Heat dissipation frame and optical module

Abstract

The utility model relates to the technical field of photoelectricity, in particular to a heat dissipation frame and an optical module. Comprising a PCBA board, a heat dissipation module, a socket and a VC board, the heat dissipation module is arranged on at least one side face of the PCBA board, and a containing groove is formed between the heat dissipation module and the PCBA board; the socket is arranged in the accommodating groove, and one side surface, deviating from the heat dissipation module, of the socket is in compression joint with the PCBA board; and the VC plate is arranged in the accommodating groove, and the VC plate is respectively attached to the heat dissipation module and the optical component in the socket. The squirrel cage solves the problem that a squirrel cage with cooling fins in the prior art cannot meet the requirement for heat dissipation of a plurality of optical components.

Description

TECHNICAL FIELD

[0001] The utility model relates to photoelectricity technical field especially a kind of heat dissipation frame and optical module. BACKGROUND

[0002] In optical transport network equipment, optical module is very important device, mainly completes photoelectricity and electro-optical conversion, so signal can be realized after passing through optical module transmission medium conversion.

[0003] In the case of using optical components such as OSFP or QSFP-DD, such high-power optical components need better heat dissipation structure to meet the normal use needs.

[0004] Most of the current heat dissipation structure is to set the squirrel cage with cooling fins on optical components, and the heat dissipation squirrel cage of such structure cannot meet the heat dissipation of multiple optical components, and the applicability is poor. INVENTION CONTENTS

[0005] The technical problem to be solved by the embodiments of the utility model lies in providing a heat dissipation frame and an optical module to solve the problem that the squirrel cage with cooling fins in the prior art cannot meet the heat dissipation of multiple optical components.

[0006] In the first aspect, the utility model discloses a heat dissipation frame, comprising: PCBA board, heat dissipation module, socket and VC board, at least one side of the PCBA board is equipped with the heat dissipation module, and accommodation groove is formed between the heat dissipation module and the PCBA board;The socket is arranged in the accommodation groove, and the side of the socket away from the heat dissipation module is pressure bonded with the PCBA board;The VC board is arranged in the accommodation groove, and the VC board is respectively attached with optical components in the heat dissipation module and the socket.

[0007] Optionally, the heat dissipation module is equipped with mounting groove, and the heat dissipation frame further comprises spring piece, the spring piece is arranged in the mounting groove, the spring piece is equipped with limiting slot, the socket is equipped with limiting buckle corresponding to the limiting slot, and the limiting slot can be buckled with the limiting buckle.

[0008] Optionally, the opposite sides of the socket are respectively equipped with limiting buckle, the spring piece comprises connecting section and buckling section arranged on the opposite sides of the connecting section respectively, the limiting slot is arranged on the buckling section, the connecting section is arranged in the mounting groove, the buckling section and the connecting section have a preset angle, the mounting groove is equipped with through groove, one of the buckling sections passes through the through groove and buckles with one of the limiting buckles, and the other buckling section buckles with the other limiting buckle.

[0009] Optionally, the connecting section is further provided with an elastic section at opposite ends, one end of the elastic section is connected with the buckling section, and the other end is connected with the connecting section.

[0010] Optionally, the heat dissipation module comprises a connecting plate and a plurality of heat dissipation fins connected with each other, the plurality of heat dissipation fins are arranged in parallel, a rectangular gap is formed along the arrangement direction of the heat dissipation fins, the connecting plate is located at one side of the rectangular gap, the VC plate is welded on the connecting plate, and the connecting plate, the other side of the rectangular gap and the PCBA plate form the accommodating groove.

[0011] Optionally, the connecting surface is provided with a first connecting hole, the PCBA plate is provided with a second connecting hole corresponding to the first connecting hole, and the heat dissipation frame further comprises an elastic connecting piece, the first connecting hole is connected with the second connecting hole through the elastic connecting piece.

[0012] Optionally, the elastic connecting piece comprises a screw, an elastic piece and a stud, the stud is arranged between the PCBA plate and the connecting plate, one end of the stud is welded and connected with the second connecting hole, and the other end abuts against the connecting plate, the screw is connected with the stud through the first connecting hole, the elastic piece is arranged between the screw and the connecting plate, and the first connecting hole can slide relative to the screw.

[0013] Optionally, the socket is provided with a avoiding groove on the side facing the heat dissipation module, and the VC plate passes through the avoiding groove and is attached to the optical component in the socket.

