Liquid crystal display panel mother board structure

By setting positioning blocks and positioning slots on the motherboard of the liquid crystal display panel, the problem of substrate position shift during the transfer process is solved, and the bonding accuracy and resolution are improved.

CN223756992UActive Publication Date: 2026-01-02TRULY HUIZHOU SMART DISPLAY
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Patent Information

Application Number
CN202423240296.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2026-01-02
Estimated Expiration
2034-12-26

AI Technical Summary

Technical Problem

During the production of LCD panels, the upper and lower substrates may shift due to transfer before curing, resulting in a decrease in bonding accuracy and resolution.

Method used

A horizontal positioning block and a vertical positioning block are set in the cutting area of ​​the upper substrate mother plate, and a horizontal positioning groove and a vertical positioning groove are set in the cutting area of ​​the lower substrate mother plate, so that the positioning block is locked into the corresponding positioning groove, thereby limiting the upper and lower substrates and preventing positional deviation.

Benefits of technology

The bonding precision of the LCD panel was improved, which in turn improved the resolution of the display screen.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223756992U_ABST
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Abstract

The utility model discloses a liquid crystal display panel mother board structure which comprises an upper substrate mother board and a lower substrate mother board, the upper substrate mother board is provided with a plurality of upper substrate daughter boards, the upper substrate mother board surrounds the upper substrate daughter boards to form an upper cutting area, and the upper cutting area is provided with transverse positioning blocks and longitudinal positioning blocks; the lower substrate mother board is provided with a plurality of lower substrate daughter boards, the lower substrate mother board surrounds the lower substrate daughter boards to form a lower cutting area, and the lower cutting area is provided with a transverse positioning groove and a longitudinal positioning groove; when the upper substrate mother board and the lower substrate mother board are connected in an attached mode, the transverse positioning blocks are clamped into the transverse positioning grooves, and the longitudinal positioning blocks are clamped into the longitudinal positioning grooves. Therefore, position deviation of the mother board of the liquid crystal display panel which is not subjected to curing operation in the transfer process can be avoided, so that the fitting precision is improved, and the resolution ratio of a display screen is further improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to liquid crystal display technical field especially relates to a liquid crystal display panel mother board structure. BACKGROUND

[0002] The liquid crystal display panel is composed of array substrate, color film substrate and liquid crystal. In the production and processing process of the liquid crystal display panel, the liquid crystal display panel is usually cut from the liquid crystal display panel mother board, so a plurality of arrayed liquid crystal display panel sub-panels to be cut are arranged on the liquid crystal display panel.

[0003] At present, large size, ultra-high definition display screen is favored by more and more users, so the resolution requirement of the display screen is also higher and higher, that is, the PPI (pixels per inch) value requirement of the display screen is higher and higher. Higher PPI means that the bonding precision of the upper and lower substrates of the liquid crystal display panel needs to be higher. In the production process, after the upper and lower substrates are bonded by frame glue, usually curing operation is needed, although the precision during bonding has been controlled, but in the process from bonding completion to curing completion, the upper and lower substrates may be offset due to the transfer of the panel, and when the frame glue curing is completed, this offset cannot be reversed, thereby not only reducing the bonding precision, but also reducing the resolution of the display screen. SUMMARY

[0004] The utility model discloses a liquid crystal display panel mother board structure can avoid the position deviation of the upper substrate and the lower substrate, and can improve the bonding precision.

[0005] The utility model discloses a liquid crystal display panel mother board structure can avoid the position deviation of the upper substrate and the lower substrate, and can improve the bonding precision.

[0006] A liquid crystal display panel mother board structure, comprising: an upper substrate mother board and a lower substrate mother board, a plurality of upper substrate sub-panels are arranged on the upper substrate mother board, an upper cutting area is formed around the upper substrate sub-panels on the upper substrate mother board, and a horizontal positioning block and a vertical positioning block are arranged on the upper cutting area; a plurality of lower substrate sub-panels are arranged on the lower substrate mother board, a lower cutting area is formed around the lower substrate sub-panels on the lower substrate mother board, and a horizontal positioning groove and a vertical positioning groove are arranged on the lower cutting area; when the upper substrate mother board and the lower substrate mother board are bonded and connected, the horizontal positioning block is clamped into the horizontal positioning groove, and the vertical positioning block is clamped into the vertical positioning groove.

