Display panel

Abstract

The utility model relates to a display panel. A display panel includes a base layer and a light emitting element layer having a plurality of light emitting regions and non-light emitting regions spaced apart from each other. The light emitting element layer includes a first electrode, a pixel defining film, a hole transport region, a light emitting layer to correspond to a plurality of light emitting regions, an electron transport region, and a second electrode. The electron transport region overlaps the plurality of light-emitting regions and the non-light-emitting region as a whole, and the hole transport region does not overlap at least a portion of the non-light-emitting region.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0157944, filed on November 15, 2023, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. TECHNICAL FIELD

[0003] Aspects of some embodiments of the disclosure herein relate to a display panel and a manufacturing method thereof. BACKGROUND

[0004] Display devices are used for various multimedia devices such as televisions, mobile phones, tablet computers, or game consoles in order to display image information to a user.

[0005] A display device includes a display module and a window module. The window module included in the display device effectively transmits image information provided by the display module to the outside and protects the display module from the outside.

[0006] The display module includes a light emitting element layer, and the light emitting element layer includes a first electrode, a second electrode, and a light emitting layer. In addition, the light emitting element layer can further include functional layers such as a hole transport zone and an electron transport zone.

[0007] The above information disclosed in this Background section is only for enhancing the understanding of the background of the present disclosure, and therefore, it can not necessarily constitute the prior art. SUMMARY

[0008] Aspects of some embodiments of the disclosure herein relate to a display panel and a manufacturing method thereof, and for example, to a display panel having a structure in which moisture penetration and oxidation of a light emitting element are prevented or reduced and a manufacturing method thereof.

[0009] Aspects of some embodiments of the disclosure include a display panel and a manufacturing method thereof having relatively improved reliability by having a structure in which moisture penetration and oxidation are prevented or reduced.

[0010] According to some embodiments of the disclosure, the display panel includes: a substrate layer; and a light emitting element layer on the substrate layer and including a plurality of light emitting regions spaced apart from each other on a plane (or in a plan view) and a non-light emitting region configured to surround each of the plurality of light emitting regions, wherein the light emitting element layer includes: a first electrode on the substrate layer corresponding to the plurality of light emitting regions; a pixel defining film on which openings corresponding to the plurality of light emitting regions are defined, and the pixel defining film is on the substrate layer; a hole transport region on the first electrode; a light emitting layer on the hole transport region corresponding to the plurality of light emitting regions; an electron transport region on the light emitting layer; and a second electrode on the electron transport region, the electron transport region entirely overlaps the plurality of light emitting regions and the non-light emitting region, and the hole transport region does not overlap at least a portion of the non-light emitting region.

[0011] According to some embodiments, the second electrode can entirely overlap the plurality of light emitting regions and the non-light emitting region.

[0012] According to some embodiments, the hole transport region can overlap the plurality of light emitting regions.

[0013] According to some embodiments, the hole transport region can include a hole injection layer on the first electrode and a hole transport layer on the hole injection layer.

[0014] According to some embodiments, the electron transport region can include an electron transport layer on the light emitting layer and an electron injection layer on the electron transport layer.

[0015] According to some embodiments, the light emitting layer can cover at least a portion of the pixel defining film, and the electron transport region can cover a remaining portion of the pixel defining film that is not covered by the light emitting layer.

[0016] According to some embodiments, the pixel defining film can be an inorganic film.

[0017] According to some embodiments, an angle between a side surface of the light emitting layer and the plane can be equal to or greater than about 80° and equal to or less than about 100°.

[0018] According to some embodiments, the display panel can further include a thin film encapsulation layer on the light emitting element layer and configured to cover the light emitting element layer.

[0019] According to some embodiments, the display panel can further include a circuit layer between the substrate layer and the light emitting element layer.

[0020] According to some embodiments of the disclosure, a method of manufacturing a display panel includes: preparing a preliminary display panel including a first electrode and a pixel defining film having openings defining light emitting regions by exposing a portion of the first electrode; patterning a light emitting layer and a sacrificial layer on the preliminary display panel to correspond to the light emitting regions; removing the sacrificial layer; forming an electron transport region on the light emitting layer; and forming a second electrode on the electron transport region, wherein the electron transport region is formed entirely while covering the pixel defining film and the light emitting layer.

[0021] According to some embodiments, the second electrode can be formed entirely while covering the electron transport region.

[0022] According to some embodiments, the method of manufacturing can further include forming a hole transport region on the preliminary display panel to correspond to the light emitting regions.

[0023] According to some embodiments, the hole transport region can include a hole injection layer and a hole transport layer.

[0024] According to some embodiments, the patterning of the light emitting layer and the sacrificial layer can include: thermally depositing the light emitting layer on the preliminary display panel; thermally depositing the sacrificial layer on the light emitting layer; and removing the light emitting layer and the sacrificial layer in regions other than the light emitting regions by a photoresist process.

[0025] According to some embodiments, the patterning of the light emitting layer and the sacrificial layer can be performed in an atmospheric environment, and the forming of the electron transport region and the forming of the second electrode are performed in vacuum, respectively.

[0026] According to some embodiments, the method of manufacturing can further include, before the forming of the electron transport region on the light emitting layer, removing moisture by heating and drying.

[0027] According to some embodiments, the method of manufacturing can further include forming a thin film encapsulation layer on the second electrode.

[0028] According to some embodiments, the electron transport region can include an electron injection layer and an electron transport layer.

[0029] According to some embodiments, an angle between a side surface of the patterned light emitting layer and a plane can be equal to or greater than about 80° and equal to or less than about 100°. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of embodiments according to the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate aspects of some embodiments of the present disclosure, and, together with the description, serve to explain principles of embodiments according to the present disclosure. In the drawings:

[0031] Figure 1 is a combined perspective view of a display device according to some embodiments of the present disclosure;

[0032] Figure 2 exploded perspective view of a display device according to some embodiments of the present disclosure;

[0033] Figure 3 cross-sectional view of a display module according to some embodiments of the present disclosure;

[0034] Figure 4 perspective view of a display module according to some embodiments of the present disclosure;

[0035] Figure 5 enlarged cross-sectional view of a portion of a display panel according to some embodiments of the present disclosure;

[0036] Figures 6A-6D cross-sectional view of a light emitting element according to some embodiments of the present disclosure;

[0037] Figure 7 flowchart illustrating a method of manufacturing a display panel according to some embodiments of the present disclosure; and

[0038] Figures 8-14 cross-sectional views respectively illustrating steps of a method of manufacturing a display panel according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0039] Embodiments according to the present disclosure can be variously modified and have various forms, and thus aspects of some embodiments will be illustrated in the accompanying drawings and described in detail below. However, it is not intended to limit the embodiments according to the present disclosure to the specific disclosed forms, and it will be understood that all modifications, equivalents, or alternatives are included within the spirit and technical scope of the embodiments according to the present disclosure.

