Overtemperature protection temperature control equipment for semiconductor processing

Abstract

The utility model discloses an overtemperature protection semiconductor processing temperature control device comprising a bottom plate, the top of the bottom plate is fixedly provided with a temperature control box, one side of the temperature control box is fixedly provided with a temperature controller I, the inner wall of the top of the temperature control box is provided with a heating structure, the front side of the temperature control box is provided with a box door, and the box door is provided with a temperature sensor. A power-off structure is fixedly arranged on the top of the temperature control box, and a plurality of supporting rods are fixedly arranged in the temperature control box. By arranging the push rod motor, the central control module, the rotating shaft, the toothed plate, the gear and the conductive block I, if the heating system is damaged, continuous heating occurs and the real-time temperature exceeds the preset temperature, the central control module can start the push rod motor to enable the output end of the push rod motor to retract, the push rod motor drives the toothed plate to move downwards, and the toothed plate drives the gear; the gear drives the rotating shaft, the rotating shaft drives the first transverse plate, the first transverse plate drives the first conductive block to be separated from the second conductive block, the heating structure is powered off, and the purpose of over-temperature protection can be achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a temperature control device for semiconductor processing with over-temperature protection. Background Technology

[0002] In semiconductor manufacturing, extremely high temperature control is required for the processing environment. Precise and stable temperature is one of the key factors in ensuring semiconductor chip performance and yield. For example, in critical processes such as photolithography, etching, and doping, excessive temperature deviations can lead to changes in the physical properties of semiconductor materials, decreased photolithography accuracy, and uneven impurity diffusion, seriously affecting product quality.

[0003] Since existing temperature control equipment does not have over-temperature protection, once the temperature control system malfunctions, such as uncontrolled heating of the heating element, blockage of the heat dissipation device, or failure of the temperature control sensor, the temperature in the processing area can easily rise sharply. This can not only damage the semiconductor products being processed, causing high economic losses, but may even lead to safety accidents such as equipment fires. Therefore, an over-temperature protection temperature control device for semiconductor processing is proposed. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a temperature control device for semiconductor processing with over-temperature protection.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a temperature control device for semiconductor processing with over-temperature protection, comprising a base plate, a temperature control box fixedly mounted on the top of the base plate, a temperature controller fixedly mounted on one side of the temperature control box, a heating structure on the inner wall of the top of the temperature control box, a door on the front of the temperature control box, and a power-off structure fixedly mounted on the top of the temperature control box.

[0006] As a further description of the above technical solution:

[0007] The temperature control box is equipped with multiple support rods, and multiple placement plates are fixed on the multiple support rods. Multiple support columns are fixed on the top of the placement plates.

[0008] As a further description of the above technical solution:

[0009] The power-off structure includes an installation box for installation. A temperature sensing module is fixedly installed on the bottom inner wall of the installation box. The sensing end of the temperature sensing module extends into the temperature control box. A battery and a central control module are installed inside the installation box. A gear plate for driving is installed inside the installation box. A rotating shaft is movably installed inside the installation box. A gear is fixedly installed on the rotating shaft. A first horizontal plate is fixedly installed on the rotating shaft. A second horizontal plate is fixedly installed on one inner wall of the installation box.

[0010] As a further description of the above technical solution:

[0011] The bottom of the first horizontal plate and the top of the second horizontal plate are respectively provided with conductive block one and conductive block two.

[0012] As a further description of the above technical solution:

[0013] A push rod motor is fixedly installed at the bottom of the toothed plate. The bottom of the push rod motor is fixedly connected to the bottom inner wall of the mounting box. The toothed plate and the gear mesh and drive each other.

[0014] As a further description of the above technical solution:

[0015] The front of the installation box is equipped with an inspection door and a second temperature controller. The second temperature controller, the temperature sensing module, and the central control module are electrically connected.

[0016] As a further description of the above technical solution:

[0017] The mounting box has round holes on both the front and back inner walls. A bearing is fixedly installed in the round hole, and the inner ring of the bearing is fixedly sleeved on the rotating shaft.

[0018] This utility model has the following beneficial effects:

[0019] 1. Compared with existing technologies, this temperature control equipment for semiconductor processing with over-temperature protection, by setting up a push rod motor, a central control module, a rotating shaft, a toothed plate, gears, and a conductive block, if the heating system is damaged and continuous heating occurs, and the real-time temperature exceeds the preset temperature, the central control module will start the push rod motor to retract its output end. The push rod motor drives the toothed plate to move down, the toothed plate drives the gear, the gear drives the rotating shaft, the rotating shaft drives the horizontal plate, and the horizontal plate drives the conductive block to separate from the conductive block, thus cutting off the power to the heating structure and achieving the purpose of over-temperature protection.

