Stackable heat dissipation docking station
By designing a stackable heat dissipation expansion dock and using recessed housings and staggered placement to avoid electronic components, the stability and heat dissipation issues when the expansion dock is stacked with small devices are solved, resulting in better heat dissipation and stability.
Patent Information
- Application Number
- CN202520145034.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-20
AI Technical Summary
When existing expansion docks are stacked with small electronic devices, there are problems with poor stability and inadequate heat dissipation.
A stackable heat dissipation expansion dock is designed, including a housing and electronic components. The housing consists of a top cover, a middle frame, and a bottom cover. The middle frame has grooves and through holes. The electronic components are staggered to avoid each other. Heat dissipation is achieved by using heat dissipation holes on the bottom cover. Heat dissipation is improved by combining a heat-conducting plate and heat sink.
It improves the stability and heat dissipation when the docking station is stacked with small electronic devices, avoids the heat from stacking affecting the heat dissipation of the devices, and makes the overall structure more stable and space-saving.
Smart Images
Figure CN223816309U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of docking station, especially a stackable docking station with heat dissipation. BACKGROUND
[0002] With the increasing richness of the functions of electronic devices, the types of external devices connected to the electronic devices are also increasing, and many electronic devices need to be expanded through docking stations.
[0003] However, the docking station is generally placed aside or stacked with the electronic device after being connected to some small electronic devices. When the docking station is placed aside and connected to external devices, the lines are messy and inconvenient. When the docking station is stacked with the electronic device, the stacking is unstable, and in addition, the heat dissipation of the small electronic device is generally located at the bottom, which may affect the heat dissipation effect of the electronic device after being stacked with the docking station. UTILITY MODEL CONTENT
[0004] The main purpose of the utility model is to provide a stackable docking station with heat dissipation, which aims to solve the stability and heat dissipation effect problems when the docking station is stacked with small devices.
[0005] To achieve the above-mentioned purpose, the docking station provided by the utility model comprises a shell and an electronic assembly. The shell comprises an upper cover, a middle frame and a bottom cover. The upper cover, the middle frame and the bottom cover form a containing cavity. The upper cover is formed with a groove. The bottom cover is provided with a plurality of heat dissipation holes. A plurality of through holes are formed in the middle frame. The electronic assembly is installed in the containing cavity and is at least partially arranged in a staggered manner to avoid the groove. The electronic assembly comprises a circuit board and a plurality of data interfaces. The data interfaces are electrically connected to the circuit board and are arranged correspondingly to the through holes.
[0006] In the docking station of the present application, the upper cover is provided with a groove, and the electronic device can be stacked in the groove more stably. At the same time, the electronic assembly inside is arranged in a staggered manner to avoid the groove, so that the heat generated by the electronic device can be better dissipated through the heat dissipation holes on the bottom cover, avoiding the heat generated by the electronic assembly affecting the heat dissipation of the electronic device, and improving the heat dissipation effect.
[0007] Optionally, the upper cover is formed with a heat conduction plate towards the bottom cover. The heat conduction plate is located at the bottom of the groove.
[0008] Optionally, the heat conduction plate is arranged in a staggered manner to form a plurality of heat conduction cavities. The heat conduction cavities are communicated with the heat dissipation holes.
[0009] Optionally, the electronic assembly further comprises a heat dissipation member. The heat dissipation member is electrically connected to the circuit board and is arranged in a staggered manner to avoid the groove.
[0010] Optionally, the docking station comprises a shielding cover, the shielding cover covering the electronic components.
[0011] Optionally, the docking station comprises a data line, the data line being electrically connected with the circuit board, the data line being at least partially extended out of the shell, the bottom cover being provided with a wire slot on a side opposite to the upper cover, and the part of the data line extended out of the shell being capable of being received into the wire slot.
[0012] Optionally, the docking station further comprises a wire card, the wire card being located in the accommodating cavity and connected with the upper cover, and the part of the data line located in the accommodating cavity being clamped with the wire card.
[0013] Optionally, the electronic components comprise an indicator light and a light guide column, the indicator light being electrically connected with the circuit board, and the light guide column being arranged on the middle frame and arranged in position with the indicator light.
