Water-based metal working fluid stock solution stability detection device

Abstract

The utility model discloses an aqueous metal working fluid stock solution stability detection device, which is characterized in that a heating table is provided with a plurality of heat conduction areas at the position of a cavity, the heating table is provided with heat conduction plates at the positions of the heat conduction areas, and semiconductor heating sheets and semiconductor refrigeration sheets are arranged in the heating table and on the lower surfaces of the heat conduction plates; the lower surface of the heating table is connected with the upper surface of the aluminum alloy radiating fin through bolts, fins are uniformly arranged on the lower surface of the aluminum alloy radiating fin, and the plurality of radiating fans are respectively connected with the lower surface of the aluminum alloy radiating fin. When the semiconductor heating sheet is used for heating, the operation stability and the service life of the device are guaranteed, meanwhile, the cooling fan is used for direct supporting, a support does not need to be built, cost and time are saved, the stability of multiple products can be detected at the same time, and efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chemistry, and in particular to the stability testing technology of water-based metalworking fluids, specifically a device for testing the stability of water-based metalworking fluid stock solution. Background Technology

[0002] When producing water-based metalworking fluids, it is necessary to conduct specialized testing and analysis on the stability of the metalworking fluids. Conventional instruments for post-stability testing of metalworking fluids include large-scale testing devices such as ovens and freezers. However, in special settings such as production workshops and small laboratories, setting up such large-scale instruments to test product stability is difficult, costly, and time-consuming. Furthermore, currently, a single heating or cooling testing device can generally only test one type of product, resulting in low efficiency and flexibility. Therefore, an improved technology is urgently needed to address the aforementioned problems in existing technologies. Utility Model Content

[0003] The purpose of this invention is to provide a device for testing the stability of water-based metalworking fluid stock solution, which is easy to use, portable, requires no support frame, and can test multiple products simultaneously, thereby solving the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a device for detecting the stability of water-based metalworking fluid stock solution, comprising a heating mechanism, an aluminum alloy heat sink, and a heat dissipation mechanism;

[0005] The heating mechanism includes a heating platform, a semiconductor heating element, and a semiconductor cooling element. The heating platform is provided with a cavity and a control panel. The heating platform is provided with several heat-conducting areas in the cavity. A heat-conducting plate is provided in each heat-conducting area of ​​the heating platform. A semiconductor heating element and a semiconductor cooling element are provided inside the heating platform and on the lower surface of each heat-conducting plate. The semiconductor heating element and the semiconductor cooling element are in close contact with the top of the cavity inside the heating platform.

[0006] The lower surface of the heating platform is connected to the upper surface of the aluminum alloy heat sink by bolts, and the lower surface of the aluminum alloy heat sink is uniformly provided with fins.

[0007] The heat dissipation mechanism includes several cooling fans, each connected to the lower surface of an aluminum alloy heat sink. The positions of the cooling fans correspond one-to-one with the heat conduction areas of the heating platform.

[0008] Preferably, the present invention provides a water-based metalworking fluid stock solution stability testing device, wherein the surface of the control panel is provided with several displays and several buttons, the control panel is connected to a semiconductor heating element via wires, and a single-crystal silicon semiconductor is provided in each heat-conducting area inside the heating platform and on the lower surface of the semiconductor heating element and the semiconductor cooling element, the single-crystal silicon semiconductor being connected to the control panel via wires.

[0009] Preferably, the present invention provides a water-based metalworking fluid stock solution stability testing device, wherein a power interface and several fan wire sockets are provided on one side of the control panel, the power interface and fan wire sockets are both located on the side of the heating platform, and the connecting wire of the cooling fan is plugged into the fan wire sockets via a plug.

[0010] Preferably, the present invention provides a water-based metalworking fluid stock solution stability testing device, wherein bosses are provided on both sides of the lower surface of the aluminum alloy heat sink and between two adjacent heat-conducting areas, the bosses are provided with a plurality of through holes and screw holes, the lower surface of the heating platform is provided with a plurality of screw holes, the screw holes of the heating platform correspond one-to-one with the through holes of the bosses and are fastened together by bolts, and the housing part of the cooling fan is fastened together with the screw holes of the bosses by bolts.

[0011] Preferably, in the water-based metalworking fluid stock solution stability testing device provided by this utility model, support feet are provided on both sides of the lower surface of the cooling fan.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] (1) The bottom of the heating platform is equipped with an aluminum alloy heat sink, and a cooling fan is installed at the bottom of the aluminum alloy heat sink. First, the cooling fan and the aluminum alloy heat sink work together to dissipate heat from the heating platform. When heating is achieved by the semiconductor heating element, the stability and lifespan of the device are guaranteed. At the same time, through a reasonable connection structure, the cooling fan can directly support the device without the need to build a support frame, saving costs and time.

