Device for testing heat dissipation performance of vapor chamber

Abstract

The utility model relates to the technical field of vapor chambers, and relates to a vapor chamber heat dissipation performance testing device. Comprising a test table board, a vapor chamber, a top plate, a wedge-shaped locking strip, a clamping plate, a rear vertical plate, a left vertical plate, a right vertical plate and a front vertical plate, a rectangular box body structure is arranged on the test table board, and the upper part and the lower part of the rectangular box body structure are opened; the front inner surface and the rear inner surface of the rectangular box body structure are correspondingly provided with multiple sets of groove body structures, the two ends of the vapor chamber can be correspondingly inserted into one set of oppositely-arranged groove body structures, the heating chip can be clamped on the vapor chamber through clamping plates, a heat conduction pad is arranged between the vapor chamber and the heating chip, and multiple thermocouple testing points are arranged between the heating chip and the heat conduction pad. The surface temperature of the heating chip is monitored in the testing process, and the heat dissipation performance of the vapor chamber is detected by testing the surface temperature of the heating chip.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of heat spreading plate relates to heat spreading plate heat dissipation performance testing device. BACKGROUND

[0002] The heat spreading plate is a vacuum cavity with microstructure on the inner wall, usually made of copper, and special working liquid is injected into the cavity. When heat is conducted from the heat source to the evaporation area, the cooling liquid in the cavity begins to vaporize after being heated in a low vacuum environment. At this time, the heat energy is absorbed and the volume expands rapidly. The gas-phase cooling medium rapidly fills the entire cavity. When the gas-phase working medium contacts a relatively cold area, condensation occurs.

[0003] With the increasing demand for performance and miniaturization of airborne electronic equipment, electronic equipment is increasingly using high-performance, miniaturized electronic devices. The performance of electronic devices is very sensitive to temperature. If the temperature is too high or too low, the performance of electronic devices will decrease significantly, thereby affecting the reliable operation of electronic equipment. Therefore, heat spreading plate technology is increasingly used to solve the heat dissipation problem of electronic devices.

[0004] The method for detecting the heat dissipation effect of the heat spreading plate is to simulate the electronic heating element with an aluminum plate and press the heat spreading plate on the lower side. The voltage of the direct current power supply is adjusted to heat the aluminum plate. When the heating power is constant, the temperature of the aluminum plate is measured. The higher the temperature, the worse the heat dissipation effect, and the lower the temperature, the better the heat dissipation effect. In this way, the heat dissipation effect of each heat spreading plate is detected. However, the existing technology cannot detect the heat dissipation performance of heat spreading plates under different working conditions and different sizes. It is also difficult to conduct comparative experimental tests on multiple heat spreading plates or to conduct comparative experimental tests on heat spreading plates and electronic equipment module housings. UTILITY MODEL CONTENTS

[0005] Therefore, the present application provides a heat spreading plate heat dissipation performance testing device that can test the heat dissipation performance of heat spreading plates and module housings with the same size under different working conditions or conduct comparative experimental tests.

[0006] UTILITY MODEL OBJECTIVE

[0007] The utility model aims to overcome the shortcomings of the prior art and provide a heat spreading plate heat dissipation performance testing device that can test the heat dissipation performance of heat spreading plates and module housings with the same size under different working conditions and conduct comparative experimental tests.

[0008] TECHNICAL SCHEME

[0009] The device for testing the heat dissipation performance of a heat plate comprises a test table, a heat plate, a top plate, wedge-shaped locking strips, a clamping plate, a rear vertical plate, a left vertical plate, a right vertical plate, and a front vertical plate. The rear vertical plate and the front vertical plate are symmetrically arranged, and the rear vertical plate and the front vertical plate are each provided with symmetrically distributed wedge-shaped locking strips for fixing the heat plate. The rear vertical plate and the front vertical plate are each provided with symmetrically distributed lugs at one end. One lug on the rear vertical plate is fixed to one side of the left vertical plate by a screw, and the other lug on the rear vertical plate is fixed to one side of the right vertical plate by a screw. The other side of the left vertical plate and the other side of the right vertical plate are clamped by a U-shaped plate, and the pre-tightening force between the left vertical plate and the right vertical plate can be adjusted by a screw on one side. The rear vertical plate, the left vertical plate, the right vertical plate, and the front vertical plate form a rectangular box. The front vertical plate is provided with symmetrically distributed bosses at the top, and the front vertical plate is lapped between the left vertical plate and the right vertical plate by the bosses and can move forward and backward towards the rear vertical plate. The heat chip is clamped to the heat plate by the clamping plate. The rear vertical plate, the left vertical plate, and the right vertical plate are each fixed to the test table by a mounting plate. The top plate covers the rectangular box.

