High-precision lead frame mechanism

Abstract

The utility model relates to the related technical field of lead frames, in particular to a high-precision lead frame mechanism, which comprises a bottom plate, a lifting mechanism is arranged on the surface of the bottom plate, and a mounting mechanism is arranged on the surface of the lifting mechanism. According to the high-precision lead frame mechanism, through the arrangement of the lifting mechanism, when parts in the mounting mechanism need to be lifted through the lifting mechanism, an external control system sends an instruction to a motor, the motor is powered on and started, an output shaft rotates in the preset direction, and due to the fact that the motor is rigidly connected with a lead screw, the lead screw synchronously rotates along with the motor; precision threads on the surface of the screw rod interact with a matched thread structure in the sliding block to achieve relative displacement, meanwhile, the auxiliary rod parallel to the screw rod is fixed to the upper portion of the bottom plate, the sliding block is tightly arranged on the auxiliary rod in a sleeving mode, the guiding and supporting effects are achieved, the sliding block is prevented from rotating, and the motion trail precision is guaranteed.

Description

Technical Field

[0001] This utility model relates to the technical field of lead frame, and in particular to a high-precision lead frame mechanism. Background Technology

[0002] The lead frame is the chip carrier of integrated circuits and a key electronic packaging material. In the early days of integrated circuit development, electronic packaging technology was relatively simple. At that time, due to the low integration density and relatively simple functions of chips, the requirements for lead frames were not high. Lead frames were mainly made of simple metal sheets through basic processing techniques such as stamping. In terms of materials, ordinary metal materials such as pure copper were often used in the early stages. However, pure copper has certain shortcomings, such as insufficient strength, and is prone to deformation in some complex packaging environments, affecting the packaging quality and subsequent use of the chip. In terms of processing technology, although stamping can initially meet the forming requirements of lead frames, precision... Due to limitations in precision, as chip size continues to shrink and the number of pins increases, this simple stamping process is insufficient to meet high-precision requirements, leading to problems such as uneven pin spacing and insufficient chip socket flatness. With the rapid advancement of chip manufacturing technology, chip integration is becoming increasingly higher, functions are becoming increasingly complex, and sizes are becoming smaller. This requires lead frames to have higher precision to adapt to smaller chip sizes and denser pin distributions. For example, in the packaging of some high-end processor chips, the pin spacing has been reduced to the sub-millimeter level, which places extremely high demands on the manufacturing precision of lead frames. Therefore, a high-precision lead frame mechanism is particularly needed.

[0003] However, traditional leadframe mechanisms, due to their fixed height, make complex packaging processes, such as multi-layer chip stacking, extremely complicated. This is because each chip layer needs to be precisely connected to the corresponding leadframe section during chip stacking. A fixed-height leadframe mechanism cannot easily adjust the leadframe to a suitable height to fit each chip layer, increasing the complexity of the packaging and the probability of errors. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision lead frame mechanism to address the existing high-precision lead frame mechanism mentioned in the background art. However, due to its fixed height, the traditional lead frame mechanism makes the entire packaging process extremely complicated for complex processes that require operation on different height planes, such as multi-layer chip stacking. This is because each chip layer needs to be precisely connected to the corresponding lead frame part during chip stacking. The fixed-height lead frame mechanism cannot easily adjust the lead frame to a suitable height to fit each chip layer, increasing the complexity of packaging and the probability of errors.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision lead frame mechanism, including a base plate, a support leg fixedly connected to the bottom of the base plate, a foot pad fixedly connected to the bottom of the support leg, a lifting mechanism provided on the surface of the base plate, a top frame provided above the lifting mechanism, and an installation mechanism provided on the surface of the lifting mechanism.

[0006] The lifting mechanism includes a motor support plate, a motor, a lead screw, an auxiliary rod, a slider, a slide rail support, and a slide groove. The motor support plate is fixedly connected to the bottom of the base plate, and the motor is installed inside the motor support plate. The lead screw is fixedly connected to the output end of the motor. An auxiliary rod is fixedly connected to the top of the base plate. Sliders are slidably connected to the surfaces of both the lead screw and the auxiliary rod. A slide rail support is fixedly connected to the top of the base plate. A slide groove is formed on the surface of the slide rail support. An installation mechanism is provided at one end of the slider.

[0007] Preferably, the support legs are symmetrically arranged at the four corners of the bottom of the base plate with respect to the central axis of the base plate, and the foot pads are evenly distributed on the bottom surface of each set of support legs.

