Fast neutron imaging detector and detection system

Abstract

The utility model provides a fast neutron imaging detector and a detection system, and belongs to the technical field of nuclear imaging detectors. The fast neutron imaging detector comprises a substrate, a scintillator assembly and a photomultiplier. Wherein the substrate is provided with a plurality of through holes, and the plurality of through holes form an array. The scintillator assemblies are arranged in the through holes in a one-to-one correspondence mode, and each scintillator assembly comprises a scintillator and a light guide piece which are arranged in a stacked mode. And the photomultiplier is electrically connected with the light guide sheet in the scintillator assembly. The detector is flexible in design of the area and the spatial resolution, resistant to mechanical impact, high in reliability, stable in performance, low in cost and convenient to debug and overhaul, and the maintenance cost of equipment is reduced.

Description

Technical Field

[0001] This application relates to the field of nuclear imaging detectors, and in particular to a fast neutron imaging detector and detection system. Background Technology

[0002] Fast neutron imaging is a rapidly developing radiographic technique that utilizes the difference in the penetrating power of X-rays within an object to observe its internal structure. Because fast neutrons have a small reaction cross section and a large inelastic scattering cross section, which increases with neutron energy, they possess strong penetrating power through matter. Compared to other imaging techniques, fast neutron imaging can scan larger and denser components. Currently, as a non-destructive testing method, fast neutron imaging plays a crucial role in non-destructive monitoring across numerous fields, including aerospace, defense, nuclear power technology, high-end manufacturing, and new energy.

[0003] Related technologies employ scintillator detectors for direct detection of fast neutrons. Scintillator detectors convert incident fast neutrons into scintillating photons using scintillators, then convert the optical signal into an electrical signal via a photoelectric conversion device. The resulting electrical signal is then measured and analyzed to achieve fast neutron detection. A significant current development direction for fast neutron imaging detectors is array-structured detectors. Specifically, scintillators are closely connected and arranged in a two-dimensional array, combined with a silicon photomultiplier array.

[0004] However, in related technologies, array-structured fast neutron detectors, in order to ensure high resolution, still have a relatively small detection area. For non-destructive testing of large outdoor buildings on the meter scale, the small detection area per scan results in extremely low detection efficiency. Furthermore, during online non-destructive testing of outdoor buildings, the fast neutron detector needs to be moved along with other supporting equipment, such as the currently researched vehicle-mounted accelerator neutron source system. Array-structured fast neutron detectors in related technologies also do not consider the detector's resistance to mechanical shock. Therefore, how to make fast neutron detectors suitable for non-destructive testing of large outdoor buildings has become an urgent problem to be solved. Utility Model Content

[0005] This application provides a fast neutron imaging detector and detection system suitable for non-destructive testing of large outdoor buildings.

[0006] In a first aspect, embodiments of this application provide a fast neutron imaging detector, the detector comprising:

[0007] A substrate having a plurality of through holes arranged in an array;

[0008] A scintillator assembly is disposed in the through-hole in a one-to-one correspondence manner; the scintillator assembly includes stacked scintillators and light guide sheets; and

[0009] A photomultiplier, which is electrically connected to the photoconductor in the scintillator assembly.

[0010] Optionally, on the substrate, the spacing between adjacent through holes is less than or equal to 5 mm and greater than or equal to 1 mm.

[0011] Optionally, the top of the scintillator extends beyond the through hole, and a clamping member is provided around the through hole. One end of the clamping member is connected to the substrate, and the other end abuts against the portion of the scintillator that extends beyond the through hole.

[0012] Optionally, at least one pair of clamping members are provided around the through hole, and the pair of clamping members respectively abut against the sidewalls of the scintillator that are distributed opposite to each other.

[0013] Optionally, the bottom of the light guide sheet is positioned above the bottom opening of the through hole.

[0014] Optionally, the photomultiplier is provided in a one-to-one correspondence with the scintillator assembly, and the photomultiplier is located on the side of the light guide sheet opposite to the scintillator and is attached to the light guide sheet.

[0015] Optionally, the photomultiplier is disposed within the through hole, and the side of the photomultiplier opposite to the scintillator is flush with the bottom of the through hole.

[0016] Optionally, the cross-sections of the scintillator and the connected photomultiplier are adapted to the cross-section of the through hole.

[0017] Optionally, the detector further includes a signal processing component electrically connected to the photomultiplier, the signal processing component also being used for communication with an external terminal.

[0018] Secondly, embodiments of this application provide a detection system, which includes a neutron source and the fast neutron imaging detector provided in the first aspect above.

