Manipulator for semiconductor wafer cassette carrying and air storage equipment
By designing a support frame and grippers, and utilizing belts and drive mechanisms to achieve vertical lifting of the grippers, the problems of large space occupation and inconvenient vertical movement of robotic arms are solved, thus realizing efficient space utilization and convenient operation of robotic arms.
Patent Information
- Application Number
- CN202520343895.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Existing robotic arms occupy a large space and are inconvenient to move vertically when gripping or placing wafer cassettes.
The device employs a support frame and gripper structure, utilizing a belt and drive mechanism to achieve vertical lifting and lowering of the gripper. A servo motor drives the first rotating shaft to rotate, which in turn drives the active and driven wheels to rotate. The belt is wound up or unwound, enabling the gripper to move vertically. The device also clamps the wafer cassette using clamping plates and limit blocks.
This reduces the space occupied by the robotic arm, enables smooth vertical movement of the gripper, and improves the space utilization efficiency and ease of operation of the robotic arm.
Smart Images
Figure CN223790478U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, specifically to a robotic arm used for handling semiconductor wafer cassettes and air storage devices. Background Technology
[0002] With the widespread use of industrial products in daily life, semiconductors have begun to play an increasingly important role in products, and their demand has increased significantly, thus promoting the vigorous development of the global semiconductor market. In order to meet the large demand for integrated circuits, most semiconductor manufacturing companies prioritize increasing production capacity and yield. In semiconductor manufacturing companies, wafers are usually handled in batches by robotic arms.
[0003] In the existing technology, robotic arms for picking up wafer cassettes generally consist of a robotic arm and grippers. The robotic arm is mostly formed by multiple linkages. During the process of picking up or putting down the wafer cassette, it is necessary to move the wafer cassette up or down. When the linkage-type robotic arm rises or falls, the hinge points need to be folded, which increases the space occupied on the plane, resulting in a larger space occupied by the entire device, and it is not convenient for the device to move in the vertical direction. Utility Model Content
[0004] In order to solve the problems in related technologies, this utility model provides a robotic arm for handling semiconductor wafer cassettes and air storage devices. This device solves the problems of the robotic arm occupying a large space and the inconvenience of vertical movement.
[0005] To solve the above problems, the following technical solutions are provided:
[0006] The present invention relates to a robotic arm for handling semiconductor wafer cassettes and air storage devices, comprising a support frame and grippers. The support frame includes a fixed plate with a frame around its perimeter. A drive mechanism for driving the grippers to move vertically is provided between the support frame and the grippers. Two first pulleys are provided on the fixed plate, and the first pulleys are rotatably engaged with the fixed plate. A belt is wound around each of the first pulleys, and the lower end of the belt is fixedly connected to the grippers. A rotation mechanism is provided on the fixed plate for driving the first pulleys to rotate. The rotation mechanism drives the belt to wind up or unwind, thereby causing the grippers to move vertically up and down.
[0007] In the above solution, the belt is used to drive the first pulley to rotate, thereby causing the belt to wind up or unwind, which drives the gripper to rise or fall vertically. This solves the problem of the robot's inconvenience in vertical movement, and the belt-driven gripper lifting and lowering greatly reduces the space occupied by the device.
[0008] The drive mechanism includes a belt, a first rotating shaft, and a second rotating shaft. The first and second rotating shafts are arranged parallel to each other and are both located on a fixed plate. The gripper is located below the fixed plate. A drive wheel is provided in the middle of the first rotating shaft, and a driven wheel adapted to the drive wheel is provided in the middle of the second rotating shaft. The first pulley is located on the first rotating shaft on both sides of the drive wheel. A second pulley is provided on both sides of the driven wheel on the second rotating shaft. A belt is wound on each of the second pulleys, and the other end of the belt is fixedly connected to the gripper. The rotating mechanism is in rotational cooperation with the first rotating shaft.
