Cold plate heat dissipation device for realizing gas-liquid two-phase heat dissipation for SXM H100 computing card

Abstract

The utility model discloses a cold plate heat dissipation device for realizing gas-liquid two-phase heat dissipation for an SXM H100 computing card, and relates to the technical field of heat dissipation of electronic equipment. The device comprises a cold plate cavity, a cavity bottom plate and a fixing plate. The cold plate cavity is provided with a liquid inlet hole and an air outlet hole; the cavity bottom plate and the cold plate cavity are connected in a sealed mode to form a cavity, and a shovel tooth structure is arranged on the inner surface of the cavity bottom plate. The fixing plate is arranged between the cold plate cavity and the cavity bottom plate and used for installing the device to the SXM H100 computing card. According to the gas-liquid two-phase heat dissipation principle that cooling liquid boils and evaporates on the form relieved tooth structure to absorb latent heat, the heat dissipation efficiency is extremely high. The cold plate heat dissipation device is suitable for heat dissipation of high-heat-flux components in the manufacturing field of high-end routers, single-slot processing routers and other computers and the manufacturing field of new-generation mobile communication base station equipment, digital stored program control exchange and other communication system equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment heat dissipation technical field especially, it relates to a kind of cold plate heat sink for SXM H100 computing card realizes gas-liquid two-phase heat dissipation. BACKGROUND

[0002] With the rapid development of high-performance computing and artificial intelligence technology, the power density of computing chips, especially such as graphics processing units (GPUs) and AI accelerator cards, has increased dramatically. For example, the H100 computing card of Nvidia's SXM version, which has extremely high power consumption and generates a large amount of heat, poses a severe challenge to the server's cooling system.

[0003] Currently, the main cooling methods for such high-power computing cards include air cooling and single-phase liquid cooling. Air cooling has limited efficiency and is noisy and energy-intensive, making it difficult to meet the cooling needs of high heat flux.

[0004] Single-phase liquid cooling uses a liquid cooling cold plate, which circulates the coolant in the internal flow channel of the cold plate through a pump. The heat is removed by the temperature rise of the liquid (sensible heat). Although single-phase liquid cooling is more efficient than air cooling, its cooling capacity is limited by the flow rate and specific heat capacity of the liquid. To improve cooling efficiency, single-phase liquid cooling cold plates usually use microchannel designs to increase the heat transfer area. However, this design has several problems: first, it increases the system flow resistance, requiring a higher power pump; second, the temperature of the coolant continues to rise from the inlet to the outlet, resulting in uneven chip surface temperatures and difficulty in handling local hot spots; finally, the microchannel structure is complex to process and is prone to clogging, posing a risk of reliability and liquid leakage.

[0005] Therefore, when traditional air cooling and single-phase liquid cooling technology cannot meet the growing cooling needs of high-power, high-heat flux electronic devices, there is an urgent need for a more efficient and reliable cooling solution.

[0006] With the performance improvement of next-generation information network key devices such as high-end routers, single-slot processing routers, new-generation mobile communication base station equipment, and digital program-controlled switches, their core computing units (SXM H100 computing cards) face significant cooling challenges. The gas-liquid two-phase cooling device proposed in this application addresses this key technical bottleneck. SUMMARY

[0007] The utility model aims at providing a kind of cold plate heat sink for SXM H100 computing card realizes gas-liquid two-phase heat dissipation, to solve the technical problems of limited cooling efficiency, uneven temperature and single-phase liquid cooling microchannel clogging risk in the prior art.

[0008] To achieve the above objectives, this utility model provides a cold plate heat dissipation device for gas-liquid two-phase heat dissipation of the SXM H100 computing card, comprising:

[0009] The cold plate cavity is provided with at least one liquid inlet and at least one air outlet;

[0010] The cavity bottom plate is sealed to the cold plate cavity, together forming a cavity that contains coolant and realizes gas-liquid phase change circulation; the inner surface of the cavity bottom plate is provided with a shovel tooth structure.

[0011] A fixing plate is disposed between the cold plate cavity and the cavity bottom plate, and is fixedly connected to the cold plate cavity and the cavity bottom plate; the fixing plate is configured to install the cold plate heat dissipation device to the base of the SXM H100 computing card.

[0012] In a preferred embodiment, the cold plate cavity and the cavity base plate are made of a first metal material with good thermal conductivity, and the fixing plate is made of a second metal material with a lower density than the first metal material.

[0013] In a preferred embodiment, the first metal material is copper; the second metal material is aluminum.