[0007] In one embodiment, the horizontal positioning groove is formed by two horizontally arranged horizontal protrusions.

[0008] In one of the embodiments, the longitudinal positioning groove is formed by two longitudinal protrusions arranged at intervals.

[0009] In one of the embodiments, the sum of the height of the lateral positioning block and the height of the lateral positioning groove is greater than the distance between the upper substrate mother board and the lower substrate mother board.

[0010] In one of the embodiments, the sum of the height of the longitudinal positioning block and the height of the longitudinal positioning groove is greater than the distance between the upper substrate mother board and the lower substrate mother board.

[0011] In one of the embodiments, the width of the lateral positioning block away from the highest point of the upper substrate mother board is 10-20 μm.

[0012] In one of the embodiments, the width of the lateral positioning groove away from the highest point of the lower substrate mother board is 10-20 μm.

[0013] In one of the embodiments, the lateral positioning block is in a strip structure, and the lateral positioning groove is in a strip structure.

[0014] In one of the embodiments, the lateral positioning block comprises a black light shielding film, a color filter film, a flat layer and a support column which are stacked in sequence.

[0015] In one of the embodiments, the lateral protrusion comprises a first metal layer, a first insulating layer, a silicon island layer, a second metal layer and a second insulating layer which are stacked in sequence.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The liquid crystal display panel mother board structure of the utility model sets up the lateral positioning block and the longitudinal positioning block on the upper cutting area of the upper substrate mother board, sets up the lateral positioning groove and the longitudinal positioning groove on the lower cutting area of the lower substrate mother board, so that the lateral positioning block is clamped in the lateral positioning groove, and the longitudinal positioning block is clamped in the longitudinal positioning groove when the upper substrate mother board and the lower substrate mother board are pasted, so that the position deviation of the liquid crystal display panel without solidification operation in the transfer process can be avoided, the pasting precision is improved, and the resolution of the display screen is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments.

[0019] Figure 1 It is a structure schematic view of the liquid crystal display panel mother board structure in the embodiment of the utility model.

[0020] Figure 2 is a structure schematic view of the partial enlargement of A in the liquid crystal display panel mother board structure in Figure 1 ;

[0021] Figure 3 is a structure schematic view of the cooperation of the transverse positioning block and the transverse positioning slot in the liquid crystal display panel mother board structure in Figure 2 ;

[0022] Figure 4 is a structure schematic view of the cooperation of the longitudinal positioning block and the longitudinal positioning slot in the liquid crystal display panel mother board structure in Figure 2 ;

[0023] Figure 5 is a structure schematic view of the stack structure of the transverse positioning block and the transverse positioning slot in the liquid crystal display panel mother board structure in Figure 2 ; DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings.

[0025] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , a liquid crystal display panel mother board structure comprises: an upper substrate mother board 100 and a lower substrate mother board 200, the upper substrate mother board 100 is provided with a plurality of upper substrate sub boards 110, the upper substrate mother board 100 is formed with an upper cutting area 120 around the upper substrate sub board 110, the upper cutting area 120 is provided with a transverse positioning block 130 and a longitudinal positioning block 140; the lower substrate mother board 200 is provided with a plurality of lower substrate sub boards, the lower substrate mother board 200 is formed with a lower cutting area around the lower substrate sub board, the lower cutting area is provided with a transverse positioning slot and a longitudinal positioning slot; when the upper substrate mother board 100 and the lower substrate mother board 200 are connected in close contact, the transverse positioning block 130 is clamped into the transverse positioning slot, and the longitudinal positioning block 140 is clamped into the longitudinal positioning slot.

