Power module

Abstract

The embodiment of the utility model discloses a power module. The power module comprises a second substrate, at least one power module and a limiting structure. The power module comprises a first substrate, a power device, a plastic package body, a first power end, a second power end and a signal terminal, the power device is located on the first surface of the first substrate, the plastic package body wraps the first substrate and the power device, and the first power end, the second power end and the signal terminal are electrically connected with the power device. The first power end is located on the first side edge of the plastic package body, the second power end is located on the second side edge of the plastic package body, the signal terminal is located on the first side edge of the plastic package body, and the root portion extends out of the plastic package body. Furthermore, the limiting structure is arranged at the root parts of the signal terminal and the first power end so as to limit the displacement of the signal terminal and the first power end. Therefore, the power module can prevent the root parts of the signal terminal and the first power end from being broken under the vibration load.

Description

[0001] This application claims priority to Chinese patent application No. 202423000617.1, filed on December 5, 2024, entitled "Power Module", the whole or part of which is incorporated herein by reference. Technical Field

[0002] This utility model relates to the field of packaging technology, and in particular to a power module. Background Technology

[0003] With the advancement of power electronics technology, power modules have developed rapidly, and the complex application scenarios of power modules have placed higher demands on their packaging. In the application environment of new energy vehicles, the complex vibration environment requires power modules to have higher vibration resistance. Among them, the root of the signal terminal of the power module is a weak point in vibration, and fracture of the signal terminal root is also a common failure after vibration testing. Therefore, there is an urgent need to design a power module. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a power module that limits the displacement of signal terminals by setting a limiting structure, so as to avoid the root of the signal terminals breaking.

[0005] This utility model embodiment provides a power module, including: a second substrate; at least one power module located on the second substrate; and a limiting structure; wherein the power module includes: a first substrate; a power device located on a first surface of the first substrate; a molding compound covering the first substrate and the power device, the molding compound including opposing first and second sides and opposing third and fourth sides, the first side and the third side being perpendicular; a signal terminal located on the first side of the molding compound, the signal terminal being electrically connected to the power device in the molding compound, the root of the signal terminal extending out of the molding compound; a first power terminal located on the first side of the molding compound, the first power terminal being electrically connected to the power device in the molding compound; and a second power terminal located on the second side of the molding compound, the second power terminal being electrically connected to the power device in the molding compound; the limiting structure is located at the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

[0006] In some embodiments, the limiting structure covers the root of the signal terminal and the first power terminal.

[0007] In some embodiments, the power module further includes an insulating layer located between the second substrate and the power module, the insulating layer having an opening through which the power module passes to be located on the second substrate; the insulating layer is spaced apart from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

[0008] In some embodiments, all the power modules are arranged in the same direction on the second substrate, and the signal terminal of each power module and the first power terminal share a limiting structure.

[0009] In some embodiments, all the power modules are arranged in the same direction on the second substrate, and the signal terminals and the first power terminals of all the power modules in the same row share a limiting structure.

[0010] In some embodiments, the limiting structure is an insulating colloid that covers the root of the signal terminal and the first power terminal.

[0011] In some embodiments, the insulating colloid is cured at the root of the signal terminal and the first power terminal.

[0012] In some embodiments, an insulating layer is further included, the insulating layer being located between the second substrate and the power module, the insulating layer having an opening through which the power module passes to be located on the second substrate; the insulating layer having a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate; the insulating adhesive is bonded to the insulating layer.

[0013] In some embodiments, the insulating colloid is bonded to the second substrate.

[0014] In some embodiments, the comparative tracking index (CTI) of the insulating colloid is greater than or equal to 400 volts.

[0015] In some embodiments, the insulating colloid has a temperature resistance of 100 degrees Celsius or higher.

[0016] In some embodiments, the width of the insulating colloid at the signal terminal is greater than its width at the first power terminal.

[0017] In some embodiments, the limiting structure includes an insulating limiting seat that carries the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

[0018] In some embodiments, the limiting seat includes a support portion that carries the root of the signal terminal and the first power terminal.

[0019] In some embodiments, the limiting seat further includes a side stop that extends upward from the edge of the bearing portion and surrounds the root of the signal terminal and the first power terminal.

[0020] In some embodiments, the limiting structure fully covers the root of the signal terminal and the first power terminal.

[0021] In some embodiments, the limiting structure partially covers the root portion of the signal terminal and the first power terminal.