[0014] Optionally, the data interface comprises a storage interface, a Type-A interface and a Type-C interface.
[0015] Optionally, the docking station further comprises a rubber pad, the rubber pad being arranged at the bottom of the recess. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in the drawings without creative labor.
[0017] Figure 1 Fig. 1 is a perspective view of the docking station of the present application;
[0018] Figure 2 Fig. 2 is another perspective view of the docking station of the present application;
[0019] Figure 3 Fig. 3 is an exploded view of the docking station of the present application;
[0020] Figure 4 Fig. 4 is a sectional view of the docking station of the present application.
[0021] Explanation of reference signs:
[0022] Reference Name Reference Name 100 Docking station 20 Electronic components 10 Housing 21 Circuit board 11 Upper cover 22 Data interface 111 Groove 23 Heat dissipation member 112 Thermal conductive plate 24 Shielding cover 113 Thermal conductive cavity 30 Line card 12 Middle frame 40 Rubber pad 121 Through hole 50 Data line 13 Bottom cover 61 Indicator light 131 Heat dissipation hole 62 Light guide column 132 Wire slot
[0023] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.
[0025] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications also change accordingly.
[0026] In addition, if the embodiments of the present application involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears to be contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the protection scope required by the present application.
[0027] Please refer to Figures 1-4 The present application provides a stackable heat dissipation docking station 100, which comprises a shell 10 and an electronic assembly 20. The shell 10 comprises an upper cover 11, a middle frame 12 and a bottom cover 13. The upper cover 11, the middle frame 12 and the bottom cover 13 form a containing cavity. The upper cover 11 is formed with a groove 111. The bottom cover 13 is provided with a plurality of heat dissipation holes 131. A plurality of through holes 121 are formed in the middle frame 12. The electronic assembly 20 is installed in the containing cavity and is at least partially arranged in a staggered manner to avoid the groove 111. The electronic assembly 20 comprises a circuit board 21 and a plurality of data interfaces 22. The data interfaces 22 are electrically connected to the circuit board 21 and are arranged correspondingly to the through holes 121.
[0028] In the docking station 100 of the present application, the upper cover 11 is provided with the groove 111. When the electronic device is stacked in the groove 111, it can be more stable. Meanwhile, the electronic assembly 20 in the interior is arranged in a staggered manner to avoid the groove 111, so that the heat generated by the electronic assembly 20 can be better dissipated through the heat dissipation holes 131 on the bottom cover 13, avoiding the heat generated by the electronic assembly 20 from affecting the heat dissipation of the electronic device when stacked, and improving the heat dissipation effect.
[0029] The docking station 100 of the present application is mainly used for stacking with small electronic devices, for example, the small electronic device can include a Mac mini host, wherein the bottom of the Mac mini host is a circular convex structure, and the bottom structure has a heat dissipation structure, and the host mainly dissipates heat through the heat dissipation structure. Further, the docking station 100 in the present application is designed by the recess 111 on the top of the shell 10 which is matched with the bottom of the host and the reasonable layout of the internal elements, so that the docking station 100 is more stable when stacked with the host, and also has good heat dissipation effect, avoiding affecting the heat dissipation effect of the host after stacking. Of course, the docking station 100 can also be stacked with other small electronic devices with bottom heat dissipation.
[0030] Specifically, the overall shape of the shell 10 can be set to a rectangular shape, and of course can also be set to a circular shape, and the overall shape of the shell 10 is not limited in the present application. The size of the outer periphery edge of the shell 10 can be matched with the size of the outer periphery edge of the external device, so that the external device can be more neat when stacked and stored in the docking station 100.
[0031] The top surface of the upper cover 11 is formed with a recess 111, and the shape of the recess 111 can be set to a circular shape or other shapes, and the specific shape of the recess 111 can be matched with the shape of the bottom of the external device, so that when the docking station 100 is stacked with the external device, the external device can be stably stacked on the top of the docking station 100, avoiding the lateral sliding deviation of the two. Wherein, the upper cover 11 can be made of metal material, and the metal material has better heat conductivity, which can better conduct heat.