[0014] In a preferred embodiment, the cold plate cavity, the fixing plate, and the cavity bottom plate are integrally connected by a brazing process.

[0015] In a preferred embodiment, the shovel tooth structure includes a plurality of parallel shovel teeth; the shovel tooth structure is used to increase the contact area between the cavity bottom plate and the coolant in the gas-liquid phase change cycle, so as to promote boiling evaporation.

[0016] In a preferred embodiment, the thickness of the shovel teeth is 0.3 mm, the height of the shovel teeth is 10 mm, and the length of the shovel teeth is 9 mm.

[0017] In a preferred embodiment, the lateral spacing between adjacent shovel teeth is 1.2 mm and the vertical spacing is 1 mm.

[0018] In a preferred embodiment, the bottom of the fixing plate is provided with at least two positioning pins, which are used to match and position with the base of the SXM H100 computing card to achieve foolproof installation.

[0019] In a preferred embodiment, the fixing plate is provided with a plurality of through holes, which correspond to the screw holes of the SXM H100 computing card base, for fixing the cold plate heat dissipation device by fasteners.

[0020] In a preferred embodiment, the number of liquid inlet holes is one, and the number of gas outlet holes is two; the liquid inlet hole and the gas outlet hole are both internal thread holes for mounting a quick connector; wherein the liquid inlet hole is adapted to mount a PU pipe quick connector with an outer diameter of 4mm and an inner diameter of 2.5mm, and the gas outlet hole is adapted to mount a PU pipe quick connector with an outer diameter of 12mm and an inner diameter of 10mm.

[0021] The technical scheme of the utility model has the following beneficial effects:

[0022] 1. The cold plate heat dissipation device of the utility model adopts gas-liquid two-phase heat dissipation principle, and utilizes the boiling evaporation of the cooling liquid on the cavity inner tooth structure to absorb a large amount of latent heat. Compared with the sensible heat absorption of single-phase liquid cooling, the heat dissipation efficiency using latent heat is several times higher, which can meet the heat dissipation requirements of high heat flux density computing cards such as SXM H100.

[0023] 2. Since the boiling temperature of the liquid under a certain saturation pressure is fixed, the two-phase heat dissipation has excellent isothermicity, so that the temperature of the computing card surface is very uniform, which is beneficial to eliminate local hot spots and improve the stability and life of the computing card.

[0024] 3. The cavity bottom plate adopts a toothed structure instead of a traditional microchannel structure. The toothed structure has a large enough boiling evaporation contact area, a large channel spacing, significantly reduced flow resistance, completely solves the risk of single-phase liquid cooling microchannel blockage, and improves the reliability and safety of the heat dissipation system. At the same time, the toothed process is simpler than the microchannel processing.

[0025] 4. The cold plate cavity and cavity bottom plate made of red copper material ensure good heat conduction performance, and the fixing plate made of aluminum material ensures structural strength, light weight and cost reduction. Through brazing integration, the sealing performance and structural reliability of the device are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 An exploded structural schematic view of a cold plate heat dissipation device provided by the utility model embodiment.

[0027] Figure 2 A reverse side three-dimensional structural schematic view of a cold plate heat dissipation device provided by the utility model embodiment.

[0028] Figure 3 A front side three-dimensional structural schematic view of a cold plate heat dissipation device provided by the utility model embodiment.

[0029] REFERENCE SIGNS:

[0030] 10 - cold plate cavity; 11 - liquid inlet hole; 12 - gas outlet hole; 20 - fixed plate; 21 - positioning pin; 22 - through hole; 30 - cavity bottom plate; 31 - spade tooth structure. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0032] In the description of the utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0033] The cold plate heat dissipation device is suitable for high-end routers, single-slot processing routers and other computer manufacturing fields, and high heat flux components in the manufacturing field of new generation mobile communication base station equipment, digital program-controlled switch and other communication system equipment.

[0034] Please refer to Figures 1 to 3 The utility model embodiment provides a kind of cold plate heat dissipation device for SXM H100 computing card realizes gas-liquid two-phase heat dissipation.The device is mainly composed of three parts: cold plate cavity 10, fixed plate 20 and cavity bottom plate 30.

[0035] Wherein, cold plate cavity 10 is located in the upper portion of device.As Figure 1 Indicated, the top of cold plate cavity 10 is equipped with at least one liquid inlet hole 11 and at least one gas outlet hole 12.In a preferred embodiment, there is one liquid inlet hole 11 and two gas outlet holes 12.Liquid inlet hole 11 is used to inject low-boiling cooling liquid, and gas outlet hole 12 is used to discharge steam generated after cooling liquid is heated.