[0009] In the above scheme, the drive mechanism drives the first rotating shaft to rotate, which in turn drives the driving wheel and the first pulley to rotate. The driving wheel drives the driven wheel to rotate, thereby driving the second rotating shaft to rotate and driving the second pulley to rotate. When both the first pulley and the second pulley rotate, the gripper can be driven to move vertically via the belt.
[0010] The gripper consists of two parallel clamping plates. A 7-shaped connecting plate is located at the upper end of each clamping plate. The vertical part of the 7-shaped connecting plate is fixedly connected to the inner wall of the clamping plate. The horizontal part of the 7-shaped connecting plate has a first groove and a second groove. Multiple first sliders are located within the first groove, and each first slider has a first fixing block. Multiple second sliders are located within the second groove, and each second slider has a second fixing block. A first motor is located in the center of the mounting box. The lead screw of the first motor is arranged vertically upwards, and a gear is mounted on the lead screw. A first rack and a second rack are located on both sides of the gear. Both the first rack and the second rack mesh with the gear. The first rack is fixedly connected to the first slider, and the second rack is fixedly connected to the second slider.
[0011] In the above scheme, by setting up clamping plates, the first motor is turned on, which drives the gear to rotate, thereby driving the first rack and the second rack to move towards each other, so that the two clamping plates are close together, thus clamping the wafer cassette. The first motor drives the gear to rotate in the opposite direction, thereby driving the first rack and the second rack to move away from each other, so that the two clamping plates are far apart, thus lowering the clamped wafer cassette.
[0012] Limiting blocks are provided on both sides of the connecting plate, and the end of the belt located inside the mounting box is fixedly engaged with the limiting block.
[0013] The above solution uses a limit block to fix the belt.
[0014] A pressure block is provided on the inner wall surface of the vertical part of the connecting plate 7, and the pressure block is fixedly engaged with the connecting plate.
[0015] The above scheme uses a clamping block to hold the wafer cassette in place.
[0016] Both inner walls of the clamping plates are provided with a support structure near their edges. The support structure includes a first column and a second column. A first horizontal plate is rotatably connected to the first column, and a second horizontal plate is rotatably connected to the second column. The first and second horizontal plates are arranged in parallel and side by side. A straight plate is provided at the end of the first and second horizontal plates away from the clamping plates. The two ends of the straight plate are respectively hinged to the first and second horizontal plates. A second motor for driving the first horizontal plate to rotate is provided on the first column.
[0017] In the above solution, by setting up a support structure, after the gripper picks up the wafer cassette, the second motor is turned on to drive the first horizontal plate to rotate until the first horizontal plate is perpendicular to the vertical plate, which is used to prevent the wafer cassette from falling during the vertical movement of the gripper.
[0018] The rotating mechanism includes a servo motor, and the first lead screw of the servo motor is fixedly engaged with the first rotating shaft.
[0019] In the above scheme, a servo motor is used to drive the first rotating shaft to rotate.
