Wafer bearing device

Abstract

The utility model provides a wafer bearing device, which comprises a chuck, a tester, a transmission piece and a temperature monitor, and is characterized in that the chuck is provided with a first end surface used for bearing a wafer; the temperature measuring hole penetrates through the chuck, a positioning groove is formed in a port, at the first end face, of the temperature measuring hole, and the positioning groove and the temperature measuring hole are coaxially arranged; the tester is used for providing an infrared signal corresponding to a preset temperature value, and when the output end of the tester is located in the positioning groove, the tester and the positioning groove are coaxially arranged; the transmission piece is used for transmitting an infrared signal provided by the tester, the near end of the transmission piece is inserted into the temperature measuring hole, and the transmission piece and the temperature measuring hole are coaxially arranged; and the temperature monitor is connected with the far end of the transmission piece and is used for converting the infrared signal transmitted by the transmission piece into an actually measured temperature value. By adopting the technical scheme, the monitoring precision can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor manufacturing, and particularly relates to a wafer bearing device. BACKGROUND

[0002] In the wafer film forming process, the change of temperature will cause the thermal expansion and contraction of the wafer, thereby generating thermal stress. Excessive thermal stress can cause the wafer to deform, crack or have other defects, which seriously affects the performance and reliability of the chip, and therefore the environmental temperature for preparing the wafer needs to be monitored.

[0003] How to improve the monitoring accuracy is a problem worth discussing. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present disclosure provides a wafer bearing device, which can improve the monitoring accuracy.

[0005] To solve the above technical problems, the present disclosure provides a wafer bearing device. The wafer bearing device comprises:

[0006] The chuck has:

[0007] The first end face is used for bearing the wafer;

[0008] The temperature measuring hole penetrates through the chuck, and the port of the temperature measuring hole at the first end face is provided with a positioning groove coaxially arranged with the temperature measuring hole;

[0009] The tester is used for providing an infrared signal corresponding to a preset temperature value, and the output end of the tester is coaxially arranged with the positioning groove when located in the positioning groove;

[0010] The transmission member is used for transmitting the infrared signal provided by the tester, and the proximal end of the transmission member is inserted into the temperature measuring hole and coaxially arranged with the temperature measuring hole;

[0011] The temperature monitor is connected with the distal end of the transmission member, and is used for converting the infrared signal transmitted by the transmission member into an actual measured temperature value.

[0012] Optionally, the transmission member comprises:

[0013] The first transmission unit, and the proximal end of the first transmission unit is the proximal end of the transmission member;

[0014] The second transmission unit, and the distal end of the second transmission unit is the distal end of the transmission member;

[0015] When the distal end of the first transmission unit is connected with the proximal end of the second transmission unit, the output end of the tester is inserted and matched with the positioning groove, and is concentrically aligned with the temperature measuring hole;

[0016] When the far end of the first transmission unit is separated from the near end of the second transmission unit, the output end of the tester is concentrically aligned with the near end face of the second transmission unit.

[0017] Optionally, the wafer carrier device further includes:

[0018] Alignment element, having:

[0019] The first channel, the proximal end of which is coaxially connected to the output of the tester;

[0020] The second channel is coaxially connected to the first channel, and the far end of the second channel is coaxially connected to the near end of the second transmission unit.

[0021] Optionally, the first channel is plugged into the output terminal of the tester, and the second channel is plugged into the proximal end of the second transmission unit.

[0022] Optionally, the inner diameter of the first channel is larger than the inner diameter of the second channel.

[0023] Optionally, the inner diameter of the first channel is greater than 5 mm and less than 10 mm, and the inner diameter of the second channel is greater than 1 mm and less than 3 mm.

[0024] Optionally, the wafer carrier device further includes:

[0025] Alignment element, wherein the alignment element is a tubular structure made of polyethylene material;

[0026] The inner wall of the alignment member has a coating layer, which is a tubular structure formed of a fluoropolymer material.

