Computer mainframe box structure

By increasing the number of fans and optimizing their layout on the graphics card, combined with a support plate and I/O bracket, the problem of unstable graphics card mounting was solved, the heat dissipation efficiency of the graphics card was improved, and a stable connection between the graphics card and the motherboard was ensured.

CN223796889UActive Publication Date: 2026-01-13GUANGZHOU TIAN BO COMPUTER EQUIP CO LTD
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Patent Information

Application Number
CN202520170933.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-25
Publication Date
2026-01-13
Estimated Expiration
2035-01-25

AI Technical Summary

Technical Problem

Existing cooling devices are prone to loosening when fixing graphics cards, and cannot effectively support the weight of the graphics card, resulting in unstable cooling performance and possibly damaging the graphics card and motherboard.

Method used

The system employs a multi-fan air-cooling structure, combined with a support plate and I/O bracket, to vertically mount the graphics card, increasing the number and layout of fans and improving heat dissipation efficiency.

Benefits of technology

By increasing the number of fans and optimizing their layout, the heat dissipation efficiency of the graphics card is improved, preventing loose motherboard connectors and ensuring a stable connection between the graphics card and the heatsink, thus preventing damage.

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Abstract

The utility model discloses a computer host case structure, relates to the technical field of computer cases, and provides the following scheme aiming at the problem that a fixed interface on a mainboard is easy to loosen along with the increase of service time because a graphics card is heavier in the prior art: the computer host case structure comprises a case shell, and heat dissipation mechanisms are arranged at the bottom, the back surface and the top of the case shell; the computer case comprises a case shell, a supporting plate is connected to one side of a surrounding plate, a heat dissipation mechanism is arranged in the case shell, the heat dissipation mechanism is an air cooling heat dissipation structure composed of a plurality of sets of fans, a first installation frame is erected at the bottom of the case shell, an IO support is installed on the first installation frame, and the IO support is horizontally arranged at the bottom of the case shell and used for vertically installing a display card. The gravity of the supporting plate can be effectively shared by the supporting plate, and the mainboard interface is prevented from loosening.
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Description

Technical Field

[0001] This utility model relates to the field of computer chassis technology, and in particular to a computer host chassis structure. Background Technology

[0002] As computer performance continues to improve, the heat dissipation of computer hosts is receiving increasing attention. For some high-end computers, the graphics card is large in size and weight. However, existing cooling devices mainly rely on the limited interfaces and simple fixing structures on the motherboard to fix the graphics card. Due to the weight of the graphics card, the fixing interfaces on the motherboard are prone to loosening as the usage time increases. Moreover, the traditional heatsink structure itself may not be able to withstand the weight of the graphics card well, resulting in unstable connection between the graphics card and the heatsink, affecting the heat dissipation effect of the graphics card, and may even damage the graphics card and the motherboard. Utility Model Content

[0003] The computer host chassis structure proposed in this utility model solves the existing problems.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a computer host chassis structure, including a chassis shell, wherein the bottom, back and top of the chassis shell are provided with heat dissipation mechanisms, and the heat dissipation mechanisms are air-cooled heat dissipation structures composed of several sets of fans; a first mounting bracket is mounted on the bottom of the chassis shell, and an I / O bracket is mounted on the first mounting bracket; the I / O bracket is horizontally arranged at the bottom of the chassis shell for vertical mounting of the graphics card.

[0005] Preferably, the chassis shell includes a side panel, a first sealing plate and a second sealing plate, and a support plate is connected to one side of the side panel, and a computer motherboard is installed on one side of the support plate. The first sealing plate and the second sealing plate are connected to the upper and lower ends of the side panel.

[0006] Preferably, a surrounding plate is vertically connected to the upper outer periphery of the chassis shell, and a first ventilation hole is opened inside the surrounding plate. A ventilation mesh plate is connected inside the first sealing plate and the second sealing plate, and a dustproof mesh is connected to the outside of the ventilation mesh plate. A first mounting bracket is connected to the upper end of the second sealing plate.

[0007] Preferably, the support plate is connected to the surrounding plate on both sides, and the support plate has mounting holes inside, with a first fan connected to one side of the upper end of the support plate.

[0008] Preferably, the heat dissipation mechanism includes a second mounting bracket and a third mounting bracket. The first mounting bracket has a trapezoidal frame structure and multiple second ventilation holes are provided inside the first mounting bracket. A second sealing plate is connected around the lower end of the first mounting bracket, and two second fans are connected inside the first mounting bracket.