[0022] This utility model embodiment provides a power module, which includes a second substrate, at least one power module, and a limiting structure. The power module includes a first substrate, a power device, a molding compound, a first power terminal, a second power terminal, and a signal terminal. The power device is located on a first surface of the first substrate. The molding compound covers the first substrate and the power device. The first power terminal, the second power terminal, and the signal terminal are electrically connected to the power device. The first power terminal is located on a first side of the molding compound, the second power terminal is located on a second side of the molding compound, and the signal terminal is located on the first side of the molding compound with its root extending out of the molding compound. Further, the limiting structure is disposed at the root of the signal terminal and the first power terminal to limit their displacement. Therefore, the power module can prevent the root of the signal terminal and the first power terminal from breaking under vibration loads. Attached Figure Description

[0023] The above and other objects, features, and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0024] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present utility model;

[0025] Figure 2 This is a schematic diagram of the usage state of a second substrate provided in an embodiment of this utility model;

[0026] Figure 3 This is a schematic diagram of the first power module provided in this embodiment of the present invention;

[0027] Figure 4This is a schematic diagram of the second type of power module provided in this embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the third type of power module provided in this embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the fourth type of power module provided in this embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 11-Second substrate; 12-Insulating layer; 2-Power module; 21-Encapsulation; 22-Signal terminal; 23-First power terminal; 24-Second power terminal; 25-First substrate; 26-Power device; 27-Interconnect layer; 28-Interconnection portion; 3-Limiting structure; 31-Insulating colloid; 32-Limiting seat; 321-Bearing portion; 322-Side stop portion. Detailed Implementation

[0032] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0033] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0034] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0036] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0037] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0038] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the usage state of a second substrate provided in an embodiment of this utility model. Figure 3 This is a schematic diagram of the first power module provided in the embodiment of this utility model, combined with... Figures 1 to 3As shown, the power module includes a second substrate 11, at least one power module 2, and a limiting structure 3. Optionally, the second substrate 11 is a metal plate. Specifically, the power module 2 is located on the second substrate 11 and includes a first substrate 25, a power device 26, a molding compound 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnect layer 27, and an interconnect portion 28. The power device 26 is located on the first surface of the first substrate 25. The molding compound 21 covers the first substrate 25 and the power device 26. The molding compound 21 includes opposing first and second sides, as well as opposing third and fourth sides. The first and third sides are perpendicular. The first power terminal 23 is located on the first side of the molding compound 21 and is electrically connected to the power device 26 in the molding compound 21. The second power terminal 24 is located on the second side of the molding compound 21 and is electrically connected to the power device 26 in the molding compound 21. The signal terminal 22 is located on the first side of the molding compound 21 and is electrically connected to the power device 26 in the molding compound 21. It should be noted that the interconnect layer 27 is a chip interconnect layer, and the power device 26 is disposed on the first substrate 25 through the interconnect layer 27. The interconnect portion 28 is used for top interconnection of the chip. Further, the root of the signal terminal 22 extends from within the molding compound 21, and the limiting structure 3 is located at the root of the signal terminal 22 and the first power terminal 23 to limit the displacement of the signal terminal 22 and the first power terminal 23, preventing the root of the signal terminal 22 and the first power terminal 23 from being pulled by the displacement of the circuit board. Optionally, the limiting structure 3 covers the root of the signal terminal 22 and the first power terminal 23.

[0039] like Figure 2 As shown, the power module also includes an insulating layer 12. Specifically, the insulating layer 12 is located between the second substrate 11 and the power module 2. It is readily understood that the insulating layer 12 has openings so that the power module 2 can pass through the openings in the insulating layer 12 and be disposed on the second substrate 11. Furthermore, the insulating layer 12 has a certain distance from the first power terminal 23, the second power terminal 24, and the signal terminal 22 of the power module 2, so that the first power terminal 23, the second power terminal 24, and the signal terminal 22 of the power module 2 are insulated from the second substrate 11.

[0040] In one embodiment, the insulating layer 12 is configured as either an FR-4 (glass fiber reinforced epoxy resin laminate) insulating layer or a PI (polyimide) insulating layer. It should be noted that the FR-4 insulating layer possesses good mechanical strength and electrical properties. It should also be noted that the PI insulating layer exhibits excellent high-temperature resistance, electrical insulation, and mechanical strength.

[0041] like Figure 3As shown, in one embodiment, the limiting structure 3 includes an insulating adhesive 31. Specifically, the insulating adhesive 31 wraps around the roots of the signal terminal 22 and the first power terminal 23, thereby limiting the displacement of the signal terminal 22 and the first power terminal 23 in a vibration environment, and thus preventing the roots of the signal terminal 22 and the first power terminal 23 from breaking. Further, the insulating adhesive 31 is cured at the roots of the signal terminal 22 and the first power terminal 23 to ensure the limiting effect on the signal terminal 22 and the first power terminal 23.

