Display panel and display device

Abstract

The utility model discloses a display panel and a display device.The display panel comprises an array substrate and a color film substrate which are arranged in a box-to-box mode, the display panel further comprises a temperature sensor, and the temperature sensor is arranged on the array substrate and / or the color film substrate and used for detecting the temperature of the array substrate and / or the color film substrate; wherein the temperature sensor comprises a copper metal wire and a molybdenum metal wire, and the copper metal wire and the molybdenum metal wire are arranged in a bending manner. Through the design, the problem of smear under a low-temperature condition can be avoided.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] With the continuous development of display technology, the mainstream displays on the market are now liquid crystal displays (LCDs) and OLED displays. They have many advantages such as thinness, energy saving, and no radiation, and have been widely used. Examples include televisions, mobile phones, personal digital assistants (PDAs), digital cameras, computer screens, and laptop screens, dominating the flat panel display field. The optical characteristics of LCDs largely depend on the temperature of the liquid crystal panel. Because the rotational viscosity of liquid crystals increases at lower temperatures, this leads to slower response times and motion blur in LCDs. Therefore, temperature sensors are needed to detect changes in the LCD panel temperature caused by external environmental conditions and internal backlighting, thereby adjusting the display state to achieve a good display effect.

[0003] Current temperature sensors generally include a metal wire component. They utilize the inherent property of metals—that the higher the temperature, the more intense the collisions between electrons and atoms, resulting in increased resistance—by connecting the metal wire in series with an external fixed resistor. This allows them to detect temperature changes based on voltage division. However, current temperature sensors exhibit ghosting issues at low temperatures, which can negatively impact the display quality of LCD panels. Utility Model Content

[0004] The purpose of this application is to provide a display panel and display device that avoid the problem of ghosting under low temperature conditions.

[0005] This application discloses a display panel, which includes an array substrate and a color filter substrate disposed opposite each other. The display panel also includes a temperature sensor disposed on the array substrate and / or the color filter substrate for detecting the temperature of the array substrate and / or the color filter substrate. The temperature sensor includes copper metal wires and molybdenum metal wires, and the copper metal wires and molybdenum metal wires are bent.

[0006] Optionally, the copper metal wire and the molybdenum metal wire are stacked, and the copper metal wire is disposed on the side of the molybdenum metal wire away from the substrate in the substrate.

[0007] Optionally, the thickness of the copper metal wire is The thickness of the molybdenum metal wire is

[0008] Optionally, the temperature sensor includes multiple U-shaped traces connected in series, with the openings of adjacent U-shaped traces arranged in opposite directions; wherein the ratio of the length to the width of the temperature sensor is 5-8.

[0009] Optionally, in the U-shaped trace section, the cross-sectional width of the copper metal wire and the cross-sectional width of the molybdenum metal wire are both between 7-10 μm.

[0010] Optionally, in the U-shaped wiring section, the spacing between the two opposing sidewalls is between 13-20 μm.

[0011] Optionally, the copper wire has a square cross-section, the molybdenum wire has an L-shaped cross-section, and the molybdenum wire is attached to the top and one side wall of the copper wire.

[0012] Optionally, the copper metal wire and the molybdenum metal wire are arranged in the same layer, and one end of the copper metal wire is connected to one end of the molybdenum metal wire.

[0013] Optionally, the temperature sensor is disposed on the array substrate, and the temperature sensor and the gate in the array substrate are formed in the same process.

[0014] This application also discloses a display device, which includes a driving circuit, a compensation module, and a display panel as described above. A temperature sensor in the display panel is connected to the compensation module, and the compensation module obtains a compensation value based on the detection result of the temperature sensor. The driving circuit is connected to both the compensation module and the display panel, and adjusts the display panel according to the compensation value.

[0015] The beneficial effects of this application embodiment are as follows: This application embodiment uses copper metal wires and molybdenum metal wires to jointly fabricate the temperature sensor in the display panel. The stability of the copper and molybdenum metals under low-temperature conditions is utilized for temperature detection, avoiding the ghosting problem of the temperature sensor in low-temperature environments. Moreover, by designing the copper and molybdenum metals as bent traces, the area of ​​the temperature sensor can be reduced, avoiding affecting the narrow bezel effect of the display panel. In addition, since the copper and molybdenum metal wires also generate heat when energized, temperature compensation of the substrate can be performed under low-temperature and high-temperature environmental conditions, and image distortion caused by insufficient voltage can be prevented during high-temperature testing. Attached Figure Description

[0016] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:

[0017] Figure 1 This is a schematic diagram of a display device provided in an embodiment of this application;

[0018] Figure 2 This is a schematic diagram of a temperature sensor combined with a fixed resistor provided in an embodiment of this application;

[0019] Figure 3 This is a planar schematic diagram of a temperature sensor provided in an embodiment of this application;

[0020] Figure 4 This is a graph showing the relationship between the linewidth of a U-shaped trace and the yield of a temperature sensor, provided in an embodiment of this application.