[0040] In this specification, it will be understood that when an element (or area, layer, part, etc.) is referred to as being "on", "connected to", or "coupled to" another element (or area, layer, part, etc.), it can be directly on, connected to, or coupled to the other element (or area, layer, part, etc.), or a third element can be present therebetween.

[0041] Meanwhile, in this specification, when an element (such as a layer, a film, an area, a plate, etc.) is referred to as being "directly on" another layer, film, area, plate, etc., there is no intervening layer, film, area, plate, etc. For example, the wording "directly on" means that no additional member such as an adhesive member, etc. can be used between two elements (such as two layers or two members).

[0042] The same reference numerals or symbols are used throughout the drawings and the same elements, components, regions, layers and / or parts are denoted with the same reference numerals or symbols. In addition, in the drawings, the size (e.g., thickness) and the proportions of elements are exaggerated for the sake of clarity (e.g., thickness of layers).

[0043] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0045] Spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0046] It will be further understood that the terms "includes", "including", "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0048] Hereinafter, a display device according to some embodiments of the present disclosure and a method of manufacturing the same will be described in greater detail with reference to the accompanying drawings.

[0049] Figure 1 A combined perspective view of a display device DD according to some embodiments of the present disclosure.

[0050] The display device DD according to some embodiments can be activated in response to an electrical signal. For example, the display device DD can be a mobile phone, a tablet personal computer, a car navigation system, a game console, or a wearable device, but embodiments according to the present disclosure are not limited thereto. As an example, Figure 1 It is illustrated that the display device DD is a mobile phone, but embodiments according to the present disclosure are not limited thereto.

[0051] In Figure 1 In the following drawings, a first direction DR1, a second direction DR2, and a third direction DR3 are illustrated, but the directions indicated by the first to third directions DR1, DR2, and DR3 illustrated in the present specification can have a relative concept, and thus can be changed to other directions. In addition, a direction completely opposite to the directions indicated by the first to third directions DR1, DR2, and DR3 can also be referred to as the first to third directions, and thus be expressed with the same reference numerals or symbols of the drawings.

[0052] Referring to Figure 1 The display device DD according to some embodiments can have a display surface FS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The display device DD can provide an image IM to a user through the display surface FS. The display device DD according to some embodiments can display the image IM on a third direction DR3 on the display surface FS parallel to each of the first direction DR1 and the second direction DR2. A front surface (or a top surface) and a rear surface (or a bottom surface) of each component can be defined based on a direction in which the image IM is displayed. The front surface and the rear surface can be opposite to each other in the third direction DR3, and normal directions of the front surface and the rear surface can each be parallel to the third direction DR3.

[0053] According to some embodiments, the display surface FS can include an active area AA and a non-active area NAA adjacent to the active area AA. The non-active area NAA can be an area in which the image IM is not displayed. However, embodiments according to the present disclosure are not limited thereto, and the non-active area NAA can be omitted.

[0054] The display device DD according to some embodiments can sense an external input applied from the outside. The external input can include various types of input provided from the outside of the display device DD. For example, the external input can include not only a touch of a user's body part such as a hand, but also an external input (e.g., hovering) applied by being close to or adjacent to the display device DD at a certain distance (e.g., a set or predetermined distance). In addition, the external input can have various types such as a physical force (e.g., pressure), heat, light, etc.

[0055] The display device DD according to some embodiments can further include various electronic modules. For example, the electronic modules can include at least one of a camera, a speaker, a light detection sensor, and a heat detection sensor. The electronic modules can sense an external input received through the display surface FS or can provide an audio signal such as a voice to the outside through the display surface FS. The electronic modules can include a plurality of components, and are not limited to any one embodiment.

[0056] Figure 2 An exploded perspective view of a display device DD according to some embodiments of the disclosure. Figure 2 Illustrating Figure 1 An exploded perspective view of a display device DD according to some embodiments of the disclosure in FIG. 1B.

[0057] Referring to Figure 2 The display device DD according to some embodiments can include a display module DM and a window module WM located on the display module DM. The window module WM can be located on top of and / or below the display module DM. Figure 2 Illustrating that the window module WM is located on top of the display module DM.

[0058] In addition, the display device DD according to some embodiments can further include an electronic module located below the display module DM. For example, the electronic module can include a camera module.

[0059] In addition, according to some embodiments, the display device DD according to some embodiments can further include an adhesive layer and / or a polarizing film located between the display module DM and the window module WM.

[0060] In addition, according to some embodiments, the display device DD according to some embodiments can further include a lower functional layer located below the display module DM. The lower functional layer can be a layer for supporting the display module DM or for preventing or reducing deformation of the display module DM due to external impact or force. The lower functional layer can include at least one of a buffer layer, a support plate, a shielding layer, a filling layer, and an interlayer adhesive layer.

[0061] The display device DD according to some embodiments can further include a housing HAU that houses the display module DM and the lower functional layer, etc. The housing HAU can be coupled to the window module WM to form the exterior of the display device DD. The housing HAU can include a material having relatively high rigidity. For example, the housing HAU can include a plurality of frames and / or plates composed of glass, plastic, or metal. The display module DM can be housed in a housing space or cavity and be protected from external impacts.

[0062] The display module DM according to some embodiments can display an image IM (see Figure 1 ) in response to an electrical signal, and can transmit / receive information about an external input. The display module DM can include a display panel and a sensor layer on the display panel.

[0063] The display module DM can include a display area DA and a non-display area NDA. The display area DA can be an area for providing an image IM (see Figure 1 ). The pixels PX can be located in the display area DA. The non-display area NDA can be adjacent to the display area DA (e.g., at the periphery thereof or outside the coverage area thereof). The non-display area NDA can surround the display area DA. A driving circuit or a driving line, etc. for driving the display area DA can be located in the non-display area NDA.

