldering. The ceramic substrate 7 has a plurality of, which can be the same as the number of the laser chips 6.

[0026] Please refer toFigure 1 、 Figure 2 、 Figure 3 and Figure 4 The TOSA also comprises a heat dissipation assembly for dissipating heat from each of the laser chips 6, which is arranged in the first housing 12. In the embodiment, the power consumption device is cooled by the heat dissipation assembly, and the heat dissipation mode comprises a heat dissipation column 9, a semiconductor cooler 10, etc. The laser chip 6 can be arranged on the heat dissipation column 9 through the ceramic substrate 7, and the ceramic substrate 7 and the heat dissipation column 9 can be assembled and fixed by high-thermal-conductivity silver glue. The heat dissipation column 9 can be a tungsten-copper heat dissipation column 9, and of course, other existing materials can also be used as long as they have high thermal conductivity. The semiconductor cooler 10, i.e., TEC, is an existing device that can more effectively dissipate heat from the laser chip. Preferably, the bottom of the first housing 12 has a base 11, and the upper surface of the base 11 is fixed to the semiconductor cooler 10 by high-thermal-conductivity silver glue. Of course, in addition to this, existing heat-conducting adhesive materials can also be used, and the embodiment does not limit this. The upper surface of the semiconductor cooler 10 is fixed to the heat dissipation column 9 by high-thermal-conductivity silver glue. Of course, in addition to this, existing heat-conducting adhesive materials can also be used, and the embodiment does not limit this.

[0027] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The heat dissipation column 9 is provided with a thermistor 8. In the embodiment, the thermistor 8 can sense temperature, thereby monitoring temperature and also cooperating with the semiconductor cooler 10 to achieve linkage temperature control. Specifically, the temperature signal obtained by the thermistor 8 can be transmitted to the semiconductor cooler 10, and the semiconductor cooler 10 adjusts temperature according to the current temperature after receiving the signal. The thermistor 8 is fixed on the surface of the tungsten-copper heat dissipation column 9 by high-thermal-conductivity silver glue.

[0028] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The second housing 1 is made of stainless steel metal material on the outside and composed of a ceramic sleeve, a ceramic rod, and a single-mode glass optical fiber on the inside. The optical fiber is nested in the ceramic rod, and the end faces of the optical fiber are PC and APC faces, respectively.

[0029] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4The utility model embodiment provides a kind of optical module, using above-mentioned TOSA, this TOSA can be applied to 40 / 100Gbps CWDM wave division transceiver hot plug optical module, can send four-way optical signal simultaneously using TO-CAN encapsulation device, and airtight encapsulation.Such as through design an array lens block 5 integrated multiple lenses, multiple light sources share an array lens block 5 and realize optical path coupling, omit the high-cost Kovar airtight shell of traditional 40G / 100G BOX type, ZBLOCK or AWG type MUX component, realize the multiple characteristics of high performance, low manufacturing difficulty, low cost and benefit.Optimal, the electrical signal connection between TO-CAN internal components is conducted through gold wire connection, and element and element are fixed by gold-tin soldering or conductive silver glue.Optimal, TO-CAN is filled with inert gas inside, for example filled with nitrogen, other inert gas is also feasible, and the embodiment is not limited to this.Optimal, TOSA uses equipment automatic optical path coupling mode to realize multi-channel optical path coupling, and the equipment automatic optical path coupling mode is prior art, which will not be described here.

[0030] Although the embodiments of the utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-lane optical module TOSA, characterized by: The adapter and a light emitting assembly are included, the light emitting assembly has a first shell, an array lens block and a plurality of laser chips, the array lens block is integrated with a plurality of lenses, each lens corresponds to each laser chip, the array lens block and each laser chip are packaged in the first shell.

2. The multi-lane optical module TOSA of claim 1, wherein: The array lens block is a molded glass block, and each lens is pressed on the molded glass block.

3. The multi-channel optical module TOSA as described in claim 1, characterized in that: An FA light combiner for combining the multipath laser beams passing through the array lens block is also included, and the FA light combiner is packaged in a second shell of the adapter.

4. The multi-lane optical module TOSA of claim 1, wherein: An adjusting ring is also included, which is sleeved outside the second shell of the adapter.

5. The multi-channel optical module TOSA as described in claim 1, characterized in that: A ceramic substrate is also included, which is soldered with each laser chip.

6. The multi-lane optical module TOSA of claim 1, wherein: A heat dissipation assembly for dissipating heat of each laser chip is also included, and the heat dissipation assembly is arranged in the first shell.

7. The multi-lane optical module TOSA of claim 6, wherein: The heat dissipation assembly includes a heat dissipation column for conducting heat of the laser chip.

8. The multi-lane optical module TOSA of claim 7, wherein: The heat dissipation column is mounted with a semiconductor refrigerator.

9. The multi-lane optical module TOSA of claim 7, wherein: A thermistor is arranged on the heat dissipation column.

10. The multi-lane optical module TOSA of claim 1, wherein: The first shell is a closed space, and the closed space is filled with nitrogen.

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