[0008] Preferably, the motor and the lead screw cooperate to form a rotating structure, and the slider slides on the surface of the lead screw and the auxiliary rod via the motor.

[0009] Preferably, the position of the slider corresponds to the position of the groove, and the outer wall size of the slider matches the inner wall size of the groove.

[0010] Preferably, the installation mechanism includes a connecting plate, a platform, a lead frame material box, a mounting block, a positioning hole, a telescopic spring, a stop block, a fixing rod, and mounting holes. One end of the slider is fixedly connected to the connecting plate, and the bottom side of one side of the connecting plate is fixedly connected to the platform. The lead frame material box is installed on the top of the platform, and the mounting block is fixedly connected to the surface of the lead frame material box. A positioning hole is opened inside the mounting block, and a telescopic spring is fixedly connected to the outside of the positioning hole. One end of the telescopic spring is fixedly connected to the stop block, and the inner end of the stop block is fixedly connected to the fixing rod. Mounting holes are opened on the surfaces of both the connecting plate and the platform.

[0011] Preferably, four sets of mounting blocks are provided on the surface of the lead frame box, with two sets of mounting blocks installed above the connecting plate and the other two sets of mounting blocks installed on the surface of the platform.

[0012] Preferably, the position of the positioning hole corresponds to the position of the mounting hole, and the outer wall dimension of the fixing rod matches the inner wall dimension of both the positioning hole and the mounting hole.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This high-precision lead frame mechanism, through the setting of the lifting mechanism, when it is necessary to use the lifting mechanism to realize the lifting action of the parts in the installation mechanism, firstly, the external control system sends the corresponding operation command to the motor. After receiving the command, the motor is powered on and starts, and its output shaft begins to rotate stably in the preset direction. The output end of the motor is rigidly fixedly connected to the lead screw, so the lead screw will move synchronously with the rotation of the motor. The surface of the lead screw is made with precision threads, and the slider that matches it has a matching thread structure inside. The two achieve relative displacement through thread transmission. At the same time, the auxiliary rod is parallel to the lead screw and fixedly connected to the top of the base plate. The slider is tightly fitted on the auxiliary rod. The auxiliary rod plays a key guiding and supporting role, ensuring that the slider can only make smooth linear movements along the axis of the auxiliary rod when the lead screw rotates, effectively preventing the slider from following the lead screw's rotation and ensuring high precision of the movement trajectory. Since one end of the slider is directly connected to the installation mechanism, as the lead screw continues to rotate, the slider will move according to the lead screw's rotation. The lifting and lowering of the slider is determined by the direction of the screw thread and the rotation direction of the motor. For example, if the screw uses a common right-hand thread, when the motor rotates clockwise, driving the screw to rotate clockwise, the slider rises along the auxiliary rod under the meshing action of the thread, thereby driving the mounting mechanism and its internal parts to rise synchronously. Conversely, when the motor rotates counterclockwise, the screw rotates counterclockwise, and the slider slides down along the auxiliary rod, realizing the descent of the parts inside the mounting mechanism. During the entire lifting and lowering process, the slide rail support and its surface groove also play an indispensable role. The slide rail support is firmly fixed above the base plate, and the width of the groove is precisely matched with the end size of the slider. When the slider moves, its end always slides smoothly and unobstructed within the groove. This not only further limits the movement path of the slider, ensuring that it can only lift and lower according to the design requirements, avoiding deviation of the slider from the predetermined track due to external interference, vibration, or other factors, but also enhances the stability of the entire lifting and lowering process, ensuring that the parts inside the mounting mechanism can achieve smooth lifting and lowering under high precision requirements, realizing a complex packaging process that can operate on different height planes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the left side view of the appearance of this utility model;

[0015] Figure 2 This is a schematic diagram of the right side view of the appearance of this utility model;

[0016] Figure 3 This is a schematic diagram of the lifting mechanism of this utility model;

[0017] Figure 4 This is a schematic diagram of the installation mechanism of this utility model.

[0018] In the diagram: 1. Base plate; 2. Support leg; 3. Foot pad; 4. Lifting mechanism; 401. Motor support plate; 402. Motor; 403. Lead screw; 404. Auxiliary rod; 405. Slider; 406. Slide rail support; 407. Slide groove; 5. Top frame; 6. Installation mechanism; 601. Connecting plate; 602. Platform; 603. Lead wire frame box; 604. Mounting block; 605. Positioning hole; 606. Telescopic spring; 607. Stop block; 608. Fixing rod; 609. Mounting hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides a technical solution: a high-precision lead frame mechanism, including a base plate 1, a support leg 2 fixedly connected to the bottom of the base plate 1, a foot pad 3 fixedly connected to the bottom of the support leg 2, a lifting mechanism 4 provided on the surface of the base plate 1, a top frame 5 provided above the lifting mechanism 4, and an installation mechanism 6 provided on the surface of the lifting mechanism 4.