[0019] The fast neutron imaging detector and detection system provided in this application have at least the following technical effects.

[0020] An array of through-holes is formed on a substrate, with scintillator components inserted into each hole in a one-to-one correspondence. This allows the number of scintillator components in the overall detector to be adjusted by setting the number of through-holes. This method enables the configuration of the number of through-holes, and consequently, the number of scintillator components, according to specific detection requirements. When detecting large outdoor buildings, a large-size fast neutron imaging detector is formed by setting a corresponding number of through-holes and scintillator components. Simultaneously, the substrate provides stable and robust support for the scintillator components, ensuring the structural stability and mechanical shock resistance of the overall fast neutron imaging detector, especially when using a large number of scintillator components. Therefore, the fast neutron imaging detector provided in this application embodiment can meet the requirements of detecting large outdoor buildings and fills a technological gap in related fields.

[0021] Details of one or more embodiments of this application are set forth in the following drawings and description to make other features, objects and advantages of this application more readily apparent. Attached Figure Description

[0022] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0023] Figure 1 This is a top view of a fast neutron imaging detector according to an exemplary embodiment;

[0024] Figure 2 This is a schematic diagram of the structure of a fast neutron imaging detector according to an exemplary embodiment;

[0025] Figure 3 This is a structural example diagram of a fast neutron imaging detector shown according to another exemplary embodiment;

[0026] Figure 4 This is a schematic diagram illustrating the connection between a scintillator assembly and a photomultiplier according to an exemplary embodiment;

[0027] Figure 5 This is an electrical structure diagram of a photomultiplier according to an exemplary embodiment;

[0028] Figure 6 This is a schematic diagram of the electrical structure of a fast neutron imaging detector according to an exemplary embodiment;

[0029] Figure 7 This is a schematic diagram illustrating the operating state of a detection system according to an exemplary embodiment;

[0030] Figure 8This is a detection effect diagram of a detection system according to an exemplary embodiment.

[0031] In the above figures, the meanings of the various reference numerals are as follows:

[0032] 100, substrate; 110, through hole; 120, clamping component;

[0033] 200, scintillator assembly; 210, scintillator; 220, light guide sheet;

[0034] 300, photomultiplier; 310, avalanche photodiode; 320, and quenching impedance;

[0035] 400. Signal processing components; 410. Amplifiers; 420. Comparators; 430. Counters; 440. Analog-to-digital converters; 450. Time-to-digital converters; 460. Microcontrollers; 470. Digital-to-analog converters.

[0036] 500, Neutron Source. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.

[0038] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0039] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0040] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0041] In a first aspect, embodiments of this application provide a fast neutron imaging detector. Figure 1 This is a top view of a fast neutron imaging detector according to an exemplary embodiment. Figure 2 This is a schematic diagram illustrating the structure of a fast neutron imaging detector according to an exemplary embodiment. Figure 1 and Figure 2 As shown, the fast neutron imaging detector includes a substrate 100, a scintillator assembly 200, and a photomultiplier 300.

[0042] A plurality of through holes 110 are provided on the substrate 100, and the plurality of through holes 110 are arranged in an array. Scintillator assemblies 200 are disposed in the through holes 110 in a one-to-one correspondence. The scintillator assembly 200 includes a scintillator 210 and a photoconductor 220 stacked together. A photomultiplier is electrically connected to the photoconductor 220 in the scintillator assembly 200.

[0043] In this detector, one scintillator assembly 200 forms a detection pixel, and the signal detected by one scintillator assembly 200 is used to form an image pixel in the detected image. For the substrate 100, through-holes 110 form the mounting positions for the scintillator assemblies 200. Furthermore, the scintillator assemblies 200 are inserted into the through-holes 110 in a one-to-one correspondence. The number of scintillator assemblies 200 in the overall detector can be adjusted by setting the number of through-holes 110. The through-holes 110 are arranged in an array, and the scintillator assemblies 200 are also arranged in an array.

[0044] This approach allows for the configuration of the number of through-holes 110, and consequently the number of scintillator assemblies 200, according to specific detection requirements. When detecting large outdoor buildings, a large-size fast neutron imaging detector is formed by setting a corresponding number of through-holes 110 and scintillator assemblies 200. Simultaneously, the substrate 100 provides stable and robust support for the scintillator assemblies 200, ensuring the overall structural stability and mechanical shock resistance of the fast neutron imaging detector, especially when using a large number of scintillator assemblies 200. Therefore, the fast neutron imaging detector provided in this embodiment can meet the requirements of detecting large outdoor buildings, filling a technological gap in related fields.