[0014] Optionally, the PCBA plate is provided with the heat dissipation module on opposite sides, and the sockets on the opposite sides of the PCBA plate are staggered.

[0015] In the second aspect, the utility model discloses an optical module, and the optical module comprises optical components and the heat dissipation frame in any one of the preceding aspects, and the optical components are arranged in the socket of the heat dissipation frame.

[0016] Compared with the prior art, the beneficial effects of the heat dissipation frame provided in the embodiment of the utility model lie in that the heat dissipation module is arranged on the PCBA board, and the accommodation groove is formed between the heat dissipation module and the PCBA board, the accommodation groove is used for accommodating the socket, the side surface of the socket away from the heat dissipation module is crimped with the PCBA board, so as to ensure the connection between the socket and the PCBA board. The socket is used for accommodating the optical component, so the heat dissipation module can dissipate heat for the optical component in the socket, the VC plate arranged on the side surface of the heat dissipation module can be attached with the optical component in the socket, and directly dissipate heat for the optical component. In the embodiment, the accommodation groove can conveniently arrange the socket between the PCBA board and the heat dissipation module, so as to increase the heat dissipation area of the socket, improve the heat dissipation efficiency of the optical component in the socket, and utilize the uniform heat capacity of the VC plate and the ground contact thermal resistance, uniformly and stably transfer the heat generated by the optical component in the socket during work to the heat dissipation module, and finally transfer to the outside through the heat dissipation module. Meanwhile, the heat dissipation module can be arranged on the opposite sides of the PCBA board, so as to form the accommodation groove on the opposite sides of the PCBA board, so as to meet the heat dissipation of the plurality of optical components. BRIEF DESCRIPTION OF DRAWINGS

[0017] The technical scheme of the utility model will be further explained in detail below with reference to the drawings and embodiments, and the drawings are as follows:

[0018] Figure 1 is the schematic diagram of the heat dissipation frame provided in the embodiment of the utility model;

[0019] Figure 2 is the exploded schematic diagram of the heat dissipation frame provided in the embodiment of the utility model;

[0020] Figure 3 is the schematic diagram of the heat dissipation module provided in the embodiment of the utility model;

[0021] Figure 4 is the schematic diagram of the elastic sheet provided in the embodiment of the utility model.

[0022] The reference signs in the drawings are as follows:

[0023] 1000, heat dissipation frame; 100, PCBA board; 101, accommodation groove; 102, second connecting hole; 200, heat dissipation module; 201, heat dissipation fin; 202, connecting plate; 2023, first connecting hole; 203, mounting groove; 2031, through groove; 204, rectangular notch; 300, socket; 301, limiting buckle; 302, avoiding groove; 400, VC plate; 500, elastic sheet; 501, connecting section; 502, buckling section; 5021, limiting groove; 503, elastic section; 600, elastic connecting piece; 601, screw; 602, stud; 603, elastic piece. DETAILED DESCRIPTION

[0024] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The preferred embodiments of the present application will be described in detail with reference to the drawings.

[0025] The embodiment of the present application provides a heat dissipation frame 1000, referring to Figures 1-3 The heat dissipation frame 1000 includes a PCBA board 100, a heat dissipation module 200, a socket 300 and a VC board 400. At least one side of the PCBA board 100 is provided with the heat dissipation module 200, and a containing groove 101 is formed between the heat dissipation module 200 and the PCBA board 100. The socket 300 is arranged in the containing groove 101, and the side of the socket 300 away from the heat dissipation module 200 is pressure-bonded with the PCBA board 100. The VC board 400 is arranged in the containing groove 101, and the VC board 400 is attached to the optical components in the heat dissipation module 200 and the socket 300 respectively.

[0026] The heat dissipation module 200 is arranged on the PCBA board 100, and the containing groove 101 is formed between the heat dissipation module 200 and the PCBA board 100. The containing groove 101 is used for containing the socket 300, and the side of the socket 300 away from the heat dissipation module 200 is pressure-bonded with the PCBA board 100, so as to ensure the connection between the socket 300 and the PCBA board 100. The socket 300 is used for containing the optical components, so that the heat dissipation module 200 can dissipate heat of the optical components in the socket 300. The VC board 400 arranged on the side of the heat dissipation module 200 can be attached to the optical components in the socket 300, and directly dissipate heat of the optical components. In the embodiment, the containing groove 101 can conveniently arrange the socket 300 between the PCBA board 100 and the heat dissipation module 200, so as to increase the heat dissipation area of the socket 300, and improve the heat dissipation efficiency of the optical components in the socket 300. Meanwhile, the heat generated by the optical components in the socket 300 during work is uniformly and stably transmitted to the heat dissipation module 200 by using the heat uniformity and ground contact thermal resistance of the VC board 400, and finally transmitted to the outside through the heat dissipation module 200. Meanwhile, the heat dissipation module 200 can be arranged on the opposite sides of the PCBA board 100, so as to form the containing groove 101 on the opposite sides of the PCBA board 100, and meet the heat dissipation requirement of the multiple optical components.