[0021] The lifting mechanism 4 includes a motor support plate 401, a motor 402, a lead screw 403, an auxiliary rod 404, a slider 405, a slide rail support 406, and a slide groove 407. The motor support plate 401 is fixedly connected to the bottom of the base plate 1. The motor 402 is installed inside the motor support plate 401. The lead screw 403 is fixedly connected to the output end of the motor 402. The auxiliary rod 404 is fixedly connected to the top of the base plate 1. The slider 405 is slidably connected to the surfaces of both the lead screw 403 and the auxiliary rod 404. The slide rail support 406 is fixedly connected to the top of the base plate 1. The slide rail support 406 has a slide groove 407 on its surface. One end of the slider 405 is provided with an installation mechanism 6. Through the setting of the lifting mechanism 4, when it is necessary to use the lifting mechanism 4 to move the parts inside the installation mechanism 6... During the lifting and lowering operation, firstly, the external control system sends a corresponding operating command to the motor 402. After receiving the command, the motor 402 is powered on and starts, and its output shaft begins to rotate stably in a preset direction. The output end of the motor 402 is rigidly fixedly connected to the lead screw 403, so the lead screw 403 will move synchronously with the rotation of the motor 402. The surface of the lead screw 403 is made of precision threads, and the slider 405 that mates with it has a matching thread structure inside. The two achieve relative displacement through thread transmission. At the same time, the auxiliary rod 404 is parallel to the lead screw 403 and fixedly connected above the base plate 1. The slider 405 is tightly fitted on the auxiliary rod 404. The auxiliary rod 404 plays a key guiding and supporting role, ensuring that the slider 405 rotates with the lead screw 403. During rotation, the slider 405 can only move smoothly in a straight line along the axis of the auxiliary rod 404, effectively preventing the slider 405 from rotating with the lead screw 403, thus ensuring high precision of the motion trajectory. Since one end of the slider 405 is directly connected to the mounting mechanism 6, as the lead screw 403 continues to rotate, the slider 405 will rise and fall according to the thread direction of the lead screw 403 and the rotation direction of the motor 402. For example, if the lead screw 403 uses a common right-hand thread, when the motor 402 rotates clockwise, driving the lead screw 403 to rotate clockwise, the slider 405 will rise along the auxiliary rod 404 under the meshing action of the thread, thereby driving the mounting mechanism 6 and its internal parts to rise synchronously; conversely, when the motor 402 rotates counterclockwise, the lead screw 403 rotates counterclockwise, and the slider 405 will rise and fall according to the thread direction of the lead screw 403 and the rotation direction of the motor 402. 5 will slide downwards along the auxiliary rod 404 to realize the descent operation of the parts in the installation mechanism 6. During the entire lifting process, the slide rail support 406 and the slide groove 407 on its surface also play an indispensable role. The slide rail support 406 is firmly fixed above the base plate 1. The width of the slide groove 407 is precisely matched with the end size of the slider 405. When the slider 405 moves, its end always slides smoothly and without obstruction in the slide groove 407. This not only further limits the movement path of the slider 405, so that it can only be lifted and lowered according to the design requirements, avoiding the slider 405 from deviating from the predetermined track due to external interference, vibration and other factors, but also enhances the stability of the entire lifting process, ensuring that the parts in the installation mechanism 6 can achieve smooth lifting and lowering under high precision requirements.

[0022] Furthermore, the support legs 2 are symmetrically arranged at the four corners of the bottom of the base plate 1 along the central axis of the base plate 1, and the foot pads 3 are evenly distributed on the bottom surface of each set of support legs 2. Through the arrangement of the support legs 2 and foot pads 3, on the one hand, a stable and reliable support foundation can be provided for the entire high-precision lead frame mechanism, ensuring that the mechanism will not easily shake or shift even when subjected to certain vibrations and impacts during the production and assembly of electronic components. For example, when the automated production line is running at high speed, the vibration generated by adjacent equipment will not interfere with the precision operation of the lead frame mechanism. On the other hand, the evenly distributed foot pads 3 can increase the contact area with the support plane, effectively distribute the overall weight of the mechanism, reduce the pressure on the placement plane, prevent indentations from being left on some relatively fragile workbenches, and further improve the stability of the mechanism when it is placed, creating a stable environment for high-precision component lifting and other operations.

