MOS tube pin cutting device

Abstract

An MOS tube pin cutting device comprises a bottom plate, an end plate is installed at one end of the bottom plate, an air cylinder is installed on the end plate, a movable end plate is arranged at the inner side end of the air cylinder, a pair of spring pins are arranged on the movable end plate in a penetrating mode, a containing table is arranged at the other ends of the spring pins, springs are arranged on the spring pins in a sleeving mode, and the springs are located between the containing table and the movable end plate. The connecting plate on the MOS tube is placed on the placing table, the MOS tube is limited through the placing table, and the movable end plate, the placing table and the spring facilitate pushing feeding operation of the MOS tube. The bottom plate is provided with a pair of stop pins to limit the placing table, and then the pins can be cut through continuous movement of the movable end plate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor device processing, especially to a MOS tube pin cutting device. BACKGROUND

[0002] For example Figure 5 It is shown as a kind of MOS tube's stereoscopic structure diagram, it includes package 9, the one end of package 9 is equipped with three pins 93, the other end of package 9 is equipped with connecting plate 90, the outside end of connecting plate 90 is equipped with a pair of notches 92, and is also equipped with perforation 91 on it.The device production is completed, needs to cut the pin 93 on it according to the needs of customer, and the pin cutting device currently used is artificial cutting, and this cutting mode is low in efficiency.At present, there is also the mode of cutting device cutting, and the pin 93 is easily deformed in the cutting process of this cutting mode. UTILITY MODEL CONTENTS

[0003] The utility model provides a kind of MOS tube pin cutting device, to solve the deficiency of above-mentioned prior art, solve the problem of low cutting efficiency and the pin is easily deformed after cutting, with strong practicality.

[0004] In order to realize the purpose of the utility model, the following technologies are adopted:

[0005] A kind of MOS tube pin cutting device, including bottom plate, the one end of bottom plate is installed with end plate, end plate is installed with air cylinder, the inner side end of air cylinder is equipped with movable end plate, a pair of spring pins are worn on movable end plate, the other end of spring pin is equipped with placing table, spring is sleeved on spring pin, and spring is located between placing table and movable end plate, when cutting, connecting plate on MOS tube is placed in placing table, and MOS tube is positioned by placing table, and movable end plate, placing table and spring facilitate the pushing feeding operation of MOS tube.

[0006] A pair of stop pins are installed on bottom plate to limit placing table, then the pin can be cut by the continuous movement of movable end plate.

[0007] The other end of the bottom plate is provided with side plates, two pairs of vertical slots are formed in the side plates, movable screws are arranged in the vertical slots, the outer ends of the movable screws at the same side and the same height are provided with movable side plates, a channel section is arranged between the movable screws at the same height, a plurality of cutters are arranged on the inner side of the channel section, a middle plate is arranged between the side plates, a plurality of insertion holes are formed in the middle plate in the length direction, the cutters are arranged in the middle plate and the cutters and the insertion holes are in one-to-one correspondence, a horizontal hole is formed in the inner end of the movable side plate, the outer end of the horizontal hole is communicated with an inclined hole, the outer end of the inclined hole extends downwardly and downwardly, an inner pressure rod is arranged in the horizontal hole and the inclined hole, a push-pull arm is arranged on the inner pressure rod, the push-pull arm is arranged on the side wall of the movable end plate, when the movable end plate continues to move, the inner pressure rod is driven to move through the push-pull arm, the movable side plates are close to each other under the action of the inner pressure rod, the cutters are close to each other, and finally the pins are cut off by the blade of the cutter, and the cutting mode is simultaneous pressure from above and below, so that the pin is not bent and deformed under the pressure of one side, and the MOS tube is conveniently cut and extracted.

[0008] Further, in order to ensure the stability of the movable end plate and the placement table, a pair of guide grooves are formed in the bottom plate, a guide block is arranged at the lower end of the movable end plate, the guide block is movably arranged in the guide groove, and a sliding block is arranged at the lower end of the placement table and movably arranged in the guide groove.

[0009] Further, in order to conveniently discharge the cut pins outwardly, a rectangular hole is formed in the middle plate and penetrates the upper and lower walls, and the rectangular hole is communicated with the insertion hole.

[0010] Further, in order to position the MOS tube, a placement groove is formed in the placement table, and the connecting plate is arranged in the placement groove.

[0011] Further, in order to position the connecting plate of the MOS tube, limit columns are formed on the two sides of the placement groove.

[0012] In addition, in order to ensure the stability and levelness of the MOS tube after being placed, a positioning rod is arranged at the groove bottom of the placement groove.

[0013] The above technical scheme has the following advantages:

[0014] The device provided by the utility model is convenient for cutting the pins of the MOS tube, and can avoid bending and deformation of the pins during cutting. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model will be further described in detail below with reference to the drawings.

[0016] Figure 1 A three-dimensional structure of one embodiment is shown Figure 1 .

[0017] Figure 2 A magnified view of point A is shown.

[0018] Figure 3 A three-dimensional structure of one embodiment is shown. Figure 2 .

[0019] Figure 4 A three-dimensional structure of one embodiment is shown. Figure 3 .

[0020] Figure 5 A three-dimensional structural diagram of a MOSFET is shown. Detailed Implementation

[0021] like Figures 1-5 As shown, a MOS transistor lead trimming device includes a base plate 1, an end plate 10 mounted on one end of the base plate 1, a cylinder 2 mounted on the end plate 10, a movable end plate 3 located on the inner end of the cylinder 2, a pair of spring pins 30 passing through the movable end plate 3, a placement platform 32 located at the other end of the spring pins 30, a placement groove 33 formed on the placement platform 32, limit posts 34 formed on both sides of the placement groove 33, and a positioning rod 35 located at the bottom of the placement groove 33. A spring 31 is sleeved on the spring pins 30, and the spring 31 is located between the placement platform 32 and the movable end plate 3. A pair of guide grooves 11 are formed on the base plate 1, a guide block is provided at the lower end of the movable end plate 3, the guide block is movably mounted on the guide grooves 11, and a slider is mounted at the lower end of the placement platform 32, the slider being movably mounted within the guide grooves 11.