[0032] Further, the bottom of the recess 111 can also be provided with a rubber pad 40, which can play the role of anti-skid and anti-friction, avoiding the friction between the two when the external device is stacked to scratch the surface.
[0033] The bottom cover 13 is formed with a plurality of heat dissipation holes 131, and the position of the heat dissipation hole 131 can correspond to the position of the recess 111 above, so that when the heat generated by the external device stacked on the top is transmitted to the accommodation cavity through the upper cover 11, the heat dissipation hole 131 can quickly dissipate the heat in the accommodation cavity, and has good heat dissipation effect.
[0034] The electronic assembly 20 includes a circuit board 21 and a plurality of data interfaces 22, and the circuit board 21 can be installed at the edge position of one side in the accommodation cavity, and the circuit board 21 is at least partially dislocated from the bottom of the recess 111 of the upper cover 11. Since the circuit board 21 also generates a certain amount of heat when working, the dislocation of the circuit board 21 from the bottom of the recess 111 can reduce the stacking area and affect the heat dissipation effect of the docking station 100.
[0035] Optionally, the electronic assembly 20 can further include a heat dissipation member 23, which can be in the same plane as the circuit board 21 and arranged at the edge position on the other side of the accommodating cavity. The heat dissipation member 23 is at least partially dislocated from the bottom of the groove 111 of the upper cover 11 to avoid blocking the space between the bottom of the groove 111 and the heat dissipation hole 131, thereby affecting the heat dissipation effect.
[0036] Further, since the electronic assembly 20 can generate electromagnetic waves and other signals during operation, in order to avoid the docking station 100 affecting the normal operation of external devices, the outer side of the electronic assembly 20 can be covered with a shielding cover 24. For example, the upper and lower sides of the circuit board 21 are covered with the shielding cover 24, and the upper and lower sides of the heat dissipation member 23 can also be covered with the shielding cover 24. The material of the shielding cover 24 can include stainless steel or white copper, which can have good shielding effect and good rigidity.
[0037] The data interface 22 can be mounted at the edge position of the circuit board 21 and electrically connected with the circuit board 21. The side edge of the middle frame 12 is provided with a plurality of through holes 121, which are communicated with the accommodating cavity. The through holes 121 can be arranged at positions corresponding to the positions of the data interface 22, so that the data interface 22 can be connected with external devices through the through holes 121.
[0038] Optionally, the data interface 22 can include a storage interface, a Type-A interface, a Type-C interface, etc. The type of the data interface 22 is not limited in the present application, which can provide more interfaces for external devices stacked with the docking station 100.
[0039] Optionally, the upper cover 11 can be formed with a heat conduction plate 112, which is located in the accommodating cavity and extends from the bottom of the groove 111 to the bottom cover 13. Further, the heat conduction plate 112 can be arranged in multiple heat conduction cavities 113 in a spaced manner, and the heat conduction cavities 113 are communicated with the heat dissipation holes 131. The heat conduction plate 112 can be used to separate the electronic assembly 20 and the middle region of the accommodating cavity, so as to avoid the heat generated by the electronic assembly 20 and the heat transferred from the top electronic device from affecting each other, and the heat conduction plate 112 can better discharge the heat from the heat dissipation holes 131.
[0040] At the same time, since the middle region of the accommodating cavity is hollow, the heat conduction plate 112 can also play a certain supporting role, avoiding the collapse of the middle due to excessive weight on the top, and improving the stability of the structure.
[0041] Please refer to Figures 1-4Optionally, the docking station 100 further comprises a data line 50, one end of the data line 50 is electrically connected with the circuit board 21 in the accommodating cavity, and the other end extends out of the shell 10. The bottom cover 13 opposite to the upper cover 11 is provided with a wire slot 132 which can be matched with the shape of the data line 50, and when the docking station 100 is in the storage state, the part of the data line 50 extending out of the shell 10 can be accommodated in the wire slot 132, which is convenient for storage.
[0042] Optionally, the docking station 100 further comprises a wire card 30, the wire card 30 is located in the accommodating cavity and connected with the upper cover 11, and the part of the data line 50 in the accommodating cavity is clamped with the wire card 30, and the wire card 30 plays a role in fixing the data line 50, avoiding swinging of the data line 50 in the accommodating cavity.