[0023] Furthermore, the motor 402 and the lead screw 403 cooperate to form a rotating structure, and the slider 405 slides on the surfaces of the lead screw 403 and the auxiliary rod 404 via the motor 402. Through the arrangement of the motor 402 and the lead screw 403, precise and controllable power transmission and motion conversion are achieved. As a power source, the motor 402 can accurately adjust the speed and direction according to the instructions of the external control system, efficiently converting electrical energy into rotational mechanical energy and transmitting it to the lead screw 403. The lead screw 403, with its precision thread and cooperation with the slider 405, converts the rotational motion into the linear lifting motion of the slider 405, thereby driving the parts in the mounting mechanism 6 to adjust their height according to the preset trajectory and speed. This precise power and motion control enables the accurate delivery of chips and other components to the required height position in the electronic component packaging process, meeting the dual requirements of precision and efficiency in modern electronic manufacturing.

[0024] Furthermore, the position of slider 405 corresponds to the position of slide groove 407, and the outer wall dimension of slider 405 matches the inner wall dimension of slide groove 407. Through the setting of slider 405 and slide groove 407, the stability and guiding accuracy of slider 405's lifting movement are further enhanced. During the process of slider 405 rising and falling with the rotation of lead screw 403, slide groove 407 tightly constrains slider 405 from both sides, making it move strictly according to the designed vertical path, eliminating lateral offset or tilting caused by uneven force, vibration and other factors. This is crucial for the high-precision electronic components in the mounting mechanism 6, ensuring that during the lifting process, the components will not collide or rub against the surrounding structure due to the slight deviation of slider 405, ensuring the integrity of the electronic components, and also ensuring the reliability of the entire lifting mechanism, thus improving the overall performance of the high-precision lead frame mechanism.

[0025] Furthermore, the mounting mechanism 6 includes a connecting plate 601, a platform 602, a lead wire frame box 603, a mounting block 604, a positioning hole 605, a telescopic spring 606, a stop block 607, a fixing rod 608, and a mounting hole 609. One end of the slider 405 is fixedly connected to the connecting plate 601. The platform 602 is fixedly connected to the bottom side of one side of the connecting plate 601. The lead wire frame box 603 is mounted on top of the platform 602. The mounting block 604 is fixedly connected to the surface of the lead wire frame box 603. A positioning hole 605 is provided inside the mounting block 604. A telescopic spring 606 is fixedly connected to the outside of the positioning hole 605. One end of the telescopic spring 606 is fixedly connected to the stop block 607. The inner end of the stop block 607 is fixedly connected to the fixing rod 608. Both the plate 601 and the platform 602 have mounting holes 609 on their surfaces. Through the mounting mechanism 6, when it is necessary to install or replace the lead frame material box 603, the operator first aligns the material box with the lead frame onto the upper part of the platform 602. Since the connecting plate 601 and the slider 405 are rigidly fixed, and the slider 405 can be flexibly raised and lowered under the drive of the lifting mechanism, the platform 602 can be raised or lowered to a convenient operating height by controlling the lifting mechanism. Next, the mounting structure at the bottom of the lead frame material box 603 is aligned with the corresponding part on the platform 602, and the material box is pushed closer to the platform 602. The mounting block 604 on the surface of the material box will gradually approach the connecting plate 601 and the platform 602. When the mounting block 604 contacts the connecting plate 601 and the platform 602... When the platform 602 is in place, the fixing rod 608 will first touch the edge of the mounting part. As the material box continues to advance, the fixing rod 608 moves into the positioning hole 605 under pressure, while compressing the telescopic spring 606. The stop block 607 also retracts inward until the mounting block 604 is completely in contact with the mounting part. At this time, the positioning hole 605 is precisely aligned with the mounting holes 609 on the connecting plate 601 and the platform 602. The telescopic spring 606, which has stored elastic potential energy due to previous compression, will now play its role, popping the stop block 607 outward and driving the fixing rod 608 to insert into the corresponding mounting hole 609, thus achieving rapid and accurate positioning and fixing of the lead frame material box 603. This installation method is not only simple to operate, but also utilizes the telescopic spring 606... The elastic fit between 06 and stop 607 can accommodate installation errors within a certain range, ensuring installation reliability. In subsequent electronic component production processes, such as chip packaging, the lead frame box 603 is fixed on the platform 602. With the operation of the lifting mechanism 4, the box can be precisely raised and lowered to the height required by each process, meeting the fine requirements of different process steps for lead frame height, ensuring the packaging quality and production efficiency of electronic components. Furthermore, if it is necessary to disassemble, maintain, or replace the lead frame box 603, simply press stop 607 again to allow the fixing rod 608 to exit from the mounting hole 609, and the box can be easily removed. The whole process is efficient and convenient, providing a strong guarantee for the continuous and stable operation of the high-precision lead frame mechanism.