[0036] Cavity bottom plate 30 is located in the lower portion of device, and its outer surface (such as Figure 2 Indicated bottom surface boss) is used to be in close contact with the core chip of SXM H100 computing card to absorb the heat generated by chip.Cavity bottom plate 30 is sealingly connected with cold plate cavity 10, and together encloses a cavity for realizing gas-liquid phase change cycle.

[0037] As Figure 3As shown, the fixing plate 20 is arranged between the cold plate cavity 10 and the cavity bottom plate 30. The fixing plate 20 is fixedly connected with the cold plate cavity 10 and the cavity bottom plate 30 to form a complete assembly. The main function of the fixing plate 20 is to stably mount the cold plate heat dissipation device to the base of the SXM H100 computing card.

[0038] The core innovation of the utility model lies in the internal structure design of the cavity bottom plate 30. As shown in the drawings, Figure 3 As shown, the inner surface (i.e. the side facing the cavity) of the cavity bottom plate 30 is provided with a gullet structure 31. The gullet structure 31 is composed of a series of parallel thin sheet-shaped fins, which greatly increases the contact area of the cavity bottom plate 30 with the cooling liquid in the cavity, providing a large number of vaporization cores for the boiling evaporation of the cooling liquid.

[0039] The working principle of the utility model is as follows: a large amount of heat is generated when the SXM H100 computing card is running, and the heat is transferred to the cavity bottom plate 30. The cavity bottom plate 30 rapidly absorbs heat and conducts the heat to the gullet structure 31 on its inner surface. The cooling liquid is injected into the cavity from the liquid inlet hole 11 and comes into contact with the high-temperature gullet structure 31. The cooling liquid boils on the gullet surface and changes from liquid to gas (steam). This phase change process absorbs a large amount of latent heat, thereby efficiently taking away the heat. The generated steam rises in the cavity and leaves the cold plate device through the gas outlet hole 12, enters the external circulation system for condensation, and completes the heat dissipation cycle.

[0040] In a preferred embodiment, in order to achieve the best heat dissipation effect and structural lightweighting, the materials of each component are optimized. The cold plate cavity 10 and the cavity bottom plate 30, as the core heat conduction components, are made of red copper material with excellent heat conduction performance. The fixing plate 20 mainly plays a supporting and fixing role, so it is made of aluminum material with low density and lower cost, which helps to reduce the weight of the entire heat dissipation device.

[0041] In order to ensure the sealing and stability of the device, especially for the connection of copper-aluminum dissimilar metals, the cold plate cavity 10, the fixing plate 20 and the cavity bottom plate 30 are integrally welded together by high-strength brazing process. This connection method ensures the connection strength and reliability for long-term use.

[0042] In view of the characteristics of two-phase heat dissipation, the size of the gullet structure 31 is optimized to overcome the defect that traditional single-phase liquid cooling microchannels are easy to block.

[0043] Specifically, in a preferred embodiment, the gullet thickness of the gullet structure 31 is designed to be 0.3mm. This thickness ensures that the gullet has sufficient mechanical strength and heat conduction efficiency. The gullet height is designed to be 10mm, and the gullet length is designed to be 9mm. Such dimensions provide sufficient boiling surface area.

[0044] More importantly, the spacing between the spades is optimized. The lateral spacing between adjacent spades is 1.2 mm, and the vertical spacing is 1 mm. Compared with the size of tens to hundreds of microns of the microchannel, the millimeter-level spacing significantly increases the flow area and greatly reduces the flow resistance, so that the coolant and the steam can flow smoothly. At the same time, the spacing completely eliminates the risk of blockage caused by small impurities in the coolant, and significantly improves the reliability of the system.

[0045] In the design of the cold plate cavity 10, a liquid inlet hole 11 and two gas outlet holes 12 are adopted. Since the volume of steam is much larger than that of liquid, the setting of two gas outlet holes helps to quickly discharge a large amount of steam, ensuring the smooth progress of the phase change cycle.

[0046] In order to facilitate connection with external pipelines, the liquid inlet hole 11 and the gas outlet hole 12 are designed as internal thread holes for installing quick couplings. In a specific embodiment, the liquid inlet hole 11 is adapted to install a PU pipe quick coupling with an outer diameter of 4 mm and an inner diameter of 2.5 mm; and the gas outlet hole 12 is adapted to install a PU pipe quick coupling with an outer diameter of 12 mm and an inner diameter of 10 mm. The pipe diameter of the gas outlet hole is significantly larger than that of the liquid inlet hole, in order to adapt to the characteristics of large volume difference between gas and liquid.

