LED packaging structure

Abstract

The utility model discloses an LED packaging structure, which belongs to the technical field of LED lamps and comprises a substrate, an LED chip, a reflection supporting piece, a fluorescent glue layer and a packaging glue layer, the LED chip and the reflection supporting piece are both mounted on the substrate, and the reflection supporting piece is arranged around the LED chip and is attached to the outer wall of the LED chip; the fluorescent glue layer is installed on the LED chip, and at least part of the fluorescent glue layer is arranged on the reflection supporting piece. The packaging adhesive layer is installed on the fluorescent adhesive layer, and the outer walls of the fluorescent adhesive layer and the packaging adhesive layer are attached to the inner wall of the reflection supporting piece; at least part of the reflection supporting piece is of an arc-shaped structure, the reflection supporting piece is provided with an inner arc face, and the inner arc face is connected with the packaging adhesive layer. When the LED chip generates blue light which is excited by the fluorescent glue layer, the blue light is projected to the inner cambered surface through the packaging glue layer, and the light right above the LED chip is overlapped with the light reflected by the inner cambered surface, so that the center illumination of the LED packaging structure is improved; through detection, the center illumination of the LED packaging structure can be improved by 3%-5%.

Description

Technical Field

[0001] This utility model relates to the technical field of LED lights, and in particular to an LED packaging structure. Background Technology

[0002] The typical LED packaging structure on the market includes a substrate, an LED chip, a phosphor layer, an encapsulating layer, and a reflector. The LED chip is mounted on the substrate, and the reflector is placed on both sides of the LED chip. Then, the phosphor layer and the encapsulating layer are laid on the LED chip. The existing reflector structure is simple and cannot improve the center illuminance of the LED lamp. Summary of the Invention

[0003] The purpose of this invention is to improve the problem that existing LED packaging structures cannot improve the center illuminance of LED lamps, and to provide an LED packaging structure.

[0004] The technical solutions for achieving the above objectives include the following:

[0005] LED packaging structure includes:

[0006] The package includes a substrate, an LED chip, a reflective support, a phosphor layer, and an encapsulating adhesive layer. The LED chip and the reflective support are both mounted on the substrate, and the reflective support is arranged around the LED chip and is attached to the outer wall of the LED chip.

[0007] The fluorescent adhesive layer is mounted on the LED chip, and at least partially disposed on the reflective support; the encapsulating adhesive layer is mounted on the fluorescent adhesive layer, and the outer walls of the fluorescent adhesive layer and the encapsulating adhesive layer are bonded to the inner wall of the reflective support.

[0008] The reflective support is at least partially arc-shaped, and has an inner arc surface that is in contact with the encapsulating adhesive layer.

[0009] In one embodiment, the curvature of the inner arc surface is 15 to 25 degrees.

[0010] In one embodiment, the reflective support includes a first reflector and a second reflector. The first reflector is mounted on the second reflector. The first reflector has a first reflective surface and a second reflective surface. The first reflective surface is attached to the outer wall of the fluorescent adhesive layer and the encapsulating adhesive layer. The inner arc surface is the second reflective surface. The first reflective surface intersects with the second reflective surface.

[0011] In one embodiment, the second reflector has a third reflective surface and a supporting surface, the fluorescent adhesive layer is at least partially mounted on the supporting surface, and the outer wall of the LED chip is attached to the third reflective surface.

[0012] In one embodiment, the LED packaging structure has two sets of conductive components mounted on a substrate, and the two sets of conductive components are respectively connected to the positive and negative terminals of the LED chip, with a gap between the two sets of conductive components.

[0013] In one embodiment, the conductive assembly includes a first pad, a second pad, and a conductive body. The first pad is mounted on the lower end of the substrate, the second pad is mounted on the upper end of the substrate, and the conductive body is mounted inside the substrate. The first pad is connected to the second pad through the conductive body.

[0014] In one embodiment, the reflective support fills the gap.

[0015] In one embodiment, the substrate is made of ceramic and any one or more metals selected from gold, silver, and copper.

[0016] In one embodiment, the fluorescent adhesive layer comprises a mixture of adhesive, fluorescent powder, and diluent.