[0027] The number of temperature measuring holes is multiple, and the ports of each temperature measuring hole are distributed at intervals on the first end face.

[0028] Optionally, the chuck further comprises:

[0029] A heat exchange channel is located inside the chuck, wherein a heat exchange medium is contained within the heat exchange channel.

[0030] Optionally, the wafer carrier device further includes:

[0031] The housing has a mounting port and a through port, wherein the chuck is located at the mounting port of the housing and forms a receiving cavity with the housing, and the distal end of the transmission member exits the receiving cavity through the through port and is connected to the temperature monitor.

[0032] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0033] In the wafer carrier device provided in this embodiment, a temperature measuring hole penetrates the chuck, and the proximal end of the transmission component is inserted into the temperature measuring hole. During testing, the tester provides an infrared signal corresponding to a preset temperature value to the proximal end face of the transmission component. This infrared signal can be transmitted to a temperature monitor via the transmission component, and the temperature monitor converts the infrared signal into a measured temperature value. Then, based on the preset temperature value and the measured temperature value, it can be determined whether the transmission performance of the transmission component meets the requirements, and whether to replace it with a transmission component with higher transmission performance can be selected, thereby improving the monitoring accuracy. Furthermore, by setting the proximal end face of the transmission component to be concentrically aligned with the temperature measuring hole, and the positioning groove located at the port of the first end face of the temperature measuring hole and coaxial with it, and the output end of the tester being coaxial with the positioning groove when it is located in the positioning groove, the tester and the proximal end face of the first transmission component can be concentrically aligned. This can improve the coupling degree of the infrared signal between the output end of the tester and the proximal end face of the transmission component, reduce the loss of infrared signal energy, and thus reduce the test error. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of this specification, the drawings used in the description of the embodiments of this specification or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram illustrating the working principle of a wafer carrier device according to an embodiment of this disclosure;

[0036] Figure 2 This is a top view of a chuck according to an embodiment of this disclosure;

[0037] Figure 3 This is an example diagram illustrating the working principle of another wafer carrier device in this disclosure embodiment;

[0038] Figure 4 This is a cross-sectional view of an alignment member according to an embodiment of this disclosure.

[0039] Explanation of reference numerals in the attached figures:

[0040] Chuck 100, first end face 110, temperature measuring hole 120, positioning groove 130;

[0041] Transmission component 200, first transmission unit 210, second transmission unit 220;

[0042] Tester 300, output terminal 310;

[0043] Temperature monitor 400;

[0044] Alignment component 500, first channel 510, second channel 520. Detailed Implementation

[0045] As is known from the background art, during the wafer deposition process, temperature changes cause thermal expansion and contraction of the wafer, resulting in thermal stress. Excessive thermal stress may lead to wafer deformation, cracking, or other defects, severely affecting chip performance and reliability. Therefore, it is necessary to monitor the ambient temperature during wafer fabrication.

[0046] In some embodiments, a wafer carrier device is used to fabricate a wafer. The wafer carrier device may include a chuck, a transporter, and a temperature monitor. The chuck has a first end face for carrying the wafer. One end of the transporter is close to the wafer, and the other end of the transporter is connected to the temperature monitor.

[0047] During the wafer deposition process, the end of the transmission device close to the wafer can collect infrared signals corresponding to the temperature of the environment near the wafer, and then transmit them to the temperature monitor via the first end connected to the temperature monitor. The temperature monitor then converts the infrared signals into the corresponding temperature, thereby realizing the monitoring of the temperature of the wafer fabrication environment.

[0048] As can be seen from the above, the monitoring accuracy is related to the transmission performance of the transmission device. If the transmission performance of the transmission device is poor, the monitoring accuracy will be low. Therefore, before using the wafer carrier device to prepare the wafer, the transmission performance of the transmission device needs to be tested.