[0047] In the design of the fixed plate 20, in order to realize accurate installation and foolproof design, as shown in Figure 2 The bottom of the fixed plate 20 is provided with two positioning pins 21. The positions of the two positioning pins 21 are accurately matched with the positioning holes on the SXM H100 computing card base, ensuring the uniqueness of the direction and position during installation.

[0048] In addition, the fixed plate 20 is also provided with four through holes 22. The positions of the four through holes 22 correspond to the four screw hole positions of the SXM H100 computing card base. During installation, by passing the fasteners (such as bolts) through the through holes 22 and locking them on the computing card base, the entire cold plate heat dissipation device can be firmly fixed on the computing card.

[0049] In summary, the utility model provides a kind of compact structure, high-efficiency heat dissipation, high reliability gas-liquid two-phase cold plate heat dissipation device. By adopting optimized spade structure, the defects of traditional microchannel easy to block are overcome;Using latent heat of phase change, the heat dissipation demand of high heat flux density computing card is met;And through reasonable material selection and structure design, lightweight and easy installation are realized.

[0050] The above only describes preferred embodiments of the utility model and is not used to limit the utility model, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A cold plate heat dissipation device for realizing gas-liquid two-phase heat dissipation of an SXM H100 computing card, characterized in that, The application relates to a cold plate heat dissipation device for SXM H100 computing cards, which comprises the following parts: a cold plate cavity (10) provided with at least one liquid inlet hole (11) and at least one gas outlet hole (12); a cavity bottom plate (30) in sealing connection with the cold plate cavity (10) and jointly forming a cavity for containing cooling liquid and realizing gas-liquid phase change circulation; the inner surface of the cavity bottom plate (30) is provided with a spade tooth structure (31); a fixing plate (20) arranged between the cold plate cavity (10) and the cavity bottom plate (30) and fixedly connected with the cold plate cavity (10) and the cavity bottom plate (30); the fixing plate (20) is configured to be used for mounting the cold plate heat dissipation device to the base of the SXM H100 computing card.

2. The cold plate heat sink device of claim 1, wherein, The cold plate cavity (10) and the cavity bottom plate (30) are made of a first metal material with good heat conduction performance, and the fixing plate (20) is made of a second metal material with lower density than the first metal material.

3. The cold plate heat sink device of claim 2, wherein, The first metal material is red copper material, and the second metal material is aluminum material.

4. The cold plate heat sink device of any one of claims 1 to 3, wherein, The cold plate cavity (10), the fixing plate (20) and the cavity bottom plate (30) are integrally connected through a brazing process.

5. The cold plate heat sink device of claim 1, wherein, The spade tooth structure (31) comprises a plurality of parallel arranged spade teeth; the spade tooth structure (31) is used for increasing the contact area of the cavity bottom plate (30) and the cooling liquid in the gas-liquid phase change circulation, so as to promote boiling evaporation.

6. The cold plate heat sink device of claim 5, wherein, The thickness of the spade tooth is 0.3 mm, the height of the spade tooth is 10 mm, and the length of the spade tooth is 9 mm.

7. The cold plate heat sink device of claim 5, wherein, The transverse spacing between adjacent spade teeth is 1.2 mm, and the vertical spacing is 1 mm.

8. The cold plate heat spreading device of claim 1, wherein, The bottom of the fixing plate (20) is provided with at least two positioning pins (21) which are used for matching positioning with the base of the SXM H100 computing card to realize foolproof installation.

9. The cold plate heat spreading device of claim 1, wherein, The fixing plate (20) is provided with a plurality of through holes (22) corresponding to the screw hole positions of the base of the SXM H100 computing card and used for fixing the cold plate heat dissipation device through fasteners.

10. The cold plate heat spreading device of claim 1, wherein, The number of the liquid inlet hole (11) is one, and the number of the gas outlet hole (12) is two; the liquid inlet hole (11) and the gas outlet hole (12) are both internal thread holes used for mounting quick couplings; wherein the liquid inlet hole (11) is suitable for mounting a PU pipe quick coupling with an outer diameter of 4 mm and an inner diameter of 2.5 mm, and the gas outlet hole (12) is suitable for mounting a PU pipe quick coupling with an outer diameter of 12 mm and an inner diameter of 10 mm.

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