[0064] The display module DM can include a plurality of pixels PX. The pixels PX can each emit light in response to an electrical signal. An image IM (see Figure 1 ) can be realized by the light emitted by the pixels PX. The pixels PX can each include a display element. For example, the display element can be an organic light emitting element, an inorganic light emitting element, an organic-inorganic light emitting element, a micro LED, a nano LED, a quantum dot light emitting element, an electrophoretic element, or an electro wetting element, etc.

[0065] The pixels PX can include first color pixels PXA-R, second color pixels PXA-G, and third color pixels PXA-B spaced apart from each other on (or in) a plane. The first color pixels PXA-R, the second color pixels PXA-G, and the third color pixels PXA-B can be referred to as red light emitting areas PXA-R, green light emitting areas PXA-G, and blue light emitting areas PXA-B, respectively.

[0066] In the display device DD according to some embodiments, the light emitting areas PXA-R, PXA-G, and PXA-B can be arranged in the form of stripes. The plurality of red light emitting areas PXA-R, the plurality of green light emitting areas PXA-G, and the plurality of blue light emitting areas PXA-B can each be arranged along the second direction DR2. Alternatively, the red light emitting areas PXA-R, the green light emitting areas PXA-G, and the blue light emitting areas PXA-B can be alternately arranged in this order along the first direction DR1.

[0067] The arrangement of the light emitting regions PXA-R, PXA-G, and PXA-B is not limited to Figure 2 The arrangement of the light emitting regions PXA-R, PXA-G, and PXA-B is not limited to The arrangement of the light emitting regions PXA-R, PXA-G, and PXA-B is not limited to The arrangement of the light emitting regions PXA-R, PXA-G, and PXA-B is not limited to

[0068] In Figure 2 , the light emitting regions PXA-R, PXA-G, and PXA-B are illustrated as having similar areas. However, embodiments according to the present disclosure are not limited thereto, and the areas of the light emitting regions PXA-R, PXA-G, and PXA-B can vary depending on the wavelength region of the emitted light. For example, according to some embodiments, the area of the green light emitting region PXA-G can be smaller than the area of the blue light emitting region PXA-B, but embodiments according to the present disclosure are not limited thereto. The area of the light emitting regions PXA-R, PXA-G, and PXA-B can mean the area when viewed on (or in a plan view of) a plane defined by the first direction DR1 and the second direction DR2.

[0069] The window module WM can cover the entire top surface of the display module DM. The window module WM can have a shape corresponding to the shape of the display module DM. The window module WM can have elasticity so as to be deformed according to deformation of the folding or bending of the display device DD. The window module WM can function to protect the display module DM from external impact.

[0070] The window module WM can include a transmissive area TA and a bezel area BZA. The transmissive area TA can overlap at least a portion of the display area DA of the display module DM. The transmissive area TA can be an optically transparent area. For example, the transmissive area TA can have a light transmittance of about 90% or more with respect to the wavelength of the visible light region. The image IM (see Figure 1 ) can be provided to the user through the transmissive area TA, and the user can receive information through the image IM (see Figure 1 ).

[0071] The bezel area BZA can be an area having a lower light transmittance than the transmissive area TA. The bezel area BZA can define the shape of the transmissive area TA. The bezel area BZA can have a color (e.g., a set or predetermined color). The bezel area BZA can cover the non-display area NDA of the display module DM, and prevent or reduce the visibility of the non-display area NDA from the outside. However, this is an example, and the bezel area BZA can be omitted in the window module WM according to some embodiments.

[0072] Figure 3A cross-sectional view of a display device DD according to some embodiments of the disclosure. Figure 3 A cross-sectional view taken along Figure 2 A cross-sectional view taken along line I-I' illustrated in FIG. 1A.

[0073] Referring to Figure 3 The display device DD can include a display module DM and a window module WM located on the display module DM. The display module DM can include a display panel DP.

[0074] The display panel DP can include a base layer BL, a circuit layer CL, an emitting element layer EDL, and a thin film encapsulation layer TFE.

[0075] The base layer BL can be a member that provides a base surface on which the circuit layer CL is located. The base layer BL can be a rigid substrate, or a flexible substrate that can be bent, folded, or rolled, etc. The base layer BL can be a glass substrate, a metal substrate, or a polymer substrate, etc. However, embodiments according to the disclosure are not limited thereto, and the base layer BL can be an inorganic layer, an organic layer, or a composite material layer.

[0076] The circuit layer CL can be located on the base layer BL. The circuit layer CL can include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line, etc. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the base layer BL by coating or deposition, etc., and then the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by performing a photo-etching process and an etching process multiple times. Then, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer CL can be formed.

[0077] The emitting element layer EDL can be located on the circuit layer CL. The emitting element layer EDL can include an emitting element. For example, the emitting element can include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0078] The thin film encapsulation layer TFE can be located on the emitting element layer EDL. The thin film encapsulation layer TFE can cover the emitting element layer EDL. The thin film encapsulation layer TFE can be located in an active area AA in which the emitting element layer EDL is located, and can extend to a non-active area NAA in which the emitting element layer EDL is not located. The thin film encapsulation layer TFE can protect the emitting element layer EDL from moisture, oxygen, and foreign substances such as dust particles.

[0079] The display module DM can further include a color filter layer located on the display panel DP. The color filter layer can be formed through a continuous process.

[0080] The display module DM can further include a polarizing film located on the display panel DP. The polarizing film can be a film having an optical function to improve light extraction efficiency of the display module DM and to reduce reflectivity of external light.

[0081] The display module DM can further include a sensor layer SS on the display panel DP. The sensor layer SS can sense an external input applied from the outside. The external input can be a user's input. The user's input can include various forms of external input such as a part of a user's body, light, heat, a pen, pressure, etc.

[0082] The window module WM can be located on the display module DM. The window module WM can allow an image from the display module DM to pass therethrough, and can also relieve an external impact. Accordingly, the window module WM can prevent or reduce damage to the display module DM or malfunction of the display module DM due to the external impact.

[0083] The window module WM can cover the entire top surface of the display module DM. The window module WM can have a shape corresponding to a shape of the display module DM. The window module WM can have elasticity so as to be deformed according to deformation of the folding or bending of the display device DD.