[0027] Specifically, the side of the socket 300 away from the heat dissipation module 200 is pressure-bonded with the PCBA board 100, which can increase the mechanical stability of the whole heat dissipation frame 1000, and prevent loosening or displacement during transportation or use. The arrangement of the socket 300 can conveniently insert and pull out the optical components, and facilitate user operation.

[0028] It should be noted that in this embodiment, the VC plate 400 generally refers to a VC heat spreader, which is a high-efficiency heat conduction technology for heat dissipation. The VC heat spreader is commonly used in electronic devices or computer hardware to help effectively conduct and disperse the heat generated by the device, improving heat dissipation efficiency. The VC heat spreader can achieve uniform distribution and conduction of heat, avoid heat concentration, improve heat dissipation efficiency, and maintain stable working temperature of the device.

[0029] In this embodiment, the socket 300 is usually arranged on the mainboard for mounting components such as CPU, memory bar, graphics card, etc. They provide a stable mounting position and also play a guiding and fixing role, ensuring that the components are correctly inserted and well connected with the mainboard. Such sockets 300 are also called "squirrel cages" in the optical field.

[0030] Reference Figure 2 The heat dissipation module 200 is provided with a mounting slot 203, and the heat dissipation frame 1000 further includes a spring sheet 500, which is arranged in the mounting slot 203. The spring sheet 500 is provided with a limiting slot 5021, and the socket 300 is provided with a limiting buckle 301 corresponding to the limiting slot 5021. The limiting slot 5021 can be buckled with the limiting buckle 301.

[0031] The spring sheet 500 is arranged in the mounting slot 203 of the heat dissipation module 200, and the spring sheet 500 is provided with a limiting slot 5021. The socket 300 is provided with a limiting buckle 301 corresponding to the limiting slot 5021. Through the buckling of the limiting slot 5021 and the limiting buckle 301, the position of the spring sheet 500 in the mounting slot 203 can be fixed, thereby improving the assembly stability between the heat dissipation module 200 and the socket 300, and preventing loosening or falling off during vibration or transportation.

[0032] The design of the limiting slot 5021 and the limiting buckle 301 can effectively prevent the spring sheet 500 from being misaligned in the mounting slot 203, ensure the correct alignment between the spring sheet 500 and the socket 300, and guarantee the normal function of the heat dissipation frame 1000.

[0033] The structural design of the limiting slot 5021 and the limiting buckle 301 makes the disassembly and maintenance between the heat dissipation module 200 and the socket 300 more convenient, simple and efficient.

[0034] Reference Figure 2 and Figure 4The opposite sides of the socket 300 are respectively provided with limiting buckles 301, the elastic sheet includes a connecting section 501 and buckling sections 502 respectively arranged on the opposite sides of the connecting section 501, a limiting groove 5021 is arranged on the buckling section 502, the connecting section 501 is arranged in the mounting groove 203, the buckling section 502 and the connecting section 501 have a preset angle, a through groove 2031 is arranged in the mounting groove 203, one of the buckling sections 502 passes through the through groove 2031 and buckles with one of the limiting buckles 301, and the other buckling section 502 buckles with the other limiting buckle 301.

[0035] The opposite sides of the socket 300 are respectively provided with limiting buckles 301, the elastic sheet includes a connecting section 501 and buckling sections 502 respectively arranged on the opposite sides of the connecting section 501, a limiting groove 5021 is arranged on the buckling section 502, the connecting section 501 is arranged in the mounting groove 203, the buckling section 502 and the connecting section 501 have a preset angle, a through groove 2031 is arranged in the mounting groove 203, one of the buckling sections 502 passes through the through groove 2031 and buckles with one of the limiting buckles 301, and the other buckling section 502 buckles with the other limiting buckle 301.

