Chip self-fixing type tray

By designing a ball and spring structure for a self-fixing chip tray, automatic chip fixing and rapid chip removal are achieved, solving the problems of low fixing efficiency and inconvenient removal in existing technologies, and improving the chip fixing and testing efficiency.

CN223764968UActive Publication Date: 2026-01-06SUZHOU ASEN SEMICON CO LTD
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Patent Information

Application Number
CN202520261583.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-19
Publication Date
2026-01-06
Estimated Expiration
2035-02-19

AI Technical Summary

Technical Problem

Existing chip-fixing trays require additional fixing devices, which reduces the efficiency of chip fixing and makes it inconvenient to quickly remove chips for testing.

Method used

A self-fixing chip tray was designed. Through a combination of a ball and a spring, the chip can be automatically fixed and easily removed. The automatic fixing of the chip is achieved by the ball and the ball groove connected by the rolling mechanism, the rebound force of the spring ensures the stability of the chip, and the handle drives the sliding column to achieve quick removal.

Benefits of technology

It improves chip fixing efficiency and removal speed, reduces the need for additional fixing devices, simplifies the operation process, and improves work efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip trays, and discloses a chip self-fixing tray which comprises a chip fixing assembly, the chip fixing assembly comprises a lower shell, an upper shell is connected to the upper side of the lower shell, a chip body is arranged in the lower shell, a first ball groove is formed in the upper side of the lower shell, a first rolling ball is connected in the first ball groove, and a second ball groove is formed in the lower side of the lower shell. A sliding column is connected to one side of the lower shell, a push plate is connected to one end of the sliding column, a grip is connected to the other end of the sliding column, a sliding groove is formed in the upper shell, a sliding block is connected into the sliding groove, and a lower pressing plate is connected to one side of the sliding block. According to the utility model, the chip can be conveniently fixed on the tray, an additional fixing device is not needed, the chip can be fixed only by pushing the chip into the chip fixing assembly, the chip fixing efficiency is improved, a worker can quickly take out the chip for inspection, the operation time required for taking out the chip is reduced, and the efficiency is improved.
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Description

Technical Field

[0001] This utility model relates to the field of chip tray technology, specifically a self-fixing chip tray. Background Technology

[0002] With the rapid development of information technology, chips, as core components of electronic devices, are becoming increasingly important. Ensuring the integrity and security of chips during manufacturing, testing, and transportation has always been a significant challenge for the industry.

[0003] Existing chip fixing trays still have some shortcomings in use: when using existing chip fixing trays, after placing the chip on the tray, other devices are often needed to fix the chip, which reduces the chip fixing efficiency. In addition, existing chip fixing trays are often inconvenient to remove the chip for testing, and the chip removal time is long. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a self-fixing chip tray.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip self-fixing tray, comprising a chip fixing assembly, the chip fixing assembly comprising a lower housing, an upper housing connected to the upper side of the lower housing, and a chip body disposed inside the lower housing, the upper side of the lower housing being provided with a first ball groove, and a first ball connected to the first ball groove, and a sliding post connected to one side of the lower housing, one end of the sliding post being connected to a push plate, and the other end of the sliding post being connected to a handle, the upper housing being provided with a sliding groove, and a slider connected to the sliding groove, and a lower pressure plate connected to one side of the slider, the upper end of the lower pressure plate being connected to a telescopic post, and the upper end of the lower pressure plate being connected to a spring.

[0006] As a further description of the above technical solution:

[0007] The lower end of the upper housing is fixed to the lower housing, and the chip body is disposed inside the lower housing and the upper housing.

[0008] As a further description of the above technical solution:

[0009] The first ball groove is located on the lower shell, and the first rolling ball is rotatably connected to the first ball groove, and there are multiple sets of the first rolling ball.

[0010] As a further description of the above technical solution:

[0011] The sliding column is slidably connected to the lower housing, with one end of the sliding column fixed to the push plate and the other end of the sliding column away from the push plate fixed to the handle.

[0012] As a further description of the above technical solution:

[0013] The slide groove is located on the inner side of the upper housing, and the slider is slidably connected in the slide groove and fixed to one side of the lower pressure plate.

[0014] As a further description of the above technical solution:

[0015] The lower end of the telescopic column is fixed to the lower pressure plate, and the end of the telescopic column away from the lower pressure plate is fixed to the upper housing. The lower end of the spring is fixed to the lower pressure plate, and the end of the spring away from the lower pressure plate is fixed to the upper housing. The spring is sleeved on the telescopic column.