[0020] 2. Compared with the prior art, this temperature control equipment for semiconductor processing with over-temperature protection, by setting up multiple supports, places the semiconductor material on top of the support pillars during processing. The setting of multiple support pillars can reduce the area of ​​the bottom of the semiconductor being blocked, thereby increasing the contact area between the hot air inside the equipment and the semiconductor and improving the heating uniformity. Attached Figure Description

[0021] Figure 1 This is a first-view perspective three-dimensional structural diagram of a temperature control device for semiconductor processing with over-temperature protection proposed in this utility model;

[0022] Figure 2 This is a second-view perspective three-dimensional structural diagram of a temperature control device for semiconductor processing with over-temperature protection proposed in this utility model;

[0023] Figure 3 This is a front cross-sectional view of the power interruption structure of a temperature control device for semiconductor processing with over-temperature protection proposed in this utility model;

[0024] Figure 4 This is a three-dimensional structural diagram of the placement plate and support column in a temperature control device for semiconductor processing with over-temperature protection proposed in this utility model.

[0025] Legend:

[0026] 1. Base plate; 2. Temperature control box; 3. Temperature controller one; 4. Heating structure; 5. Box door; 6. Support rod; 7. Placement plate; 8. Support column; 9. Power-off structure; 901. Mounting box; 902. Temperature sensing module; 903. Battery; 904. Central control module; 905. Push rod motor; 906. Gear plate; 907. Rotating shaft; 908. Gear; 909. Horizontal plate one; 910. Conductive block one; 911. Horizontal plate two; 912. Conductive block two; 913. Inspection door; 914. Temperature controller two. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1 to 4 The present invention provides a temperature control device for semiconductor processing with overheat protection: including a base plate 1, a temperature control box 2 fixedly mounted on the top of the base plate 1, a temperature controller 3 fixedly mounted on one side of the temperature control box 2, a heating structure 4 on the inner wall of the top of the temperature control box 2, and a door 5 on the front of the temperature control box 2.

[0029] In order to improve the heating uniformity, multiple support rods 6 are fixedly installed inside the temperature control box 2. Multiple placement plates 7 are fixedly installed on the multiple support rods 6. Multiple support columns 8 are fixedly installed on the top of the placement plates 7. The arrangement of multiple support columns 8 can reduce the area of ​​the bottom of the semiconductor being blocked, thereby increasing the contact area between the hot air inside the equipment and the semiconductor and improving the heating uniformity.

[0030] To achieve over-temperature protection, a power-off structure 9 is fixedly installed on the top of the temperature control box 2. The power-off structure 9 includes a mounting box 901 for installation. A temperature sensing module 902 is fixedly installed on the bottom inner wall of the mounting box 901, with its sensing end extending into the temperature control box 2. A battery 903 and a central control module 904 are located inside the mounting box 901. A gear plate 906 for driving is also located inside the mounting box 901. A push rod motor 905 is fixedly installed at the bottom of the gear plate 906, and its bottom is fixedly connected to the bottom inner wall of the mounting box 901. The gear plate 906 and gear 908 mesh and drive each other. A rotating shaft 907 is movably installed inside the mounting box 901. Circular holes are provided on both the front and back inner walls of the mounting box 901, and bearings are fixedly installed within these holes. The inner ring of the bearing is fixedly fitted onto the rotating shaft 907. A gear 908 is fixedly installed on the rotating shaft 907, and a horizontal plate 909 is fixedly installed on the rotating shaft 907. One side of the mounting box 901... A horizontal plate 911 is fixedly installed on the inner wall. Conductive blocks 910 and 912 are respectively installed at the bottom of the horizontal plate 909 and the top of the horizontal plate 911. The front of the mounting box 901 is equipped with an inspection door 913 and a temperature controller 914. The temperature controller 914, the temperature sensing module 902, and the central control module 904 are electrically connected. If the heating system is damaged and continuous heating occurs, the temperature sensing module 902 will transmit the temperature inside the equipment to the central control module. 904, the central control module 904 compares the real-time temperature with the preset temperature. If the temperature exceeds the preset temperature, it will activate the push rod motor 905 to retract its output end. The push rod motor 905 drives the toothed plate 906 to move down, the toothed plate 906 drives the gear 908, the gear 908 drives the rotating shaft 907, the rotating shaft 907 drives the horizontal plate 909, the horizontal plate 909 drives the conductive block 910 and the conductive block 912 to separate, so that the heating structure 4 is de-energized, which can achieve the purpose of over-temperature protection.