[0009] Preferably, the second mounting bracket is a rectangular frame structure, the upper end of the second mounting bracket is connected to a second sealing plate, and the interior of the second mounting bracket is connected to a third fan.

[0010] Preferably, a side panel is connected to one side of the third mounting bracket, and three fourth fans are connected vertically and parallel to each other inside the third mounting bracket.

[0011] The beneficial effects of this utility model are as follows: the device has a support plate connected to one side of the enclosure, which enables the support plate to effectively share the weight of the support plate and prevent the motherboard interface from becoming loose; at the same time, the fourth fan, the third fan and the second fan are installed on one side of the graphics card and on the corresponding upper and lower parts, which increases the number of fans installed in the host, thereby improving the heat dissipation efficiency of the host and allowing the heat inside the host to be dissipated more quickly. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 This is a schematic diagram showing the disassembly of the chassis shell of this utility model.

[0014] Figure 3 This is a schematic diagram showing the disassembly of the support plate of this utility model.

[0015] Figure 4 This is a disassembly diagram of the heat dissipation mechanism of this utility model.

[0016] Figure 5 This is a schematic diagram of the internal structure of the chassis shell of this utility model.

[0017] The diagram is labeled as follows: 1. Chassis outer shell; 101. Enclosure panel; 102. First sealing plate; 103. Second sealing plate; 104. First ventilation hole; 105. Ventilation mesh plate; 106. Dustproof mesh; 2. Support plate; 201. Mounting hole; 202. First fan; 3. Graphics card; 4. Cooling mechanism; 401. First mounting bracket; 402. Second mounting bracket; 403. Third mounting bracket; 404. Second ventilation hole; 405. Second fan; 406. Third fan; 407. Fourth fan; 5. I / O bracket. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-5A computer chassis structure includes a chassis shell 1. The bottom, back, and top of the chassis shell 1 are provided with heat dissipation mechanisms 4, and the heat dissipation mechanisms 4 are air-cooled heat dissipation structures composed of several sets of fans. The bottom of the chassis shell 1 is provided with a first mounting bracket 401, and an I / O bracket 5 is mounted on the first mounting bracket 401. The I / O bracket 5 is horizontally set at the bottom of the chassis shell 1 for vertical mounting of a graphics card 3. The I / O bracket 5 is mounted at the bottom of the chassis shell 1, which improves the stability of the support for the graphics card 3. In addition, fans are added to the bottom and the back where the original I / O bracket is installed, which further improves the heat dissipation effect.

[0020] Reference Figure 2 The upper outer perimeter of the chassis shell 1 is vertically connected to a partition plate 101, and a first ventilation hole 104 is provided inside the partition plate 101. A ventilation mesh plate 105 is connected inside the first sealing plate 102 and the second sealing plate 103, and a dustproof mesh 106 is connected to the outside of the ventilation mesh plate 105. A first mounting bracket 401 is connected to the upper end of the second sealing plate 103. The first sealing plate 102 and the second sealing plate 103 are connected to each other through the partition plate 101 to accommodate and protect the various computer components inside. At the same time, the first sealing plate 102 is provided inside the partition plate 101, and the ventilation mesh plate 105 is connected inside the first sealing plate 102 and the second sealing plate 103 so that the internal air can circulate and heat can be dissipated.

[0021] Reference Figure 3 The support plate 2 is a square folded plate structure. The two sides of the support plate 2 are connected to the surrounding plate 101. The support plate 2 has mounting holes 201 inside, and the computer motherboard is connected inside the mounting holes 201. The first fan 202 is connected to the upper side of the support plate 2. The two sides of the mounting holes 201 are connected to one side of the surrounding plate 101 respectively. The computer motherboard is fixed through the mounting holes 201, and the first fan 202 is fixed to the upper side of the support plate 2.

