Tin coating positioning tool

Abstract

The tin coating positioning tool is suitable for machining of the tin coating technology of the electronic component and comprises a supporting frame and a clamping structure arranged on the supporting frame, after the electrode end of the electronic component extends out of the supporting frame, the non-electrode end of the electronic component is tightly clamped through the clamping structure, and therefore the non-electrode end of the electronic component can be tightly clamped. Therefore, the tin coating process treatment of the electronic component is assisted to be completed. The tool is easy to manufacture and low in cost, the efficiency of manual tinning is improved, and the consistency of the tinning effect is good.

Description

Technical Field

[0001] This utility model belongs to the technical field of electrical assembly production, and particularly relates to a soldering positioning fixture. Background Technology

[0002] Electronic components with gold-plated through-hole leads, such as transistor leads, require degold plating and tinning before soldering. Current transistor tinning processes include manual tinning and automatic tinning machine tinning. Manual tinning suffers from inconsistent tinning results, low efficiency, and high labor intensity for workers. Automatic tinning machines, on the other hand, are expensive and require a high level of operator skill.

[0003] In summary, the efficiency of tinning existing electronic components is relatively low. Utility Model Content

[0004] In view of this, the tinning positioning fixture of this utility model solves the technical problem that the tinning process of electronic components is inefficient due to existing devices or methods.

[0005] A soldering positioning fixture, suitable for the soldering process of electronic components, includes a support frame and a clamping structure disposed on the support frame, wherein...

[0006] After the electrical terminals of the electronic components extend out of the support frame, the non-electrical terminals of the electronic components are tightly clamped by the clamping structure to assist in completing the tinning process of the electronic components.

[0007] Preferably or optionally, the support frame includes a first support plate and a second support plate, the first support plate being connected to the second support plate via a pad column, wherein the clamping structure is correspondingly disposed on the first support plate and the second support plate.

[0008] Preferably or optionally, the first support plate is detachably connected to the second support plate via a pad post, wherein...

[0009] The axial length of the pad is less than the length of the electronic component, so that the electrodes at both ends of the electronic component extend out of the support frame.

[0010] Preferably or optionally, the first support plate is placed below the second support plate, and the clamping structure includes waist-shaped holes spaced apart in the direction of the center line of the first support plate. The waist-shaped holes are used for the protrusion of the electrode ends of the electronic components, and the width of the waist-shaped holes is smaller than the width of the electronic components to prevent the electronic components from falling off.

[0011] The non-electrical ends of the electronic components can be embedded in or pass through the second support plate.

[0012] Preferably or optionally, a rectangular hole is provided along the centerline of the second support plate, and support protrusions are provided at intervals on the inner annular surface of the rectangular hole. A cover plate is fitted over the rectangular hole, and the cover plate is supported by the support protrusions.

[0013] The cover plate is provided with a set of docking holes at intervals along its center line. Each of the waist-shaped holes corresponds to a set of docking holes. The set of docking holes is used for the non-electrical ends of electronic components to pass through or protrude.

[0014] Preferably or optionally, the cover plate has a disassembly hole in the central area. After the electrode tinning process of the electronic components, an external tool can remove the cover plate through the disassembly hole to retrieve the tinned electronic components.

[0015] Preferably or optionally, the size of the cover plate is adapted to the size of the rectangular hole.

[0016] Preferably or optionally, the support protrusion is configured as an arc-shaped structure or a polygonal structure, for example, a semi-circular structure or a quadrilateral structure.

[0017] The beneficial effects of this utility model:

[0018] This invention utilizes a clamping structure to assist in the tinning process. After the electrical terminals of the electronic components extend from the support frame, the clamping structure tightly holds the non-electrical terminals, thus aiding in the tinning process. Due to its tooling structure, it improves production efficiency, reduces manpower, and enhances the consistency of tinning. Its processing effect is significant, and its simple structure represents a major innovative breakthrough in improving the production capacity of electrical assembly plants. The simplified process, reduced costs, and wide applicability make it a valuable tool for widespread application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure;

[0021] Figure 2 This is an exploded view of the overall structure, where,

[0022] 1. First support plate; 2. Electronic components; 3. Pad post; 4. Second support plate; 5. Cover plate; 11. Waist-shaped hole; 21. Rectangular hole; 22. Support protrusion; 51. Assembly hole group; 52. Disassembly hole. Detailed Implementation

[0023] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0024] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0025] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this disclosure, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using other structures and / or functionalities besides one or more of the aspects set forth herein.

[0026] like Figures 1 to 2 The tinning positioning fixture shown is suitable for the tinning process of electronic component 2, which is a transistor or field-effect transistor. The transistor is a triode or diode. It includes a support frame and a clamping structure mounted on the support frame. After the electrical terminals of electronic component 2 extend out of the support frame, the clamping structure tightly holds the non-electrical terminals of electronic component 2 to assist in the tinning process. This reduces production costs and minimizes the inconsistencies caused by manual tinning. It also saves manpower; generally, a worker can hold the support frame with one hand and perform the tinning process on the electrical terminals with the other, thus reducing costs and improving production efficiency.