[0020] The above solution has the following advantages:
[0021] The robotic arm of this invention for handling semiconductor wafer cassettes and air storage devices includes a support frame and grippers. A drive mechanism for driving the grippers to move vertically is provided between the support frame and the grippers. The drive mechanism includes a belt, a first rotating shaft, and a second rotating shaft. A drive wheel is provided in the middle of the first rotating shaft, and a driven wheel adapted to the drive wheel is provided in the middle of the second rotating shaft. First pulleys are provided on both sides of the drive wheel on the first rotating shaft, and second pulleys are provided on both sides of the driven wheel on the second rotating shaft. One end of the belt is located inside the mounting box, and the other end of the belt is wound around the outer wall of the first or second pulley. A servo motor for driving the first rotating shaft to rotate is connected to the first rotating shaft. By setting the belt, the servo motor is turned on, and the servo motor drives the first rotating shaft to rotate, causing the drive wheel and the first pulley to rotate. The drive wheel drives the driven wheel to rotate, thereby driving the second rotating shaft to rotate, which in turn drives the second pulley to rotate. When both the first and second pulleys rotate, the grippers can be driven to move vertically via the belt. Attached Figure Description
[0022] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:
[0023] Figure 1 A schematic diagram of a robotic arm used for handling semiconductor wafer cassettes and air storage devices;
[0024] Figure 2A front view of a robotic arm used for handling semiconductor wafer cassettes and air storage devices;
[0025] Figure 3 Another structural schematic diagram of a robotic arm used for handling semiconductor wafer cassettes and air-to-air storage devices;
[0026] Figure 4 A schematic diagram of the gripper in a robotic hand used for handling semiconductor wafer cassettes and air-to-air storage devices;
[0027] Figure 5 An enlarged schematic diagram of part A of a robotic arm used for handling semiconductor wafer cassettes and air-to-air storage devices;
[0028] Figure 6 An enlarged schematic diagram of part B of the robotic arm used for handling semiconductor wafer cassettes and air-to-air storage devices;
[0029] Explanation of reference numerals in the attached drawings: 1. Support frame; 2. Gripper; 3. Drive mechanism; 4. Fixing plate; 5. Mounting box; 6. Gear; 7. First rack; 8. Second rack; 9. Limiting block; 10. Pressure block; 11. First column; 12. First horizontal plate; 13. Second horizontal plate; 14. Straight plate; 15. Second motor;
[0030] 21. Clamping plate; 22. Connecting plate; 23. First groove; 24. Second groove; 25. First slider; 26. First fixing block; 27. Second slider; 28. Second fixing block;
[0031] 31. Belt; 32. First shaft; 33. Second shaft; 34. Drive pulley; 35. Driven pulley; 36. First pulley; 37. Second pulley; 38. Servo motor. Detailed Implementation
[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0033] In specific embodiment 1, such as Figure 1 , 5As shown, the robotic arm of this utility model for handling semiconductor wafer cassettes and air storage devices includes a support frame 1, a gripper 2, and a drive mechanism 3 for driving the gripper 2 to move vertically. A fixed plate 4 is provided on the support frame 1, the drive mechanism 3 is located on the fixed plate 4, and the gripper 2 is located below the fixed plate 4. A mounting box 5 is provided at the upper end of the gripper 2. The drive mechanism 3 includes a belt 31, a first rotating shaft 32, and a second rotating shaft 33. A drive wheel 34 is provided in the middle of the first rotating shaft 32, and a driven wheel 35 adapted to the drive wheel 34 is provided in the middle of the second rotating shaft 33. First pulleys 36 are provided on both sides of the drive wheel 34 on the first rotating shaft 32, and second pulleys 37 are provided on both sides of the driven wheel 35 on the second rotating shaft 33. A limited... Positioning blocks 9 and limiting blocks 9 are located on both sides of the connecting plate 22. The belt 31 located inside the mounting box 5 is fixedly engaged with the limiting block 9. The other end of the belt 31 is wrapped around the outer wall of the first pulley 36 or the second pulley 37. A servo motor 38 for driving the first rotating shaft 32 is connected to the first rotating shaft 32. The first lead screw of the servo motor 38 is fixedly engaged with the first rotating shaft 32. The servo motor 38 drives the first rotating shaft 32 to rotate, causing the driving wheel 34 and the first pulley 36 to rotate. The driving wheel 34 drives the driven wheel 35 to rotate, thereby driving the second rotating shaft 33 to rotate, which in turn drives the second pulley 37 to rotate. When both the first pulley 36 and the second pulley 37 rotate, the gripper 2 can be moved vertically through the belt 31, thereby realizing the smooth vertical movement of the wafer cassette.