[0016] As a further description of the above technical solution:

[0017] The lower pressure plate is provided with a second ball groove on its lower side, and a second ball is rolled in the second ball groove, and multiple sets of the second ball are provided.

[0018] This utility model has the following beneficial effects:

[0019] 1. By pushing the chip body, the chip body moves on the first rolling ball, which in turn causes the first rolling ball to roll in the first ball groove. The chip body also squeezes the second rolling ball, causing the second rolling ball to roll in the second ball groove. This squeezes the pressure plate upward, and then the chip body is fixed by the rebound force of the spring. This allows the chip to be easily fixed on the tray without the need for additional fixing devices. The chip can be fixed simply by pushing it into the chip fixing assembly, which improves the efficiency of chip fixing.

[0020] 2. By manually pushing the handle, the handle drives the sliding column to slide on the lower housing, thereby moving the push plate to push out the chip body. This allows the staff to quickly remove the chip for inspection, reducing the operation time required to remove the chip and thus improving efficiency. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of a chip self-fixing tray proposed in this utility model;

[0022] Figure 2 This is a schematic diagram of a partially exploded structure of a chip self-fixing tray proposed in this utility model. Figure 1 ;

[0023] Figure 3 This is a schematic diagram of a partially exploded structure of a chip self-fixing tray proposed in this utility model. Figure 2 ;

[0024] Figure 4 This is a schematic diagram of a partially exploded structure of a chip self-fixing tray proposed in this utility model. Figure 3 .

[0025] Legend:

[0026] 1. Chip fixing assembly; 101. Lower housing; 102. Upper housing; 103. Chip body; 104. First rolling ball; 105. Push plate; 106. Sliding column; 107. Handle; 108. Slide groove; 109. Slider; 110. Telescopic column; 111. Spring; 112. Lower pressure plate; 113. Second ball groove; 114. Second rolling ball; 115. First ball groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-4 This utility model provides a chip self-fixing tray, including: chip fixing component 1.

[0029] Specifically, the chip fixing assembly 1 includes a lower housing 101, and an upper housing 102 is connected to the upper side of the lower housing 101. The chip body 103 is disposed inside the lower housing 101. A first ball groove 115 is provided on the upper side of the lower housing 101, and a first ball 104 is connected inside the first ball groove 115. A sliding post 106 is connected to one side of the lower housing 101. A push plate 105 is connected to one end of the sliding post 106, and a handle 107 is connected to the other end of the sliding post 106. A sliding groove 108 is provided on the upper housing 102, and a slider 109 is connected inside the sliding groove 108. A lower pressure plate 112 is connected to one side of the slider 109. A telescopic post 110 is connected to the upper end of the lower pressure plate 112, and a spring 111 is connected to the upper end of the lower pressure plate 112.

[0030] In this embodiment, the chip fixing component 1 constitutes the chip self-fixing tray involved in this application, which realizes stable fixing of the chip.

[0031] In this embodiment, the chip involved is a microelectronic circuit that integrates a large number of tiny electronic components on a single semiconductor substrate.

[0032] In this embodiment, the chip fixing component 1 is provided in two sets, and each set can fix one chip. The chip fixing component 1 can be provided in multiple sets to fix multiple chips.

[0033] It should be noted that there are multiple sets of first rolling balls 104 and multiple sets of first ball grooves 115. The first rolling balls 104 roll in the first ball grooves 115, so that the chip moves on the first rolling balls 104.

[0034] Specifically, the lower end of the upper housing 102 is fixed to the lower housing 101, and the chip body 103 is disposed within the lower housing 101 and the upper housing 102. A first ball groove 115 is disposed on the lower housing 101, and a first ball 104 is rotatably connected to the first ball groove 115. Multiple sets of first balls 104 are provided. A sliding post 106 is slidably connected to the lower housing 101, and one end of the sliding post 106 is fixed to the push plate 105. The end of the sliding post 106 away from the push plate 105 is fixed to the handle 107. A sliding groove 108 is disposed on the inner side of the upper housing 102, and a slider 109 slides. The slider 109 is fixed to one side of the lower pressure plate 112 and connected to the slide groove 108. The lower end of the telescopic column 110 is fixed to the lower pressure plate 112, and the end of the telescopic column 110 away from the lower pressure plate 112 is fixed to the upper housing 102. The lower end of the spring 111 is fixed to the lower pressure plate 112, and the end of the spring 111 away from the lower pressure plate 112 is fixed to the upper housing 102. The spring 111 is sleeved on the telescopic column 110. The lower side of the lower pressure plate 112 is provided with a second ball groove 113, and a second ball 114 is tumbling connected in the second ball groove 113. Multiple sets of the second ball 114 are provided.