[0049] To address the aforementioned technical issues, the wafer carrier device in this embodiment can be equipped with a temperature sensing hole and a tester. The temperature sensing hole penetrates the chuck, and the proximal end of the transmission component is inserted into the temperature sensing hole. During testing, the tester provides a test signal corresponding to a preset temperature value to the proximal end face of the transmission component. This test signal can be transmitted to a temperature monitor via the transmission component, and the temperature monitor converts the test signal into a measured temperature value. Based on the preset temperature value and the measured temperature value, it can be determined whether the transmission performance of the transmission component meets the requirements, and whether to replace it with a transmission component with higher transmission performance can be selected, thereby improving monitoring accuracy. Furthermore, by setting the proximal end face of the transmission component to be concentrically aligned with the temperature sensing hole, and a coaxial positioning groove located at the port of the first end face of the temperature sensing hole, and the output end of the tester being coaxial with the positioning groove when located within the positioning groove, the tester and the proximal end face of the first transmission component can be concentrically aligned. This can improve the coupling degree of the test signal between the output end of the tester and the proximal end face of the transmission component, reduce the loss of test signal energy, and thus reduce test errors.

[0050] To make the above-mentioned objectives, features and beneficial effects of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0051] For ease of description and understanding, the near end and far end are first described in the embodiments of this specification. The "near end" refers to the end away from the temperature monitor, and the "far end" is the end adjacent to the temperature monitor.

[0052] Combined with reference Figures 1 to 2 ,in, Figure 1 A schematic diagram illustrating the working principle of a wafer carrier device according to an embodiment of this disclosure is shown. Figure 2 A top view of a chuck according to an embodiment of the present disclosure is shown.

[0053] Continue to combine with reference Figures 1 to 2 In this embodiment, the wafer carrier device may include: a chuck 100, a transmission device 200, a temperature monitor 400, and a tester 300.

[0054] Specifically, the chuck 100 is used to carry the wafer, the tester 300 is used to provide a test signal, such as an infrared signal, corresponding to a preset temperature value, the transmitter 200 is used to transmit the test signal, such as the infrared signal, and the temperature monitor 400 is used to convert the test signal, such as the infrared signal, into a temperature value.

[0055] In one specific implementation, an infrared sensor (such as a thermopile or pyroelectric detector) can be used to detect the infrared radiation emitted by the target object and convert it into an electrical signal (also known as the aforementioned infrared signal). An analog-to-digital converter (ADC) can then be used to convert the analog signal into a digital signal, and according to the blackbody radiation law, the digital signal is converted into a temperature value.

[0056] In one specific implementation, a correspondence table between signals and temperatures can be pre-established, and the temperature value can be obtained by looking up the table.

[0057] In another specific implementation, the temperature value can be calculated using a formula, such as the Stefan-Boltzmann law.

[0058] In some embodiments, the chuck 100 may be a disk-shaped structure, such as a disc-shaped structure. The chuck 100 includes a first end face 110 and a second end face (not shown in the figure). The first end face 110 is the end face that carries the wafer, and the second end face is the end face of the chuck 100 that is opposite to the wafer.

[0059] In some embodiments, the chuck 100 may have a temperature sensing port 120.

[0060] The temperature sensing port 120 penetrates the chuck 100, and its two ports are located on the first end face 110 and the second end face, respectively. This allows the proximal end of the transmission component 200 to enter the temperature sensing port 120 through the port on the second end face. Thus, when the wafer is placed on the first end face 110, the proximal end face of the transmission component 200 is positioned opposite the back face of the wafer, enabling the acquisition of the infrared signal corresponding to the temperature at the back face of the wafer during the wafer deposition process.

[0061] In some embodiments, the outer diameter of the transmission element 200 is adapted to the inner diameter of the temperature measuring hole 120.

[0062] In some embodiments, the proximal end of the transmission element 200 is plugged into the temperature measuring hole 120.

[0063] In some embodiments, the transmission device 200 may be a device such as an optical fiber for transmitting optical signals.

[0064] In some embodiments, the chuck 100 may also have a positioning groove 130.