[0034] like Figure 3 , 6 As shown, the gripper 2 consists of two parallel clamping plates 21. A 7-shaped connecting plate 22 is provided at the upper end of each clamping plate 21. The vertical part of the 7-shaped connecting plate 22 is fixedly connected to the inner wall of the clamping plate 21. The horizontal part of the 7-shaped connecting plate 22 has a first groove 23 and a second groove 24. Multiple first sliders 25 are provided in the first groove 23, and first fixing blocks 26 are provided on the multiple first sliders 25. Multiple second sliders 27 are provided in the second groove 24, and second fixing blocks 28 are provided on the multiple second sliders 27. A first motor is provided in the middle of the mounting box 5, and the lead screw of the first motor is arranged vertically upwards. A gear 6 is mounted on the lead screw, and a first rack 7 and a second rack 8 are mounted on both sides of the gear 6. Both the first rack 7 and the second rack 8 mesh with the gear 6. The first rack 7 is fixedly connected to the first slider 25, and the second rack 8 is fixedly connected to the second slider 27. When the first motor is turned on, the gear 6 is driven to rotate, thereby driving the first rack 7 and the second rack 8 to move towards each other, so that the two clamping plates 21 are brought closer together, thus clamping the wafer cassette. When the first motor drives the gear 6 to rotate in the opposite direction, the first rack 7 and the second rack 8 are driven to move away from each other, so that the two clamping plates 21 are moved away from each other, thus lowering the clamped wafer cassette.
[0035] In a specific embodiment 2, such as Figure 2 As shown, the difference between this embodiment and embodiment 1 is that the connecting plate 22 in this embodiment is provided with a pressure block 10. The pressure block 10 is located on the inner wall surface of the vertical part of the connecting plate 227. The pressure block 10 and the connecting plate 22 are fixedly engaged. The pressure blocks 10 on both sides are used to clamp the wafer cassette.
[0036] In a specific embodiment 3, such as Figure 4 As shown, the difference between this embodiment and embodiments 1 and 2 is that, in this embodiment, the inner walls of the two clamping plates 21 are provided with support structures near the edges. The support structure includes a first column 11 and a second column. A first horizontal plate 12 is rotatably connected to the first column 11, and a second horizontal plate 13 is rotatably connected to the second column. The first horizontal plate 12 and the second horizontal plate 13 are arranged in parallel side by side. A straight plate 14 is provided at the end of the first horizontal plate 12 and the second horizontal plate 13 away from the clamping plate 21. The two ends of the straight plate 14 are respectively hinged to the first horizontal plate 12 and the second horizontal plate 13. A second motor 15 is provided on the first column 11 for driving the first horizontal plate 12 to rotate. After the gripper 2 clamps the wafer cassette, the second motor 15 is turned on to drive the first horizontal plate 12 to rotate until the first horizontal plate 12 is perpendicular to the straight plate 14, which is used to prevent the wafer cassette from falling during the vertical movement of the gripper 2.
[0037] During operation, the second motor 15 is first turned on to drive the first horizontal plate 12 to rotate, so that the first horizontal plate 12 is arranged parallel to the straight plate 14. The servo motor 38 is turned on to drive the gripper 2 to move vertically downward until the gripper 2 is above the wafer cassette. The first motor is then turned on, and the lead screw of the first motor drives the gear 6 to rotate, thereby driving the first rack 7 and the second rack 8 to move towards each other, so that the two grippers 21 are close together until the pressure block 10 abuts against the outer wall of the wafer cassette. At the same time, the servo motor 38 drives the gripper 2 to move vertically upward, while the second motor 15 drives the first horizontal plate 12 to rotate until the first horizontal plate 12 is perpendicular to the straight plate 14, which can prevent the wafer cassette from falling during the vertical movement of the gripper 2. The servo motor 38 then moves the gripper 2 to the appropriate position.
[0038] In the description of this utility model, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise specified and limited, it should be noted that the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components, and can be direct connections or indirect connections through an intermediate medium. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0039] Obviously, the above embodiments are merely examples for clear illustration and are not intended to limit the implementation. For those skilled in the art, other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all implementation methods here, and any obvious variations or modifications derived therefrom are still within the protection scope of this utility model.