[0014] (2) A semiconductor heating element and a semiconductor cooling element are installed in each heat conduction area inside the heating stage. A cooling fan is installed at the bottom to work with each heat conduction area. This allows for the simultaneous testing of the stability of multiple products, greatly improving efficiency. Attached Figure Description

[0015] Figure 1 This is a front view structural diagram of the present invention;

[0016] Figure 2 This is a top view of the structure of this utility model;

[0017] Figure 3This is a schematic diagram of the structure of this utility model from below;

[0018] Figure 4 This is a schematic diagram of an aluminum alloy heat sink structure.

[0019] In the diagram: 1. Heating platform; 2. Semiconductor heating element; 3. Semiconductor cooling element; 4. Control panel; 5. Heat-conducting plate; 6. Aluminum alloy heat sink; 7. Fins; 8. Cooling fan; 9. Display screen; 10. Button; 11. Monocrystalline silicon semiconductor; 12. Power interface; 13. Fan power cord socket; 14. Boss; 15. Support leg. Detailed Implementation

[0020] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] It should be noted that in the description of this utility model, the terms "inner", "outer", "upper", "lower", "both sides", "one end", "the other end", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] Please see Figure 1-4 This utility model provides a technical solution: a water-based metalworking fluid stock solution stability testing device, including a heating mechanism, an aluminum alloy heat sink 6 and a heat dissipation mechanism;

[0023] The heating mechanism includes a heating platform 1, a semiconductor heating element 2, and a semiconductor cooling element 3. The heating platform 1 is provided with a cavity and a control panel 4. The control panel 4 includes a controller. The surface of the control panel 4 is provided with several displays 9 and several buttons 10. The control panel 4 is connected to the semiconductor heating element 2 through wires. The displays 9 and buttons 10 are used for temperature viewing and adjustment, respectively. The heating platform 1 is provided with several heat-conducting areas in the cavity. The heating platform 1 is provided with heat-conducting plates 5 in each heat-conducting area. The semiconductor heating element 2 and the semiconductor cooling element 3 are provided in the heating platform 1 and on the lower surface of each heat-conducting plate 5. The semiconductor heating element 2 and the semiconductor cooling element 3 are closely attached to the top of the cavity inside the heating platform 1. A single crystal silicon semiconductor 11 is provided (bonded) in each heat-conducting area inside the heating platform 1 and on the lower surface of the semiconductor heating element 2 and the semiconductor cooling element 3. The single crystal silicon semiconductor 11 is connected to the control panel 4 through wires and is used for temperature detection in each heat-conducting area.

[0024] The lower surface of the heating platform 1 is connected to the upper surface of the aluminum alloy heat sink 6 by bolts. Fins 7 are evenly arranged on the lower surface of the aluminum alloy heat sink 6.

[0025] The heat dissipation mechanism includes several cooling fans 8, each connected to the lower surface of the aluminum alloy heat sink 6. The positions of the cooling fans 8 correspond one-to-one with the heat conduction areas of the heating platform 1. A power interface 12 and several fan cable connectors 13 are located on one side of the control panel 4. These connectors facilitate connection to the power supply and the cooling fan 8 cables. The cooling fan 8 cables are plugged into the fan cable connectors 13, thus connecting the cooling fans 8 to the control panel 4. The lower surface of the aluminum alloy heat sink 6 and adjacent... Each heat-conducting area is provided with a boss 14, which has several through holes and screw holes. The lower surface of the heating platform 1 is provided with several screw holes. The screw holes of the heating platform 1 correspond one-to-one with the through holes of the boss 14 and are fastened together by bolts. The housing of the cooling fan 8 is fastened to the screw holes of the boss 14 by bolts. The aluminum alloy heat sink 6 is connected to the heating platform 1 and the cooling fan 8 by means of the through holes and screw holes of the boss 14 and the bolts respectively. Support feet 15 are provided on both sides of the lower surface of the cooling fan 8 to achieve overall elevation and support, and to exhaust hot air from the bottom of the cooling fan 8.