[0010] Further, a sealing strip is arranged at the contact area between the rectangular box and the top plate for structural sealing.

[0011] Further, an exhaust fan is arranged on the test table to form a heat dissipation airflow on the heat plate.

[0012] Further, a ventilation hole is arranged on the top plate for the heat dissipation airflow to enter.

[0013] Further, a sensor is arranged between the heat plate and the heat chip to detect the temperature of the heat chip.

[0014] Further, the stroke of the front-to-back movement of the front vertical plate should meet the installation and use requirements of heat plates of different thicknesses.

[0015] Further, the height of the rear vertical plate, the left vertical plate, and the right vertical plate is higher than the height of the heat plate.

[0016] The application has the following advantages:

[0017] (1) In the present application, a rectangular box structure is arranged on the test table, and the rectangular box structure is open at the top and bottom. A plurality of groove structures are arranged on the front and rear inner surfaces of the rectangular box structure. The heat plate can be correspondingly inserted and arranged in a set of oppositely arranged groove structures. The heat chip can be clamped on the heat plate by the clamping plate. The heat plate and the heat chip are padded with a heat-conducting pad. A plurality of thermocouple test points are arranged between the heat chip and the heat-conducting pad to monitor the surface temperature of the heat chip during the test. The surface temperature of the heat chip is tested to detect the heat dissipation performance of the heat plate.

[0018] In addition, the scheme can also be used for the performance test of the module shell of the electronic module, the test and installation mode of which are same as the vapor chamber, and since the scheme is provided with the plurality of groove structure groups, the scheme can simultaneously perform the comparative experiment test of the performance of the plurality of heat dissipation plates or the comparative experiment test of the vapor chamber and the module shell of the electronic equipment.

[0019] (2) The top plate is installed on the top of the rectangular box body structure, the air inlet fan is installed on the bottom of the top plate, and the air outlet fan is installed on the top of the test table, so that the scheme can perform the vapor chamber heat dissipation performance test under different strength air cooling conditions by adjusting the power of the fan.

[0020] (3) In the scheme, the rectangular box body structure is surrounded by the rear stand plate, the left stand plate, the right stand plate and the front stand plate, and the front stand plate is clamped between the left stand plate and the right stand plate, so that the distance between the rear stand plate and the front stand plate can be adjusted by moving the front stand plate forward, and the distance between each groove structure group is adjusted, so that the scheme can be applied to the vapor chamber heat dissipation performance test of different width sizes. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic view of the utility model;

[0022] Figure 2 is a structural schematic view of the utility model after installing the top plate;

[0023] Figure 3 is a sectional view schematic view of the utility model;

[0024] Figure 4 is a bottom plate schematic view of the utility model;

[0025] Figure 5 is a U-shaped buckle plate schematic view of the clamping plate top of the utility model;

[0026] Figure 6 is a U-shaped plate schematic view of the utility model.

[0027] Among them, 1-test table, 2-vapor chamber, 3-top plate, 4-wedge locking strip, 5-clamping plate, 6-heating chip, 7-rear stand plate, 8-left stand plate, 9-right stand plate, 10-front stand plate, 11-mounting plate, 12-sealing strip, 13-U-shaped plate; 101-ear piece; 501-U-shaped buckle plate. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model embodiment will be described in more detail below in combination with the utility model embodiments. In the examples, the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The described embodiments are part of the embodiments of the utility model, not all. The described embodiments below are exemplary and are intended to explain the utility model, and cannot be understood as a limitation of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model. The embodiments of the utility model will be described in detail below.

[0029] The heat plate heat dissipation performance testing device is used for heat plate heat dissipation performance testing, including test table top, and rectangular box body structure installed on the test table top, the rectangular box body structure is opened up and down, the top of the rectangular box body structure is detachably installed with the top plate, the bottom of the top plate and the top of the test table top are installed with the air inlet fan and the air outlet fan respectively, a plurality of groove structures are arranged on the front and rear inner surfaces of the rectangular box body structure, the heat plate is correspondingly inserted and installed in a group of groove structures at both ends, and is locked through the wedge-shaped locking strip, the clamping plate is detachably installed on the heat plate, and after installation is completed, the clamping plate left side and the heat plate right side clamp the heating chip. The setting of the air outlet fan and the air inlet fan can facilitate the heat plate performance testing under forced air cooling condition.

[0030] In a preferred embodiment of the present scheme, a heat-conducting pad is interposed between the heat plate and the heating chip; a plurality of thermocouple test points are arranged between the heating chip and the heat-conducting pad to test the surface temperature of the heating chip.