[0045] As an alternative, the spacing between adjacent vias 110 on the substrate 100 is less than or equal to 5 mm and greater than or equal to 1 mm, such as 2 mm, 3 mm, 4 mm, etc. By setting a reasonable spacing between adjacent vias 110, it is possible to avoid the excessive spacing between adjacent scintillator components 200, which would reduce the imaging pixels of the detector, and also to avoid the excessive spacing between vias 110, which would weaken the mechanical stability of the substrate 100.

[0046] Optionally, the substrate 100 is made of an opaque material to avoid signal crosstalk between different scintillator components 200. For example, the substrate 100 is made of metal materials such as stainless steel or copper, which ensures its mechanical shock resistance while achieving optical isolation between different scintillator components 200.

[0047] Figure 3 This is an example structural diagram of a fast neutron imaging detector illustrated according to another exemplary embodiment, such as... Figure 2 and 3 As shown, the top of the scintillator 210 in the scintillator assembly 200 extends beyond the through hole 110. A clamping member 120 is provided around the through hole 110. One end of the clamping member 120 is connected to the substrate 100, and the other end abuts against the portion of the scintillator 210 that extends beyond the through hole 110.

[0048] Optionally, the clamping member 120 has a deformable function, for example, it is made of an elastic material. During the installation of the scintillator 210, the clamping member 120 is deflected away from the radial direction of the through hole by an external force to avoid obstructing the installation of the scintillator 210. After installation, the external force is removed so that the clamping member 120 abuts against the portion of the scintillator 210 that extends beyond the through hole 110. The clamping member 120 ensures that the scintillator unit 200 is stably placed in the through hole 110.

[0049] At least one pair of clamping members 120 are provided around the through hole 110, and the pair of clamping members 120 respectively abut against the relatively distributed sidewalls of the scintillator 210. In this way, the stabilizing effect of the clamping members 120 on the scintillator unit 200 is optimized. As a preferred embodiment, for example... Figure 2 and Figure 3 As shown, four clamping members 120 are provided around the through hole 110, that is, one clamping member 120 is provided on each side of the quadrilateral through hole 110, which fully ensures the stability of the scintillator assembly 200.

[0050] In one example, combined Figure 2 As shown, the light guide 220 is bonded to the light-emitting surface of the scintillator 210, for example, by applying appropriate pressure or adhesive to connect the light guide 220 and the scintillator 210. The contact surfaces of the light guide 220 and the scintillator 210 should be as smooth and flat as possible to achieve a tight physical fit. Furthermore, the light guide 220 is disposed inside the through hole 110, with the bottom surface of the light guide 220 located above the bottom opening of the through hole 110.

[0051] At this point, the photoconductor 220 is completely placed inside the through-hole 110. In this way, each scintillator 210 has a corresponding photoconductor 220. When the size of the fast neutron imaging detector is large, the number of scintillator assemblies 200 can be increased, and the photoconductor 220 in each scintillator assembly 200 can maintain a small size. This makes it easier to ensure the uniformity of the performance of the photoconductor 220, avoiding the problem of uneven performance distribution in large-size photoconductors, thereby ensuring the detection accuracy and precision of large-size fast neutron imaging detectors. At the same time, this method also facilitates equipment maintenance; any malfunctioning scintillator assembly 200 can be disassembled and replaced.

[0052] In this embodiment of the application, as an optional approach, the photomultiplier 300 can adopt a positive sheet structure, that is, a layer of photomultiplier 300 is attached to the underside of the substrate 100 and connected to the light guide sheet 220 of at least two sets of scintillator components 200.

[0053] Alternatively, the photomultiplier 300 and the scintillator assembly 200 are configured in a one-to-one correspondence. Figure 4This is a schematic diagram illustrating the connection between a scintillator assembly and a photomultiplier according to an exemplary embodiment, as shown below. Figure 4 As shown, the photomultiplier 300 is located on the side of the light guide plate opposite to the scintillator 210 and is attached to the light guide plate 220. This arrangement, with a photomultiplier 300 for each scintillator component 200, avoids signal ambiguity and reduces the complexity of signal processing. Furthermore, it allows for clear differentiation of the signals detected by each scintillator component 200 during subsequent signal processing, which helps improve the spatial resolution of the image. In addition, it facilitates maintenance, replacement, and debugging in case of pixel failure in each detector.