[0042] In one embodiment, the insulating colloid 31 is bonded to the insulating layer 12. It is readily understood that the insulating colloid 31 has good adhesion to the insulating material, thereby enhancing the bond strength between the insulating colloid 31 and the insulating layer 12, and thus ensuring the limiting effect of the insulating colloid 31 on the root of the signal terminal 22.

[0043] In one embodiment, the insulating colloid 31 is bonded to the second substrate 11. That is, even when the second substrate 11 is not provided with an insulating layer 12, the insulating colloid 31 can still achieve the insulation function and the limiting function of the signal terminal 22 by bonding to the second substrate 11.

[0044] It is readily understood that the insulating colloid 31 protects the power module 2 from current leakage or short circuits, contributing to improved product quality and safety performance. Optionally, the insulating colloid 31 may include epoxy resin, pressure-sensitive adhesive, UV-curable adhesive, or other colloids.

[0045] In one embodiment, the CTI (Comparative Tracking Index) value of the insulating colloid 31 is greater than or equal to 400 volts. It should be noted that the CTI value refers to the highest voltage at which the surface of a solid insulating material can withstand 50 drops of electrolyte without forming a leakage mark under the combined action of an electric field and electrolyte. In other words, the CTI value is an indicator used to evaluate the ability of an insulating material to resist electric arc shock. The higher the CTI value, the higher the tracking resistance of the insulating material, the better its insulation, and the higher its safety performance. Therefore, the insulating colloid 31 helps to improve product quality and safety performance.

[0046] In one embodiment, the insulating colloid 31 is a heat-resistant colloid. It should be noted that the temperature that the insulating colloid 31 can withstand is greater than or equal to the upper limit of the temperature that the signal terminal 22 can reach. Optionally, the temperature resistance of the insulating colloid 31 is greater than or equal to 100 degrees Celsius. That is, the insulating colloid 31 can maintain its physical and chemical properties unchanged at high temperatures, thereby ensuring bonding strength and stability, and effectively preventing the signal terminal 22 from breaking at the root due to deterioration of the insulating colloid 31.

[0047] like Figure 3As shown, in some embodiments, the width of the insulating colloid 31 at the signal terminal 22 is greater than the width at the first power terminal 23, so as to expose at least a portion of the first power terminal 23.

[0048] Figure 4 This is a schematic diagram of the second type of power module provided in this embodiment of the present invention, as shown below. Figure 4 As shown, in one embodiment, the limiting structure 3 includes an insulated limiting seat 32. Specifically, the limiting seat 32 includes a support portion 321 and a side stop portion 322. More specifically, the support portion 321 is located below the signal terminal 22 and the first power terminal 23 to support the roots of the signal terminal 22 and the first power terminal 23, and the side stop portion 322 extends upward from the edge of the support portion 321 and surrounds the roots of the signal terminal 22 and the first power terminal 23. Optionally, the side stop portion 322 is formed in an L-shape or a U-shape to surround the roots of the signal terminal 22 and the first power terminal 23 and achieve limiting. Thus, under the action of the limiting seat 32, the power module 2 can prevent the signal terminal 22 and the first power terminal 23 from being pulled by the displacement of the circuit board, which could cause the roots to break.

[0049] Optionally, the limiting seat 32 is made of acrylic, polyimide, polytetrafluoroethylene, or other insulating materials. Thus, the limiting seat 32 can protect the power module 2 from current leakage or short circuits, contributing to improved product quality and safety performance.

[0050] As an optional implementation, the limiting seat 32 can cooperate with the insulating colloid 31 to simultaneously limit the signal terminal 22 or the first power terminal 23. Thus, the limiting structure 3, through the insulating colloid 31 and / or the limiting seat 32, can prevent the power module 2 from breaking the signal terminal 22 or the first power terminal 23 under vibration.

[0051] Figure 5 This is a schematic diagram of the third type of power module provided in this embodiment of the present invention, as shown below. Figure 5 As shown, in one embodiment, all power modules 2 are arranged in the same direction on the second substrate 11, and each power module 2 is provided with a corresponding limiting structure 3. Optionally, the signal terminal 22 and the first power terminal 23 of each power module 2 share a limiting seat 32 and / or insulating colloid 31, that is, the signal terminal 22 and the first power terminal 23 of each power module 2 share a limiting structure 3.

[0052] Figure 6 This is a schematic diagram of the fourth type of power module provided in this embodiment of the utility model, as shown below. Figure 6As shown, in one embodiment, all power modules 2 are arranged in the same direction on the second substrate 11, and the signal terminals 22 and first power terminals 23 of all power modules 2 located in the same row share a limiting structure 3. Exemplarily, the signal terminals 22 and first power terminals 23 of all power modules 2 located in the same row share a limiting seat 32. Optionally, the signal terminals 22 and first power terminals 23 of all power modules 2 located in the same row share an insulating colloid 31 and / or a limiting seat 32.

