Three-temperature magnetic field for wafer test

Abstract

The utility model discloses a three-temperature magnetic field for wafer test, which comprises a test circuit board, the upper end of the test circuit board is provided with a fixed seat, the upper end of the fixed seat is provided with a magnetic field support, the upper end of the magnetic field support is provided with a pressing plate, the pressing plate is detachably connected with the test circuit board, the upper end of the pressing plate is provided with a placing groove, and the placing groove is provided with a magnetic field. The upper end of the magnetic field support is provided with a circular groove, a detachable test seat is arranged in the circular groove, the test seat is located on the inner side of the circular groove, the lower side of the pressing plate is further provided with a sealing colloid, the sealing colloid is sealed on one side of the magnetic field support, the magnetic field support comprises two magnetic pole seats, the magnetic fields of the two magnetic pole seats are opposite, and the magnetic pole seats are arranged in the circular groove. A winding shaft is connected between the two magnetic pole seats, the winding shaft is used for winding a coil, the two magnetic pole seats are respectively provided with a positioning groove, and the device has the advantages of being reasonable in structure, convenient to use, good in sealing effect and accurate in test result.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer test technical field especially relates to a wafer test three temperature magnetic field. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, because its shape is circular, therefore is called silicon wafer. After wafer manufacturing is completed, the electrical performance and circuit function of each chip on wafer need to be tested to ensure that wafer can realize the circuit function of chip, and then is sent to packaging factory for packaging. In order to ensure the performance stability of chip under high temperature, normal temperature and low temperature environment, high temperature, normal temperature and low temperature test (i.e. "three temperature test") need to be carried out.

[0003] The three temperature magnetic field for wafer test in prior art has poor sealing performance, which can cause great volatility of temperature around the magnetic field, thus affecting the accuracy of wafer test result, greatly affecting the magnetic field, and the structure is relatively complex, so that the use and installation are inconvenient. In view of the above problems, the following solution is proposed. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a wafer test three temperature magnetic field, which has the advantages of convenient use, good sealing effect and accurate test result.

[0005] The above technical purpose of the utility model is realized by the following technical scheme:

[0006] A three temperature magnetic field for wafer test, including test circuit board, the upper end of test circuit board is provided with fixed seat, the upper end of fixed seat is equipped with magnetic field support, the upper end of magnetic field support is equipped with pressing plate, and the pressing plate is detachably connected with test circuit board, the upper end of pressing plate is equipped with placing groove, the upper end of magnetic field support is equipped with circular groove, the detachable test seat is arranged in the circular groove, and the test seat is located on the inner side of circular groove, the lower side of pressing plate is further provided with sealing rubber, and the sealing rubber is sealed on one side of magnetic field support.

[0007] Preferably, the magnetic field support includes two magnetic pole seats, the magnetic fields of the two magnetic pole seats are opposite, a winding shaft is connected between the two magnetic pole seats, the winding shaft is used for winding coil, and a positioning groove is formed on each of the two magnetic pole seats.

[0008] Preferably, a plurality of fixing screws are arranged on the pressing plate, a plurality of protection tubes are arranged on the lower side of the pressing plate, the plurality of fixing screws are arranged in the protection tubes respectively, a plurality of threaded nuts are fixed on the upper end of the test circuit board, and the lower ends of the plurality of fixing screws are arranged in the threaded nuts respectively.

[0009] As preferred, a plurality of fastening screws are arranged on the test seat, and lower ends of the plurality of fastening screws are respectively arranged in the magnetic field support.

[0010] As preferred, a plurality of positioning columns are arranged at lower ends of the magnetic field support, and a plurality of positioning holes are arranged on the fixing seat, and the plurality of positioning columns are respectively matched with the plurality of positioning holes.

[0011] The utility model discloses a beneficial effect is: through winding shaft can be used for winding coil, and cooperate two magnetic pole seat and electrify to coil, can produce magnetic field, can place wafer chip of needing testing on the upper end of test seat simultaneously, can complete the test to the wafer chip through the change of magnetic field and temperature change, through sealing colloid can guarantee the sealing performance of one side of magnetic field support, thereby can prevent the air, therefore can guarantee the stability of temperature and the stability of magnetic field, further can improve the accuracy of test result. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is structural schematic diagram of example;

[0013] Figure 2 It is upper end structural schematic diagram of test circuit board in example;

[0014] Figure 3 It is partial structural schematic diagram of example;

[0015] Figure 4 It is structural schematic diagram of magnetic field support in example;

[0016] Figure 5 It is bottom structural schematic diagram of magnetic field support in example.

[0017] Fig. 1 test circuit board;2, fixed seat;3, magnetic field support;4, pressing plate;5, placing groove;6, test seat;7, sealing colloid;8, magnetic pole seat;9, winding shaft;10, positioning groove;11, fixed screw;12, protection tube;13, screw cap;14, fastening screw;15, positioning column;16, positioning hole. DETAILED DESCRIPTION

[0018] The following description is only preferred embodiment of the utility model, and the protection scope is not only limited to the embodiment, and the technical scheme under the idea of the utility model should belong to the protection scope of the utility model. Same parts are indicated with same reference numerals. It should be noted that the words "front", "back", "left", "right", "up" and "down" in the following description refer to the directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to the directions towards or away from the geometric center of a particular component.