[0017] In one embodiment, the reflective support is composed of a mixture of adhesive and titanium dioxide.

[0018] The technical solution provided by this utility model has the following advantages and effects:

[0019] The reflective support has an inner arc surface that is in contact with the encapsulating adhesive layer. When the LED chip generates blue light, it is excited by the phosphor layer and then projected onto the inner arc surface through the encapsulating adhesive layer. The light directly above the LED chip will overlap with the light reflected by the inner arc surface, thereby improving the center illuminance of the LED package structure. Through testing, it was found that when the upper surface of the reflective support and the upper surface of the encapsulating adhesive layer are on the same end face, the center illuminance of the LED package structure can be improved by 3%-5%. Attached Figure Description

[0020] The accompanying drawings illustrate specific examples of the technical solutions described in this utility model, and together with the detailed embodiments, form part of the specification, serving to explain the technical solutions, principles, and effects of this utility model.

[0021] Unless otherwise specified or defined, the same reference numerals in different figures represent the same or similar technical features, and different reference numerals may be used to represent the same or similar technical features.

[0022] Figure 1 This is a schematic diagram of an LED packaging structure in one embodiment of the present invention;

[0023] Figure 2 This is one embodiment of the present invention. Figure 1 Enlarged view of point A;

[0024] Explanation of reference numerals in the attached figures:

[0025] 100. LED packaging structure; 1. Substrate; 10. Connector assembly; 11. First pad; 12. Second pad; 13. Connector; 14. Gap; 2. LED chip; 3. Reflective support; 31. First reflector; 311. First reflective surface; 312. Second reflective surface; 32. Second reflector; 321. Third reflective surface; 322. Support surface; 4. Phosphor adhesive layer; 5. Encapsulating adhesive layer. Detailed Implementation

[0026] To facilitate understanding of this utility model, the specific embodiments of this utility model will be described in more detail below with reference to the accompanying drawings.

[0027] Unless otherwise specified or defined, the terms "first," "second," etc., used in this document are for distinguishing names only and do not represent a specific number or order.

[0028] Unless otherwise stated or defined, the term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0029] It should be noted that when a component is considered "fixed" to another component, it can be directly fixed to the other component or there can be an intervening component; when a component is considered "connected" to another component, it can be directly connected to the other component or there can be an intervening component; when a component is considered "mounted" on another component, it can be directly mounted on the other component or there can be an intervening component; when a component is considered "placed" on another component, it can be directly placed on the other component or there can be an intervening component.

[0030] This utility model proposes an LED packaging structure 100, such as... Figure 1 and Figure 2 As shown, the device includes a substrate 1, an LED chip 2, a reflective support 3, a phosphor layer 4, and an encapsulating adhesive layer 5. The LED chip 2 and the reflective support 3 are both mounted on the substrate 1, and the reflective support 3 is arranged around the LED chip 2 and is attached to the outer wall of the LED chip 2. The phosphor layer 4 is mounted on the LED chip 2, and at least part of the phosphor layer 4 is disposed on the reflective support 3. The encapsulating adhesive layer 5 is mounted on the phosphor layer 4, and the outer walls of the phosphor layer 4 and the encapsulating adhesive layer 5 are attached to the inner wall of the reflective support 3. The reflective support 3 is at least partially arc-shaped, and the reflective support 3 has an inner arc surface that is in contact with the encapsulating adhesive layer 5.

[0031] Specifically, the LED chip 2 is mounted on the substrate 1. The substrate 1 supports the LED chip 2 and acts as a conductor, facilitating the connection between the LED chip 2 and the power supply. A reflective support 3 surrounds the LED chip 2 and adheres to its outer wall. The reflective support 3 shields the sidewalls of the LED chip 2, preventing light from diffusing or leaking from the sidewalls. A phosphor layer 4 covers the LED chip 2, exciting the light emitted by the LED chip 2 to produce white light, and absorbing and reflecting external ultraviolet rays to protect the LED chip 2 from UV damage. The encapsulating adhesive layer 5 isolates and protects the internal components of the LED encapsulation structure 100, preventing the intrusion of harmful substances such as moisture, oxygen, and dust, thereby ensuring the stability and long-term reliability of the LED chip 2 and the phosphor layer 4.