[0036] Specifically, a through groove 2031 is arranged in the mounting groove 203, one of the buckling sections 502 passes through the through groove 2031 and buckles with one of the limiting buckles 301, and the other buckling section 502 buckles with the other limiting buckle 301, and the buckling section 502 and the connecting section 501 have a preset angle, that is, the buckling section 502 and the connecting section 501 are vertically bent. The above design can ensure that the buckling section 502 can be correctly aligned with the limiting buckle 301 during assembly, prevent misalignment, and ensure normal connection between the elastic sheet 500 and the socket 300.

[0037] Reference Figure 4 The opposite ends of the connecting section 501 are respectively provided with elastic sections 503, one end of the elastic section 503 is connected to the connecting section 501, and the other end is connected to the buckling section 502.

[0038] The opposite ends of the connecting section 501 are respectively provided with elastic sections 503, one end of the elastic section 503 is connected to the connecting section 501, and the other end is connected to the buckling section 502.

[0039] Wherein, because the preset angle between the buckling segment 502 and the connecting segment 501, and the elasticity of the elastic segment 503, the user can press the elastic segment 503 to make the elastic segment 503 deform elastically, so that the buckling segment 502 at one end of the elastic segment 503 moves, and finally the limiting groove 5021 provided on the buckling segment 502 is buckled and connected with the limiting buckle 301 provided on the socket 300.

[0040] Reference Figure 2 And 3 The heat dissipation module 200 includes a plurality of heat dissipation fins 201 and a connecting plate 202 connected to each other. The heat dissipation fins 201 are provided in plurality, and the plurality of heat dissipation fins 201 are arranged in parallel. A rectangular notch 204 is arranged along the arrangement direction of the heat dissipation fins 201. The connecting plate 202 is located at one side of the rectangular notch 204. The VC plate 400 is welded on the connecting plate 202. The connecting plate 202, the other side of the rectangular notch 204 and the PCBA plate 100 form a containing groove 101.

[0041] The heat dissipation module 200 includes a plurality of heat dissipation fins 201 and a connecting plate 202 connected to each other. A rectangular notch 204 is arranged along the arrangement direction of the heat dissipation fins 201. The connecting plate 202 is located at one side of the rectangular notch 204. In this way, the containing groove 101 is formed between the heat dissipation module 200 and the PCBA plate 100, and the containing groove 101 is used to contain the socket 300. The socket 300 can contain optical components, thereby dissipating heat from the optical components in the socket 300.

[0042] Wherein, a rectangular notch 204 is arranged along the arrangement direction of the heat dissipation fins 201. The connecting plate 202 is located at one side of the rectangular notch 204. The plurality of parallel arranged heat dissipation fins 201 can increase the surface area of the heat dissipation module 200 in contact with the external environment, thereby enhancing the heat exchange efficiency and improving the heat dissipation effect of the heat dissipation module 200. On the other hand, the VC plate 400 is welded on the connecting plate 202. The VC plate 400 can be arranged in the socket 300, thereby further enhancing the heat dissipation effect.

[0043] Specifically, the connecting plate 202, the other side of the rectangular notch 204 and the PCBA plate 100 jointly form the containing groove 101. The containing groove 101 is used to contain the socket 300 and the optical components in the socket 300, thereby dissipating heat from the optical components and ensuring normal use of the optical components.

[0044] Reference Figure 1 And Figure 2The first connecting hole 2023 is arranged on the connecting plate 202, the second connecting hole 102 corresponding to the first connecting hole 2023 is arranged on the PCBA plate 100, the heat dissipation frame 1000 further comprises an elastic connecting piece 600, and the first connecting hole 2023 is connected with the second connecting hole 102 through the elastic connecting piece 600.

[0045] The first connecting hole 2023 is arranged on the connecting plate 202, the second connecting hole 102 is arranged on the PCBA plate 100, and the first connecting hole 2023 and the second connecting hole 102 are connected through the elastic connecting piece 600. The elastic connecting piece 600 is arranged on the heat dissipation module 200, and the elastic connecting piece 600 can lift and move the heat dissipation module 200 by the elastic force of the elastic connecting piece 600 when the optical module is placed into the socket 300. The elastic connecting piece 600 can keep the connecting plate 202 and the PCBA plate 100 in stable connection, and also keep a certain degree of freedom between the connecting plate 202 and the PCBA plate 100 when the connecting plate 202 and the PCBA plate 100 are affected by external force, so as to buffer and disperse the force, reduce the direct pressure on the connecting hole, reduce the stress concentration degree of the structure, and prolong the service life of the heat dissipation frame 1000.