[0084] The window module WM can include a glass substrate or a synthetic resin film. The window module WM can have a multi-layer structure or a single-layer structure. The window module WM can further include a window module protection layer on the glass substrate or the synthetic resin film. The window module protection layer can include a flexible plastic material such as polyimide or polyethylene terephthalate. In addition, an adhesive layer between the window module WM and the window module protection layer can be further included.

[0085] Figure 4 A perspective view of a display module DM according to some embodiments of the present disclosure.

[0086] The display module DM can include a base layer BL divided into a display area DA and a non-display area NDA.

[0087] The display module DM can include a pixel PX in the display area DA and a signal line SGL electrically connected to the pixel PX. The display module DM can include a driving circuit GDC and a pad member PLD in the non-display area NDA.

[0088] The pixel PX can be arranged in a first direction DR1 and a second direction DR2. The pixel PX can include a plurality of pixel rows extending in the first direction DR1 and arranged in the second direction DR2, and a plurality of pixel columns extending in the second direction DR2 and arranged in the first direction DR1.

[0089] The signal lines SGL can include gate lines GL, data lines DL, power supply lines PL, and control signal lines CSL. The gate lines GL can be connected to corresponding ones of the pixels PX, respectively, and the data lines DL can be connected to corresponding ones of the pixels PX, respectively. The power supply lines PL can be electrically connected to the pixels PX. The control signal lines CSL can be connected to the driving circuit GDC, and can supply control signals to the driving circuit GDC.

[0090] The driving circuit GDC can include a gate driving circuit. The gate driving circuit can generate gate signals, and can output the generated gate signals to the gate lines GL in order. The gate driving circuit can further output another control signal to the pixel driving circuit.

[0091] The pad member PLD can be a member to which a flexible printed circuit board is connected. In Figure 4 , the pad member PLD can include pixel pads D-PD, and the pixel pads D-PD can be pads to connect the flexible printed circuit board to the display panel DP. The pixel pads D-PD can be connected to corresponding ones of the signal lines SGL, respectively. The pixel pads D-PD can be connected to corresponding pixels PX through the signal lines SGL. In addition, any one of the pixel pads D-PD can be connected to the driving circuit GDC.

[0092] Figure 5 An enlarged cross-sectional view of a portion of the display panel DP according to some embodiments of the disclosure. Figure 5 Explain the cross section taken along the line II-II' explained in Figure 2 Explain the cross section taken along the line II-II' explained in Figure 2 It is explained that the light emitting regions PXA-R, PXA-G, and PXA-B have the same length in the first direction DR1, while Figure 5 It is explained that the light emitting regions PXA-R, PXA-G, and PXA-B have different lengths in the first direction DR1.

[0093] Referring to Figure 5 , the display panel DP can include non-light emitting regions NPXA and light emitting regions PXA-R, PXA-G, and PXA-B. The light emitting regions PXA-R, PXA-G, and PXA-B can respectively emit light generated from light emitting elements ED-1, ED-2, and ED-3. The light emitting regions PXA-R, PXA-G, and PXA-B can be arranged to be spaced apart from each other in a plane (or in a plan view). In Figure 5 , the light emitting elements ED include the light emitting elements ED-1, ED-2, and ED-3, and the light emitting layer EM includes the light emitting layers EML-R, EML-G, and EML-B, but embodiments according to the disclosure are not limited thereto.

[0094] Each of the light emitting regions PXA-R, PXA-G, and PXA-B can be separated by a pixel defining film PDL. The non-light emitting region NPXA can be a region between adjacent light emitting regions PXA-R, PXA-G, and PXA-B, and can correspond to the pixel defining film PDL. In a plan (or in a plan view), the non-light emitting region NPXA can surround the light emitting regions PXA-R, PXA-G, and PXA-B. However, in the present specification, the light emitting regions PXA-R, PXA-G, and PXA-B can each correspond to the pixel PX (see FIG. 1A). Figure 2 The pixel defining film PDL can separate the light emitting elements ED-1, ED-2, and ED-3. The light emitting layers EML-R, EML-G, and EML-B of the light emitting elements ED-1, ED-2, and ED-3 can be separated by being located in the openings OP defined in the pixel defining film PDL.

[0095] The light emitting regions PXA-R, PXA-G, and PXA-B can be classified into a plurality of groups depending on the colors of light generated from the light emitting elements ED-1, ED-2, and ED-3. Figure 5 Three light emitting regions PXA-R, PXA-G, and PXA-B emitting red light, green light, and blue light are illustrated. For example, the display panel DP according to some embodiments can include a red light emitting region PXA-R, a green light emitting region PXA-G, and a blue light emitting region PXA-B separated from each other. The red light emitting region PXA-R can be referred to as a first light emitting region, the green light emitting region PXA-G can be referred to as a second light emitting region, and the blue light emitting region PXA-B can be referred to as a third light emitting region.

[0096] The plurality of light emitting elements ED-1, ED-2, and ED-3 in the display panel DP can emit light in wavelength ranges different from each other. For example, according to some embodiments, the display panel DP can include a first light emitting element ED-1 emitting red light, a second light emitting element ED-2 emitting green light, and a third light emitting element ED-3 emitting blue light. That is, the red light emitting region PXA-R, the green light emitting region PXA-G, and the blue light emitting region PXA-B of the display panel DP can correspond to the first color light emitting element ED-1, the second color light emitting element ED-2, and the third color light emitting element ED-3, respectively.

[0097] However, embodiments according to the present disclosure are not limited thereto, and the first to third color light emitting elements ED-1, ED-2, and ED-3 can emit light in the same wavelength range, or at least one of the first to third color light emitting elements ED-1, ED-2, and ED-3 can emit light in a wavelength range different from the other wavelength ranges. For example, the first to third color light emitting elements ED-1, ED-2, and ED-3 can all emit blue light.

[0098] The light emitting element layer EDL can include first to third color light emitting elements ED-1, ED-2, and ED-3 and a pixel definition film PDL. The light emitting elements ED-1, ED-2, and ED-3 can each include a first electrode EL1 and a second electrode EL2, and can respectively include a light emitting layer EML-R, EML-G, and EML-B between the first electrode EL1 and the second electrode EL2. The light emitting element layer EDL can include the pixel definition film PDL between the light emitting areas PXA-R, PXA-G, and PXA-B to define the light emitting areas PXA-R, PXA-G, and PXA-B. The light emitting element layer EDL can further include a hole transport region HTR between the first electrode EL1 and each of the light emitting layers EML-R, EML-G, and EML-B. The light emitting element layer EDL can further include an electron transport region ETR between the second electrode EL2 and each of the light emitting layers EML-R, EML-G, and EML-B.