[0065] The positioning groove 130 is located at the port of the temperature measuring hole 120 at the first end face 110, and is used to determine the relative position of the output end 310 of the tester 300 and the near end face of the transmission member 200.

[0066] Specifically, the radial dimension of the positioning groove 130 is adapted to the radial dimension of the output end 310 of the tester 300. The positioning groove 130 is coaxially arranged with the temperature measuring hole 120. In this way, when the output end 310 of the tester 300 is located in the positioning groove 130, the output end 310 of the tester 300 can be coaxially arranged with the positioning groove 130. Combined with the fact that the proximal end of the transmission member 200 is aligned with the temperature measuring hole 120, the output end 310 of the tester 300 can be coaxially arranged with the proximal end face of the transmission member 200.

[0067] Therefore, it can improve the coupling degree of the test signal between the output terminal 310 of the tester 300 and the near end face of the transmission device 200, reduce the loss of test signal energy, and thus reduce test error.

[0068] In some embodiments, the outer diameter of the output end 310 of the tester 300 can be in the range of [5mm, 10mm], for example 7.6mm; the inner diameter of the positioning groove 130 can be in the range of [5mm, 10mm], for example 7.6mm.

[0069] In some embodiments, the length of the output end 310 of the tester 300 along the axial direction can be in the range of [1mm, 10mm], for example 5.6mm; the length of the positioning groove 130 along the axial direction can be in the range of [1mm, 10mm], for example 2mm.

[0070] In some embodiments, the positioning slot 130 can be plugged into the output terminal 310 of the tester 300.

[0071] In some embodiments, the chuck 100 may also have a heat exchange passage (not shown in the figure).

[0072] The heat exchange channel is located inside the chuck 100, for example, between the first end face 110 and the second end face. The heat exchange channel contains a heat exchange medium, such as pure water. Through heat exchange, the temperature of the first end face 110 of the chuck 100 can be adjusted, thereby adjusting the temperature of the environment near the wafer.

[0073] In some embodiments, the input and output ends 310 of the heat exchange channel are both located on the second end face, which can reduce interference to the first end face 110, thereby reducing interference to the wafer during the wafer film formation process.

[0074] It should be noted that the heat exchange channel can be a passageway opened inside the chuck 100 or a pipeline installed inside the chuck 100.

[0075] In some embodiments, the tester 300 may be a device such as a wavelength tunable module (WTM) that emits an infrared signal corresponding to a preset temperature value.

[0076] In some embodiments, the temperature monitor 400 may be a device that converts infrared signals into temperature values, such as an infrared temperature sensor or an infrared thermometer.

[0077] In some embodiments, the number of temperature measuring holes 120 can be multiple, and the ports of each temperature measuring hole 120 are distributed at intervals on the first end face 110, so that the temperature at multiple points can be monitored simultaneously, thereby improving monitoring efficiency and accuracy.

[0078] In some embodiments, the number of transmission elements 200 and the number of temperature monitors 400 are the same as the number of temperature measuring holes 120, with each transmission element 200 corresponding to one temperature measuring hole 120 and one temperature monitor 400.

[0079] In some embodiments, the wafer carrier may further include a housing.

[0080] The housing has an installation port and a through port. The chuck 100 is located at the installation port of the housing and forms a receiving cavity with the housing. The far end of the transmission component 200 leaves the receiving cavity through the through port and connects to the temperature monitor 400.

[0081] Before fabricating the wafer using the wafer carrier device, the transmission performance of the transmission device 200 is tested.

[0082] As an example of a specific testing method applied to the aforementioned wafer carrier, the testing method may include the following steps:

[0083] S01: Assemble the chuck 100, the transmission component 200, and the temperature monitor 400. The proximal end of the transmission component 200 is inserted into the temperature measuring hole 120. The transmission component 200 is located inside the temperature measuring hole 120, and the proximal end face does not exceed the bottom of the positioning groove 130. The distal end of the transmission component 200 is connected to the temperature monitor 400.