[0032] Furthermore, the reflective support 3 has an inner arc surface, which is in contact with the encapsulating adhesive layer 5. When the LED chip 2 generates blue light, it is excited by the phosphor layer 4 and then projected onto the inner arc surface through the encapsulating adhesive layer 5. The light directly above the LED chip 2 and the light reflected by the inner arc surface are emitted upwards simultaneously. By utilizing the light reflected by the inner arc surface, the center illuminance of the LED encapsulation structure 100 can be improved. Through testing, it was found that the upper surface of the reflective support 3 and the upper surface of the encapsulating adhesive layer 5 are located on the same end face, and the center illuminance of the LED encapsulation structure 100 can be improved by 3%-5%.

[0033] Preferably, the curvature of the inner arc surface is between 15 and 25 degrees. In this embodiment, the curvature of the inner arc surface is between 16 and 20 degrees, which can further improve the center illuminance of the LED packaging structure 100 by 3%-5%.

[0034] Preferably, the reflective support 3 includes a first reflector 31 and a second reflector 32. The first reflector 31 is mounted on the second reflector 32. The first reflector 31 has a first reflective surface 311 and a second reflective surface 312. The first reflective surface 311 is attached to the outer wall of the phosphor layer 4 and the encapsulating adhesive layer 5, and the inner arc surface is the second reflective surface 312. The first reflective surface 311 and the second reflective surface 312 intersect. Specifically, the first reflective surface 311 is used to reflect the light emitted after the phosphor layer 4 is excited, as well as the light transmitted from the encapsulating adhesive layer 5, to prevent light leakage. In this embodiment, the phosphor layer 4 and the encapsulating adhesive layer 5 have the same width, and the width of the phosphor layer 4 is greater than the width of the LED chip 2. The second reflective surface 312 is used to reflect the light transmitted from the phosphor layer 4 and to reflect the light above the LED encapsulation structure 100. The light reflected by the second reflective surface 312 further improves the center illuminance of the LED encapsulation structure 100. Furthermore, when the center of the LED package structure 100 is reinforced, the yellow ring of the light source spot and the uniformity of the light source color temperature can be improved.

[0035] Preferably, the second reflector 32 has a third reflective surface 321 and a supporting surface 322. The phosphor layer 4 is at least partially mounted on the supporting surface 322, and the outer wall of the LED chip 2 is attached to the third reflective surface 321. Specifically, the supporting surface 322 is used to support at least a portion of the phosphor layer 4, while the third reflective surface 321 is used to reflect light from the sidewall of the LED chip 2, preventing light leakage from the LED chip 2 and ensuring the light output brightness of the LED chip 2.

[0036] Preferably, the LED packaging structure 100 has two sets of conductive components 10, which are mounted on the substrate 1 and are respectively connected to the positive and negative terminals of the LED chip 2. A gap 14 is provided between the two sets of conductive components 10. Specifically, the positive terminal of the LED chip 2 is connected to the positive terminal of the power supply through one set of conductive components 10, and the negative terminal of the LED chip 2 is connected to the negative terminal of the power supply through the other set of conductive components 10. Moreover, the gap 14 between the two sets of conductive components 10 prevents short circuits in the LED chip 2.

[0037] Preferably, the reflective support 3 at least partially fills the gap 14. Specifically, the reflective support 3 is made of liquid high-reflectivity white adhesive. During installation, the LED chip 2 is surrounded by baffles. Since there is a gap 14 between the two sets of conductive components 10, the liquid high-reflectivity white adhesive flows into the gap 14 and fills it when it is laid. After the liquid high-reflectivity white adhesive cures, the reflective support 3 on the substrate 1 becomes an integrated structure, further improving the overall stability of the LED packaging structure 100.

[0038] Preferably, the conductive assembly 10 includes a first pad 11, a second pad 12, and a conductive body 13. The first pad 11 is mounted on the lower end of the substrate 1, the second pad 12 is mounted on the upper end of the substrate 1, and the conductive body 13 is mounted inside the substrate 1. The first pad 11 is connected to the second pad 12 through the conductive body 13. Specifically, the positive electrode of the LED chip 2 is soldered onto the second pad 12 and is connected to the conductive body 13. The first pad 11 is soldered onto a circuit board, which has circuitry and is connected to the LED chip 2.