[0022] Reference Figure 4 , Figure 5The heat dissipation mechanism 4 includes a first mounting bracket 401, a second mounting bracket 402, and a third mounting bracket 403. The first mounting bracket 401 has a trapezoidal frame structure and multiple second ventilation holes 404 are opened inside the first mounting bracket 401. A second sealing plate 103 is connected to the lower part of the first mounting bracket 401. Two second fans 405 are connected inside the first mounting bracket 401, and the two second fans 405 correspond to the graphics card 3 and the motherboard inside the chassis. The second mounting bracket 402 has a rectangular frame structure, and a second sealing plate 103 is connected to the upper part of the second mounting bracket 402. A third fan 406 is connected inside 402, and the third fan 406 also corresponds to the graphics card 3. A side panel 101 is connected to one side of the third mounting bracket 403, and three fourth fans 407 are connected vertically inside the third mounting bracket 403. By installing the third fan 406, the second fan 405 and the fourth fan 407 on the top, bottom and one side of the graphics card 3 and the computer motherboard respectively, when the computer host is running, each fan rotates according to the set direction, drawing the internal heat out from different directions and layers, so that the heat can be quickly dissipated and the heat dissipation efficiency is improved.

[0023] Working principle: First, during host assembly, the upper end of the chassis shell 1 is connected to the second sealing plate 103, the upper end of the second sealing plate 103 is connected to the surrounding plate 101, and the upper end of the surrounding plate 101 is connected to the first sealing plate 102. The support plate 2 is fixed to one side of the surrounding plate 101 with screws. Then, the computer motherboard is installed in the mounting hole 201 inside the support plate 2. The graphics card 3 is vertically installed on the IO bracket 5 and simultaneously plugged into the socket on the computer motherboard. The second fan 405 is installed inside the first mounting bracket 401, and the second mounting bracket 402 is connected to the lower part of the second sealing plate 103. The third fan 406 is installed inside the second mounting bracket 402. The first mounting bracket 401 is installed above the second sealing plate 103. The fourth fan 407 is connected to the inside of the third mounting bracket 403. The third mounting bracket 403 is installed to one side of the surrounding plate 101. When the host is running, the third fan 406, the second fan 405, and the fourth fan 407 are started and rotated in the set direction, so that the heat can be quickly circulated and dissipated.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A computer chassis structure, comprising a chassis shell (1), characterized in that, The bottom, back and top of the chassis shell (1) are provided with heat dissipation mechanism (4), and the heat dissipation mechanism (4) is a wind-cooled heat dissipation structure composed of several sets of fans. The bottom of the chassis shell (1) is provided with a first mounting bracket (401), and an IO bracket (5) is installed on the first mounting bracket (401). The IO bracket (5) is horizontally set at the bottom of the chassis shell (1) for vertical installation of the graphics card (3).

2. The computer host chassis structure according to claim 1, characterized in that, The chassis shell (1) includes a side panel (101), a first sealing plate (102) and a second sealing plate (103), and a support plate (2) is connected to one side of the side panel (101), and a computer motherboard is installed on one side of the support plate (2). The first sealing plate (102) and the second sealing plate (103) are connected to the upper and lower ends of the side panel (101).

3. The computer host chassis structure according to claim 2, characterized in that, The outer periphery of the upper end of the chassis shell (1) is vertically connected to a partition plate (101), and a first ventilation hole (104) is opened inside the partition plate (101). A ventilation mesh plate (105) is connected inside the first sealing plate (102) and the second sealing plate (103), and a dustproof mesh (106) is connected to the outside of the ventilation mesh plate (105). A first mounting bracket (401) is connected to the upper end of the second sealing plate (103).

4. A computer host chassis structure according to claim 2, characterized in that, The support plate (2) is connected to the surrounding plate (101) on both sides, and the support plate (2) has an installation hole (201) inside. A first fan (202) is connected to one side of the upper end of the support plate (2).

5. A computer host chassis structure according to claim 1, characterized in that, The heat dissipation mechanism (4) includes a second mounting bracket (402) and a third mounting bracket (403). The first mounting bracket (401) has a trapezoidal frame structure and multiple second ventilation holes (404) are provided inside the first mounting bracket (401). A second sealing plate (103) is connected around the lower end of the first mounting bracket (401). Two second fans (405) are connected inside the first mounting bracket (401).

6. A computer host chassis structure according to claim 5, characterized in that, The second mounting bracket (402) is a rectangular frame structure. The upper end of the second mounting bracket (402) is connected to a second sealing plate (103), and the interior of the second mounting bracket (402) is connected to a third fan (406).

7. A computer host chassis structure according to claim 5, characterized in that, The third mounting bracket (403) is connected to a side panel (101), and three fourth fans (407) are connected inside the third mounting bracket (403) in parallel vertical connection.