[0084] S02: The output terminal 310 of the tester 300 is inserted and fixed in the positioning slot 130, and a test signal corresponding to a preset temperature value (e.g., 700 degrees Celsius) is provided. The output terminal 310 of the tester 300 is opposite to the near end of the transmission component 200 and is coaxial.

[0085] S03: Read the measured temperature value after conversion by the temperature monitor 400, and compare the difference between the measured temperature value and the preset temperature value with the preset error range.

[0086] Specifically, if the difference between the measured temperature value and the preset temperature value is within the preset error range, the transmission performance of the transmission component 200 is deemed to meet the requirements. If the difference between the measured temperature value and the preset temperature value is outside the preset error range, the transmission performance of the transmission component 200 is deemed to not meet the requirements, and the transmission component 200 needs to be replaced in a timely manner.

[0087] Combined with reference Figures 1 to 4 ,in, Figure 3 A schematic diagram illustrating the working principle of another wafer carrier device in an embodiment of this disclosure is shown; Figure 4 A cross-sectional view of an alignment member according to an embodiment of the present disclosure is shown.

[0088] In some embodiments, the transmission element 200 may include a plurality of transmission units.

[0089] In the wafer fabrication process, each transmission unit is connected in sequence. This allows for the selection and free combination of appropriate transmission components 200 according to actual length requirements, thereby obtaining a transmission component 200 that meets the requirements and improving the reusability of the transmission component 200.

[0090] For ease of description and understanding, the following embodiments of this disclosure will be described in detail using the example of a transmission device 200 comprising two transmission units.

[0091] In some embodiments, the transmission unit 200 may include a first transmission unit 210 and a second transmission unit 220.

[0092] The transmission unit that is plugged into the temperature measuring hole 120 is the first transmission unit 210, the proximal end of the first transmission unit 210 is the proximal end of the transmission component 200, and the transmission unit connected to the temperature monitor 400 is the second transmission unit 220, the distal end of the second transmission unit 220 is the distal end of the transmission component 200.

[0093] It should be noted that the transmission performance of the transmission device 200 depends on the transmission performance of the first transmission unit 210 and the second transmission unit 220. Therefore, the transmission performance of the second transmission unit 220 needs to be tested before the wafer is fabricated using the wafer carrier device.

[0094] In some embodiments, the wafer carrier may further include an alignment member 500.

[0095] The alignment member 500 is a tube structure. When the second transmission unit 220 is tested, the far end of the first transmission unit 210 is separated from the proximal end of the second transmission unit 220. The two ends of the alignment member 500 are respectively connected to the output end 310 of the tester 300 and the proximal end of the second transmission unit 220 to determine the relative position of the output end 310 of the tester 300 and the proximal end face of the second transmission unit 220.

[0096] In some embodiments, the alignment member 500 may have a first channel 510 and a second channel 520.

[0097] Specifically, the radial dimension of the proximal port of the first channel 510 is adapted to the radial dimension of the output terminal 310 of the tester 300, so that when the output terminal 310 of the tester 300 is located within the first channel 510, the proximal port of the first channel 510 is coaxial with the output terminal 310 of the tester 300; the radial dimension of the distal port of the second channel 520 is adapted to the radial dimension of the proximal end of the second transmission unit 220, so that when the proximal end of the second transmission unit 220 is located within the second channel 520, the proximal end of the second transmission unit 220 is coaxial with the second channel 520; the first channel 510 and the second channel 520 are coaxially connected, which allows the output terminal 310 of the tester 300 to be coaxially set with the proximal end of the second transmission unit 220.

[0098] Therefore, it can improve the coupling degree of the test signal between the output terminal 310 of the tester 300 and the near end face of the second transmission unit 220, reduce the loss of test signal energy, and thus reduce test error.

[0099] In some embodiments, the inner diameter of the first channel 510 is larger than the inner diameter of the second channel 520.

[0100] In some embodiments, the outer diameter of the output terminal 310 of the tester 300 can be in the range of [5mm, 10mm], for example 7.6mm; the inner diameter of the first channel 510 can be in the range of [5mm, 10mm], for example 7.6mm.