[0039] Preferably, the substrate 1 is made of ceramic combined with one or more metals selected from gold, silver, and copper. Specifically, ceramic is used to improve the thermal conductivity and heat dissipation efficiency of the substrate 1, and any one of the metals selected from gold, silver, and copper is used to ensure the electrical conductivity stability of the substrate 1.

[0040] Preferably, the fluorescent adhesive layer 4 is composed of a mixture of adhesive, fluorescent powder, and diluent.

[0041] Preferably, the reflective support 3 is composed of a mixture of adhesive and titanium dioxide.

[0042] When referencing drawings, new features are explained. To avoid redundant references to drawings that would make the description less concise, features already described will not be referenced again on the drawings if the description is clear.

[0043] The purpose of the above embodiments is to reproduce and derive the technical solution of this utility model by way of example, and to fully describe the technical solution, purpose and effect of this utility model. The purpose is to enable the public to have a more thorough and comprehensive understanding of the disclosed content of this utility model, and it is not intended to limit the protection scope of this utility model.

[0044] The above embodiments are not an exhaustive list based on the present invention, and there may be other embodiments not listed. Any substitutions and improvements made without departing from the concept of the present invention are within the protection scope of the present invention.

Claims

1. An LED package structure, characterized in that, The LED packaging structure comprises a substrate, an LED chip, a reflective support, a fluorescent glue layer and an encapsulation glue layer, the LED chip and the reflective support are both mounted on the substrate, and the reflective support is arranged around the LED chip and is attached to the outer wall of the LED chip. The fluorescent glue layer is mounted on the LED chip and is arranged at least partially on the reflective support, the encapsulation glue layer is mounted on the fluorescent glue layer, and the outer wall of the fluorescent glue layer and the encapsulation glue layer is attached to the inner wall of the reflective support. The reflective support is at least partially in an arc structure, and has an inner arc surface which is in contact with the encapsulation glue layer. The curvature of the inner arc surface is 15-25 degrees.

2. The LED package structure of claim 1, wherein, The reflective support comprises a first reflector and a second reflector, the first reflector is mounted on the second reflector, the first reflector has a first reflecting surface and a second reflecting surface, the first reflecting surface is attached to the outer wall of the fluorescent glue layer and the encapsulation glue layer, the inner arc surface is the second reflecting surface, and the first reflecting surface intersects with the second reflecting surface.

3. The LED package structure of claim 2, wherein, The second reflector has a third reflecting surface and a supporting surface, the fluorescent glue layer is mounted at least partially on the supporting surface, and the outer wall of the LED chip is attached to the third reflecting surface.

4. The LED package structure of claim 3, wherein, The LED packaging structure has two groups of lead-through components, the two groups of lead-through components are mounted on the substrate, and the two groups of lead-through components are respectively in conduction with the positive and negative electrodes of the LED chip, and the two groups of lead-through components have a gap therebetween.

5. The LED package structure of claim 1, wherein the phosphor layer is disposed on the LED chip. The reflective support is at least partially filled into the gap.

6. The LED package structure of claim 5, wherein the phosphor layer is disposed on the LED chip. The lead-through component comprises a first solder pad, a second solder pad and a lead-through body, the first solder pad is mounted on the lower end of the substrate, the second solder pad is mounted on the upper end of the substrate, the lead-through body is mounted in the substrate, and the first solder pad is in conduction with the second solder pad through the lead-through body.

7. The LED package structure of claim 5, wherein the phosphor layer is disposed on the LED chip. The substrate is made of ceramic and any one or more of gold, silver and copper.

8. The LED package structure of claim 5, wherein, The fluorescent glue layer is made of glue, fluorescent powder and diluent.

9. The LED package structure of any one of claims 1 to 8, wherein, The reflective support is made of glue and titanium dioxide.

10. The LED package structure of any one of claims 1 to 8, wherein, ​

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