Claims
1. A robotic arm for handling semiconductor wafer cassettes and air-to-air storage devices, comprising a support frame (1) and grippers (2), wherein the support frame (1) includes a fixing plate (4) and a frame is provided around the fixing plate (4), characterized in that, A drive mechanism (3) for driving the gripper (2) to move vertically is provided between the support frame (1) and the gripper (2). The fixed plate (4) is provided with at least two first pulleys (36). The first pulleys (36) are rotated with the fixed plate (4). Each of the first pulleys (36) is wound with a belt (31). The lower end of the belt (31) is fixedly connected to the gripper (2). The fixed plate (4) is provided with a rotating mechanism for driving the first pulleys (36) to rotate. The rotating mechanism drives the belt (31) to wind up or unwind, thereby driving the gripper (2) to rise and fall vertically.
2. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 1, characterized in that, The drive mechanism (3) includes a belt (31), a first rotating shaft (32) and a second rotating shaft (33). The first rotating shaft (32) and the second rotating shaft (33) are arranged in parallel and are both located on the fixed plate (4). The gripper (2) is located below the fixed plate (4). A drive wheel (34) is provided in the middle of the first rotating shaft (32). A driven wheel (35) adapted to the drive wheel (34) is provided in the middle of the second rotating shaft (33). The first pulley (36) is located on the first rotating shaft (32) on both sides of the drive wheel (34). A second pulley (37) is provided on both sides of the driven wheel (35) on the second rotating shaft (33). A belt (31) is wound on each of the second pulleys (37). The other end of the belt (31) is fixedly connected to the gripper (2). The rotating mechanism is in rotational cooperation with the first rotating shaft (32).
3. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 2, characterized in that, The gripper (2) consists of two parallel clamping plates (21). The upper end of each clamping plate (21) is provided with a 7-shaped connecting plate (22). The vertical part of the 7-shaped connecting plate (22) is fixedly connected to the inner wall of the clamping plate (21). The horizontal part of the 7-shaped connecting plate (22) is provided with a first groove (23) and a second groove (24). Multiple first sliders (25) are provided in the first groove (23), and a first fixing block (26) is provided on each of the multiple first sliders (25). Multiple second sliders (27) are provided in the second groove (24). A second fixing block (28) is provided on the second slider (27); a mounting box (5) is provided at the upper end of the gripper (2), a first motor is provided in the middle of the mounting box (5), the lead screw of the first motor is arranged vertically upward, a gear (6) is provided on the lead screw, a first rack (7) and a second rack (8) are provided on both sides of the gear (6), the first rack (7) and the second rack (8) mesh with the gear (6), the first rack (7) is fixedly connected to the first slider (25), and the second rack (8) is fixedly connected to the second slider (27).
4. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 3, characterized in that, Limiting blocks (9) are provided on both sides of the connecting plate (22), and the belt (31) is fixedly engaged with the limiting blocks (9).
5. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 3, characterized in that, A pressure block (10) is provided on the inner wall surface of the 7-shaped vertical part of the connecting plate (22), and the pressure block (10) is fixedly engaged with the connecting plate (22).
6. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 3, characterized in that, The inner walls of the two clamping plates (21) are provided with support structures near the edges. The support structures include a first column (11) and a second column. A first horizontal plate (12) is rotatably connected to the first column (11), and a second horizontal plate (13) is rotatably connected to the second column. The first horizontal plate (12) and the second horizontal plate (13) are arranged in parallel. A straight plate (14) is provided at the end of the first horizontal plate (12) and the second horizontal plate (13) away from the clamping plate (21). The two ends of the straight plate (14) are respectively hinged to the first horizontal plate (12) and the second horizontal plate (13). A second motor (15) for driving the first horizontal plate (12) to rotate is provided on the first column (11).
7. The robotic arm for semiconductor wafer cassette handling and over-the-air storage equipment as described in claim 1, characterized in that, The rotating mechanism includes a servo motor (38), and the first lead screw of the servo motor (38) is fixedly engaged with the first rotating shaft (32).