[0026] Assembly Method and Operating Principle: First, pass bolts through the through holes of each boss 14 on the aluminum alloy heat sink 6, and tighten the bolts into the corresponding screw holes on the bottom of the heating platform 1, thus connecting the aluminum alloy heat sink 6 to the heating platform 1. Then, pass bolts through the housing of the cooling fan 8 and connect them to the screw holes of each boss 14 on the aluminum alloy heat sink 6, thus connecting the cooling fan 8 to the aluminum alloy heat sink 6. At this point, the aluminum alloy heat sink 6 is located between the heating platform 1 and the cooling fan 8. Finally, plug the connector of the cooling fan 8's cable into the fan cable socket 13 on the side of the heating platform 1 to complete the assembly. During use, plug the power cord into the power interface 12 on the side of the control panel 4 on the heating platform 1 to provide power. Place the metalworking fluid in a glass container and place the glass container on the heat-conducting plate 5 of the heating platform 1. Heating is achieved through the semiconductor heating element 2, and cooling is achieved through the semiconductor cooling element 3. The stability of the product during heating and cooling (high temperature 40-60℃, low temperature -5℃) is observed by the clarity or turbidity of the fluid's appearance. During operation, the semiconductor heating element 2 inside the heating platform 1 heats up, triggering the corresponding cooling fan 8 to dissipate heat through its blades. During cooling, the semiconductor cooling element 3 provides cooling, while the aluminum alloy heat sink 6 conducts heat. The heat generated in the heat-conducting area of ​​the heating platform 1 is conducted through the aluminum alloy heat sink 6, and the cooling fan 8 blows the heat transferred to the aluminum alloy heat sink 6 away from below, thus achieving heat dissipation at the bottom of the heating platform 1. This invention has a reasonable structure. The bottom of the heating platform 1 is equipped with an aluminum alloy heat sink 6, and a cooling fan 8 is installed at the bottom of the aluminum alloy heat sink 6. Firstly, the cooling fan 8 and the aluminum alloy heat sink 6 work together to dissipate heat from the heating platform 1. When heating with the semiconductor heating element, the stability and lifespan of the device are ensured. Simultaneously, the reasonable connection structure allows for direct support via the cooling fan 8, eliminating the need for a support frame, saving cost and time. Furthermore, semiconductor heating elements 2 and semiconductor cooling elements 3 are installed in each heat-conducting area within the heating platform 1, and the cooling fan 8 at the bottom works in conjunction with each heat-conducting area, allowing for simultaneous testing of the stability of multiple products, greatly improving efficiency.

[0027] Any aspects of this utility model not described in detail are well-known technologies to those skilled in the art.

[0028] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications and equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An aqueous metal working fluid stock solution stability detection device, characterized by: It comprises a heating mechanism, an aluminum alloy heat sink (6) and a heat dissipation mechanism. The heating mechanism comprises a heating table (1) and semiconductor heating fins (2) and semiconductor refrigeration fins (3), the heating table (1) is provided with a cavity and a control panel (4), the heating table (1) is provided with a plurality of heat conduction areas at the cavity, the heating table (1) is provided with a heat conduction plate (5) at each heat conduction area, the semiconductor heating fins (2) and the semiconductor refrigeration fins (3) are arranged in the heating table (1) and below the lower surface of each heat conduction plate (5), and the semiconductor heating fins (2) and the semiconductor refrigeration fins (3) are tightly attached to the top of the internal cavity of the heating table (1). The lower surface of the heating table (1) is connected to the upper surface of the aluminum alloy heat sink (6) through bolts, and the lower surface of the aluminum alloy heat sink (6) is uniformly provided with fins (7). The heat dissipation mechanism comprises a heat dissipation fan (8), the heat dissipation fan (8) is provided with a plurality of heat dissipation fans (8) and is connected to the lower surface of the aluminum alloy heat sink (6), and the position of the heat dissipation fan (8) corresponds to the heat conduction area of the heating table (1).

2. The water-based metal working fluid stock solution stability detection device according to claim 1, characterized in that: The surface of the control panel (4) is provided with a plurality of display screens (9) and a plurality of buttons (10), the control panel (4) is connected to the semiconductor heating fins (2) through wires, each heat conduction area in the heating table (1) is provided with a single crystal silicon semiconductor (11) below the lower surface of the semiconductor heating fins (2) and the semiconductor refrigeration fins (3), and the single crystal silicon semiconductor (11) is connected to the control panel (4) through wires.

3. The water-based metal working fluid stock solution stability detection device according to claim 1, characterized in that: The control panel (4) is provided with a power interface (12) and a plurality of fan wire jacks (13) on one side, the power interface (12) and the fan wire jacks (13) are arranged on the side surface of the heating table (1), and the connecting line of the heat dissipation fan (8) is plugged into the fan wire jacks (13) through a plug.

4. The water-based metal working fluid stock solution stability detection device according to claim 1, characterized in that: The lower surface of the aluminum alloy heat sink (6) is provided with a boss (14) between the two adjacent heat conduction areas on both sides, the boss (14) is provided with a plurality of through holes and screw holes, the lower surface of the heating table (1) is provided with a plurality of screw holes, the screw holes of the heating table (1) correspond to the through holes of the boss (14) and are fastened and connected through bolts, and the shell part of the heat dissipation fan (8) is fastened and connected with the screw holes of the boss (14) through bolts.

5. The water-based metal working fluid stock solution stability detection device according to claim 1, characterized in that: The lower surface of the heat dissipation fan (8) is provided with a supporting leg (15) on both sides.

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