[0031] In a preferred embodiment of the present scheme, the heat-conducting pad has a thickness of 1mm and a heat-conducting coefficient of 5W / (K·m).

[0032] In a preferred embodiment of the present scheme, the clamping plate is provided with a U-shaped buckle plate at each end, and the two U-shaped buckle plates are oppositely arranged; lock screws are vertically screwed on the outer vertical edge plate of the U-shaped buckle plate.

[0033] In a preferred embodiment of the present scheme, the rectangular box body structure includes a rear vertical plate, a left vertical plate, a right vertical plate and a front vertical plate, and a plurality of groove structures are correspondingly arranged on the rear vertical plate and the front vertical plate; an installation plate is arranged on the bottom of the rear vertical plate, the bottom of the left vertical plate and the bottom of the right vertical plate respectively, and the rear vertical plate, the left vertical plate and the right vertical plate can be fixed on the test table top through the installation plate and screws respectively; after installation is completed, the front vertical plate is clamped between the left vertical plate and the right vertical plate to form a rectangular box body structure.

[0034] In a preferred embodiment of the present scheme, the bottom of the top plate is provided with an air inlet fan, and the top of the test table is provided with an air outlet fan; the groove structure is arranged in the middle of the rear stand and the front stand, so that the heat plate is spaced apart from the top plate and the test table.

[0035] In a preferred embodiment of the present scheme, the top of the rear stand and the front stand extends to both sides at both ends, and the left stand and the right stand can be respectively clamped below the corresponding ear pieces; the rear stand is provided with threaded holes corresponding to the top plate at both ear pieces, and the left stand and the right stand are provided with threaded holes corresponding to the top plate at the front top; after installation, the top plate is screwed on the rectangular box structure by screws; and after installation, a sealing strip is placed in the gap between the top of the left stand and the right stand and the top plate.

[0036] In a preferred embodiment of the present scheme, the test device further comprises a U-shaped plate, two screws are screwed on one end of the U-shaped plate, and after installation, the U-shaped plate can be buckled on the left stand and the right stand and locked and fixed through the two screws.

[0037] As shown in Figures 1-3 , the heat plate heat dissipation performance test device is used for testing the heat dissipation performance of the heat plate 2 or the module shell, which comprises a test table 1 and a rectangular box structure installed on the test table, and a plurality of groove structures are arranged on the inner surfaces of the front and rear of the rectangular box structure; when the heat dissipation performance of the heat plate 2 is tested, the heat plate 2 is inserted into a groove structure at both ends and locked by a wedge-shaped locking strip 4; a clamping plate 5 is detachably installed on the heat plate 2, the clamping plate has a small overall size, and a heating chip 6 is clamped between the left side of the clamping plate 5 and the right side of the heat plate 2, so that the heat dissipation performance of the heat plate can be tested by monitoring the surface temperature of the heating chip 6.

[0038] At the same time, in the present embodiment, as shown in Figure 2 , Figure 4 , a top plate 3 is installed on the top of the rectangular box structure, an air inlet fan is installed at the bottom of the top plate 3, and an air outlet fan is installed at the top of the test table 1, so that the heat dissipation performance of the heat plate under different intensity air cooling conditions can be tested by adjusting the power of the fan.

[0039] Further, in the present scheme, a heat-conducting pad is interposed between the heat plate 2 and the heating chip 6; a plurality of thermocouple test points are arranged between the heating chip 6 and the heat-conducting pad to test the surface temperature of the heating chip 6; preferably, the thickness of the heat-conducting pad is 1mm, and the heat-conducting coefficient is 5W / (K·m).

[0040] In the present embodiment, as shown in Figure 5 , a U-shaped buckle 501 is arranged at each end of the clamping plate 5, and the two U-shaped buckles 501 are oppositely arranged; as shown in Figure 5As shown, the outer vertical edge plate of the U-shaped buckle plate 501 is provided with a threaded hole, and a locking screw is screwed in the threaded hole. Figure 1 As shown, when the clamping plate 5 is sleeved on the heat plate 2, the heating chip 6 can be tightly attached to the heat plate 2 by tightening the locking screw.

[0041] Further, in this scheme, the rectangular box structure includes a rear vertical plate 7, a left vertical plate 8, a right vertical plate 9, and a front vertical plate 10, and the groove structure is arranged on the rear vertical plate 7 and the front vertical plate 10. In order to facilitate installation, the bottom front and back sides of the rear vertical plate 7, and the bottom outer sides of the left vertical plate 8 and the right vertical plate 9 are respectively provided with an installation plate 11, so that the rear vertical plate 7, the left vertical plate 8, and the right vertical plate 9 can be fixed on the test table 1 by screws, and the front vertical plate 10 is clamped between the left vertical plate 8 and the right vertical plate 9. By moving the position of the front vertical plate 10, the distance between the front and back vertical plates can be adjusted to detect the heat dissipation performance of heat plates 2 or module housings of different width sizes. In addition, as shown in Figure 1 、 Figure 2 As shown, the left and right sides of the rear vertical plate 7 and the left and right sides of the front vertical plate 10 are provided with sealing pieces on the contact surfaces with the left vertical plate 8 or the right vertical plate 9.

