Semiconductor electroplating tool

Abstract

The utility model relates to the technical field of semiconductors, and discloses a semiconductor electroplating tool, which comprises a moving assembly and a clamping assembly, the clamping assembly is arranged at the lower end of the moving assembly, the clamping assembly comprises a second fixing frame, the second fixing frame is connected with a clamping motor, the output end of the clamping motor is fixedly connected with a worm, and the worm is connected with the moving assembly. A worm gear is connected to one side of the worm, a rotating shaft is connected to the middle of the worm gear, a connecting rod is fixedly connected to one end of the rotating shaft, a fixing clamping block is connected to the lower end of the connecting rod, an anti-skid pad is arranged on the fixing clamping block, and a fixing rod is arranged on one side of the fixing clamping block. According to the electroplating device, frequent manual operation around chemical substances such as electroplating liquid is avoided, the risk that operators make contact with harmful substances is reduced, the body health and safety of the operators are guaranteed, regular cleaning, maintenance and replacement of the containing groove are facilitated, the good performance of the equipment is kept, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a semiconductor electroplating fixture. Background Technology

[0002] As the core of the modern electronics industry, every step of the semiconductor manufacturing process is crucial. Semiconductor electroplating technology, as a key surface treatment technology, is widely used in the manufacturing process of semiconductor devices.

[0003] Existing semiconductor electroplating fixtures still have some shortcomings in use: when using existing semiconductor electroplating fixtures, it is often necessary to manually move the semiconductor material to be electroplated to the next electroplating process, which increases the risk of operators coming into contact with harmful substances and reduces personnel safety. In addition, existing semiconductor electroplating fixtures are not convenient to remove the placement tank for cleaning and maintenance, thus reducing the service life of the equipment. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor electroplating fixture.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor electroplating fixture, comprising a moving component and a clamping component, wherein the clamping component is located at the lower end of the moving component, and the clamping component includes a second fixed frame, the second fixed frame is connected to a clamping motor, and a worm gear is fixedly connected to the output end of the clamping motor, and a worm wheel is connected to one side of the worm gear, a rotating shaft is connected to the middle of the worm wheel, and a connecting rod is fixedly connected to one end of the rotating shaft, and a fixed clamping block is connected to the lower end of the connecting rod. At the same time, an anti-slip pad is provided on the fixed clamping block, and a fixed rod is provided on one side of the fixed clamping block, and a placement groove is connected to the lower end of the fixed rod.

[0006] The moving component includes a fixed base plate, with a first fixed frame connected to the upper end of the fixed base plate and an electrolytic cell connected to the upper end of the fixed base plate. A drive motor is connected to one side of the first fixed frame, and a threaded rod is fixedly connected to the output end of the drive motor. A threaded block is connected to the threaded rod, with a fixed column connected to the upper end of the threaded block and a hydraulic telescopic rod connected to the lower end of the threaded block.

[0007] As a further description of the above technical solution:

[0008] The upper end of the second fixed frame is fixed to the hydraulic telescopic rod, and the clamping motor is fixed to the second fixed frame, and the upper end of the worm gear is rotatably connected to the second fixed frame.

[0009] As a further description of the above technical solution:

[0010] One side of the worm gear is engaged with a worm wheel, and the middle part of the worm wheel is fixed to the rotating shaft. The two ends of the rotating shaft are respectively rotatably connected to the second fixed frame.

[0011] As a further description of the above technical solution:

[0012] One end of the connecting rod is fixed to the rotating shaft, and the end of the connecting rod away from the rotating shaft is fixed to the fixed clamping block, and the anti-slip pad is fixed to the side of the fixed clamping block away from the connecting rod.

[0013] As a further description of the above technical solution:

[0014] The fixing rod is attached to the anti-slip pad on the fixing clamp block, and the lower end of the fixing rod is fixed to the placement groove.

[0015] As a further description of the above technical solution:

[0016] The drive motor is fixed to the first fixed frame via a bracket, and the lower end of the first fixed frame is fixed to the fixed base plate, and the lower end of the electrolytic cell is fixed to the fixed base plate.