[0101] In some embodiments, the length of the output terminal 310 of the tester 300 along the axial direction can be in the range of [1mm, 10mm], for example 5.6mm; the length of the first channel 510 along the axial direction can be in the range of [1mm, 10mm], for example 5.4mm.

[0102] In some embodiments, the outer diameter of the proximal end of the second transmission unit 220 can be in the range of [1mm, 3mm], for example 2.5mm; the inner diameter of the second channel 520 can be in the range of [1mm, 3mm], for example 2.5mm.

[0103] In some embodiments, the length of the second channel 520 along the axial direction can be in the range of [5mm, 15mm], for example, 12mm.

[0104] In some embodiments, the radial thickness of the tube corresponding to the first channel 510 can be in the range of [0.5mm, 1.5mm], for example, 1mm.

[0105] In some embodiments, the radial thickness of the tube corresponding to the second channel 520 can be in the range of [0.5mm, 1.5mm], for example 0.9mm.

[0106] In some embodiments, the output terminal 310 of the tester 300 can be plugged into the first channel 510.

[0107] In some embodiments, the proximal end of the second transmission unit 220 can be plugged into the second channel 520.

[0108] In some embodiments, the material of the tube body of the alignment member 500 is selected from one or more of polyethylene, polypropylene, polyvinyl chloride, etc.

[0109] In some embodiments, the inner wall of the alignment member 500 may also have a coating layer.

[0110] The coating layer has a tubular structure, and the material of the coating layer is selected from fluorinated polymers such as polytetrafluoroethylene.

[0111] As an example of a specific testing method applied to the aforementioned wafer carrier, the testing method may include the following steps:

[0112] S11: Assemble the chuck 100, the first transmission unit 210, the second transmission unit 220, and the temperature monitor 400, wherein the proximal end of the first transmission unit 210 is inserted into the temperature measuring hole 120, the distal end of the first transmission unit 210 is connected to the proximal end of the second transmission unit 220, and the distal end of the second transmission unit 220 is connected to the temperature monitor 400.

[0113] S12: The output terminal 310 of the tester 300 is inserted and fixed in the positioning slot 130, and a test signal corresponding to the first preset temperature value (e.g., 700 degrees Celsius) is provided, wherein the output terminal 310 of the tester 300 is opposite to the near end of the first transmission unit 210 and is coaxial.

[0114] S13: Read the first measured temperature value after conversion by the temperature monitor 400, and compare the difference between the first measured temperature value and the first preset temperature value with the first preset error range.

[0115] Specifically, if the difference between the first measured temperature value and the first preset temperature value is within the first preset error range, it is determined that the transmission performance of both the first transmission unit 210 and the second transmission unit 220 meets the requirements, and the test ends without needing to continue with subsequent steps; if the difference between the first measured temperature value and the second preset temperature value is outside the first preset error range, it is determined that the transmission performance of at least one of the first transmission unit 210 and the second transmission unit 220 does not meet the requirements, and step S14 needs to be continued.

[0116] S14: Separate the first transmission unit 210 from the second transmission unit 220.

[0117] S15: The output terminal 310 of the tester 300 and the proximal end of the second transmission unit 220 are respectively connected by the alignment member 500, and a test signal corresponding to the second preset temperature value (e.g., 700 degrees Celsius) is provided, wherein the output terminal 310 of the tester 300 is opposite to the proximal end of the second transmission unit 220 and is coaxial.

[0118] S16: Read the second measured temperature value after conversion by the temperature monitor 400, and compare the difference between the second measured temperature value and the second preset temperature value with the second preset error range.

[0119] Specifically, if the difference between the second measured temperature value and the second preset temperature value is within the second preset error range, it is determined that the transmission performance of the second transmission unit 220 meets the requirements, while the transmission performance of the first transmission unit 210 does not meet the requirements and needs to be replaced; if the difference between the second measured temperature value and the second preset temperature value is outside the second preset error range, it is determined that the transmission performance of the second transmission unit 220 does not meet the requirements and needs to be replaced. After replacing the second transmission unit 220, steps S15 to S16 are continued until the transmission performance of the second transmission unit 220 meets the requirements, and then the test ends.