[0021] Figure 5 This is a graph showing the relationship between the line spacing of a U-shaped trace and the yield of a temperature sensor, provided in an embodiment of this application.

[0022] Figure 6 This is a cross-sectional schematic diagram of a U-shaped wiring section provided in an embodiment of this application.

[0023] Among them, 10 is the display device; 100 is the display panel; 110 is the temperature sensor; 111 is the copper wire; 112 is the molybdenum wire; 113 is the U-shaped wiring section; 200 is the driving circuit; and 300 is the compensation module. Detailed Implementation

[0024] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0025] Furthermore, unless otherwise explicitly specified and limited, "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] As shown in Figure 1, this application provides a display device 10, which includes a driving circuit 200, a compensation module 300, and a display panel 100. The display panel 100 is a liquid crystal panel, including an array substrate and a color filter substrate disposed opposite each other. Temperature sensors 110 are provided on the array substrate and / or the color filter substrate to detect the temperature on the array substrate and / or the color filter substrate. The temperature sensors 110 can be located at the corners of the display panel 100 or at the edge of the frame of the display panel 100. As a specific example, temperature sensors 110 are provided on both the array substrate and the color filter substrate, with one temperature sensor 110 at each of the four corners of the array substrate and the four corners of the color filter substrate. These temperature sensors 110 accurately measure the temperature on the display panel 100.

[0027] In addition, the temperature sensor 110 is connected to the compensation module 300, and the compensation module 300 obtains a compensation value based on the detection result of the temperature sensor 110. The driving circuit 200 is connected to the compensation module 300 and the display panel 100 respectively, and adjusts the display panel 100 according to the compensation value.

[0028] As shown in Table 1, the rotational viscosity and response time of liquid crystals change with temperature. The lower the temperature, the greater the change in rotational viscosity and response time. When the temperature reaches -20 degrees Celsius, the rotational viscosity and response time of the liquid crystal decrease exponentially before leveling off. This demonstrates that temperature has a significant impact on liquid crystals, and accurate temperature detection is crucial for ensuring good display quality.

[0029]

[0030]

[0031] Table 1: Variation of liquid crystal rotation viscosity and response time at different temperatures

[0032] This application embodiment uses a metal material to fabricate the temperature sensor 110, utilizing the characteristic that the resistance of the metal wire increases with temperature, and the voltage division of an external fixed resistor to achieve temperature detection. However, experiments have shown that most metal materials are prone to instability at low temperatures, resulting in inaccurate temperature detection.

[0033] like Figure 2As shown in Tables 2 and 3, according to the formula Vout=(Rc / Rs+Rc)Vs (where Rc is a fixed resistance of 100Ω; Vs equals 5V; and Vout is the voltage of the temperature sensor), between -20°C and 80°C, the voltage fluctuation after energizing molybdenum is the smallest, followed by the combination of molybdenum and copper, while copper exhibits the largest voltage fluctuation. However, as the energizing time increases, the voltage of different metals fluctuates, especially at low temperatures. Table 3 shows that the voltage fluctuation is smallest when using a combination of molybdenum and copper, followed by copper, and finally molybdenum.

[0034] It can be seen that when the number of U-shaped traces 113 in the temperature sensor 110 is small, the combination scheme can maintain good voltage stability even under low temperature conditions and long-term power supply.

[0035] project -20℃ -10℃ 0℃ 10℃ 25℃ 40℃ 60℃ 80℃ Maximum fluctuation Mo 3.39 3.39 3.39 3.40 3.40 3.41 3.42 3.44 0.05 Cu 1.97 2.01 2.02 2.09 2.19 2.30 2.40 2.45 0.48 Mo / Cu 2.11 2.13 2.14 2.18 2.21 2.28 2.37 2.50 0.40

[0036] Table 2: Initial voltage of metals at different temperatures

[0037] project 0 100h 200h 300h 400h 500h Diff. Mo 3.39 3.34 3.35 4 4.5 5 1.6 Cu 1.97 1.98 1.97 2 2.5 3 1.03 Mo / Cu 2.11 2.12 2.13 2.14 2.15 2.16 0.05

[0038] Table 3: Voltage of metals at -20°C for different durations of current application

[0039] Based on this, the embodiments of this application use copper metal wire 111 and molybdenum metal wire 112 to jointly fabricate the temperature sensor 110 in the display panel, so that the temperature sensor 110 can maintain good stability even when the display panel works for a long time under low temperature conditions, and there will be no ghosting problem caused by voltage fluctuations on the temperature sensor 110.