[0017] As a further description of the above technical solution:

[0018] The threaded block is threadedly connected to the threaded rod, and both ends of the threaded rod are rotatably connected to the first fixed frame, and the end of the threaded block away from the hydraulic telescopic rod is slidably connected to the first fixed frame.

[0019] As a further description of the above technical solution:

[0020] The threaded block is fixed to the hydraulic telescopic rod at one end away from the fixed column, and the two ends of the fixed column are respectively fixed to the first fixed frame through brackets.

[0021] This utility model has the following beneficial effects:

[0022] 1. By starting the drive motor, the drive motor drives the threaded rod to rotate, thereby causing the threaded block to slide on the fixed post. This, in turn, moves the semiconductor material placed in the clamped placement slot below to the next electroplating chamber for electroplating. This avoids frequent manual operation around electroplating solutions and other chemicals, reduces the risk of operators coming into contact with harmful substances, and protects the health and safety of personnel.

[0023] 2. By starting the clamping motor, the clamping motor drives the worm gear to rotate, which in turn drives the worm wheel to rotate. The rotation of the worm wheel drives the fixed clamping block below to deflect outward through the rotating shaft, thereby stopping the clamping of the fixing rod and allowing the placement slot to be removed. This makes it convenient for regular cleaning, maintenance and replacement of the placement slot, which helps to maintain the good performance of the equipment and extend its service life. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of a semiconductor electroplating fixture proposed in this utility model;

[0025] Figure 2 This is a partial structural diagram of a semiconductor electroplating fixture proposed in this utility model. Figure 1 ;

[0026] Figure 3 This is a partial structural diagram of a semiconductor electroplating fixture proposed in this utility model. Figure 2 ;

[0027] Figure 4 This is a partial cross-sectional structural diagram of a semiconductor electroplating fixture proposed in this utility model.

[0028] Legend:

[0029] 1. Moving component; 2. Clamping component; 101. Fixed base plate; 102. First fixed frame; 103. Electrolytic cell; 104. Drive motor; 105. Threaded rod; 106. Threaded block; 107. Fixed column; 108. Hydraulic telescopic rod; 201. Second fixed frame; 202. Clamping motor; 203. Worm gear; 204. Worm wheel; 205. Rotating shaft; 206. Connecting rod; 207. Fixed clamping block; 208. Anti-slip pad; 209. Fixed rod; 210. Placement slot. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Reference Figures 1-4 This utility model provides a semiconductor electroplating fixture, including: a moving component 1 and a clamping component 2.

[0032] Specifically, the clamping assembly 2 is located at the lower end of the moving assembly 1, and the clamping assembly 2 includes a second fixed frame 201. The second fixed frame 201 is connected to a clamping motor 202, and the output end of the clamping motor 202 is fixedly connected to a worm gear 203. A worm wheel 204 is connected to one side of the worm gear 203, and a rotating shaft 205 is connected to the middle of the worm wheel 204. A connecting rod 206 is fixedly connected to one end of the rotating shaft 205, and a fixed clamping block 207 is connected to the lower end of the connecting rod 206. At the same time, an anti-slip pad 208 is provided on the fixed clamping block 207, and a fixed rod 209 is provided on one side of the fixed clamping block 207. A placement groove 210 is connected to the lower end of the fixed rod 209.

[0033] The mobile component 1 includes a fixed base plate 101, and a first fixed frame 102 is connected to the upper end of the fixed base plate 101. An electrolytic cell 103 is also connected to the upper end of the fixed base plate 101. A drive motor 104 is connected to one side of the first fixed frame 102. A threaded rod 105 is fixedly connected to the output end of the drive motor 104. A threaded block 106 is connected to the threaded rod 105. A fixed column 107 is connected to the upper end of the threaded block 106. A hydraulic telescopic rod 108 is connected to the lower end of the threaded block 106.