[0054] In this optional method, see again Figure 2 The photomultiplier 300 is also disposed within the through-hole 110, and the side of the photomultiplier 300 opposite to the scintillator 200 is flush with the bottom of the through-hole 110. In this manner,

[0055] Furthermore, the cross-sections of the scintillator assembly 200 and the connected photomultiplier 300 are adapted to the cross-section of the through-hole 110. Specifically, the scintillator 210, the light guide 220, and the photomultiplier 300 all have the same cross-sectional shape and size, and are adapted to the cross-section of the through-hole 110. In this way, it is convenient to install the aforementioned assembly 200 and photomultiplier 300 in the through-hole 110.

[0056] Optionally, the scintillator 210 is specifically a plastic scintillator, preferably a BC408 plastic scintillator. This scintillator has high detection sensitivity and can monitor low-level radiation signals. Furthermore, the material has a short fluorescence decay time, typically with a rise time of 0.9 ns and a decay time of 2.1 ns, meeting the requirements for rapid response in the moving scanning process of non-destructive testing of outdoor buildings. In addition, the BC408 plastic scintillator has good chemical and thermal stability, is not easily affected by chemical corrosion and temperature changes, and can operate normally under relatively harsh environmental conditions. Simultaneously, it has high mechanical strength, is vibration and shock resistant, does not require complex packaging processes, and is relatively robust and reliable during use and transportation.

[0057] Optionally, the light guide 220 is made of PMMA (polymethyl methacrylate). PMMA has a transmittance of up to approximately 92%, which effectively reduces light loss during transmission, ensuring the strength and quality of the optical signal. Its refractive index is around 1.49 in some studies or applications; therefore, using PMMA to fabricate the light guide 220 helps reduce signal reflection at the interface and improve signal collection efficiency. Furthermore, PMMA is lightweight and flexible, able to withstand a certain degree of bending and vibration, and its mechanical structure is more reliable compared to traditional brittle optical glass.

[0058] The photomultiplier 300 is a solid-state photodetector. Figure 5 This is an electrical structure diagram of a photomultiplier according to an exemplary embodiment, such as... Figure 5 As shown, the photomultiplier 300 includes multiple sets of avalanche photodiodes 310 connected in series and quenching resistors 320, and the multiple sets of avalanche photodiodes 310 and quenching resistors 320 are connected in parallel. The avalanche photodiodes 310 operate in Geiger mode.

[0059] In use, the scintillator assembly 200 and the photomultiplier 300 operate on the following principles:

[0060] Upon entering the scintillator assembly 200, fast neutrons first scatter with the atomic nuclei in the scintillator 210. During scattering, the neutrons transfer some energy to the atomic nuclei, causing them to enter an excited state. During de-excitation, the excited nuclei further transfer energy to the scintillator molecules through non-one-line scattering or elastic scattering. After absorbing energy from the atomic nuclei, the electrons of the scintillator molecules transition from the ground state to the excited state. The excited molecules then return to the ground state via radiative transition within an extremely short time (typically on the nanosecond scale), emitting photons. The photons emitted from the scintillator 210 enter the photoconductor 220. The refractive index of the photoconductor 220 is typically higher than that of the surrounding environment (such as air). When a photon is incident at an angle greater than the critical angle at the interface between the photoconductor and the surrounding environment, total internal reflection will occur within the photoconductor 220. The photomultiplier 300 includes a photosensitive region made of silicon material. After photons are transmitted to the photosensitive region of the photomultiplier 300, they are absorbed by the silicon material. The energy of the photons is transferred to electrons in the silicon atoms, causing the electrons to jump from the valence band to the conduction band, thereby generating electron-hole pairs in the silicon. Inside the silicon photomultiplier 300, through a special structure and electric field design, each initially generated electron-hole pair will trigger an avalanche multiplication effect under the action of a strong electric field. After avalanche multiplication, a large number of electron-hole pairs form a detectable current signal, thus realizing the process of converting the optical signal into an electrical signal.

[0061] In one embodiment, Figure 6 This is a schematic diagram of the electrical structure of a fast neutron imaging detector according to an exemplary embodiment. Figure 6 As shown, the detector also includes a signal processing component 400 electrically connected to the photomultiplier 300, and the signal processing component 400 is also used for communication connection with an external terminal.

[0062] The signal processing component 400 processes the electrical signal converted by the photomultiplier 300 to obtain a processed signal, and then sends the processed signal to an external terminal. For example... Figure 6As shown, the electrical signal converted by the silicon photomultiplier 300 is amplified by the pulse amplitude amplifier 410 and comparator 420, and the counter 430 extracts the counting information. The logic level signal output by the amplifier 410 is converted by the analog-to-digital converter 440 (ADC) to extract the pulse amplitude information, and by the time-to-flight converter 450 (TDC) to extract the time-of-flight (TOF) information. The extracted TOF information, together with the counting information, is then transmitted to an external terminal such as a computer via the microcontroller 460 (PIC).