[0040] Furthermore, in this embodiment, the copper and molybdenum metal traces are designed as bent lines, which helps to reduce the area of ​​the temperature sensor 110 and avoids affecting the narrow bezel effect of the display panel. In addition, since the copper metal lines 111 and molybdenum metal lines 112 generate heat when energized, they can also provide temperature compensation for the substrate under low and high temperature conditions, and prevent image distortion caused by insufficient voltage during high temperature testing.

[0041] like Figure 3 As shown, the temperature sensor 110 in this embodiment adopts an arc-shaped design. Specifically, the temperature sensor 110 includes multiple U-shaped traces 113 connected in series, and the openings of adjacent U-shaped traces 113 are arranged in opposite directions. Through this design, the temperature sensor 110 can adopt a relatively long trace design while ensuring that the temperature sensor 110 does not occupy a large area.

[0042] In this embodiment, the temperature sensor 110 has a square cross-section. As shown in Table 4, the inventors used three control group designs. In the first group, the temperature sensor 110 has a square cross-section. As the cross-sectional size of the temperature sensor 110 increases, the maximum current increases accordingly; as the side length of the cross-section of the temperature sensor 110 increases by 100µm, the maximum current increases by 0.005A. In the second group, the temperature sensor 110 has a rectangular cross-section. As the cross-sectional size of the temperature sensor 110 increases, the maximum current increases accordingly; however, for every 50µm increase in the short side of the rectangle, the increase in the maximum current of the temperature sensor 110 gradually decreases. In the third group, the temperature sensor 110 has a circular cross-section. As the cross-sectional size of the temperature sensor 110 increases, the maximum current increases accordingly; however, for every 100µm increase in the diameter of the circle, the maximum current of the temperature sensor 110 increases uniformly by 0.005A. It can be seen that when the cross-section of the temperature sensor 110 is designed with circular and square dimensions, the uniformity of the maximum current on the temperature sensor 110 can be guaranteed even when the size is adjusted. In addition, since the square shape has a large contact area with the substrate in the substrate and has good stability, the cross-section of the temperature sensor 110 is designed as a square.

[0043]

[0044]

[0045] Table 4: Voltage and current after energization when the cross-section of the metal wire has different shapes and sizes.

[0046] In this embodiment, the length-to-width ratio of the temperature sensor 110 is 5-8, and the number of U-shaped traces 113 is at least 10. As shown in Table 5, when the number of U-shaped traces 113 in the temperature sensor 110 is small, the maximum current of the temperature sensor 110 after being powered on increases with the increase of the line width in the U-shaped traces 113, but the voltage change range is small. When the number of U-shaped traces 113 in the temperature sensor 110 is large, the voltage change range reaches 4V, and the maximum current is 0.05A. If the current fluctuates slightly, the voltage will also change significantly. It can be seen that when the number of U-shaped traces 113 in the temperature sensor 110 is large, the sensitivity of the temperature sensor 110 is higher.

[0047] Furthermore, in order to avoid interference from the coupling between metal lines in the U-shaped trace section 113, the ratio of the line spacing to the line width in the U-shaped trace section 113 is made to be greater than 1.5.

[0048]

[0049]

[0050] Table 5: Voltage and current after energization when using different quantities and sizes of U-shaped wiring sections.

[0051] In this embodiment of the application, the copper metal line 111 and the molybdenum metal line 112 are stacked, and the copper metal line 111 is disposed on the side of the molybdenum metal line 112 away from the substrate in the substrate, that is, the molybdenum metal line 112 is disposed below the copper metal line 111.

[0052] Because copper has better electrical conductivity than molybdenum, meaning pure copper has higher metal sensitivity than molybdenum, copper is a transition metal with poor chemical reactivity, making it difficult to bond with ordinary glass substrates and insulating substrates. This results in poor bonding strength and easy detachment during production, leading to decreased manufacturing efficiency. However, by using a combination structure of copper metal wire 111 and molybdenum metal wire 112, the adsorption force between the temperature sensor 110 and the glass substrate or insulating substrate can be enhanced, preventing the temperature sensor 110 from detaching during production. Furthermore, since the molybdenum metal wire 112 is located below the copper metal wire 111, it also prevents copper ions from diffusing into the underlying glass substrate or insulating substrate.