[0099] The first electrode EL1 can be located on the circuit layer CL. The first electrode EL1 can be arranged to correspond to the light emitting areas PXA-R, PXA-G, and PXA-B. The first electrode EL1 can be arranged to be spaced apart from each other on (or in) a plane in correspondence with the light emitting areas PXA-R, PXA-G, and PXA-B. A portion of the first electrode EL1 can be covered by the pixel definition film PDL. For example, a portion of the first electrode EL1 adjacent to (e.g., overlapping) the non-light emitting area NPXA can be covered by the pixel definition film PDL. A portion of a top surface of the first electrode EL1 overlapping the light emitting areas PXA-R, PXA-G, and PXA-B can be exposed by an opening OP defined in the pixel definition film PDL.

[0100] The first electrode EL1 can have an electric conductivity. The first electrode EL1 can be formed of a metallic material such as a metal alloy or an electrically conductive compound. The first electrode EL1 can be an anode or a cathode. However, embodiments according to the present disclosure are not limited thereto. In addition, the first electrode EL1 can be a pixel electrode. The first electrode EL1 can be a transmissive electrode, a transreflective electrode, or a reflective electrode. The first electrode EL1 can include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound selected from two or more thereof, a mixture selected from two or more thereof, or an oxide thereof.

[0101] When the first electrode EL1 is a transmissive electrode, the first electrode EL1 can include a transparent metal oxide, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), or the like. When the first electrode EL1 is a transreflective electrode or a reflective electrode, the first electrode EL1 can include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or a compound or a mixture thereof (for example, a mixture of Ag and Mg), or a multi-layer structure material such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Alternatively, the first electrode EL1 can have a multi-layer structure including a reflective film or a transreflective film formed of the above-described materials and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), or the like. For example, the first electrode EL1 can have a three-layer structure of ITO / Ag / ITO, but embodiments are not limited thereto. In addition, embodiments according to the present disclosure are not limited thereto, and the first electrode EL1 can include the aforementioned metal materials, any combination of two or more metal materials selected from the aforementioned metal materials, or oxides of the aforementioned metal materials, or the like.

[0102] A pixel definition film PDL can be located on the circuit layer CL. The pixel definition film PDL can be arranged to correspond to the non-emitting area NPXA. Openings OP corresponding to the emitting areas PXA-R, PXA-G, and PXA-B can be defined in the pixel definition film PDL. The pixel definition film PDL can cover a portion of the first electrode EL1. A top surface of the first electrode EL1 can be exposed by the openings OP defined in the pixel definition film PDL. The pixel definition film PDL can be an inorganic film. For example, the pixel definition film PDL can include silicon oxide (SiO x ) and / or silicon nitride (SiN y ). Because the pixel definition film PDL is an inorganic film, defects due to shorting between the first electrode EL1 and the second electrode EL2 do not occur.

[0103] A hole transport region HTR can be provided on the first electrode EL1. The hole transport region HTR can be located within the openings OP defined in the pixel definition film PDL. The hole transport region HTR can be arranged to be spaced apart from each other in a plan (or in a plan view) corresponding to the emitting areas PXA-R, PXA-G, and PXA-B. As the hole transport region HTR is arranged to be spaced apart from each other, current leakage between the pixels can be prevented or reduced. In addition, the hole transport region HTR can cover a portion of the pixel definition film PDL adjacent to the openings OP. However, unlike that explained in the Figure 5 HTR can be located only in the openings OP without covering a portion of the pixel definition film PDL.

[0104] The light-emitting layer EML can be located on the hole transport region HTR. For example, as illustrated in FIG. 1A, the light-emitting layer EML can be located on the hole transport region HTR. Figure 5 As illustrated in FIG. 1A, a first color light-emitting layer EML-R can be located in the first color light-emitting element ED-1, a second color light-emitting layer EML-G can be located in the second color light-emitting element ED-2, and a third color light-emitting layer EML-B can be located in the third color light-emitting element ED-3. The first color light-emitting layer EML-R can emit red light, the second color light-emitting layer EML-G can emit green light, and the third color light-emitting layer EML-B can emit blue light.

[0105] The light-emitting layers EML-R, EML-G, and EML-B can protrude toward the encapsulation layer TFE in the third direction DR3 than the pixel definition film PDL. Portions of the pixel definition film PDL adjacent to the light-emitting areas PXA-R, PXA-G, and PXA-B can be covered by the light-emitting layers EML. Side surfaces of the light-emitting layers EML-R, EML-G, and EML-B can be covered by the electron transport region ETR. The side surfaces of the light-emitting layers EML-R, EML-G, and EML-B can be perpendicular (or substantially perpendicular) to a plane. Here, the side surfaces can mean surfaces of the light-emitting layers EML-R, EML-G, and EML-B parallel (or substantially parallel) to the third direction DR3, and the plane can mean a surface defined by the first direction DR1 and the second direction DR2. The expression “substantially perpendicular” can mean that each of angles between the plane and the side surfaces of the light-emitting layers EML-R, EML-G, and EML-B is equal to or greater than about 80° and equal to or less than about 100°.

[0106] Corresponding to the light-emitting areas PXA-R, PXA-G, and PXA-B, the light-emitting layers EML-R, EML-G, and EML-B can be arranged to be spaced apart from each other on (or in) a plane. The first light-emitting layer EML-R can be located in the first light-emitting area PXA-R, the second light-emitting layer EML-G can be located in the second light-emitting area PXA-G, and the third light-emitting layer EML-B can be located in the third light-emitting area PXA-B. The first light-emitting layer EML-R can be referred to as a red light-emitting area, the second light-emitting layer EML-G can be referred to as a green light-emitting area, and the third light-emitting layer EML-B can be referred to as a blue light-emitting area.

[0107] The electron transport region ETR can be located on the light emitting layer EML. The electron transport region ETR can overlap the light emitting regions PXA-R, PXA-G, and PXA-B and the non-light emitting region NPXA as a whole. For example, the electron transport region ETR can cover the first to third light emitting layers EML-R, EML-G, and EML-B, and the pixel defining film PDL exposed without being covered by the light emitting layer EML. That is, the electron transport region ETR can be formed as a common layer. Since the electron transport region ETR is not spaced apart from each other by being patterned in the respective light emitting regions PXA-R, PXA-G, and PXA-B, but the electron transport region ETR is formed as a common layer, the electron transport region ETR can not be exposed to moisture / oxygen, thereby preventing or reducing moisture penetration and oxidation.