[0035] In a preferred embodiment, when it is necessary to remove the chip, the handle 107 is manually pushed. The handle 107 causes the sliding column 106 to slide on the lower housing 101, thereby causing the push plate 105 to move and push the chip out.

[0036] As a preferred implementation, the pusher plate 105 has a rubber pad on the side used to push out the chip, which can reduce the possibility of damage to the chip.

[0037] In a preferred embodiment, the spring 111 is sleeved on the telescopic column 110, so that the telescopic column 110 retracts along with the spring 111, preventing the spring 111 from bending and losing its effect.

[0038] In use, when placing the chip in the chip fixing assembly, the chip body is placed on the first ball through the opening on one side of the lower and upper housings. Pushing the chip body causes it to move on the first ball, which in turn causes the first ball to roll in the first ball groove. When pushing the chip body, it squeezes the second ball, causing it to roll in the second ball groove. This squeezes the lower pressure plate upward, which in turn causes the slider to slide in the groove on the upper housing. This causes the telescopic column and spring to retract, and the spring's rebound force squeezes the chip body to fix it in place. Then, if it is necessary to remove the chip body, the handle is manually pushed. The handle causes the sliding column to slide on the lower housing, which in turn causes the push plate to move and push the chip body out.

[0039] This invention provides a self-fixing chip tray that can easily fix chips onto the tray without the need for additional fixing devices. Simply push the chip into the chip fixing component to complete the fixing, which improves the efficiency of chip fixing. Furthermore, staff can quickly remove the chip for inspection, reducing the operation time required to remove the chip and thus improving efficiency.

[0040] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip self-fixing tray, characterized by: Chip fixing assembly (1) is provided with lower shell (101), and the upper side of lower shell (101) is connected with upper shell (102), and the inside of lower shell (101) is provided with chip body (103), the upper side of lower shell (101) is provided with first ball groove (115), and the inside of first ball groove (115) is connected with first ball (104), and the side of lower shell (101) is connected with sliding column (106), one end of sliding column (106) is connected with push plate (105), and the other end of sliding column (106) is connected with handle (107), the upper side of upper shell (102) is provided with sliding groove (108), and the inside of sliding groove (108) is connected with sliding block (109), and the side of sliding block (109) is connected with lower pressing plate (112), the upper end of lower pressing plate (112) is connected with telescopic column (110), and the upper end of lower pressing plate (112) is connected with spring (111).

2. The chip self-fixing tray according to claim 1, wherein: The lower end of the upper shell (102) is fixedly connected to the lower shell (101), and the chip body (103) is arranged in the lower shell (101) and the upper shell (102).

3. A chip self-fixing tray according to claim 2, characterized in that: The first ball groove (115) is arranged on the lower shell (101), and the first ball (104) is rollingly connected in the first ball groove (115), and the first ball (104) is provided with a plurality of groups.

4. The chip self-fixturing tray of claim 3, wherein: The sliding column (106) is connected to the lower shell (101) through sliding, one end of the sliding column (106) is fixedly connected to the push plate (105), and the end of the sliding column (106) away from the push plate (105) is fixedly connected to the handle (107).

5. A chip self-fixturing tray as claimed in claim 4, wherein: The sliding groove (108) is arranged on the inner side of the upper shell (102), and the sliding block (109) is slidably connected in the sliding groove (108), and the sliding block (109) is fixedly connected to one side of the lower pressing plate (112).

6. A chip self-fixturing tray as claimed in claim 5, wherein: The lower end of the telescopic column (110) is fixedly connected to the lower pressing plate (112), the end of the telescopic column (110) away from the lower pressing plate (112) is fixedly connected to the upper shell (102), the lower end of the spring (111) is fixedly connected to the lower pressing plate (112), the end of the spring (111) away from the lower pressing plate (112) is fixedly connected to the upper shell (102), and the spring (111) is sleeved on the telescopic column (110).

7. A chip self-fixturing tray as claimed in claim 6, wherein: The lower side of the lower pressing plate (112) is provided with a second ball groove (113), and a second ball (114) is rollingly connected in the second ball groove (113), and the second ball (114) is provided with a plurality of groups.