[0053] In this embodiment of the application, the thickness of the copper metal wire 111 is The thickness of the molybdenum metal wire 112 is

[0054] The inventors' experiments revealed that the greater the thickness of the temperature sensor 110, the greater the maximum current. When the thickness of the molybdenum metal wire 112 is fixed, while the thickness of the copper metal wire 111 increases, the current increases linearly at the same voltage. When the thickness of the molybdenum metal wire 112 is... The thickness of copper wire 111 is Temperature sensor 110 has a maximum current of 0.045A when connected to a 4V voltage; when the thickness of molybdenum wire 112 is... The thickness of copper wire 111 is Temperature sensor 110 has a maximum current of 0.05A when connected to a 4V voltage; when the thickness of molybdenum wire 112 is... The thickness of copper wire 111 is Temperature sensor 110 has a maximum current of 0.06A when connected to a 4V voltage. It can be seen that when the thickness of the copper wire 111 increases from... Increase to When the temperature sensor 110 increases by 0.005A, the maximum current of the copper wire 111 increases from [value missing]. Increase to When the thickness of the copper wire 111 increases, the maximum current of the temperature sensor 110 increases by 0.01A; that is, the greater the thickness of the copper wire 111, the higher the sensitivity of the temperature sensor 110.

[0055] Because the copper wire 111 has higher sensitivity, it is designed with a larger thickness to ensure the sensitivity of the temperature sensor; while to ensure the bonding effect between the temperature sensor and the substrate, and to mitigate the impact of the molybdenum wire 112 on the sensitivity, the molybdenum wire 112 is designed with a smaller thickness. Therefore, the thickness of the copper wire 111 is designed as follows: The thickness of the molybdenum metal wire 112 is designed as follows: At the same time, when the temperature sensor 110 is placed on the array substrate, the temperature sensor 110 and the gate in the array substrate are formed in the same process. At this time, the thickness design of the gate in the array substrate is convenient for the production and processing of the array substrate.

[0056] In other embodiments, the molybdenum metal line 112 can also be disposed above the copper metal line 111, so that the copper metal line 111 is in direct contact with the glass substrate and the copper metal line 111 directly senses the temperature on the glass substrate, making the temperature sensor 110 more sensitive and avoiding the blockage of temperature by the molybdenum metal line 112.

[0057] In this embodiment of the application, when the temperature sensor 110 is designed with multiple U-shaped wiring sections 113 connected in series, the cross-sectional width of the copper metal wire 111 and the cross-sectional width of the molybdenum metal wire 112 are both between 7-10 μm.

[0058] like Figure 4 As shown, the larger the linewidth of the U-shaped trace 113, the higher the fabrication yield of the temperature sensor 110. When the linewidth of the U-shaped trace 113 is greater than 7µm, the fabrication yield of the temperature sensor 110 reaches 99%, and then basically stabilizes. This is because the shape of the U-shaped trace 113 is etched. The smaller the linewidth in the U-shaped trace 113, the more likely the trace etching will break, affecting the fabrication yield of the temperature sensor 110.

[0059] In the embodiments of this application, when the temperature sensor 110 is designed with multiple U-shaped wiring portions 113 connected in series, the distance (i.e., line spacing) between two opposite sidewalls in the U-shaped wiring portion 113 is between 13-20 μm.

[0060] like Figure 5As shown, the larger the line spacing of the U-shaped trace portion 113, the higher the manufacturing yield of the temperature sensor 110. When the line spacing of the U-shaped trace portion 113 is greater than 13µm, the manufacturing yield of the temperature sensor 110 reaches 99%, and then basically stabilizes. This is because when manufacturing the temperature sensor 110, since the temperature sensor 110 adopts a metal trace design and is located at the edge of the panel, a layer of metal needs to be etched into metal traces. Due to the small width of the metal traces and the use of the U-shaped trace portion 113 design, more etching solution is applied to the periphery during the etching of the metal traces. If the line spacing of the U-shaped trace portion 113 is too small, only a small amount of etching solution will act on the opening area of ​​the U-shaped trace portion 113, resulting in incomplete etching of the metal traces. If the line spacing of the U-shaped trace portion 113 increases, the opening size of the U-shaped trace portion 113 will increase, and the etching solution in the periphery will converge into the interior of the U-shaped trace portion 113, thereby etching a uniform metal line pattern and ensuring the manufacturing yield of the temperature sensor 110.

[0061] like Figure 6 As shown, in another embodiment of this application, the temperature sensor 110 further employs a design where a molybdenum wire 112 wraps around a copper wire 111. Specifically, the copper wire 111 has a square cross-section, the molybdenum wire 112 has an L-shaped cross-section, and the molybdenum wire 112 is attached to the top and one side wall of the copper wire 111.