[0026] Furthermore, four sets of mounting blocks 604 are provided on the surface of the lead frame material box 603, with two sets of mounting blocks 604 installed above the connecting plate 601 and the other two sets installed on the surface of the platform 602. Through the arrangement of the mounting blocks 604, on the one hand, stable connection support points are provided for the lead frame material box 603 from multiple directions. In actual operation, whether the material box is subjected to lateral impact or vibration generated during lifting, the multiple sets of mounting blocks 604 can work together to distribute the force and ensure that the material box is always firmly fixed on the platform 602 without loosening or displacement, which would affect the production accuracy. On the other hand, this distribution method can better adapt to the structural characteristics of the connecting plate 601 and the platform 602, making the fit between the material box and the two more tight and uniform, optimizing the overall installation stability, and laying a solid foundation for subsequent high-precision electronic component processing operations.

[0027] Furthermore, the position of the positioning hole 605 corresponds to the position of the mounting hole 609, and the outer wall dimension of the fixing rod 608 matches the inner wall dimension of both the positioning hole 605 and the mounting hole 609. Through the arrangement of the positioning hole 605, the fixing rod 608, and the mounting hole 609, precise and reliable positioning and fixing functions are achieved. During installation, when the mounting block 604 approaches the connecting plate 601 and the platform 602, the precisely corresponding positioning hole 605 and mounting hole 609 act like navigation coordinates, guiding the fixing rod 608 to insert smoothly and avoiding misalignment. Installation jamming or failure caused by hole position deviation is prevented. At the same time, the tight fit between the fixing rod 608 and the hole wall not only prevents the material box from shaking in the horizontal direction, but also provides sufficient support in the vertical direction. This allows the material box to remain in place even when subjected to frequent lifting and lowering movements and vibration interference on the production line. This ingenious structural design greatly improves the installation accuracy and stability of the lead frame material box 603, effectively ensuring the continuity and efficiency of the electronic component production process and meeting the stringent process requirements of high-precision electronic manufacturing.