[0108] The electron transport region ETR can be formed using various methods such as a vacuum deposition method, a spin coating method, a casting method, a Langmuir-Blodgett (LB) method, an inkjet printing method, a laser printing method, or a laser induced thermal imaging (LITI) method.

[0109] The second electrode EL2 can be provided on the electron transport region ETR. The second electrode EL2 can overlap the light emitting regions PXA-R, PXA-G, and PXA-B and the non-light emitting region NPXA as a whole. For example, the second electrode EL2 can be formed as a common layer. Since the second electrode EL2 is not spaced apart from each other by being patterned in the respective light emitting regions PXA-R, PXA-G, and PXA-B, but the second electrode EL2 is formed as a common layer, the second electrode EL2 can not be exposed to moisture / oxygen, thereby preventing or reducing moisture penetration and oxidation.

[0110] The second electrode EL2 can be a common electrode. The second electrode EL2 can be a cathode or an anode, but embodiments according to the present disclosure are not limited thereto. For example, when the first electrode EL1 is an anode, the second electrode EL2 can be a cathode, and when the first electrode EL1 is a cathode, the second electrode EL2 can be an anode. The second electrode EL2 can be a transmissive electrode, a transreflective electrode, or a reflective electrode. The second electrode EL2 can include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound selected from two or more thereof, a mixture selected from two or more thereof, or an oxide thereof.

[0111] When the second electrode EL2 is a transmissive electrode, the second electrode EL2 can include a transparent metal oxide, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), or the like. When the second electrode EL2 is a transreflective electrode or a reflective electrode, the second electrode EL2 can include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or a compound or a mixture thereof (for example, a mixture of Ag and Mg), or a multi-layer structure material such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). Alternatively, the second electrode EL2 can have a multi-layer structure including a reflective film or a transreflective film formed of the above-described materials and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), or the like. Embodiments according to the present disclosure are not limited thereto, and the second electrode EL2 can include the aforementioned metal materials, any combination of two or more metal materials selected from the aforementioned metal materials, or oxides of the aforementioned metal materials, or the like.

[0112] A sealing layer TFE can be positioned on the second electrode EL2. The sealing layer TFE can cover the steps formed by the light emitting elements ED-1, ED-2, and ED-3, and can provide a flat surface. The sealing layer TFE can cover the light emitting element layer EDL. The sealing layer TFE can seal the light emitting element layer EDL. The sealing layer TFE can be a thin film encapsulation layer. The sealing layer TFE can be a single layer, or a multi-layer in which a plurality of layers are stacked. The sealing layer TFE can include at least one insulating layer. The sealing layer TFE according to some embodiments can include at least one inorganic film (hereinafter, an inorganic encapsulation film). In addition, the sealing layer TFE according to some embodiments can include at least one organic film (hereinafter, an organic encapsulation film) and at least one inorganic encapsulation film.

[0113] The inorganic encapsulation film can protect the light emitting element layer EDL from moisture / oxygen, and the organic encapsulation film can protect the light emitting element layer EDL from foreign substances such as dust particles. The inorganic encapsulation film can include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide, or the like, but is not particularly limited thereto. The organic encapsulation film can include an acrylic compound or an epoxy compound, or the like. The organic encapsulation film can include a photopolymerizable organic material, but is not particularly limited.

[0114] The sealing layer TFE according to some embodiments can include a first inorganic film positioned on the light emitting element layer EDL, an organic layer positioned on the first inorganic film, and a second inorganic film positioned on the organic layer.

[0115] According to some embodiments, the first inorganic film can be located directly on the light emitting element layer EDL. For example, the first inorganic film can be located directly on the second electrode EL2. Alternatively, when the capping layer CPL (see Figure 6D ) is located on the second electrode EL2, the first inorganic film can be located directly on the capping layer CPL (see Figure 6D ). The first inorganic film can be located on the second electrode EL2 to protect the light emitting element layer EDL from moisture / oxygen.

[0116] Figures 6A-6D A cross-sectional view of a light emitting element ED according to some embodiments of the present disclosure. Figures 6A-6D Each illustrates a cross-section of a light emitting element ED representing a first to third color light emitting element ED-1, ED-2, and ED-3.

[0117] Referring to Figure 6B , the hole transport region HTR can include a hole injection layer HIL and a hole transport layer HTL. Referring to Figure 6C , the hole transport region HTR can further include an electron blocking layer EBL.

[0118] The hole transport region HTR can have a single layer structure composed of a single material, a single layer structure composed of a plurality of different materials, or a multi-layer structure having a plurality of layers composed of a plurality of different materials. For example, the hole transport region HTR can have a single layer structure of the hole injection layer HIL or the hole transport layer HTL, or can have a single layer structure composed of a hole injection material and a hole transport material. Alternatively, the hole transport region HTR can have a single layer structure composed of a plurality of different materials, or can have a multi-layer structure in which the hole injection layer HIL / hole transport layer HTL, hole injection layer HIL / hole transport layer HTL / buffer layer, hole injection layer HIL / buffer layer / hole transport layer HTL / buffer layer, or hole injection layer HIL / hole transport layer HTL / electron blocking layer EBL is sequentially stacked from the first electrode EL1, but embodiments according to the present disclosure are not limited thereto.

[0119] Referring to Figure 6A , the electron transport region ETR can be located on the light emitting layer EML. Referring to Figure 6B , the electron transport region ETR can include an electron injection layer EIL and an electron transport layer ETL. Referring to Figure 6C , the electron transport region ETR can further include a hole blocking layer HBL.

[0120] Referring to Figures 6A-6DThe electron transport zone ETR can have a single layer structure composed of a single material, a single layer structure composed of a plurality of different materials, or a multi-layer structure having a plurality of layers composed of a plurality of different materials. For example, the electron transport zone ETR can have a single layer structure of an electron injection layer EIL or an electron transport layer ETL, or can have a single layer structure composed of an electron injection material and an electron transport material. Alternatively, the electron transport zone ETR can have a single layer structure composed of a plurality of different materials or a multi-layer structure in which an electron transport layer ETL / electron injection layer EIL, a hole blocking layer HBL / electron transport layer ETL / electron injection layer EIL are sequentially stacked from the light emitting layer EML, but is not limited thereto.