[0031] Working principle: Battery 903 supplies power to push rod motor 905. Central control module 904 is electrically connected to push rod motor 905. Conductive block 2 912 is electrically connected to the positive terminal of heating structure 4. Conductive block 1 910 is electrically connected to the positive terminal of power supply. Heating temperature can be set through temperature controller 1 3, and power-off temperature can be input through temperature controller 2 914. Then, the semiconductor material to be processed is placed on top of multiple support pillars 8. The arrangement of multiple support pillars 8 can reduce the area of ​​the bottom of the semiconductor being blocked, thereby increasing the contact area between hot air and semiconductor inside the equipment and improving heating uniformity. When the heating system malfunctions and continuous heating occurs, the temperature sensing module 902 transmits the temperature inside the equipment to the central control module 904. The central control module 904 compares the real-time temperature with the preset temperature. If the temperature exceeds the preset temperature, it will activate the push rod motor 905 to retract its output end. The push rod motor 905 drives the toothed plate 906 to move down, the toothed plate 906 drives the gear 908, the gear 908 drives the rotating shaft 907, and the rotating shaft 907 drives the horizontal plate 909. The horizontal plate 909 drives the conductive block 910 and the conductive block 912 to separate, causing the heating structure 4 to lose power, thus achieving the purpose of over-temperature protection.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature-controlled apparatus for semiconductor processing with over-temperature protection, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly provided with a temperature control box (2), one side of the temperature control box (2) is fixedly provided with a temperature controller I (3), the top inner wall of the temperature control box (2) is provided with a warming structure (4), the front of the temperature control box (2) is provided with a box door (5), and the top of the temperature control box (2) is fixedly provided with a power-off structure (9).

2. A temperature-controlled apparatus for semiconductor processing with over-temperature protection according to claim 1, characterized in that: A plurality of supporting rods (6) are fixedly arranged in the temperature control box (2), a plurality of placing plates (7) are fixedly arranged on the supporting rods (6), and the top of the placing plate (7) is fixedly provided with a plurality of supporting columns (8).

3. A temperature-controlled apparatus for semiconductor processing with over-temperature protection as defined in claim 1, wherein: The power-off structure (9) comprises a mounting box (901) for mounting, a temperature sensing module (902) is fixedly arranged on the bottom inner wall of the mounting box (901), the sensing end of the temperature sensing module (902) extends into the temperature control box (2), the mounting box (901) is provided with a battery (903) and a central control module (904), the mounting box (901) is provided with a toothed plate (906) for driving, the mounting box (901) is movably provided with a rotating shaft (907), the rotating shaft (907) is fixedly provided with a gear (908), the rotating shaft (907) is fixedly provided with a horizontal plate I (909), and the inner wall of one side of the mounting box (901) is fixedly provided with a horizontal plate II (911).

4. A temperature-controlled apparatus for semiconductor processing with over-temperature protection according to claim 3, characterized in that: The bottom of the horizontal plate I (909) and the top of the horizontal plate II (911) are respectively provided with an electrically conductive block I (910) and an electrically conductive block II (912).

5. A temperature controlled apparatus for semiconductor processing with over-temperature protection as defined in claim 3, wherein: The bottom of the toothed plate (906) is fixedly provided with a push rod motor (905), the bottom of the push rod motor (905) and the bottom inner wall of the mounting box (901) are fixedly connected, and the toothed plate (906) and the gear (908) are in meshing transmission.

6. A temperature controlled apparatus for semiconductor processing with over-temperature protection as defined in claim 3, wherein: The front of the mounting box (901) is provided with an inspection door (913) and a temperature controller II (914), the temperature controller II (914), the temperature sensing module (902) and the central control module (904) are electrically connected.

7. A temperature controlled apparatus for semiconductor processing with over-temperature protection as defined in claim 3, wherein: The front inner wall and the back inner wall of the mounting box (901) are both provided with a circular hole, a bearing is fixedly arranged in the circular hole, and the inner ring of the bearing is fixedly sleeved on the rotating shaft (907).

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