[0028] Working Principle: After the equipment is put into the electronic component production process, the first stage is preparation. Operators select suitable lead frame boxes 603 according to production requirements and, following the previously described installation process, precisely fix the boxes onto the platform 602 using the mounting mechanism 6. At this time, the lifting mechanism 4 is in an initial standby state, the motor 402 is not powered on, and the slider 405 and its connected mounting mechanism 6 are at a preset starting height. This height is usually convenient for operators to load and unload materials and for initial equipment debugging. When production officially starts, such as when entering the first process of chip packaging, the external control system sends precise commands to the motor 402 of the lifting mechanism 4 according to a preset program. The motor 402 responds quickly and rotates in the direction of the command. The drive screw 403 rotates, which in turn causes the slider 405 to move smoothly up and down along the auxiliary rod 404. The mounting mechanism 6 and its lead frame cassette 603 also move precisely to the height required for the first process. During this process, the slide rail support 406 and the slide groove 407 cooperate closely to ensure the precise movement path of the slider 405, preventing any slight wobbling from affecting the docking accuracy between the lead frame in the cassette and the chip packaging equipment. At this stage, the robotic arm or other automated operating components of the chip packaging equipment begin to operate on the lead frame in the lead frame cassette 603, possibly precisely placing the chip on the lead frame or performing preliminary soldering. The four sets of mounting blocks 604 of the mounting mechanism 6 provide stable support. The lead frame cassette 603 remains stable during these operations, ensuring the precision of the chip-lead frame bonding. Simultaneously, the fastening structure comprised of the positioning hole 605, fixing rod 608, and mounting hole 609 maintains stability in both horizontal and vertical directions, preventing component displacement due to equipment vibration or external impact, thus ensuring chip packaging quality. After completing the first process, the control system again instructs the motor 402 to drive the slider 405 to raise or lower the cassette to the height corresponding to the next process. This cycle repeats until the entire chip packaging process is complete. If an abnormality occurs during any process, requiring temporary inspection or replacement of components within the lead frame cassette 603, the operator can easily adjust the cassette by pressing the stop 607. Rod 608 detaches from mounting hole 609, allowing for quick disassembly of the material box. After appropriate processing, it can be quickly reinstalled. The entire process is efficient and smooth, without affecting the overall production rhythm. Throughout the production operation, the symmetrically distributed support legs 2 and foot pads 3 at the bottom of the base plate 1 continuously play their role, providing a stable foundation for the equipment. Facing the continuous vibrations generated by the operation of various equipment on the production line and the impact forces caused by the start-up and shutdown of adjacent large machinery, the support legs 2 and foot pads 3, with their stable structure and large contact area, disperse the force, ensuring that the main body of the equipment, including the lifting mechanism 4 and the mounting mechanism 6, remains in a stable state. This ensures that the precise cooperation of each component is not disturbed, enabling the high-precision lead frame mechanism to serve the electronic component manufacturing process for a long time with high accuracy and high efficiency.To meet the increasingly stringent production demands of modern electronic products, the motor 402, model Y315S-2, completes the application of a high-precision lead frame mechanism.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision lead frame mechanism, comprising a base plate (1), characterized in that: The bottom of the base plate (1) is fixedly connected to a support leg (2), the bottom of the support leg (2) is fixedly connected to a foot pad (3), the surface of the base plate (1) is provided with a lifting mechanism (4), the top frame (5) is provided above the lifting mechanism (4), and the surface of the lifting mechanism (4) is provided with an installation mechanism (6). The lifting mechanism (4) includes a motor support plate (401), a motor (402), a lead screw (403), an auxiliary rod (404), a slider (405), a slide rail support (406), and a slide groove (407). The bottom of the base plate (1) is fixedly connected to the motor support plate (401). The motor (402) is installed inside the motor support plate (401). The output end of the motor (402) is fixedly connected to the lead screw (403). The top of the base plate (1) is fixedly connected to the auxiliary rod (404). The surfaces of the lead screw (403) and the auxiliary rod (404) are slidably connected to the slider (405). The top of the base plate (1) is fixedly connected to the slide rail support (406). The surface of the slide rail support (406) is provided with a slide groove (407). One end of the slider (405) is provided with an installation mechanism (6).

2. The high-precision lead frame mechanism according to claim 1, characterized in that: The support legs (2) are symmetrically arranged at the four corners of the bottom of the base plate (1) along the central axis of the base plate (1), and the foot pads (3) are evenly distributed on the bottom surface of each set of support legs (2).

3. The high-precision lead frame mechanism according to claim 1, characterized in that: The motor (402) and the lead screw (403) cooperate to form a rotating structure, and the slider (405) slides on the surface of the lead screw (403) and the auxiliary rod (404) through the motor (402).

4. The high-precision lead frame mechanism according to claim 1, characterized in that: The position of the slider (405) corresponds to the position of the groove (407), and the outer wall size of the slider (405) matches the inner wall size of the groove (407).

5. The high-precision lead frame mechanism according to claim 1, characterized in that: The mounting mechanism (6) includes a connecting plate (601), a platform (602), a lead wire frame box (603), a mounting block (604), a positioning hole (605), a telescopic spring (606), a stop block (607), a fixing rod (608), and a mounting hole (609). One end of the slider (405) is fixedly connected to the connecting plate (601), and the bottom side of the connecting plate (601) is fixedly connected to the platform (602). The lead wire frame box (609) is mounted on the top of the platform (602). 3) A mounting block (604) is fixedly connected to the surface of the lead frame box (603). A positioning hole (605) is opened inside the mounting block (604). A telescopic spring (606) is fixedly connected to the outside of the positioning hole (605). A stop block (607) is fixedly connected to one end of the telescopic spring (606). A fixing rod (608) is fixedly connected to the inner end of the stop block (607). Mounting holes (609) are opened on the surfaces of the connecting plate (601) and the platform (602).

6. A high-precision lead frame mechanism according to claim 5, characterized in that: The mounting blocks (604) are provided in four sets on the surface of the lead frame box (603), and two sets of mounting blocks (604) are installed above the connecting plate (601), while the other two sets of mounting blocks (604) are installed on the surface of the platform (602).

7. A high-precision lead frame mechanism according to claim 5, characterized in that: The position of the positioning hole (605) corresponds to the position of the mounting hole (609), and the outer wall dimension of the fixing rod (608) matches the inner wall dimension of the positioning hole (605) and the mounting hole (609).

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