[0121] According to some embodiments, a capping layer CPL (see Figure 6D ) can be further located on the second electrode EL2 of the light emitting element ED. The capping layer CPL can be a multi-layer or a single layer. According to some embodiments, the capping layer CPL can be an organic layer or an inorganic layer. For example, when the capping layer CPL includes an inorganic material, the inorganic material can include an alkali metal compound (such as LiF), an alkaline earth metal compound (such as MgF2, etc.), SiON, SiN y , and SiO x .

[0122] Figure 7 A flowchart for explaining a manufacturing method of a display panel DP (see Figure 5 ) according to some embodiments of the disclosure is illustrated. Figures 8-14 Cross-sectional views for respectively explaining steps of a manufacturing method of a display panel DP (see Figure 5 ) according to some embodiments of the disclosure are illustrated.

[0123] Referring to Figure 7 , the manufacturing method of a display panel according to some embodiments of the disclosure can include a step of preparing a preliminary display panel (S100), a step of patterning in a light emitting zone (S200), a step of removing a sacrificial layer (S300), and a step of forming a common layer (S400). The manufacturing method of a display panel according to some embodiments of the disclosure can further include a step of forming a thin film encapsulation layer (S500).

[0124] Figure 8 A cross-sectional view for explaining the step of preparing a preliminary display panel (S100) is illustrated. The preliminary display panel can include a base layer BL, a circuit layer CL located on the base layer BL, a first electrode EL1 located on the circuit layer CL, and a pixel definition layer PDL located on the circuit layer CL.

[0125] Referring to Figures 3-5The foregoing description made can be similarly applied to the base layer BL, the circuit layer CL, the first electrode EL1, and the pixel definition film PDL. The first electrode EL1 can be formed in the light emitting regions PXA-R, PXA-G, and PXA-B, for example, by a sputtering process. The pixel definition film PDL can be formed, for example, by chemical vapor deposition (CVD). The pixel definition film PDL can be an inorganic film. Because the pixel definition film PDL is an inorganic film, the pixel definition film PDL can be preserved without being removed during dry etching of the patterning step described later.

[0126] Figures 9A-11 A cross-sectional view of the step (S200) of patterning in the light emitting region is illustrated. The step (S200) of patterning in the light emitting region can be a step of patterning the light emitting layers EML-R, EML-G, and EML-B and the sacrificial layer SL corresponding to the light emitting regions PXA-R, PXA-G, and PXA-B.

[0127] Figures 9A-9D The step of patterning the first light emitting layer EML-R and the sacrificial layer SL in the first light emitting region PXA-R is each illustrated. The step of patterning the first light emitting layer EML-R and the sacrificial layer SL in the first light emitting region PXA-R can include a step of patterning the hole transport region HTR.

[0128] Reference Figure 9A The hole transport region HTR, the first light emitting layer EML-R, and the sacrificial layer SL can be formed in their entirety. For example, the hole transport region HTR, the first light emitting layer EML-R, and the sacrificial layer SL can be formed by a thermal evaporation process. The sacrificial layer SL can be an inorganic film (such as a metal film) or an organic film.

[0129] Reference Figure 9B A photoresist PR can be formed corresponding to the first light emitting region PXA-R. A material that does not affect an organic layer (a light emitting layer, etc.) under the photoresist PR can be used for the photoresist PR.

[0130] Reference Figure 9C In a state in which the photoresist PR is formed in the first light emitting region PXA-R, an organic layer formed in a region other than the first light emitting region PXA-R can be removed by dry etching.

[0131] Reference Figure 9D When the photoresist PR is removed, the patterning of the hole transport region HTR, the first light emitting layer EML-R, and the sacrificial layer SL in the first light emitting region PXA-R can be completed.

[0132] Figures 10A-10DThe step of patterning the second light-emitting layer EML-G and the sacrificial layer SL in the second light-emitting area PXA-G is explained. The step of patterning the second light-emitting layer EML-G and the sacrificial layer SL in the second light-emitting area PXA-G can include the step of patterning the hole transport area HTR.

[0133] Referring to Figure 10A The hole transport area HTR, the second light-emitting layer EML-G, and the sacrificial layer SL can be formed entirely. For example, the hole transport area HTR, the second light-emitting layer EML-G, and the sacrificial layer SL can be formed by a thermal evaporation process. The sacrificial layer SL can be an inorganic film such as a metal film or an organic film.

[0134] Referring to Figure 10B A photoresist PR can be formed corresponding to the second light-emitting area PXA-G. A material that does not affect an organic layer (a light-emitting layer, etc.) under the photoresist PR can be used for the photoresist PR.

[0135] Referring to Figure 10C In a state in which the photoresist PR is formed in the second light-emitting area PXA-G, an organic layer in an area other than the second light-emitting area PXA-G formed in the second light-emitting area PXA-G can be removed by dry etching. Figure 10A

[0136] Referring to Figure 10D When the photoresist PR is removed, patterning of the hole transport area HTR, the second light-emitting layer EML-G, and the sacrificial layer SL in the second light-emitting area PXA-G can be completed.

[0137] Figure 11 The step of patterning the third light-emitting layer EML-B and the sacrificial layer SL in the third light-emitting area PXA-B is explained. The step of patterning the third light-emitting layer EML-B and the sacrificial layer SL in the third light-emitting area PXA-B can include the step of patterning the hole transport area HTR. The hole transport area HTR, the third light-emitting layer EML-B, and the sacrificial layer SL can be formed entirely, and a photoresist PR can be formed corresponding to the third light-emitting area PXA-B. Then, an organic layer (a light-emitting layer, etc.) in an area other than the third light-emitting area PXA-B formed in the third light-emitting area PXA-B can be removed by dry etching. Figure 11 When the photoresist PR is removed, patterning of the hole transport area HTR, the third light-emitting layer EML-B, and the sacrificial layer SL in the third light-emitting area PXA-B can be completed.

[0138] Figure 12 ​A cross-sectional view to explain the step (S300) of removing the sacrificial layer SL. The sacrificial layer SL can be removed by a wet etching so as not to damage the underlying organic layer. Until the process step of removing the sacrificial layer SL, the sacrificial layer SL can protect the underlying light-emitting layers EML-R, EML-G, and EML-B on the first to third light-emitting regions.