[0046] Specifically, the design of the elastic connecting piece 600 makes the connecting component more easily disassembled and replaced. When it is necessary to maintain or replace the components in the heat dissipation frame 1000, the elastic connecting piece 600 can be relatively easily disengaged, necessary operations are performed, and then the elastic connecting piece 600 is reconnected, so that the convenience of maintenance is improved.

[0047] Reference Figure 2 The elastic connecting piece 600 comprises a screw 601, an elastic piece 603 and a stud 602, the stud 602 is arranged between the PCBA plate 100 and the connecting plate 202, one end of the stud 602 is welded and connected with the second connecting hole 102, the other end abuts against the connecting plate 202, the screw 601 is connected with the stud 602 through the first connecting hole 2023, the elastic piece 603 is arranged between the screw 601 and the connecting plate 202, and the first connecting hole 2023 can slide relative to the screw 601.

[0048] The elastic connecting piece 600 comprises a screw 601, an elastic piece 603 and a stud 602, the stud 602 is arranged between the PCBA plate 100 and the connecting plate 202, the elastic piece 603 is sleeved on the screw 601 and located between the nut of the screw 601 and the connecting plate 202, one end of the stud 602 is welded with the second connecting hole 102 on the PCBA plate 100, and the other end abuts against the connecting plate 202, so that the stud 602 can cooperate with the heat dissipation fin 201 on the heat dissipation module 200, on the one hand, the heat dissipation module 200 is installed to a reasonable height, on the other hand, the PCBA plate 100 and the heat dissipation module 200 are tightly connected, the stability and firmness of the heat dissipation frame 1000 are maintained. At the same time, when the optical component is inserted into the socket 300, the optical component can support the socket 300, so that the size of the socket 300 changes, so that the heat dissipation fin 201 can be lifted in the vertical direction. When the optical component is inserted into the socket 300 to lift the heat dissipation module 200, the connecting plate 202 can slide the screw 601 within a certain range through the first connecting hole 2023, so as to ensure the normal installation of the optical component, and the connecting plate 202 can also be stably pressed on the PCBA plate 100 due to the elastic force of the elastic piece 603 after the optical component is installed.

[0049] The elastic piece 603 can provide a certain elastic buffering effect. When external force acts on the connecting part, the elastic piece 603 can absorb and alleviate part of the force, reduce the direct pressure on the connecting hole and the connecting part, and thus reduce the stress concentration degree of the structure.

[0050] Reference Figure 2 The socket 300 is provided with an avoiding groove 302 on the side facing the heat dissipation module 200, and the VC plate 400 passes through the avoiding groove 302 and is attached to the optical component in the socket 300.

[0051] In the foregoing embodiment, the VC plate 400 is welded on the connecting plate 202, and the socket 300 is arranged in the accommodating groove 101 composed of the connecting plate 202 and the PCBA plate 100, so that the socket 300 is correspondingly arranged with the VC plate 400. The avoiding groove 302 is arranged on the socket 300, so that the VC plate 400 arranged on the heat dissipation module 200 passes through the avoiding groove 302 and is attached to the optical component in the socket 300, so that the VC plate 400 can directly contact the optical component in the socket 300, and heat conduction of the optical component and uniform heat transfer to the heat dissipation module 200 are facilitated, and the optical component is cooled.

[0052] The avoiding groove 302 facilitates the installation process between the VC plate 400 and the socket 300. The VC plate 400 can be more easily inserted into the socket 300, reducing the difficulties and obstacles that may occur during installation, and improving the installation efficiency.

[0053] Reference Figure 1 When the two opposite sides of the PCBA board 100 are respectively provided with the heat dissipation modules 200, the two heat dissipation modules 200 are arranged in a staggered manner, and the sockets 300 on the opposite sides of the PCBA board 100 are arranged in a staggered manner.

[0054] By arranging the heat dissipation modules 200 on the opposite sides of the PCBA board 100, the sockets 300 can be arranged on the opposite sides of the PCBA board 100, and the optical components can be arranged in the sockets 300, so that the two optical components can be simultaneously subjected to heat dissipation treatment. By arranging the sockets 300 on the opposite sides of the PCBA board 100 in a staggered manner, the excessive concentration of heat can be avoided, and the simultaneous heat dissipation of the two optical components can be achieved. The above arrangement increases the heat dissipation area of the heat dissipation frame and improves the heat dissipation effect.