[0034] In this embodiment, the moving component 1 and the clamping component 2 constitute the semiconductor electroplating fixture involved in this application, which realizes the electroplating of semiconductors.

[0035] In this embodiment, the semiconductor involved is a material with unique electrical properties, and its conductivity is between that of a conductor and an insulator.

[0036] In this embodiment, the fixing rod 209 fixed to the upper end of the placement groove 210 is fixed and clamped by the fixing clamp 207, and the placement groove 210 is used to place the semiconductor material that needs to be electroplated.

[0037] It should be noted that the electrolytic cell 103 is provided with three electroplating chambers. The current density of the first electroplating chamber from left to right is 3ASD, the current density of the second electroplating chamber is 2ASD, and the current density of the third electroplating chamber is 0.6ASD.

[0038] Specifically, the upper end of the second fixed frame 201 is fixed to the hydraulic telescopic rod 108, and the clamping motor 202 is fixed to the second fixed frame 201. The upper end of the worm gear 203 is rotatably connected to the second fixed frame 201. A worm wheel 204 is meshed on one side of the worm gear 203, and the middle part of the worm wheel 204 is fixed to the rotating shaft 205. Both ends of the rotating shaft 205 are rotatably connected to the second fixed frame 201. One end of the connecting rod 206 is fixed to the rotating shaft 205, and the end of the connecting rod 206 away from the rotating shaft 205 is fixed to the fixed clamping block 207. The anti-slip pad 208 is fixed to the side of the fixed clamping block 207 away from the connecting rod 206. The fixed rod 209 is attached to the anti-slip pad 208 provided on the fixed clamping block 207, and the lower end of the fixed rod 209 is fixed to the placement groove 210.

[0039] In a preferred embodiment, the worm gear 203 is rotatably connected to the second fixed frame 201, and the worm gear 203 can simultaneously drive two symmetrically arranged worm wheels 204 to rotate, thereby driving two symmetrically arranged rotating shafts 205 to rotate in opposite directions.

[0040] In a preferred embodiment, the anti-slip pad 208 is fixed to the fixing block 207, and the anti-slip pad 208 is used to prevent slippage when clamping the fixing rod 209, and the groove 210 is provided with a number of filter holes.

[0041] Specifically, the drive motor 104 is fixed to the first fixed frame 102 via a bracket, and the lower end of the first fixed frame 102 is fixed to the fixed base plate 101. The lower end of the electrolytic cell 103 is fixed to the fixed base plate 101. The threaded block 106 is threaded to the threaded rod 105, and both ends of the threaded rod 105 are rotatably connected to the first fixed frame 102. The end of the threaded block 106 away from the hydraulic telescopic rod 108 is slidably connected to the first fixed frame 102. The end of the threaded block 106 away from the fixed column 107 is fixed to the hydraulic telescopic rod 108, and both ends of the fixed column 107 are fixed to the first fixed frame 102 via brackets.

[0042] In a preferred embodiment, the outer side of the threaded block 106 is slidably connected to a groove provided on the first fixing frame 102.

[0043] It should be noted that the upper end of the threaded block 106 is slidably connected to the fixed post 107, and the fixed post 107 is fixedly connected to the first fixed frame 102, so that when the threaded block 106 moves, it prevents the threaded block 106 from rotating with the threaded rod 105.

[0044] In use, when electroplating semiconductor materials, the semiconductor material to be electroplated is placed in the placement tank. The hydraulic telescopic rod is activated, driving the second fixing frame downwards. This causes the clamping fixing rod below to move downwards, thus moving the semiconductor material in the placement tank into the electrolytic tank for electroplating. When it is necessary to remove the placement tank, the drive motor is activated, driving the threaded rod to rotate. This causes the threaded block to slide on the fixing post, moving the semiconductor material in the clamped placement tank below to the next electroplating chamber. The clamping motor is then activated, driving the worm gear to rotate. This rotation of the worm gear, through the rotating shaft, causes the lower fixing block to deflect outwards, stopping the clamping fixing rod and allowing the placement tank to be removed.