[0042] In this embodiment, the groove structure is arranged in the middle of the rear vertical plate 7 and the front vertical plate 10, so that the heat plate 2 is spaced apart from the top plate 3 and the test table 1.

[0043] Further, in this scheme, the top of the rear vertical plate 7 and the front vertical plate 10 respectively extends two ears 101 to the two sides, and the left vertical plate 8 and the right vertical plate 9 can be respectively clamped below the corresponding ears 101. The two ears 101 of the rear vertical plate 7 and the front top of the left vertical plate 8 and the right vertical plate 9 are respectively provided with threaded holes corresponding to the top plate 3. After installation, the top plate 3 is screwed on the rectangular box structure by screws, and the top plate 3 is provided with a hole for the power line to pass out. After installation, sealing strips 12 are respectively placed in the gap between the top of the left vertical plate 8 and the right vertical plate 9 and the top plate 3.

[0044] As shown in Figure 2 、 Figure 6 In this embodiment, the test device further includes a U-shaped plate 13, one end of the U-shaped plate 13 is provided with two screws, and after installation, the U-shaped plate 13 can be buckled on the left vertical plate 8 and the right vertical plate 9 and locked and fixed through the two screws.

[0045] In this embodiment, before testing, the clamping plate 5 needs to be sleeved on the heat plate 2, the screws at both ends are tightened, the heating chip 6 is tightly attached to the surface of the heat plate 2, and then the heat plate 2 is inserted.

[0046] As will be understood by one of ordinary skill in the art, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. The specific embodiments described above are illustrative of specific embodiments of the application and are not meant to be limiting of the application. Any modification of the above-described embodiments, which comes within the spirit of the application, is intended to be included in the scope of the application. The above-described embodiments are intended to be illustrative of the application and are not meant to be limiting of the application. Any modification of the above-described embodiments, which comes within the spirit of the application, is intended to be included in the scope of the application. The above-described embodiments are intended to be illustrative of the application and are not meant to be limiting of the application. Any modification of the above-described embodiments, which comes within the spirit of the application, is intended to be included in the scope of the application.

Claims

1. A device for testing the heat dissipation performance of a vapor chamber, characterized in that, The utility model relates to a test platform, which comprises a test platform, a hot plate, a top plate, wedge-shaped locking strips, clamps, a rear vertical plate, a left vertical plate, a right vertical plate, and a front vertical plate.

2. The apparatus of claim 1, wherein, The rear vertical plate and the front vertical plate are symmetrically arranged, and the rear vertical plate and the front vertical plate are each provided with symmetrically distributed wedge-shaped locking strips for fixing the hot plate.

3. The apparatus of claim 1, wherein, The rear vertical plate and the front vertical plate are each provided with symmetrically distributed lugs at one end.

4. The apparatus of claim 1, wherein, One lug on the rear vertical plate is fixed to one side of the left vertical plate through a screw, and the other lug on the rear vertical plate is fixed to one side of the right vertical plate through a screw.

5. The apparatus of claim 1, wherein, The other side of the left vertical plate and the other side of the right vertical plate are clamped through a U-shaped plate, and the pre-tightening force between the left vertical plate and the right vertical plate is adjusted through a screw on one side.

6. The apparatus of claim 1, wherein, The rear vertical plate, the left vertical plate, the right vertical plate, and the front vertical plate enclose a rectangular box.

7. The apparatus of claim 1, wherein, The top of the front vertical plate is provided with symmetrically distributed bosses, which are used to overlap the front vertical plate between the left vertical plate and the right vertical plate and can move forward and backward towards the rear vertical plate. The heating chip is fixed on the hot plate through a clamp. The rear vertical plate, the left vertical plate, and the right vertical plate are each fixed on the test platform through a mounting plate. The top plate covers the rectangular box. The test platform is provided with an exhaust fan for forming a cooling air flow on the hot plate. The top plate is provided with a ventilation hole for the cooling air flow to enter. The utility model further comprises a sensor arranged between the hot plate and the heating chip for detecting the temperature of the heating chip. The front-to-back movement stroke of the front vertical plate should meet the installation and use requirements of hot plates with different thicknesses. The height of the rear vertical plate, the left vertical plate, and the right vertical plate is higher than the height of the hot plate.

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