[0055] Specifically, the staggered arrangement of the two heat dissipation modules 200 can help to balance the heat, and the optical components can be arranged at different positions on the opposite sides of the PCBA board 100, so as to avoid the overlap of the heat dissipation areas on the opposite sides of the PCBA board 100 and to avoid the local concentration of heat on the PCBA board 100, thereby keeping the heat distribution in the heat dissipation frame 1000 balanced.

[0056] It is easy to understand that by increasing the number of heat dissipation modules 200, the applicability of the heat dissipation frame 1000 can be improved, so that the heat dissipation frame 1000 can dissipate heat for multiple optical components, thereby improving the application range of the heat dissipation frame 1000.

[0057] The utility model embodiment further provides an optical module, the optical module includes optical component and the heat dissipation frame 1000 in preceding embodiment, and the optical component is arranged in the socket 300 of the heat dissipation frame 1000.

[0058] The optical module includes the same structure and advantages as the heat dissipation frame 1000 in the preceding embodiment. The structure and advantages of the heat dissipation frame 1000 have been described in detail in the preceding embodiment, and will not be repeated here.

[0059] It should be understood that the above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; all these modifications and substitutions should belong to the protection scope of the claims of the utility model.

Claims

1. A heat sink, characterized by, The application relates to a heat dissipation frame. The heat dissipation frame comprises a PCBA board, a heat dissipation module arranged on at least one side of the PCBA board, a receiving groove formed between the heat dissipation module and the PCBA board, a socket arranged in the receiving groove, the socket being in pressure contact with the PCBA board on the side away from the heat dissipation module, and a VC board arranged in the receiving groove and in contact with optical components in the heat dissipation module and the socket. The heat dissipation module is provided with a mounting groove, the heat dissipation frame further comprises a spring piece arranged in the mounting groove, the spring piece is provided with a limiting groove, the socket is provided with a limiting buckle corresponding to the limiting groove, and the limiting groove can be buckled with the limiting buckle. The opposite sides of the socket are respectively provided with limiting buckles, the spring piece comprises a connecting section and buckling sections arranged on the opposite sides of the connecting section, the limiting groove is arranged on the buckling section, the connecting section is arranged in the mounting groove, the buckling section and the connecting section have a preset angle, the mounting groove is provided with a through groove, one of the buckling sections passes through the through groove and is buckled with one of the limiting buckles, and the other buckling section is buckled with the other limiting buckle. The opposite ends of the connecting section are further provided with elastic sections, one end of the elastic section is connected with the buckling section, and the other end of the elastic section is connected with the connecting section.

2. The heat sink of claim 1, wherein, The heat dissipation module comprises a connecting plate and a plurality of heat dissipation fins connected with each other, the plurality of heat dissipation fins are arranged in parallel, a rectangular notch is formed along the arrangement direction of the heat dissipation fins, the connecting plate is located on one side of the rectangular notch, the VC board is welded on the connecting plate, and the connecting plate, the other side of the rectangular notch and the PCBA board form the receiving groove.

3. The heat sink of claim 2, wherein, The connecting surface is provided with a first connecting hole, the PCBA board is provided with a second connecting hole corresponding to the first connecting hole, and the heat dissipation frame further comprises an elastic connecting piece, the first connecting hole is connected with the second connecting hole through the elastic connecting piece.

4. The heat sink of claim 3, wherein, The elastic connecting piece comprises a screw, an elastic piece and a stud, the stud is arranged between the PCBA board and the connecting plate, one end of the stud is welded with the second connecting hole, the other end of the stud abuts against the connecting plate, the screw passes through the first connecting hole and is connected with the stud, the elastic piece is arranged between the screw and the connecting plate, and the first connecting hole can slide relative to the screw.

5. The heat sink of claim 1, wherein, The side of the socket facing the heat dissipation module is provided with a avoiding groove, and the VC board passes through the avoiding groove and is in contact with the optical components in the socket.

6. The heat sink of claim 5, wherein, The opposite sides of the PCBA board are respectively provided with the heat dissipation modules, and the sockets on the opposite sides of the PCBA board are staggered.

7. The heat sink of claim 6, wherein, The application further relates to an optical component and the heat dissipation frame according to any one of claims 1-9, and the optical component is arranged in the socket of the heat dissipation frame.

8. The heat sink of claim 1, wherein, ​ 9. The heat sink of any one of claims 1-8, wherein, ​ 10. An optical module characterized by comprising: ​

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