[0139] The side surfaces of the light-emitting layers EML-R, EML-G, and EML-B formed by the photopatterning process can be perpendicular (or substantially perpendicular) to a plane. Here, the side surface can mean a surface of the light-emitting layers EML-R, EML-G, and EML-B parallel (or substantially parallel) to the third direction DR3, and the plane can mean a surface defined by the first direction DR1 and the second direction DR2. The expression "substantially perpendicular" can mean that each of the angles between the plane and the side surfaces of the light-emitting layers EML-R, EML-G, and EML-B is equal to or greater than about 80° and equal to or less than about 100°. Unlike according to embodiments of the disclosure, when the light-emitting layers are formed by a fine metal mask process, the angles of the side surfaces of the light-emitting layers with respect to the plane can be small due to a shadow effect. In the manufacturing method of the display panel according to some embodiments of the disclosure, the light-emitting layers EML-R, EML-G, and EML-B are formed by the photopatterning process regardless of the size of the panel, and thus the display panel can be manufactured as a single panel even if the panel is a large panel.

[0140] The process steps described above with reference to Figures 8-12 may be performed in an atmospheric environment. Figure 13 The process steps in and hereinafter can be performed in a vacuum. The manufacturing method of the display panel according to some embodiments of the disclosure can further include a step of removing moisture from the substrate by heating and drying the substrate in a state of Figure 13 before forming the common layer in Figure 12 . For example, the substrate in a state of Figure 12 may be dried at a temperature of about 90℃ or lower so as not to damage the organic matter.

[0141] Figure 13 A cross-sectional view to explain the step (S400) of forming the common layer. The step (S400) of forming the common layer can include a step of forming an electron transport region ETR on the light-emitting layers EML-R, EML-G, and EML-B, and a step of forming a second electrode EL2 on the electron transport region ETR. The electron transport region ETR can be formed integrally while covering the light-emitting layers EML-R, EML-G, and EML-B and the pixel definition film PDL not covered by the light-emitting layers EML-R, EML-G, and EML-B. The electron transport region ETR can be formed, for example, by a thermal deposition process. The second electrode EL2 can be formed integrally while covering the electron transport region ETR.

[0142] Since the electron transport region ETR and the second electrode EL2 are not spaced apart from each other by being patterned in each of the light emitting regions PXA-R, PXA-G, and PXA-B, but are formed as a common layer, the electron transport region ETR and the second electrode EL2 can not be exposed to moisture / oxygen, and thus moisture penetration and oxidation can be prevented or reduced.

[0143] Figure 14 A cross-sectional view illustrating a step (S500) of forming a thin film encapsulation layer. The encapsulation layer TFE can be formed completely while covering the second electrode EL2. The encapsulation layer TFE can include at least one inorganic film and at least one organic film, and reference is made to Figures 3-5 The foregoing description made with respect to the encapsulation layer TFE can be similarly applied.

[0144] In the method of manufacturing a display panel according to some embodiments of the present disclosure, the light emitting layer, etc. is patterned by a photo-patterning process, whereby a separate fine metal mask can be unnecessary, a high-resolution panel can be manufactured, and even a large panel can be manufactured as a single panel. In addition, in the method of manufacturing a display panel according to some embodiments of the present disclosure, the electron transport region and the second electrode can each be formed as a common layer in a vacuum, thereby not being exposed to the atmosphere, so that moisture penetration and oxidation can be prevented or reduced. Accordingly, the reliability of the display panel manufactured thereby can be improved.

[0145] According to the foregoing description, the display panel and the method of manufacturing the same according to some embodiments of the present disclosure can prevent or reduce moisture penetration and oxidation of the layers on top of the light emitting layer by providing the layers on top of the light emitting layer as a common layer, thereby not being exposed to the atmosphere during the process steps.

[0146] In the foregoing, descriptions have been made with reference to some embodiments of the present disclosure, but those skilled in the art or of ordinary skill in the related art can understand that various modifications and changes can be made to the present disclosure within the scope of the spirit and technical range of the present disclosure described in the claims. Accordingly, the technical scope according to the embodiments of the present disclosure is not limited to what is described in the detailed description of the specification, but is determined by the claims and their equivalents.

Claims

1. A display panel comprising: a substrate layer; and a light-emitting element layer over the substrate layer and including a plurality of light-emitting regions spaced apart from each other in a plan view and a non-light-emitting region surrounding each of the plurality of light-emitting regions, wherein the light-emitting element layer includes: a first electrode over the substrate layer corresponding to the plurality of light-emitting regions; a pixel-defining film over the substrate layer, openings corresponding to the plurality of light-emitting regions being defined in the pixel-defining film; a hole-transporting region over the first electrode; a light-emitting layer over the hole-transporting region corresponding to the plurality of light-emitting regions; an electron-transporting region over the light-emitting layer; and a second electrode over the electron-transporting region, the electron-transporting region entirely overlaps the plurality of light-emitting regions and the non-light-emitting region, and the hole-transporting region does not overlap at least a part of the non-light-emitting region.

2. The display panel according to claim 1, wherein the second electrode entirely overlaps the plurality of light-emitting regions and the non-light-emitting region.

3. The display panel according to claim 1, wherein the hole-transporting region overlaps the plurality of light-emitting regions.

4. The display panel according to claim 1, wherein the hole-transporting region includes a hole-injection layer over the first electrode and a hole-transporting layer over the hole-injection layer.

5. The display panel according to claim 1, wherein the electron-transporting region includes an electron-transporting layer over the light-emitting layer and an electron-injection layer over the electron-transporting layer.

6. The display panel according to claim 1, wherein the light-emitting layer covers at least a part of the pixel-defining film, and the electron-transporting region covers a remaining part of the pixel-defining film not covered by the light-emitting layer.

7. The display panel according to claim 1, wherein the pixel-defining film is an inorganic film.

8. The display panel according to claim 1, wherein an angle between a side surface of the light-emitting layer and a plane is equal to or larger than 80° and equal to or smaller than 100°.

9. The display panel according to claim 1, further comprising a thin film encapsulation layer over the light-emitting element layer and configured to cover the light-emitting element layer.

10. The display panel according to claim 1, further comprising a circuit layer between the substrate layer and the light-emitting element layer.

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