[0026] It should be noted that the liquid crystal display panel mother board needs to be cured after the frame glue is attached, and the upper substrate and the lower substrate of the uncured liquid crystal display panel mother board will be offset during the transfer process, which will cause the attachment deviation to be large. Therefore, in the embodiment, the horizontal positioning block 130 is arranged on the upper cutting area 120, and the horizontal positioning groove is correspondingly arranged on the lower cutting area. The horizontal positioning of the upper substrate mother board 100 and the lower substrate mother board 200 is realized through the cooperation of the horizontal positioning block 130 and the horizontal positioning groove, so as to avoid the horizontal position offset. The vertical positioning block 140 is arranged on the upper cutting area 120, and the vertical positioning groove is correspondingly arranged on the lower cutting area. The vertical positioning of the upper substrate mother board 100 and the lower substrate mother board 200 is realized through the cooperation of the vertical positioning block 140 and the vertical positioning groove, so as to avoid the vertical position offset. In this way, the positioning operation of the upper substrate mother board 100 and the lower substrate mother board 200 can be realized, so as to effectively prevent the position offset of the upper substrate mother board 100 and the lower substrate mother board 200, improve the attachment precision, and further improve the resolution of the display screen. In addition, since the positioning block and the positioning groove are arranged on the cutting area, after the liquid crystal display panel mother board is cut, the cutting area will be discarded, and only the complete liquid crystal display panel sub-board is reserved. In this way, the attachment precision can be improved without changing the structure of the liquid crystal display panel sub-board.

[0027] In an embodiment, the horizontal positioning groove is formed by two horizontally arranged horizontal protrusions 210. In the embodiment, the horizontal protrusion 210 is directly formed by the functional structure layer on the lower substrate sub-board. For example, when the lower substrate sub-board is an array substrate, the horizontal protrusion 210 can be manufactured at the same time as the array substrate. For example, the functional structure layer of the array substrate is sequentially stacked by a first metal layer 211, a first insulating layer 212, a silicon island layer 213, a second metal layer 214 and a second insulating layer 215. The corresponding horizontal protrusion 210 includes the first metal layer 211, the first insulating layer 212, the silicon island layer 213, the second metal layer 214 and the second insulating layer 215 which are sequentially stacked, and the first insulating layer 212 and the second insulating layer 215 are reserved in the formed horizontal positioning groove. In this way, only two mutually parallel horizontal protrusions 210 are needed to form a horizontal positioning groove. Further, it is not necessary to additionally set the manufacturing process of the horizontal positioning groove, so as to not only prevent the position offset, but also avoid increasing the production time.

[0028] Similarly, in an embodiment, the vertical positioning groove is formed by two vertically arranged vertical protrusions. In the embodiment, the structure of the vertical protrusion is the same as that of the horizontal protrusion 210.

[0029] In an embodiment, when the lower substrate mother board 200 is an array substrate, the corresponding upper substrate mother board 100 is a color filter substrate, and the lateral positioning blocks 130 and the longitudinal positioning blocks 140 on the color filter substrate can be directly formed by the functional layer structure on the color filter substrate. For example, the functional layer structure on the color filter substrate generally includes a black light shielding film BM 131, a color filter film RGB 132, a planarization layer OC 133, and a support column PS 134 stacked in sequence. In this embodiment, the lateral positioning block 130 includes the black light shielding film BM 131, the color filter film RGB 132, the planarization layer OC 133, and the support column PS 134 stacked in sequence. That is, the lateral positioning block 130 can be formed at the same time when the functional layer structure on the color filter substrate is formed. In this way, the manufacturing process of the lateral positioning block 130 does not need to be additionally set, thereby not only preventing position deviation but also avoiding the increase of production time.

[0030] Similarly, in an embodiment, the structure of the longitudinal positioning block 140 is the same as that of the lateral positioning block 130.

[0031] In an embodiment, the sum of the height of the lateral positioning block 130 and the height of the lateral positioning groove is greater than the distance between the upper substrate mother board 100 and the lower substrate mother board 200. In this way, when the upper substrate mother board 100 and the lower substrate mother board 200 are connected by frame glue, the lateral positioning block 130 can be ensured to be clamped into the lateral positioning groove.

[0032] Similarly, the sum of the height of the longitudinal positioning block 140 and the height of the longitudinal positioning groove is greater than the distance between the upper substrate mother board 100 and the lower substrate mother board 200. In this way, when the upper substrate mother board 100 and the lower substrate mother board 200 are connected by frame glue, the longitudinal positioning block 140 can be ensured to be clamped into the longitudinal positioning groove.