[0063] The signal processing component 400 also includes a digital-to-analog converter 470 for use with the comparator 420. One input port of the comparator 420 receives a signal from the amplifier 410, and the other input port receives a threshold signal set by the digital-to-analog converter 470. When the amplitude of the input signal to the comparator 420 is greater than the threshold signal, the comparator 420 outputs a specific logic level (e.g., a high level); otherwise, it outputs another logic level (e.g., a low level). In this way, the signal processing component 400 completes the processing of the signal transmitted by the photomultiplier 300.

[0064] In summary, the fast neutron imaging detector provided in this application embodiment uses a substrate 100 with through holes 110 to form a mounting bracket for the scintillator assembly 200, flexibly expanding the detectable detection area. Furthermore, the substrate 100 also improves the overall structural stability of the fast neutron imaging detector. The fast neutron imaging detector provided in this application embodiment can perform online non-destructive testing on outdoor buildings, and its detector pixel size and total detection area can be flexibly designed. Compared with existing large-area fast neutron imaging detectors, it not only offers flexible design of detector area and spatial resolution, but also resists mechanical shock, has high reliability, stable performance, lower cost, and is easy to debug and repair, reducing equipment maintenance costs.

[0065] Secondly, embodiments of this application provide a detection system. Figure 7 This is a schematic diagram illustrating the operating state of a detection system according to an exemplary embodiment. Figure 8 This is a detection effect diagram of a detection system according to an exemplary embodiment. For example... Figure 7 As shown, the detection system includes a neutron source 500 and a fast neutron imaging detector provided in the first aspect above.

[0066] In the case of outdoor buildings (e.g.) Figure 7When performing non-destructive testing on the bridge shown, the neutron source 500 and the fast neutron imaging detector are located on either side of the target, and the fast neutron imaging detector moves with the neutron source 500 to perform a linear scan. When the simulated incident neutron energy is 1 MeV, each scintillator component and its connected photomultiplier in the fast neutron array detector constitute a pixel of the detector, with a pixel size of 10 mm × 10 mm × 10 mm. Under predetermined scanning parameters, the Adaptive Steepest Descent-Projection onto Convex Sets (ASD-POCS) algorithm is used to reconstruct the image of the target. The reconstructed result is shown below. Figure 8 As shown, the detection system provided in this application embodiment effectively achieves non-destructive testing of bridges.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A fast neutron imaging detector, characterized in that, The detector includes: A substrate having a plurality of through holes arranged in an array; A scintillator assembly is disposed in the through-hole in a one-to-one correspondence manner; the scintillator assembly includes stacked scintillators and light guide sheets; and A photomultiplier, which is electrically connected to the photoconductor in the scintillator assembly.

2. The fast neutron imaging detector according to claim 1, characterized in that, On the substrate, the spacing between adjacent through holes is less than or equal to 5 mm and greater than or equal to 1 mm.

3. The fast neutron imaging detector according to claim 1, characterized in that, The top of the scintillator extends beyond the through hole, and a clamping member is provided around the through hole. One end of the clamping member is connected to the substrate, and the other end abuts against the portion of the scintillator that extends beyond the through hole.

4. The fast neutron imaging detector according to claim 3, characterized in that, At least one pair of clamping members are provided around the through hole, and the pair of clamping members respectively abut against the sidewalls of the scintillator that are distributed opposite to each other.

5. The fast neutron imaging detector according to claim 1, characterized in that, The bottom of the optical guide sheet is positioned above the bottom opening of the through hole.

6. The fast neutron imaging detector according to claim 5, characterized in that, The photomultiplier is provided in a one-to-one correspondence with the scintillator assembly. The photomultiplier is located on the side of the light guide sheet opposite to the scintillator and is attached to the light guide sheet.

7. The fast neutron imaging detector according to claim 6, characterized in that, The photomultiplier is disposed inside the through hole, and the side of the photomultiplier opposite to the scintillator is flush with the bottom of the through hole.

8. The fast neutron imaging detector according to claim 6, characterized in that, The cross-sections of the scintillator and the connected photomultiplier are adapted to the cross-section of the through hole.

9. The fast neutron imaging detector according to claim 1, characterized in that, The detector also includes a signal processing component electrically connected to the photomultiplier, and the signal processing component is also used for communication connection with an external terminal.

10. A detection system, characterized in that, The detection system includes a neutron source and a fast neutron imaging detector as described in any one of claims 1 to 9.

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