[0045] This invention provides a semiconductor electroplating fixture that avoids frequent manual handling around electroplating solutions and other chemicals, reducing the risk of operators coming into contact with harmful substances, protecting their health and safety, and facilitating regular cleaning, maintenance, and replacement of the placement tank, thus helping to maintain the equipment's good performance and extend its service life.

[0046] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor electroplating tooling, characterized by: The utility model provides a mobile assembly (1) and clamping assembly (2) including, clamping assembly (2) is located the lower end of mobile assembly (1), and clamping assembly (2) includes second fixed frame (201), second fixed frame (201) is connected with clamping motor (202), and the output of clamping motor (202) is fixedly connected with worm (203), and one side of worm (203) is connected with worm wheel (204), the middle part of worm wheel (204) is connected with rotating shaft (205), and one end of rotating shaft (205) is fixedly connected with connecting rod (206), and the lower end of connecting rod (206) is connected with fixed clamping block (207), and fixed clamping block (207) is equipped with antiskid pad (208) simultaneously on, one side of fixed clamping block (207) is equipped with fixed rod (209), and the lower end of fixed rod (209) is connected with the placement groove (210), The utility model provides a mobile assembly (1) and clamping assembly (2) including, clamping assembly (2) is located the lower end of mobile assembly (1), and clamping assembly (2) includes second fixed frame (201), second fixed frame (201) is connected with clamping motor (202), and the output of clamping motor (202) is fixedly connected with worm (203), and one side of worm (203) is connected with worm wheel (204), the middle part of worm wheel (204) is connected with rotating shaft (205), and one end of rotating shaft (205) is fixedly connected with connecting rod (206), and the lower end of connecting rod (206) is connected with fixed clamping block (207), and fixed clamping block (207) is equipped with antiskid pad (208) simultaneously on, one side of fixed clamping block (207) is equipped with fixed rod (209), and the lower end of fixed rod (209) is connected with the placement groove (210), 2. The semiconductor electroplating tooling of claim 1, wherein: The upper end of second fixed frame (201) is fixedly connected on the hydraulic telescopic rod (108), and clamping motor (202) is fixedly connected on second fixed frame (201), and the upper end of worm (203) is rotatably connected on second fixed frame (201).

3. The semiconductor electroplating tooling of claim 2, wherein: One side of worm (203) is engaged with worm wheel (204), and the middle part of worm wheel (204) is fixedly connected on rotating shaft (205), and the two ends of rotating shaft (205) are rotatably connected on second fixed frame (201) respectively.

4. The semiconductor electroplating tooling of claim 3, wherein: One end of connecting rod (206) is fixedly connected on rotating shaft (205), and the end, away from rotating shaft (205), of connecting rod (206) is fixedly connected on fixed clamping block (207), and antiskid pad (208) is fixedly connected on one side of fixed clamping block (207), away from connecting rod (206).

5. The semiconductor electroplating tool of claim 4, wherein: Fixed rod (209) is connected on the antiskid pad (208) equipped on fixed clamping block (207), and the lower end of fixed rod (209) is fixedly connected on the placement groove (210).

6. The semiconductor electroplating tool of claim 5, wherein: The output of driving motor (104) is fixedly connected on first fixed frame (102) through support, and the lower end of first fixed frame (102) is fixedly connected on fixed bottom plate (101), and the lower end of electrolytic cell (103) is fixedly connected on fixed bottom plate (101).

7. The semiconductor electroplating tool of claim 6, wherein: Threaded block (106) is threadedly connected on threaded rod (105), and the two ends of threaded rod (105) are rotatably connected on first fixed frame (102) respectively, and the end, away from hydraulic telescopic rod (108), of threaded block (106) is slidably connected on first fixed frame (102).

8. The semiconductor electroplating tool of claim 7, wherein: The threaded block (106) is fixed to the hydraulic telescopic rod (108) away from one end of the fixed column (107), and the two ends of the fixed column (107) are respectively fixed to the first fixed frame (102) through the support.

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