[0053] In one embodiment, the limiting structure 3 completely covers the root of the signal terminal 22 and the first power terminal 23, that is, the insulating colloid 31 completely covers the root of the signal terminal 22 and the first power terminal 23.

[0054] like Figure 6 As shown, in one embodiment, the limiting structure 3 partially covers the root of the signal terminal 22 and the first power terminal 23, and the insulating colloid 31 covers a portion of the root of the signal terminal 22 and the first power terminal 23, exposing the root portion of the signal terminal 22 and the first power terminal 23.

[0055] This utility model embodiment provides a power module, which includes a second substrate, at least one power module, and a limiting structure. The power module includes a first substrate, a power device, a molding compound, a first power terminal, a second power terminal, and a signal terminal. The power device is located on a first surface of the first substrate. The molding compound covers the first substrate and the power device. The first power terminal, the second power terminal, and the signal terminal are electrically connected to the power device. The first power terminal is located on a first side of the molding compound, the second power terminal is located on a second side of the molding compound, and the signal terminal is located on the first side of the molding compound with its root extending out of the molding compound. Further, the limiting structure is disposed at the root of the signal terminal and the first power terminal to limit their displacement. Therefore, the power module can prevent the root of the signal terminal and the first power terminal from breaking under vibration loads.

[0056] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power module, characterized by Comprising: a second substrate; at least one power module, the power module being located on the second substrate; and a limiting structure; wherein the power module comprises: a first substrate; a power device, the power device being located on a first surface of the first substrate; a plastic package, the plastic package covering the first substrate and the power device, the plastic package comprising opposite first and third sides and opposite second and fourth sides, the first and third sides being perpendicular; a signal terminal, the signal terminal being located on the first side of the plastic package, the signal terminal being electrically connected to the power device in the plastic package, a root of the signal terminal being extended out of the plastic package; a first power terminal, the first power terminal being located on the first side of the plastic package, the first power terminal being electrically connected to the power device in the plastic package; and a second power terminal, the second power terminal being located on the second side of the plastic package, the second power terminal being electrically connected to the power device in the plastic package; the limiting structure being located on the root of the signal terminal and the first power terminal to limit displacement of the signal terminal and the first power terminal. The limiting structure covers the root of the signal terminal and the first power terminal.

2. The power module of claim 1, wherein, Further comprising an insulating layer, the insulating layer being located between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating layer having a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

3. The power module of claim 1 or 2, wherein, All the power modules are arranged on the second substrate in the same direction, the signal terminal and the first power terminal of each power module sharing one limiting structure.

4. The power module of claim 1 or 2, wherein, All the power modules are arranged on the second substrate in the same direction, the signal terminal and the first power terminal of all the power modules in the same row sharing one limiting structure.

5. The power module of claim 1 or 2, wherein, The limiting structure is:

6. The power module of claim 1 or 2, wherein, an insulating gel, the insulating gel covering the root of the signal terminal and the first power terminal. The insulating gel is solidified on the root of the signal terminal and the first power terminal.

7. The power module of claim 6, wherein, Further comprising an insulating layer, the insulating layer being located between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating layer having a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate; 8. The power module of claim 6, wherein, The insulating gel is bonded on the insulating layer. The insulating gel is bonded on the second substrate.

9. The power module of claim 6, wherein, The comparative tracking index (CTI) of the insulating gel is greater than or equal to 400 volts.

10. The power module of claim 6, wherein, The insulating gel is resistant to a temperature greater than or equal to 100 degrees Celsius.

11. The power module of claim 6, wherein, The width of the insulating gel at the signal terminal is greater than the width at the first power terminal.

12. The power module of claim 6, wherein, The limiting structure comprises:

13. The power module of claim 1 or 2, wherein, ​ An insulative retainer that carries the root of the signal terminal and the first power terminal to limit displacement of the signal terminal and the first power terminal.

14. The power module of claim 13, wherein, The retainer includes: A carrier that carries the root of the signal terminal and the first power terminal.

15. The power module of claim 14, wherein, The retainer also includes a side stop that extends upward from an edge of the carrier and encloses the root of the signal terminal and the first power terminal.

16. The power module of claim 1 or 2, wherein, The retainer fully encloses the root of the signal terminal and the first power terminal.

17. The power module of claim 1 or 2, wherein, The retainer partially encloses the root of the signal terminal and the first power terminal.

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