[0062] Through this design, firstly, both the copper metal line 111 and the molybdenum metal line 112 are in direct contact with the glass substrate or insulating layer. Compared to the scheme where only the copper metal line 111 is in direct contact with the glass substrate or insulating layer, this embodiment of the application can further increase the adhesion between the temperature sensor 110 and the glass substrate or insulating layer by increasing the direct contact between the copper metal line 111 and the insulating layer. Moreover, since the heat dissipation and thermal conductivity of copper are better than those of molybdenum, the above design can also ensure that the copper metal line 111 directly receives the heat from the substrate, and utilize the temperature sensitivity of copper to achieve high sensitivity of the temperature sensor 110. In addition, the molybdenum metal line 112 also covers the top of the copper metal line 111, preventing the heat of the copper metal line 111 from being directly transferred to the liquid crystal layer and affecting the deflection effect of the liquid crystal.

[0063] Of course, it is also possible to go further and simultaneously cover the top and both sides of the copper metal wire 111 with the molybdenum metal wire 112.

[0064] In other embodiments, the copper wire 111 and the molybdenum wire 112 may not be stacked vertically. For example, the copper wire 111 and the molybdenum wire 112 may be arranged in the same layer, with one end of the copper wire 111 connected to one end of the molybdenum wire 112. Alternatively, the copper wire 111 and the molybdenum wire 112 may be designed in the same layer and attached side by side.

[0065] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A display panel, comprising an array substrate and a color filter substrate which are arranged in a cell, characterized in that, The display panel further comprises a temperature sensor disposed on the array substrate and / or the color filter substrate for detecting the temperature of the array substrate and / or the color filter substrate. The temperature sensor comprises a copper metal line and a molybdenum metal line, and the copper metal line and the molybdenum metal line are disposed in a bent manner.

2. The display panel of claim 1, wherein, The copper metal line and the molybdenum metal line are disposed in a stacked manner, and the copper metal line is disposed on the side of the molybdenum metal line away from the substrate in the substrate.

3. The display panel of claim 2, wherein, The thickness of the copper metal line is The thickness of the molybdenum metal line is 4. The display panel of claim 1 or 2, wherein, The temperature sensor comprises a plurality of U-shaped trace portions connected in series, and the openings of adjacent U-shaped trace portions are disposed in a reverse manner. The ratio of the length to the width of the temperature sensor is 5-8.

5. The display panel of claim 4, wherein, In the U-shaped trace portion, the cross-sectional width of the copper metal line and the cross-sectional width of the molybdenum metal line are both between 7-10um.

6. The display panel of claim 4, wherein, In the U-shaped trace portion, the spacing between two opposite side walls is between 13-20um.

7. The display panel of claim 1, wherein, The cross section of the copper metal line is square, the cross section of the molybdenum metal line is L-shaped, and the molybdenum metal line is attached to the top and one side wall of the copper metal line.

8. The display panel of claim 1, wherein, The copper metal line and the molybdenum metal line are disposed in the same layer, and one end of the copper metal line is connected to one end of the molybdenum metal line.

9. The display panel of claim 1, wherein, The temperature sensor is disposed on the array substrate, and the temperature sensor is formed in the same process as the gate in the array substrate.

10. A display device, characterized by comprising: The display panel further comprises a temperature sensor disposed on the array substrate and / or the color filter substrate for detecting the temperature of the array substrate and / or the color filter substrate. The temperature sensor comprises a copper metal line and a molybdenum metal line, and the copper metal line and the molybdenum metal line are disposed in a bent manner. The copper metal line and the molybdenum metal line are disposed in a stacked manner, and the copper metal line is disposed on the side of the molybdenum metal line away from the substrate in the substrate. The temperature sensor comprises a plurality of U-shaped trace portions connected in series, and the openings of adjacent U-shaped trace portions are disposed in a reverse manner. The ratio of the length to the width of the temperature sensor is 5-8. In the U-shaped trace portion, the cross-sectional width of the copper metal line and the cross-sectional width of the molybdenum metal line are both between 7-10um. In the U-shaped trace portion, the spacing between two opposite side walls is between 13-20um. The cross section of the copper metal line is square, the cross section of the molybdenum metal line is L-shaped, and the molybdenum metal line is attached to the top and one side wall of the copper metal line. The copper metal line and the molybdenum metal line are disposed in the same layer, and one end of the copper metal line is connected to one end of the molybdenum metal line. The temperature sensor is disposed on the array substrate, and the temperature sensor is formed in the same process as the gate in the array substrate. The display panel further comprises a temperature sensor disposed on the array substrate and / or the color filter substrate for detecting the temperature of the array substrate and / or the color filter substrate.

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