[0019] For example, Figures 1 to 5As shown, a three-temperature magnetic field for wafer testing includes a test circuit board 1, a fixed seat 2 is arranged at the upper end of the test circuit board 1, a magnetic field support 3 is arranged at the upper end of the fixed seat 2, a pressing plate 4 is arranged at the upper end of the magnetic field support 3, and the pressing plate 4 is detachably connected with the test circuit board 1, a placing groove 5 is arranged at the upper end of the pressing plate 4, a circular groove is arranged at the upper end of the magnetic field support 3, a detachable test seat 6 is arranged in the circular groove, and the test seat 6 is located at the inner side of the circular groove, a sealing body 7 is further arranged at the lower side of the pressing plate 4, and the sealing body 7 seals one side of the magnetic field support 3. By winding a coil on the magnetic field support 3 and electrifying the coil, a magnetic field can be generated, and the wafer chip to be tested can be placed on the upper end of the test seat 6. The test of the wafer chip can be completed by the change of the magnetic field and the change of the temperature. The sealing performance of one side of the magnetic field support 3 can be ensured by the sealing body 7, so that air leakage can be prevented, and the stability of the temperature and the stability of the magnetic field can be ensured. Further, the accuracy of the test result can be improved.

[0020] The magnetic field support 3 includes two magnetic pole seats 8, the magnetic fields of the two magnetic pole seats 8 are opposite, a winding shaft 9 is connected between the two magnetic pole seats 8, the winding shaft 9 is used for winding the coil, and a positioning groove 10 is arranged on each of the two magnetic pole seats 8. The winding shaft 9 can be used for winding the coil, and the two ends of the coil can be positioned by the two positioning grooves 10, so as to ensure the stability of the magnetic field.

[0021] A plurality of fixing screws 11 are arranged on the pressing plate 4, a plurality of protection tubes 12 are arranged at the lower side of the pressing plate 4, the plurality of fixing screws 11 are respectively arranged in the protection tubes 12, a plurality of threaded caps 13 are fixedly arranged at the upper end of the test circuit board 1, the lower ends of the plurality of fixing screws 11 are respectively located in the threaded caps 13. After the magnetic field support 3 is placed on the upper end of the fixed seat 2, the pressing plate 4 can be placed, the plurality of fixing screws 11 are respectively screwed into the pressing plate 4, then the protection tubes 12 are sleeved, and the fixing screws 11 are tightened, so that the top ends of the fixing screws 11 are screwed into the threaded caps 13. In this way, the pressing plate 4 can be fixed, and the magnetic field support 3 can be fixed and installed. The protection tubes 12 can support and limit the installation of the pressing plate 4.

[0022] A plurality of fastening screws 14 are arranged on the test seat 6, the lower ends of the plurality of fastening screws 14 are respectively located in the magnetic field support 3. The test seat 6 can be replaced and installed by the plurality of fixing screws 11, so that the test seat 6 made of different materials can be replaced to test wafers of different specifications.

[0023] A plurality of positioning columns 15 are fixedly arranged at the lower end of the magnetic field support 3, a plurality of positioning holes 16 are arranged on the fixed seat 2, the plurality of positioning columns 15 are matched with the plurality of positioning holes 16. The positions of the magnetic field support 3 can be limited by the cooperation of the plurality of positioning columns 15 and the positioning holes 16, so as to prevent the magnetic field support 3 from rotating after being fixed, and further ensure the stability of the magnetic field generation.

[0024] The above-described specific embodiments further specifically describe the technical problems, technical solutions and beneficial effects solved by the present application. It should be understood that the above-described embodiments are merely specific embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A three-temperature magnetic field for wafer testing, characterized by, Including test circuit board (1), the upper end of test circuit board (1) is provided with fixed seat (2), the upper end of fixed seat (2) is equipped with magnetic field support (3), the upper end of magnetic field support (3) is equipped with pressing plate (4), and pressing plate (4) is detachably connected with test circuit board (1), the upper end of pressing plate (4) is provided with placing groove (5), the upper end of magnetic field support (3) is provided with circular groove, and the detachable test seat (6) is arranged in the circular groove, and the test seat (6) is located on the inner side of the circular groove, the lower side of pressing plate (4) is further provided with sealing glue body (7), and the sealing glue body (7) is sealed on one side of magnetic field support (3).

2. The three-temperature magnetic field for wafer testing according to claim 1, wherein, The magnetic field support (3) includes two magnetic pole seats (8), the magnetic fields of the two magnetic pole seats (8) are opposite, a winding shaft (9) is connected between the two magnetic pole seats (8), the winding shaft (9) is used for winding coil, and a positioning groove (10) is formed on each of the two magnetic pole seats (8).

3. The three-temperature magnetic field for wafer testing according to claim 2, wherein, A plurality of fixing screws (11) are arranged on the pressing plate (4), a plurality of protection tubes (12) are arranged on the lower side of the pressing plate (4), the plurality of fixing screws (11) are arranged in the protection tubes (12) respectively, a plurality of threaded caps (13) are fixed on the upper end of the test circuit board (1), and the lower ends of the plurality of fixing screws (11) are located in the threaded caps (13) respectively.

4. The three-temperature magnetic field for wafer testing according to claim 3, wherein, A plurality of fastening screws (14) are arranged on the test seat (6), and the lower ends of the plurality of fastening screws (14) are located in the magnetic field support (3) respectively.

5. The three-temperature magnetic field for wafer testing according to claim 4, wherein, A plurality of positioning columns (15) are fixed on the lower end of the magnetic field support (3), a plurality of positioning holes (16) are arranged on the fixed seat (2), and the plurality of positioning columns (15) are matched with the plurality of positioning holes (16) respectively.

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