[0033] Preferably, the width of the lateral positioning block 130 away from the highest point of the upper substrate mother board 100 is 10-20 μm. Correspondingly, in this embodiment, the width of the lateral positioning groove away from the highest point of the lower substrate mother board 200 is 10-20 μm.

[0034] Preferably, the lateral positioning block 130 is in a strip structure, and the lateral positioning groove is in a strip structure. In this embodiment, the projection distance between the lateral positioning block 130 and the lateral positioning groove can be set according to the actual bonding accuracy requirement. For example, when the bonding accuracy requirement of the upper substrate mother board 100 and the lower substrate mother board 200 in the lateral direction is ±2 um, the corresponding projection distance between the lateral positioning block 130 and the lateral positioning groove is 2 um.

[0035] Preferably, the longitudinal positioning blocks 140 are in a strip structure, and the longitudinal positioning slots are in a strip structure. In the embodiment, the projection interval between the longitudinal positioning blocks 140 and the longitudinal positioning slots can be set according to the actual fitting accuracy requirement, for example, when the fitting accuracy requirement of the upper substrate master plate 100 and the lower substrate master plate 200 in the longitudinal direction is ±2um, the corresponding projection interval between the longitudinal positioning blocks 140 and the longitudinal positioning slots is 2um.

[0036] Please refer to Figure 2 In an embodiment, the positioning structure composed of the lateral positioning blocks 130 and the lateral positioning slots can be provided with multiple groups, and the positioning structure composed of the longitudinal positioning blocks 140 and the lateral positioning slots is also provided with multiple groups. In this way, the positioning effect can be further improved.

[0037] The above-described embodiments only express several embodiments of the present application, and the description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A liquid crystal display panel motherboard structure, characterized in that, The application relates to a substrate mother plate and a substrate daughter plate. The upper substrate mother plate is provided with a plurality of upper substrate daughter plates, and an upper cutting area is formed around the upper substrate daughter plates, wherein the upper cutting area is provided with transverse positioning blocks and longitudinal positioning blocks. The lower substrate mother plate is provided with a plurality of lower substrate daughter plates, and a lower cutting area is formed around the lower substrate daughter plates, wherein the lower cutting area is provided with transverse positioning grooves and longitudinal positioning grooves. When the upper substrate mother plate and the lower substrate mother plate are connected, the transverse positioning blocks are clamped into the transverse positioning grooves, and the longitudinal positioning blocks are clamped into the longitudinal positioning grooves.

2. The liquid crystal display panel mother structure according to claim 1, wherein The transverse positioning grooves are formed by two transverse protruding parts.

3. The liquid crystal display panel mother structure according to claim 1, wherein The longitudinal positioning grooves are formed by two longitudinal protruding parts.

4. The liquid crystal display panel mother structure according to claim 1, wherein The sum of the height of the transverse positioning blocks and the height of the transverse positioning grooves is greater than the distance between the upper substrate mother plate and the lower substrate mother plate.

5. The liquid crystal display panel mother structure according to claim 1, wherein The sum of the height of the longitudinal positioning blocks and the height of the longitudinal positioning grooves is greater than the distance between the upper substrate mother plate and the lower substrate mother plate.

6. The liquid crystal display panel mother structure according to claim 1, wherein The width of the transverse positioning blocks away from the highest point of the upper substrate mother plate is 10-20 mu m.

7. The liquid crystal display panel mother structure according to claim 6, wherein The width of the transverse positioning grooves away from the highest point of the lower substrate mother plate is 10-20 mu m.

8. The liquid crystal display panel mother structure according to claim 1, wherein The transverse positioning blocks are in a strip-shaped structure, and the transverse positioning grooves are in a strip-shaped structure.

9. The liquid crystal display panel mother structure according to any one of claims 1 to 8, wherein The transverse positioning blocks comprise a black light-shielding film, a color filter film, a flat layer and a support column which are stacked in sequence.

10. The liquid crystal display panel mother structure according to claim 2, wherein The transverse protruding parts comprise a first metal layer, a first insulating layer, a silicon island layer, a second metal layer and a second insulating layer which are stacked in sequence.