[0022] A pair of stop pins 12 are installed on the base plate 1. A side plate 4 is installed on the other end of the base plate 1. Two pairs of vertical slots 40 are provided on the side plate 4. Movable screws 41 pass through the vertical slots 40. Movable side plates 44 are installed on the outer ends of the movable screws 41 located on the same side and at the same height. I-shaped parts 42 are provided between the movable screws 41 located at the same height. Multiple cutters 43 are installed on the inner side of the I-shaped parts 42. A middle plate 5 is installed between the side plates 4. Multiple insertion holes 50 are provided in the middle plate 5 along its length. Rectangular holes 51 are provided in the middle plate 5 through the upper and lower walls. The rectangular holes 51 are connected to the insertion holes 50. The cutter 43 passes through the middle plate 5, and there is a one-to-one correspondence between the cutter 43 and the insertion hole 50. The inner end of the moving side plate 44 is provided with a transverse hole 45, and the outer end of the transverse hole 45 is connected to an oblique hole 46. The outer end of the oblique hole 46 extends downward at an angle. An inner pressure rod 47 passes through the transverse hole 45 and the oblique hole 46. A push-pull arm 48 is provided on the inner pressure rod 47. The push-pull arm 48 is installed on the side wall of the movable end plate 3.

[0023] In this embodiment, during operation, the operator places the connecting plate 90 on the MOS transistor into the placement slot 33, and the limiting post 34 is locked in the notch 92, and the positioning rod 35 is inserted into the through hole 91.

[0024] Then the cylinder 2 is started, under the drive of the cylinder 2, the movable end plate 3, the placing table 32 and the MOS tube move to the middle plate 5, until the pin 93 is inserted in the hole 50, and extends a certain length. After that, the placing table 32 will be blocked by the blocking pin 12, and stop moving, while the movable end plate 3 will continue to move under the drive of the cylinder 2, and when moving, will drive the inner pressure rod 47 to move through the push-pull arm 48, and when the inner pressure rod 47 moves, will make it act on the inclined hole 46, and before that, the inner pressure rod 47 moves in the transverse hole 45, when the inner pressure rod 47 moves in the inclined hole 46, will make the movable side plate 44 close to each other, and with the movable side plate 44 closing to each other, will make the cutter 43 close to each other, and finally cut off the pin 93 through the cutter 43, and then the pin 93 will be discharged outward through the rectangular hole 51, after that, the MOS tube will be pulled out under the pull of the cylinder 2, at the same time, the cutter 43 also returns to the original position.

[0025] The preferred embodiments of the present application are described above, but the present application is not limited to the above, and it is obvious that those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Therefore, if these modifications and changes of the present application belong to the scope of the claims of the present application and equivalent technologies, the present application also intends to include these modifications and changes.

Claims

1. A MOS transistor pin cutting device, characterized by, The utility model provides a kind of cutting device, including bottom plate (1), one end of bottom plate (1) is equipped with end plate (10), end plate (10) is equipped with cylinder (2), the inner side end of cylinder (2) is equipped with movable end plate (3), a pair of spring pin (30) is arranged on movable end plate (3), the other end of spring pin (30) is equipped with placing table (32), spring (31) is sleeved on spring pin (30), and spring (31) is located between placing table (32) and movable end plate (3); Bottom plate (1) is equipped with a pair of blocking pin (12); The other end of bottom plate (1) is equipped with side plate (4), two pairs of vertical grooves (40) are formed in side plate (4), movable screw (41) is arranged in vertical groove (40), movable screw (41) is arranged in the same side and the same height, and movable screw (41) is equipped with dynamic side plate (44) on the outer side end, movable screw (41) is equipped with H-shaped piece (42) between the same height, a plurality of cutting knives (43) are arranged on the inner side of H-shaped piece (42), middle plate (5) is arranged between side plate (4), a plurality of insertion holes (50) are formed in middle plate (5) along the length direction, cutting knife (43) is arranged in middle plate (5), and cutting knife (43) and insertion hole (50) are in one-to-one correspondence, transverse hole (45) is formed in the inner side end of dynamic side plate (44), inclined hole (46) is communicated with the outer side end of transverse hole (45), the outer side end of inclined hole (46) extends downwardly and downwardly, inner pressure rod (47) is arranged in transverse hole (45) and inclined hole (46), push-pull arm (48) is arranged on inner pressure rod (47), and push-pull arm (48) is arranged on the side wall of movable end plate (3).

2. The MOS transistor lead trimming apparatus of claim 1, wherein, Bottom plate (1) is equipped with a pair of guide grooves (11), and the lower end of movable end plate (3) is equipped with a guide block, the guide block is movably arranged in guide groove (11), and the lower end of placing table (32) is equipped with a sliding block, the sliding block is movably arranged in guide groove (11).

3. The MOS transistor lead trimming apparatus of claim 1, wherein, Middle plate (5) is equipped with rectangular hole (51) penetrating the upper and lower walls, and rectangular hole (51) is communicated with insertion hole (50).

4. The MOS transistor lead trimming apparatus of claim 1, wherein, Placing groove (33) is formed in placing table (32).

5. The MOS transistor lead trimming apparatus of claim 4, wherein, Limiting column (34) is formed on both sides of placing groove (33).

6. The MOS transistor lead trimming device of claim 4, wherein, Positioning rod (35) is arranged on the groove bottom of placing groove (33).

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