[0120] In some embodiments, the first preset temperature value and the second preset temperature value may be the same or different.

[0121] In some embodiments, the first preset error range is greater than or equal to the second preset error range.

[0122] It is understandable that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0123] It is understood that "multiple" in this document refers to two or more. The descriptions of the first, second, third, fourth, etc., appearing in the embodiments of this application are only for illustration and to distinguish the described objects, and have no order, nor do they indicate a special limitation on the number of devices in the embodiments of this application, and cannot constitute any limitation on the embodiments of this application.

[0124] It is understood that the above description provides multiple embodiment solutions, and the optional methods described in each embodiment solution can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment solutions, all of which can be considered as the embodiment solutions disclosed in this disclosure.

[0125] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A wafer carrier device, characterized in that, include: A chuck, having: The first end face is used to support the wafer; A temperature measuring hole penetrates the chuck, and a positioning groove is provided at the port of the temperature measuring hole at the first end face. The positioning groove is coaxially arranged with the temperature measuring hole. The tester is used to provide an infrared signal corresponding to a preset temperature value. When the output end of the tester is located in the positioning groove, it is coaxially arranged with the positioning groove. A transmission element is used to transmit the infrared signal provided by the tester. The proximal end of the transmission element is inserted into the temperature measuring hole and is coaxially arranged with the temperature measuring hole. A temperature monitor, connected to the far end of the transmission device, is used to convert the infrared signal transmitted by the transmission device into a measured temperature value.

2. The wafer carrier device according to claim 1, characterized in that, The transmission device includes: A first transmission unit, wherein the proximal end of the first transmission unit is the proximal end of the transmission element; The second transmission unit, the far end of which is the far end of the transmission element; When the far end of the first transmission unit is connected to the near end of the second transmission unit, the output end of the tester is inserted into the positioning slot and concentrically aligned with the temperature measuring hole. When the far end of the first transmission unit is separated from the near end of the second transmission unit, the output end of the tester is concentrically aligned with the near end face of the second transmission unit.

3. The wafer carrier device according to claim 1, characterized in that, Also includes: Alignment element, having: The first channel, the proximal end of which is coaxially connected to the output of the tester; The second channel is coaxially connected to the first channel, and the far end of the second channel is coaxially connected to the near end of the second transmission unit.

4. The wafer carrier device according to claim 3, characterized in that, The first channel is plugged into the output terminal of the tester, and the second channel is plugged into the proximal end of the second transmission unit.

5. The wafer carrier device according to claim 3, characterized in that, The inner diameter of the first channel is larger than the inner diameter of the second channel.

6. The wafer carrier device according to claim 3, characterized in that, The inner diameter of the first channel is greater than 5 mm and less than 10 mm, and the inner diameter of the second channel is greater than 1 mm and less than 3 mm.

7. The wafer carrier device according to claim 1, characterized in that, Also includes: Alignment element, wherein the alignment element is a tubular structure made of polyethylene material; The inner wall of the alignment member has a coating layer, which is a tubular structure formed of a fluoropolymer material.

8. The wafer carrier device according to claim 1, characterized in that, The number of temperature measuring holes is multiple, and the ports of each temperature measuring hole are distributed at intervals on the first end face.

9. The wafer carrier device according to claim 1, characterized in that, The chuck also has: A heat exchange channel is located inside the chuck, wherein a heat exchange medium is contained within the heat exchange channel.

10. The wafer carrier device according to claim 1, characterized in that, Also includes: The housing has a mounting port and a through port, wherein the chuck is located at the mounting port of the housing and forms a receiving cavity with the housing, and the distal end of the transmission member exits the receiving cavity through the through port and is connected to the temperature monitor.

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