[0027] As a specific implementation provided in this case, the support frame includes a first support plate 1 and a second support plate 4. The first support plate 1 is connected to the second support plate 4 through a pad 3. The clamping structure is correspondingly arranged on the first support plate 1 and the second support plate 4. The first support plate 1 is detachably connected to the second support plate 4 through the pad 3, for example, by means of a bolt assembly. The axial length of the pad 3 is less than the length of the electronic component 2, so that the two electrodes of the electronic component 2 extend out of the support frame respectively.

[0028] Furthermore, the first support plate 1 is positioned below the second support plate 4. The clamping structure includes oblong holes 11 spaced apart along the centerline of the first support plate 1. These oblong holes 11 allow the electrode ends of the electronic component 2 to protrude, and their width is smaller than the width of the electronic component 2 to prevent it from falling off. Generally, the oblong holes 11 can support 10-16 transistors. It should be noted that, generally, the tinning process requires at least 80% of the electrode length to be tinned; it is not necessary to tin the entire electrode end. The non-electrical terminals of the electronic component 2 can be embedded in or pass through the second support plate 4, for example, by having multiple embedding slots or holes on the second support plate 4 to match them.

[0029] Furthermore, a rectangular hole 21 is provided along the centerline of the second support plate 4. Supporting protrusions 22 are spaced apart on the inner annular surface of the rectangular hole 21. Preferably, this is an integral structure, with the supporting protrusions 22 positioned near the lower end of the rectangular hole 21. A cover plate 5 is placed over the rectangular hole 21, supported by the supporting protrusions 22. A set of mating holes 51 is spaced apart along the centerline of the cover plate 5. Each oblong hole 11 corresponds to a set of mating hole sets 51. The mating hole sets 51 are used for the non-electrical terminals of the electronic component 2 to pass through or protrude. The positions of the mating hole sets 51 correspond to the positions of the oblong holes 11, facilitating the mating of the two ends of the electronic component 2.

[0030] As a specific embodiment provided in this case, a disassembly hole 52 is provided in the central area of ​​the cover plate 5. After the electrode tinning process of the electronic component 2, an external tool can remove the cover plate 5 through the disassembly hole 52 to retrieve the tinned electronic component 2. Preferably, the cover plate 5 is slightly interference-fitted with the rectangular hole 21, and the cover plate 5 can be disassembled by using a hook through the disassembly hole 52. Preferably, the size of the cover plate 5 is adapted to the size of the rectangular hole 21, and the supporting protrusion 22 is an arc-shaped structure or a polygonal structure, for example, a semi-circular structure or a quadrilateral structure.

[0031] Operating instructions:

[0032] 1. Hold the support frame to ensure that the tooling is basically parallel to the surface of the tin pot;

[0033] 2. Apply an appropriate amount of flux to each component pin using a brush;

[0034] 3. Immerse the device leads in the tin pot, ensuring that the lower surface of the first support plate just touches the molten tin surface;

[0035] 4. After holding for a certain period of time, lift the fixture and rotate the buckle until the cover plate is loosened; remove the cover plate using the hook and remove all components.

[0036] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A tin-plating positioning fixture, suitable for the tin-plating process of electronic components, characterized in that, The support frame and the clamping structure arranged on the support frame, wherein, The non-electrode end of the electronic component is tightly clamped by the clamping structure after the electrode end of the electronic component extends out of the support frame, so as to assist the tin processing of the electronic component.

2. The tin positioning tooling of claim 1, wherein, The support frame comprises a first support plate and a second support plate, and the first support plate is connected with the second support plate through a cushion column, wherein the clamping structure is arranged on the first support plate and the second support plate.

3. The tin positioning tooling of claim 2, wherein, The first support plate is detachably connected with the second support plate through the cushion column, wherein, The axial length of the cushion column is smaller than the length of the electronic component, so that the two electrode ends of the electronic component extend out of the support frame.

4. The tin positioning tooling of claim 2, wherein, The first support plate is arranged below the second support plate, the clamping structure comprises a waist-shaped hole arranged in the center line direction of the first support plate, the waist-shaped hole is used for the partial extension of the electrode end of the electronic component, and the width of the waist-shaped hole is smaller than the width of the electronic component, so as to avoid the electronic component from falling off the first support plate. The non-electrode end of the electronic component can be embedded in or pass through the second support plate.

5. The tin positioning tooling of claim 4, wherein, The second support plate is provided with a rectangular hole in the center line direction, the inner ring surface of the rectangular hole is provided with a support protrusion at intervals, a cover plate is arranged on the rectangular hole, and the cover plate is supported by the support protrusion, wherein, The center line direction of the cover plate is provided with a plurality of groups of butt joint holes at intervals, each waist-shaped hole corresponds to a group of butt joint holes, and the butt joint holes are used for the non-electrode end of the electronic component to pass through or extend out.

6. The tin positioning tooling of claim 5, wherein, The central region of the cover plate is provided with a dismounting hole, and after the electrode tin processing of the electronic component, an external tool can take out the cover plate through the dismounting hole, so as to take back the electronic component after the tin processing.

7. The tin positioning tooling of claim 6, wherein, The size of the cover plate is matched with the size of the rectangular hole.

8. The tin positioning tooling of claim 7, wherein, The support protrusion is arranged in an arc structure or a polygonal structure, for example, a semicircular structure or a quadrilateral structure.

9. The tin positioning tooling of claim 1, wherein, The electronic component is a transistor or a field effect tube.

10. The tin positioning tooling of claim 9, wherein, The transistor is a triode or a diode.

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