[0043] Optionally, the electronic assembly 20 can further comprise an indicator light 61 and a light guide column 62, the indicator light 61 is installed at the edge position of the circuit board 21 and electrically connected with the circuit board 21, and the light guide column 62 is arranged on the middle frame 12, the light guide column 62 is arranged in position with the indicator light 61, the light guide column 62 can guide the light of the indicator light 61, and the user can judge the working state of the docking station 100 through the indicator light 61.
[0044] In summary, the docking station 100 in the embodiment of the application can make the external device and the docking station 100 more stable when stacked, avoid side sliding and deviation, and save the floor space when longitudinally stacked, and make the desktop more tidy when stored and placed. Through the reasonable layout of the internal electronic elements, the thickness of the docking station 100 is relatively thin, avoiding occupying too much space, and the layout of the empty middle region of the accommodating cavity can better dissipate the heat transferred to the inside of the accommodating cavity, having good heat dissipation effect.
[0045] The above description is only preferred embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structural transformation made by the application and the drawings, or direct / indirect application in other related technical fields is included in the patent protection range of the present application.
Claims
1. A stackable heat dissipating docking station (100), characterized in that, The application relates to a docking station (100) comprising a shell (10) and an electronic assembly (20). The shell (10) comprises an upper cover (11), a middle frame (12) and a bottom cover (13), the upper cover (11), the middle frame (12) and the bottom cover (13) form a containing cavity, the upper cover (11) is formed with a groove (111), the bottom cover (13) is provided with a plurality of heat dissipation holes (131), and the middle frame (12) is provided with a plurality of through holes (121). The electronic assembly (20) is arranged in the containing cavity and at least partially avoids the groove (111), the electronic assembly (20) comprises a circuit board (21) and a plurality of data interfaces (22), the data interfaces (22) are electrically connected with the circuit board (21) and are arranged in correspondence with the through holes (121).
2. The stackable heat-dissipating docking station (100) of claim 1, wherein, The upper cover (11) is formed with a heat conduction plate (112) towards the bottom cover (13), and the heat conduction plate (112) is located at the bottom of the groove (111).
3. The stackable heat spreading dock (100) of claim 2, wherein, The heat conduction plate (112) is arranged in a spaced mode to form a plurality of heat conduction cavities (113), and the heat conduction cavities (113) are communicated with the heat dissipation holes (131).
4. The stackable heat spreading dock (100) of claim 1, wherein, The electronic assembly (20) further comprises a heat dissipation piece (23) which is electrically connected with the circuit board (21) and is arranged in the groove (111) in a spaced mode.
5. The stackable heat spreading dock (100) of claim 1, wherein, The docking station (100) comprises a shielding cover (24) which covers the electronic assembly (20).
6. The stackable heat spreading dock (100) of claim 1, wherein, The docking station (100) comprises a data line (50) which is electrically connected with the circuit board (21) and at least partially extends out of the shell (10), the bottom cover (13) is provided with a wire groove (132) on the side opposite to the upper cover (11), and the part of the data line (50) extending out of the shell (10) can be arranged in the wire groove (132).
7. The stackable heat spreading dock (100) of claim 6, wherein, The docking station (100) further comprises a wire card (30) which is arranged in the containing cavity and is connected with the upper cover (11), and the part of the data line (50) arranged in the containing cavity is clamped with the wire card (30).
8. The stackable heat spreading dock (100) of claim 1, wherein, The electronic assembly (20) comprises an indicating lamp (61) and a light guide column (62), the indicating lamp (61) is electrically connected with the circuit board (21), the light guide column (62) is arranged on the middle frame (12), and the light guide column (62) is arranged in position with the indicating lamp (61).
9. The stackable heat spreading dock (100) of claim 1, wherein, The data interfaces (22) comprise a storage interface, a Type-A interface and a Type-C interface.
10. The stackable heat spreading dock (100) of claim 1, wherein, The docking station (100) further comprises a rubber pad (40) which is arranged at the bottom of the groove (111).